Capacitor heat conduction device
By designing a heat-conducting plate that is in close contact with the side of the capacitor and setting up a heat-conducting circuit in the capacitor heat-conducting device, the problem of low heat dissipation efficiency in the prior art is solved, realizing a capacitor heat-conducting device with high-efficiency heat dissipation and compact structure, and extending the service life of the capacitor.
Patent Information
- Application Number
- CN202520138407.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing capacitor heat dissipation devices have low heat dissipation efficiency, resulting in short lifespan and easy burnout of capacitors in high-temperature environments. Furthermore, existing technologies only conduct heat to the bottom of the capacitor, resulting in poor heat dissipation.
Design a capacitor heat conduction device. The side of the heat conduction plate is in close contact with the side of the capacitor. A heat conduction circuit is set inside. The inlet and outlet of the water are connected to the two ends of the heat conduction circuit, respectively. The heat conduction plate is in direct contact with the capacitor, which increases the contact area and conducts heat evenly. Cooling liquid is used for heat dissipation.
It improves the heat dissipation efficiency and effectiveness of the capacitor, extends the capacitor's lifespan, ensures that the capacitor can be used in more applications, and has a compact structure that saves space.
Smart Images
Figure CN223941675U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical heat dissipation technology, and in particular to a capacitor heat conduction device. Background Technology
[0002] A capacitor is a power electronic component that can store electrical charge. Capacitors play a crucial role in circuits for tuning, bypassing, coupling, and filtering, and are indispensable devices in the field of power electronics. A capacitor typically consists of two conductors close together, separated by an insulating dielectric layer. When a voltage is applied between the two plates of the capacitor, it stores electrical charge.
[0003] When capacitors are used in high-power electronic devices, they generate a great deal of heat. Especially in some enclosed systems, the high operating temperature can easily lead to overheating, shortening the capacitor's lifespan or causing it to burn out. Furthermore, the operating temperature limitations of the capacitor's dielectric material become a bottleneck restricting its application scenarios.
[0004] Currently, capacitors on the market typically use water cooling to dissipate heat, which is achieved by conducting the capacitor's heat through a heat conduction device. However, existing capacitor heat conduction devices have low thermal conductivity and generally only conduct heat to the bottom of the capacitor, resulting in very poor heat dissipation and very low efficiency.
[0005] Therefore, there is an urgent need to provide a capacitor heat conduction device with good heat dissipation effect and high heat dissipation efficiency. Utility Model Content
[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a capacitor heat conduction device with good heat dissipation effect and high heat dissipation efficiency, thereby solving the above-mentioned technical problems.
[0007] A capacitor heat conduction device for conducting heat to a capacitor includes: a heat conduction plate with its side tightly attached to the side of the capacitor, an inlet and an outlet disposed on the heat conduction plate, the heat conduction plate having a heat conduction circuit inside, and the inlet and outlet being respectively connected to the two ends of the heat conduction circuit.
[0008] Preferably, the side height of the heat-conducting plate is the same as the side height of the capacitor.
[0009] Preferably, the heat-conducting plate is a cylindrical shape attached to the periphery of the side of a single capacitor.
[0010] In another preferred embodiment, in the above-mentioned capacitor array arrangement, each column of capacitors is provided with a heat-conducting plate. The heat-conducting plate has an S-shaped cross-section and is interlaced with the side of the capacitor. The capacitor is attached to the arc of the heat-conducting plate, and the shape of the arc matches the shape of the side of the capacitor.
[0011] In another preferred embodiment, the capacitors are arranged in a staggered array with adjacent columns, and a heat-conducting plate is provided between adjacent columns of capacitors. The heat-conducting plate has a wavy cross-section with a bend. The heat-conducting plate is attached to the side of the capacitors in the adjacent columns, and the capacitors in the adjacent columns are attached to the bend of the heat-conducting plate. The shape of the bend matches the shape of the side of the capacitor.
