Multi-layer PCB with improved circuit yield

Abstract

The utility model discloses a multilayer PCB board with improved circuit yield, comprising a board body, an air duct fixedly arranged in the board body, silica gel heat conduction blocks fixedly arranged on two sides of the air duct, and heat radiation fins fixedly arranged on two sides of the board body. Heat conduction rods are fixedly arranged at the positions, close to the tops and the bottoms, of the opposite sides of the two cooling fins, a filter is fixedly arranged at the position, close to one side, of the top of the front surface of the plate body, and an exchange controller is fixedly arranged at the position, close to the other side, of the top of the front surface of the plate body. According to the multi-layer PCB with the improved circuit yield, by arranging the air guide pipes, the silica gel heat conduction blocks, the heat conduction rods and the cooling fins, when the multi-layer PCB is used, heat accumulated in the board body can be dissipated outwards in time, damage to the board body caused by too high accumulation of internal heat is avoided, the heat dissipation performance of the multi-layer PCB is improved, convenience is brought to a user, and the multi-layer PCB is worthy of popularization and application. The practicability of the device is improved, and the use requirements of users are met.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically to a multilayer PCB board that improves circuit yield. Background Technology

[0002] PCB, also called printed circuit board, is a type of printed circuit board. Multilayer PCBs refer to PCBs with two or more layers. They consist of connecting wires and solder pads for assembling and soldering electronic components on several insulating substrates. They serve both to conduct electricity between layers and to insulate against each other. Multilayer PCBs are used in electrical products, utilizing more single-sided or double-sided wiring boards. A multilayer PCB can also be composed of multiple PCBs combined together.

[0003] The prior art document, "A Multilayer PCB Board with Improved Circuit Yield", patent number (CN220711701U), describes a method that adds a spring to the outside of a connecting rod and a rubber sleeve to the outside of the connecting rod. During the assembly of the multilayer PCB board, the spring can separate two adjacent PCB boards, preventing electronic components on one PCB board from contacting adjacent PCB boards. This increases the heat dissipation area and prevents heat accumulation.

[0004] However, when using multilayer PCBs, heat dissipation can only dissipate heat from the outside, while the heat inside the PCB is difficult to dissipate quickly, causing inconvenience to users and failing to meet their needs. Utility Model Content

[0005] The purpose of this utility model is to provide a multilayer PCB board with improved circuit yield, in order to solve the problem mentioned in the background art that when multilayer PCB boards are used, they can only dissipate heat from the outside, while the heat inside the PCB board is difficult to dissipate quickly, causing inconvenience to users and failing to meet user needs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multilayer PCB board with improved circuit yield, comprising a board body, an air duct fixedly disposed inside the board body, silicone heat-conducting blocks fixedly disposed on both sides of the air duct, heat sinks fixedly disposed on both sides of the board body, heat-conducting rods fixedly disposed on the top and bottom positions of the opposite side of the two heat sinks, a filter fixedly disposed on one side of the top of the front surface of the board body, and a switching controller fixedly disposed on the other side of the top of the front surface of the board body.

[0007] Furthermore, connecting grooves are provided on both sides of the top and bottom of the plate.

[0008] Furthermore, the number of air ducts is several, and each pair of air ducts is designed to be equidistant from each other.

[0009] Furthermore, the number of silicone heat-conducting blocks is several, and each pair of silicone heat-conducting blocks is designed to be equidistant from each other.

[0010] Furthermore, the two heat-conducting rods extend through the plate on opposite sides and are fixedly connected to the silicone heat-conducting block.

[0011] Furthermore, a signal transceiver is fixedly installed at the middle position on the front surface of the plate.

[0012] Furthermore, an insertion interface is fixedly provided at the bottom position of the front surface of the plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This multilayer PCB board with improved yield rate, through the installation of air ducts, silicone heat-conducting blocks, heat-conducting rods, and heat sinks, enables the device to dissipate heat accumulated inside the board in a timely manner during use, preventing excessive internal heat buildup from damaging the board, improving the heat dissipation performance of the device, bringing convenience to users, enhancing the practicality of the device, and meeting the user's needs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0017] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0018] Figure 4 for Figure 2 A magnified view of part B in the diagram.

[0019] In the diagram: 1. Board; 2. Air duct; 3. Silicone heat-conducting block; 4. Heat sink; 5. Heat-conducting rod; 6. Filter; 7. Switch controller; 8. Connection slot; 9. Signal transceiver; 10. Plug interface. Detailed Implementation

[0020] The utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The following embodiments are only descriptive and are not limiting of the scope of protection of this utility model.

