FTTR-B gateway

Abstract

The utility model relates to the technical field of gateways, in particular to an FTTR-B gateway, which comprises a shell, a circuit board, a bidirectional optical assembly, a shielding case, a heat dissipation plate and a first heat conduction plate, the shell is internally provided with an installation cavity, the circuit board and the shielding case are installed in the installation cavity, the circuit board is arranged at the top of the shielding case, the top of the shielding case is provided with a through hole, and the heat dissipation plate is arranged in the through hole. The bidirectional optical assembly is installed in the shielding case and is electrically connected with the circuit board through the through hole. The heat dissipation plate is installed on the bottom wall of the shell and located in the installation cavity, the first heat conduction plate is located between the top face of the heat dissipation plate and the bottom face of the shielding cover, the bottom face of the heat dissipation plate makes contact with the bottom wall of the shell, the bottom face of the first heat conduction plate makes contact with the heat dissipation plate, and the top face of the first heat conduction plate makes contact with the bottom face of the shielding cover. Heat emitted by the bidirectional optical assembly is finally radiated to the outside through the shielding cover, the first heat conduction plate, the heat dissipation plate and the shell in sequence. The heat of the bidirectional optical assembly can be effectively conducted to the outside, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of gateway technology, and in particular to an FTTR-B gateway. Background Technology

[0002] A gateway is a "gateway" connecting two or more networks, typically used for data conversion and transmission between networks with different protocols, data formats, or architectures. It acts as a translator, repackaging data from one network to suit the needs of another.

[0003] An existing gateway includes a housing, electrical components, a circuit board, a bidirectional optical component, and a shielding cover. The housing has a mounting cavity, in which the circuit board and electrical components are mounted. The shielding cover is connected to the circuit board, and the bidirectional optical component is mounted in the space enclosed by the shielding cover and the circuit board. The bidirectional optical component is electrically connected to the circuit board and is used to convert electrical signals into optical signals and to convert received optical signals into electrical signals and transmit them to the circuit board.

[0004] In existing gateways, the bidirectional optical components generate heat during operation, leading to higher temperatures inside the housing and affecting the normal operation of the gateway. Summary of the Invention

[0005] This utility model provides an FTTR-B gateway, which aims to solve the problem that in existing gateways, the bidirectional optical components generate heat during operation, resulting in high temperatures inside the housing and affecting the normal operation of the gateway.

[0006] This utility model provides an FTTR-B gateway, including a housing, a circuit board, a bidirectional optical component, a shield, a heat sink, and a first heat-conducting plate. The housing has an installation cavity, and the circuit board and the shield are installed in the installation cavity. The circuit board is located on the top of the shield, and the top of the shield has a through hole. The bidirectional optical component is installed inside the shield and is electrically connected to the circuit board through the through hole.

[0007] The heat sink is installed on the bottom wall of the housing and is located inside the mounting cavity. The first heat-conducting plate is located between the top surface of the heat sink and the bottom surface of the shield. The bottom surface of the heat sink is in contact with the bottom wall of the housing, the bottom surface of the first heat-conducting plate is in contact with the heat sink, and the top surface of the first heat-conducting plate is in contact with the bottom surface of the shield.

[0008] Optionally, the first heat-conducting plate is a thermally conductive silicone plate.

[0009] Optionally, a second heat-conducting plate is also included. The second heat-conducting plate is installed inside the shielding cover. The side of the second heat-conducting plate closest to the bidirectional optical component is in contact with the bidirectional optical component, and the side of the second heat-conducting plate furthest from the bidirectional optical component is in contact with the shielding cover.

[0010] Optionally, the second heat-conducting plate is a thermally conductive silicone plate.

[0011] Optionally, along the first direction, the second heat-conducting plate is directly opposite the first heat-conducting plate.

[0012] Optionally, the first heat-conducting plate and the second heat-conducting plate have the same shape.

[0013] Optionally, along the second direction, the length of the first heat-conducting plate is greater than or equal to the length of the second heat-conducting plate;

[0014] The second direction is perpendicular to the first direction.

[0015] Optionally, the shielding cover is provided with a plurality of heat dissipation holes, which are arranged at intervals, and the second heat-conducting plate blocks at least a portion of the heat dissipation holes at the end away from the circuit board.

[0016] Optionally, the heat sink includes a first support portion, a transition portion, and a second support portion. The transition portion is connected between the first support portion and the second support portion. The first support portion and the second support portion are spaced apart along a first direction. The shielding cover is in contact with the first support portion on the side facing the heat sink, and the second support portion is connected to the housing.

[0017] Optionally, the second bearing portion is provided with a plug-in hole, and the inner wall of the mounting cavity is provided with a plug-in post, which is plugged into the plug-in hole.