[0012] In another preferred embodiment, the capacitor array is arranged such that the heat-conducting plate is flat and sandwiched between adjacent capacitors.
[0013] Preferably, a thermally conductive material is disposed between the capacitor and the heat-conducting plate.
[0014] More preferably, the thermally conductive material is a thermally conductive pad or a thermally conductive adhesive.
[0015] Preferably, the water outlet and the water inlet are located at the same end of the heat-conducting plate, and the capacitor heat-conducting device is further provided with connectors that are respectively connected to both ends of the heat-conducting circuit, with the water inlet and the water outlet located at the upper end or front end of the connector.
[0016] Preferably, the capacitor is cylindrical or cuboid in shape.
[0017] Compared with the prior art, this utility model has the following advantages: The heat-conducting plate of the capacitor heat-conducting device of this utility model has an internal heat-conducting circuit. The circuit layout can be configured as needed. The two ends of the heat-conducting circuit are connected to the inlet and outlet, respectively. External cooling liquid enters the heat-conducting circuit through the inlet, absorbs the heat from the capacitor in close contact with the heat-conducting plate, and then exits through the outlet. The side of the heat-conducting plate is in close contact with the side of the capacitor, resulting in direct contact and high heat transfer efficiency. Compared with the prior art which only conducts heat to the bottom of the capacitor, the contact area between the heat-conducting plate and the capacitor is larger, resulting in more uniform heat transfer and higher efficiency. This avoids uneven heat dissipation and temperature rise in some areas. Therefore, the capacitor heat-conducting device of this utility model has good heat dissipation effect and high efficiency, extending the capacitor's lifespan and ensuring its applicability in more applications. Furthermore, the close contact between the side of the heat-conducting plate and the side of the capacitor saves space, resulting in a more compact structure and a smaller capacitor module. Attached Figure Description
[0018] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention.
[0019] Figure 1 This is a schematic diagram of the structure of the first embodiment of the capacitor heat conduction device of this utility model;
[0020] Figure 2This is a schematic diagram of the structure of the first embodiment of the capacitor heat conduction device of this utility model when used with a capacitor;
[0021] Figure 3 This is a schematic diagram of the structure of a second embodiment of the capacitor heat conduction device of this utility model;
[0022] Figure 4 This is a schematic diagram of the structure of a second embodiment of the capacitor heat conduction device of this utility model when used with a capacitor;
[0023] Figure 5 This is a schematic diagram of the third embodiment of the capacitor heat conduction device of this utility model;
[0024] Figure 6 This is a schematic diagram of the structure of a third embodiment of the capacitor heat conduction device of this utility model when used with a capacitor;
[0025] Figure 7 This is a schematic diagram of the fourth embodiment of the capacitor heat conduction device of this utility model;
[0026] Figure 8 This is a schematic diagram of the structure of a fourth embodiment of the capacitor heat conduction device of this utility model when used with a capacitor. Detailed Implementation
[0027] The present invention will be further described in conjunction with the following embodiments and accompanying drawings:
[0028] A capacitor heat conduction device, such as Figures 1 to 8 As shown, the device for conducting heat to capacitor 20 includes: a heat-conducting plate 10 with its side tightly attached to the side of capacitor 20, an inlet 11 and an outlet 12 disposed on the heat-conducting plate 10, the heat-conducting plate 10 having a heat-conducting circuit inside, and the inlet 11 and outlet 12 being connected to the two ends of the heat-conducting circuit respectively.
[0029] Specifically, capacitor 20 can be cylindrical, such as... Figure 2 , Figure 4 and Figure 6 As shown; capacitor 20 can also be in the shape of a cuboid, such as... Figure 8 As shown. Of course, capacitor 20 can also be other shapes. In order to make the side of heat-conducting plate 10 fit tightly against the side of capacitor 20, the cross-sectional shape of heat-conducting plate 10 can be set according to the shape of capacitor 20.