[0021] Please see Figure 1-4This utility model provides a technical solution: a multilayer PCB board with improved circuit yield, including a board body 1, the board body 1 being a multilayer circuit board, an air duct 2 fixedly installed inside the board body 1, the air duct 2 serving to guide air, silicone heat-conducting blocks 3 fixedly installed on both sides of the air duct 2, the silicone heat-conducting blocks 3 serving to conduct heat, heat sinks 4 fixedly installed on both sides of the board body 1, the heat sinks 4 serving to dissipate heat, heat-conducting rods 5 fixedly installed on the top and bottom positions of the opposite side of the two heat sinks 4, the heat-conducting rods 5 being able to conduct heat, a filter 6 fixedly installed on one side of the top of the front surface of the board body 1, the filter 6 serving to filter, and a switching controller 7 fixedly installed on the other side of the top of the front surface of the board body 1, the switching controller 7 serving to switch signals.

[0022] Furthermore, the top and bottom sides of the plate 1 are provided with connecting grooves 8, which facilitate the user to install the device.

[0023] Furthermore, the number of air ducts 2 is set in several, and each pair of air ducts 2 is designed to be equidistant from each other. The air ducts 2 serve to guide air.

[0024] Furthermore, the number of silicone heat-conducting blocks 3 is several, and the distance between each pair of silicone heat-conducting blocks 3 is equidistant. The silicone heat-conducting blocks 3 play a role in heat conduction.

[0025] Furthermore, the two heat-conducting rods 5 each penetrate the plate 1 on one side opposite to each other and are fixedly connected to the silicone heat-conducting block 3. The heat-conducting rods 5 are able to transfer heat to the heat sink 4.

[0026] Furthermore, a signal transceiver 9 is fixedly installed at the middle position of the front surface of the plate 1, wherein the signal transceiver 9 serves to transmit and receive signals.

[0027] Furthermore, a plug-in interface 10 is fixedly provided at the bottom position of the front surface of the plate 1, wherein the plug-in interface 10 is used to plug in the interface.

[0028] Working principle: This device allows air to circulate by setting an air guide pipe 2 inside the plate 1. After the silicone heat-conducting block 3 absorbs the heat from the plate 1, it will be carried away by the air, thereby dissipating heat from the plate 1. The heat-conducting rod 5 can transfer the heat to the heat sink 4, and the heat will then be dissipated outward through the heat sink 4.

[0029] Based on the above work process, we can conclude that:

[0030] This multilayer PCB board with improved yield rate, by setting up air duct 2, silicone heat-conducting block 3, heat-conducting rod 5 and heat sink 4, enables the device to dissipate the heat accumulated inside the board 1 in a timely manner during use, avoiding damage to the board 1 caused by excessive internal heat accumulation, improving the heat dissipation performance of the device, bringing convenience to users, improving the practicality of the device, and meeting the user's needs.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer PCB board with improved circuit yield, comprising a board body (1), characterized in that: An air duct (2) is fixedly installed inside the plate (1). Silicone heat-conducting blocks (3) are fixedly installed on both sides of the air duct (2). Heat sinks (4) are fixedly installed on both sides of the plate (1). Heat-conducting rods (5) are fixedly installed on the top and bottom sides of the two heat sinks (4). A filter (6) is fixedly installed on one side of the top of the front surface of the plate (1). An exchange controller (7) is fixedly installed on the other side of the top of the front surface of the plate (1).

2. The multilayer PCB board with improved circuit yield according to claim 1, characterized in that: The plate (1) has connecting grooves (8) on both sides of the top and bottom.

3. The multilayer PCB board with improved circuit yield according to claim 1, characterized in that: The number of air ducts (2) is several, and each pair of air ducts (2) is designed to be equidistant from each other.

4. The multilayer PCB board with improved circuit yield according to claim 1, characterized in that: The number of silicone heat-conducting blocks (3) is several, and each pair of silicone heat-conducting blocks (3) is designed to be equidistant from each other.

5. A multilayer PCB board with improved circuit yield according to claim 1, characterized in that: The two heat-conducting rods (5) penetrate the plate (1) on opposite sides and are fixedly connected to the silicone heat-conducting block (3).

6. The multilayer PCB board with improved circuit yield according to claim 1, characterized in that: A signal transceiver (9) is fixedly installed at the middle position on the front surface of the plate (1).

7. A multilayer PCB board with improved circuit yield according to claim 1, characterized in that: An insertion interface (10) is fixedly provided at the bottom position of the front surface of the plate (1).

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