[0018] The heat emitted by the bidirectional optical component of this invention is radiated to the shielding cover, conducted to the first heat-conducting plate, then to the heat sink, and finally to the housing, from which it radiates to the outside. Through this heat transfer mechanism, the heat from the bidirectional optical component is effectively dissipated to the outside, improving heat dissipation efficiency and ensuring that key components such as the bidirectional optical component operate within a suitable temperature environment. This enhances the performance and stability of the equipment and extends its service life. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a partial structural diagram of an FTTR-B gateway provided in one embodiment of the present invention;

[0021] Figure 2 This is a partially exploded view of an FTTR-B gateway according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the heat sink of an FTTR-B gateway according to an embodiment of the present invention.

[0023] Instruction manual illustrations and reference numerals:

[0024] 1. Housing; 11. Connecting post; 2. Circuit board; 3. Bidirectional optical component; 4. Shielding cover; 5. Heat sink; 51. First support part; 52. Transition part; 53. Second support part; 6. First heat conduction plate; 7. Second heat conduction plate. Detailed Implementation

[0025] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Reference Figure 1 and Figure 2This utility model provides an FTTR-B gateway, including a housing 1, a circuit board 2, a bidirectional optical component 3, a shielding cover 4, a heat sink 5, and a first heat-conducting plate 6. The bidirectional optical component 3, also known in the art as a BOSA, is used to convert and transmit optical and electrical signals. The housing 1 of the FTTR-B gateway provides protection and support for the entire device. The housing 1 has a mounting cavity providing space for the installation of other components. The circuit board 2 and the shielding cover 4 are installed in the mounting cavity. The circuit board 2 is located on top of the shielding cover 4, and the top of the shielding cover 4 has a through hole. The bidirectional optical component 3 is installed inside the shielding cover 4 and is electrically connected to the circuit board 2 through the through hole. In this embodiment, the BOSA is mounted on the circuit board 2, typically by soldering. The shielding cover 4 protects the BOSA and reduces the influence of external electromagnetic fields.

[0028] The heat sink 5 is installed on the bottom wall of the housing 1 and is located inside the mounting cavity. The first heat-conducting plate 6 is located between the top surface of the heat sink 5 and the bottom surface of the shield 4. The bottom surface of the heat sink 5 is in contact with the bottom wall of the housing 1, the bottom surface of the first heat-conducting plate 6 is in contact with the heat sink 5, and the top surface of the first heat-conducting plate 6 is in contact with the bottom surface of the shield 4.

[0029] In this embodiment, the heat dissipation process is as follows: the heat emitted by the bidirectional optical component 3 radiates to the shielding cover 4, the shielding cover 4 conducts heat to the first heat-conducting plate 6, the first heat-conducting plate 6 conducts heat to the heat sink 5, the heat sink 5 conducts heat to the housing 1, and the housing 1 radiates heat to the outside. Through the above heat transfer, the heat of the bidirectional optical component 3 can be effectively conducted to the outside, improving the heat dissipation efficiency, ensuring that key components such as the bidirectional optical component 3 operate in a suitable temperature environment, improving the performance and stability of the equipment, and extending the service life of the equipment.

[0030] As an example, the first heat-conducting plate 6 is a thermally conductive silicone plate. The first heat-conducting plate 6 is formed by coating thermally conductive silicone onto the heat sink 5. The amount of thermally conductive silicone coating is sufficient to ensure that its bottom surface contacts the heat sink 5 and its top surface contacts the bottom surface of the shielding cover 4. The thermally conductive silicone has good thermal conductivity, allowing it to tightly adhere to the shielding cover 4 and the heat sink 5, effectively conducting the heat generated by the bidirectional optical component 3 inside the shielding cover 4 to the heat sink 5, and then dissipating it into the surrounding environment from the heat sink 5.

[0031] As an example, a second heat-conducting plate 7 is also included. The second heat-conducting plate 7 is installed inside the shielding cover 4. The side of the second heat-conducting plate 7 closest to the bidirectional light component 3 is in contact with the bidirectional light component 3, and the side of the second heat-conducting plate 7 furthest from the bidirectional light component 3 is in contact with the shielding cover 4.

[0032] As an example, the second heat-conducting plate 7 is a thermally conductive silicone plate. In this embodiment, the second heat-conducting plate 7 is formed by thermally conductive silicone coated inside the shielding cover 4. The amount of thermally conductive silicone coating needs to be sufficient to ensure that its bottom surface contacts the shielding cover 4 and its top surface contacts the bottom surface of the bidirectional optical component 3.

[0033] As an example, along the first direction, the second heat-conducting plate 7 is directly opposite the first heat-conducting plate 6. In this embodiment, the first direction is the vertical direction shown in the attached figures, and the first heat-conducting plate 6 and the second heat-conducting plate 7 are directly opposite each other in the vertical direction.

[0034] As an example, the first heat-conducting plate 6 and the second heat-conducting plate 7 have the same shape. Both the first heat-conducting plate 6 and the second heat-conducting plate 7 are rectangular plate structures. The thickness direction of the first heat-conducting plate 6 is parallel to the first direction.