[0030] The heat-conducting plate 10 of this utility model's capacitor heat-conducting device has a heat-conducting circuit inside. The circuit layout can be configured as needed. The two ends of the heat-conducting circuit are connected to the inlet 11 and the outlet 12, respectively. External cooling liquid enters the heat-conducting circuit through the inlet 11, absorbs heat from the capacitor 20 which is in close contact with the heat-conducting plate 10, and then exits through the outlet 12. The side of the heat-conducting plate 10 is in close contact with the side of the capacitor 20, resulting in direct contact and high heat transfer efficiency. Compared to existing technologies that only conduct heat to the bottom of the capacitor 20, this device has a larger contact area with the capacitor 20, leading to more uniform heat transfer and higher efficiency. This avoids uneven heat dissipation and temperature rise in some areas of the capacitor 20. Therefore, this utility model's capacitor heat-conducting device has excellent heat dissipation effect and high efficiency, extending the lifespan of the capacitor 20 and ensuring its applicability in more applications. In addition, the side of the heat-conducting plate 10 of the capacitor heat-conducting device of this utility model is closely attached to the side of the capacitor 20, which saves the placement space of the heat-conducting plate 10, making the structure more compact and the capacitor 20 module smaller.
[0031] Better, such as Figures 1 to 8 As shown, the side height of the heat-conducting plate 10 is the same as the side height of the capacitor 20. When the side height of the heat-conducting plate 10 is the same as the side height of the capacitor 20, the contact area between the heat-conducting plate 10 and the capacitor 20 can be maximized, resulting in more uniform heat conduction, higher heat conduction efficiency, higher heat dissipation efficiency, and better heat dissipation effect.
[0032] As a first embodiment of the capacitor heat conduction device of this utility model, such as Figure 1 and Figure 2 As shown, the heat-conducting plate 10 is a cylindrical shape that is attached to the sides of a single capacitor 20. That is, when only one capacitor 20 is needed, the heat-conducting plate 10 can be set into a cylindrical shape. The cylindrical heat-conducting plate 10 can be attached and fitted around the sides of the capacitor 20. The heat-conducting plate 10 has a simple structure, ensuring that the shape of the heat-conducting plate 10 and the single capacitor 20 fits snugly. The contact area between the heat-conducting plate 10 and the capacitor 20 is large, resulting in uniform heat conduction, high heat conduction efficiency, high heat dissipation efficiency, and good heat dissipation effect. Specifically, when the capacitor 20 is cylindrical, the heat-conducting plate 10 can be set into a cylindrical shape; when the capacitor 20 is cuboid, the heat-conducting plate 10 can be set into a rectangular cylindrical shape. That is, the cylindrical shape of the heat-conducting plate 10 can be set according to the shape of the capacitor 20, ensuring that the heat-conducting plate 10 fits snugly against the outer shape of the capacitor 20, and the cylindrical shape matches the side shape of the capacitor 20.
[0033] As a second embodiment of the capacitor heat conduction device of this utility model, such as Figure 3 and Figure 4As shown, the capacitors 20 are arranged in an array, and each column of capacitors 20 is provided with a heat-conducting plate 10. The cross-section of the heat-conducting plate 10 is S-shaped with an arc 13. The heat-conducting plate 10 is interspersed and attached to the side of the capacitors 20, and the capacitors 20 are attached to the arc 13 of the heat-conducting plate 10.
[0034] When the capacitors 20 are arranged in a modular configuration, the cross-section of the heat-conducting plate 10 is set to an S-shape with an arc 13. The heat-conducting plate 10 has a simple structure, and a capacitor 20 is attached to each arc 13 of the heat-conducting plate 10. The shape of the arc 13 matches the side shape of the capacitor 20, meaning that each arc 13 of the heat-conducting plate 10 can closely fit the side shape of the capacitor 20. This design is reasonable and ingenious. The contact area between the side of the arc 13 and the side of the capacitor 20 is large, resulting in uniform heat conduction, high heat conduction efficiency, high heat dissipation efficiency, and excellent heat dissipation effect. Only one heat-conducting plate 10 is needed for heat dissipation in each column of capacitors 20, making the structure very compact. Under the same heat dissipation effect, the number of heat-conducting plates 10 is greatly reduced, saving heat-conducting plate 10 materials and reducing costs. It also saves space for the heat-conducting plates 10. The capacitor 20 module with the capacitor heat-conducting device is small in size and has a compact structure. Specifically, when capacitor 20 is cylindrical, arc 13 can be circular; when capacitor 20 is cuboid, arc 13 can be square. That is, the shape of arc 13 on heat-conducting plate 10 can be set according to the shape of capacitor 20 to ensure that heat-conducting plate 10 fits the shape of capacitor 20.
[0035] As a third embodiment of the capacitor heat conduction device of this utility model, such as Figure 5 and Figure 6 As shown, the capacitors 20 are arranged in a staggered array with adjacent columns. A heat-conducting plate 10 is set between adjacent columns of capacitors 20. The cross-section of the heat-conducting plate 10 is wavy with a bend 14. The heat-conducting plate 10 is attached to the side of the adjacent column of capacitors 20. The capacitors 20 in the adjacent column are attached to the bend 14 of the heat-conducting plate 10. The shape of the bend 14 matches the shape of the side of the capacitor 20.
[0036] When the capacitors 20 are arranged in a staggered array of adjacent columns, the cross-section of the heat-conducting plate 10 is set to a wave shape with bends 14. The heat-conducting plate 10 has a simple structure. Each bend 14 with the opening facing left is attached to a capacitor 20 located in the left column, and each bend 14 with the opening facing right is attached to a capacitor 20 located in the right column. The two sides of the heat-conducting plate 10 dissipate heat for the two columns of capacitors 20 respectively. The shape of the bend 14 matches the side shape of the capacitor 20. Each bend 14 of the heat-conducting plate 10 can closely fit the side shape of the capacitor 20. The setting is reasonable and ingenious. The contact area between the side of the bend 14 and the side of the capacitor 20 is large, the heat conduction is uniform, the heat conduction efficiency is high, the heat dissipation efficiency is high, and the heat dissipation effect is very good. Only one heat-conducting plate 10 is needed between adjacent columns of capacitors 20 for heat dissipation, resulting in a very compact structure. While achieving the same heat dissipation effect, this design further reduces the number of heat-conducting plates 10 required, saving material and reducing cost. It also saves space, making the capacitor 20 module with the included heat-conducting device smaller and more compact. Specifically, when the capacitor 20 is cylindrical, the bend 14 can be rounded; when the capacitor 20 is cuboid, the bend 14 can be square. That is, the shape of the bend 14 of the heat-conducting plate 10 can be customized according to the shape of the capacitor 20, ensuring a close fit between the heat-conducting plate 10 and the shape of the capacitor 20.
[0037] As a fourth embodiment of the capacitor heat conduction device of this utility model, such as Figure 7 and Figure 8 As shown, the capacitors 20 are arranged in an array, and the heat-conducting plate 10 is flat and sandwiched between adjacent capacitors 20.
[0038] When the capacitor 20 is set to a cuboid shape, the heat-conducting plate 10 is set to a flat plate shape. The heat-conducting plate 10 is sandwiched between adjacent capacitors 20. The structure of the heat-conducting plate 10 is very simple. Only one heat-conducting plate 10 is needed between adjacent columns of capacitors 20 for heat dissipation. The two sides of the heat-conducting plate 10 dissipate heat for the two columns of capacitors 20 respectively. The structure is very compact. Under the same heat dissipation effect, the number of heat-conducting plates 10 is reduced, the material of the heat-conducting plate 10 is saved, and the cost is low. It also saves the space for setting up the heat-conducting plate 10. The capacitor 20 module with the capacitor heat-conducting device is small in size and has a very compact structure.