[0035] Optionally, along the second direction, the length of the first heat-conducting plate 6 is greater than or equal to the length of the second heat-conducting plate 7; the second direction is perpendicular to the first direction. In this embodiment, the second direction is the length direction of the first heat-conducting plate 6 in the figure, and the width direction of the first heat-conducting plate 6 in the figure is the third direction. The first direction, the second direction, and the third direction are perpendicular to each other.

[0036] As an example, the shielding cover 4 is provided with multiple heat dissipation holes, which are arranged at intervals. The second heat-conducting plate 7 blocks at least a portion of the heat dissipation holes at the end away from the circuit board 2. In this embodiment, the heat dissipation holes are arranged in an array. The arrangement of the heat dissipation holes increases the heat dissipation area of ​​the shielding cover 4, which is beneficial for heat dissipation. The second heat-conducting plate 7 blocks part of the heat dissipation holes, which can prevent dust and other foreign objects from entering the shielding cover 4, and at the same time does not affect the heat dissipation effect. Some of the heat can be transferred from the second heat-conducting plate 7, and the other part of the heat is transferred to the housing 1 through the air flow from the unblocked heat dissipation holes, and then exchanged with the outside through the holes in the housing 1 itself.

[0037] Reference Figure 3 As an example, the heat sink 5 includes a first support portion 51, a transition portion 52, and a second support portion 53. The transition portion 52 connects the first support portion 51 and the second support portion 53. The first support portion 51 and the second support portion 53 are spaced apart along a first direction. The shielding cover 4 is in contact with the first support portion 51 on the side facing the heat sink 5. The second support portion 53 is connected to the housing 1. In this embodiment, the second support portion 53 is connected to the housing 1. Thermally conductive silicone is coated on the second support portion 53. The first support portion 51 and the second support portion 53 are transitioned and formed together through the transition portion 52. The three components are integrally formed.

[0038] As an example, the second support portion 53 is provided with a insertion hole, and the inner wall of the mounting cavity is provided with a insertion post 11, which is inserted and engaged with the insertion hole. In this embodiment, after the second support portion 53 is inserted and engaged, it can also be fixed to the housing 1 by welding.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. An FTTR-B gateway, characterized in that, The device includes a housing, a circuit board, a bidirectional optical component, a shielding cover, a heat sink, and a first heat-conducting plate. The housing has an installation cavity, and the circuit board and the shielding cover are installed in the installation cavity. The circuit board is located on top of the shielding cover, and the top of the shielding cover has a through hole. The bidirectional optical component is installed inside the shielding cover and is electrically connected to the circuit board through the through hole. The heat sink is installed on the bottom wall of the housing and is located inside the mounting cavity. The first heat-conducting plate is located between the top surface of the heat sink and the bottom surface of the shield. The bottom surface of the heat sink is in contact with the bottom wall of the housing, the bottom surface of the first heat-conducting plate is in contact with the heat sink, and the top surface of the first heat-conducting plate is in contact with the bottom surface of the shield.

2. The FTTR-B gateway according to claim 1, characterized in that, The first heat-conducting plate is a thermally conductive silicone plate.

3. The FTTR-B gateway according to claim 1, characterized in that, It also includes a second heat-conducting plate, which is installed inside the shielding cover. The side of the second heat-conducting plate closer to the bidirectional optical component is in contact with the bidirectional optical component, and the side of the second heat-conducting plate away from the bidirectional optical component is in contact with the shielding cover.

4. The FTTR-B gateway according to claim 3, characterized in that, The second heat-conducting plate is a thermally conductive silicone plate.

5. The FTTR-B gateway according to claim 4, characterized in that, Along the first direction, the second heat-conducting plate is directly opposite the first heat-conducting plate.

6. The FTTR-B gateway according to claim 5, characterized in that, The first heat-conducting plate has the same shape as the second heat-conducting plate.

7. The FTTR-B gateway according to claim 6, characterized in that, Along the second direction, the length of the first heat-conducting plate is greater than or equal to the length of the second heat-conducting plate; The second direction is perpendicular to the first direction.

8. The FTTR-B gateway according to claim 5, characterized in that, The shielding cover is provided with multiple heat dissipation holes, which are arranged at intervals. The second heat-conducting plate seals at least a portion of the heat dissipation holes at the end away from the circuit board.

9. The FTTR-B gateway according to claim 1, characterized in that, The heat sink includes a first support portion, a transition portion, and a second support portion. The transition portion is connected between the first support portion and the second support portion. The first support portion and the second support portion are spaced apart along a first direction. The shielding cover is in contact with the first support portion on the side facing the heat sink. The second support portion is connected to the housing.

10. The FTTR-B gateway according to claim 9, characterized in that, The second bearing part is provided with a plug hole, and the inner wall of the mounting cavity is provided with a plug post, which is plugged into the plug hole.

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