[0039] Preferably, a thermally conductive material is disposed between the capacitor 20 and the heat-conducting plate 10. The thermally conductive material can increase the thermal conductivity between the capacitor 20 and the heat-conducting plate 10, improve heat dissipation efficiency, and thus enhance the thermal conductivity between the capacitor 20 and the heat-conducting plate 10. Specifically, the thermally conductive material can be a thermally conductive pad or thermally conductive adhesive. Thermally conductive pads and thermally conductive adhesives offer good thermal conductivity, low cost, and ease of installation. Of course, other thermally conductive materials from existing technologies can also be used.
[0040] Better, such as Figures 1 to 8As shown, the outlet 12 and the inlet 11 are located at the same end of the heat-conducting plate 10. The capacitor heat-conducting device is also provided with connectors 30 that are respectively connected to the two ends of the heat-conducting circuit. The inlet 11 and the outlet 12 are located at the upper end or the front end of the connectors 30.
[0041] The outlet 12 and the inlet 11 are located at the same end of the heat-conducting plate 10, but they can be located at different ends of the heat-conducting plate 10 as needed. A connector 30 is provided in the capacitor heat-conducting device, with the inlet 11 and the outlet 12 located at the upper or front end of the connector 30. This allows the heat-conducting plate 10 to be easily connected to external pipelines through the inlet 11 and the outlet 12, making pipeline installation more convenient and faster.
[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.
Claims
1. A capacitor heat conduction device for conducting heat to a capacitor, characterized in that, include: A heat-conducting plate is attached to the side of the capacitor, and an inlet and an outlet are provided on the heat-conducting plate. The heat-conducting plate has a heat-conducting circuit inside, and the inlet and outlet are respectively connected to the two ends of the heat-conducting circuit.
2. The capacitor heat conduction device according to claim 1, characterized in that: The side height of the heat-conducting plate is the same as the side height of the capacitor.
3. The capacitor heat conduction device according to claim 2, characterized in that: The heat-conducting plate is a cylindrical shape that is attached to the perimeter of the side of a single capacitor.
4. The capacitor heat conduction device according to claim 2, characterized in that: The capacitor array is arranged such that each column of capacitors is provided with a heat-conducting plate. The heat-conducting plate has an S-shaped cross-section and is interlaced with the side of the capacitor. The capacitor is attached to the arc of the heat-conducting plate, and the shape of the arc matches the shape of the side of the capacitor.
5. The capacitor heat conduction device according to claim 2, characterized in that: The capacitors are arranged in a staggered array with a heat-conducting plate between adjacent columns. The heat-conducting plate has a wavy cross-section with a bend. The heat-conducting plate is attached to the side of the capacitors in the adjacent columns, and the capacitors in the adjacent columns are attached to the bend of the heat-conducting plate. The shape of the bend matches the shape of the side of the capacitor.
6. The capacitor heat conduction device according to claim 2, characterized in that: The capacitor array is arranged such that the heat-conducting plate is flat and sandwiched between adjacent capacitors.
7. A capacitor heat-conducting device according to any one of claims 1 to 6, characterized in that: A thermally conductive material is disposed between the capacitor and the heat-conducting plate.
8. The capacitor heat conduction device according to claim 7, characterized in that: The thermally conductive material is a thermally conductive pad or thermally conductive adhesive.
9. A capacitor heat-conducting device according to any one of claims 1 to 6, characterized in that: The water outlet and the water inlet are located at the same end of the heat-conducting plate. The capacitor heat-conducting device is also provided with connectors that are respectively connected to both ends of the heat-conducting circuit. The water inlet and the water outlet are located at the upper end or front end of the connectors.
10. A capacitor heat-conducting device according to any one of claims 1 to 6, characterized in that: The capacitor is cylindrical or cuboid in shape.