Multilayer MINILED circuit board
By designing a multi-layer MINILED circuit board, combined with heat sinks and reinforcing components, the problems of heat dissipation and thermal expansion coefficient mismatch of traditional PCB materials under miniaturized chips and dense heat sources are solved, achieving higher heat dissipation capacity and structural stability, ensuring the stable operation of MINILED chips and the durability of the circuit board.
Patent Information
- Application Number
- CN202520428973.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-12
AI Technical Summary
Traditional PCB materials have low thermal conductivity under miniaturized chips and dense heat sources, which leads to increased local temperature rise, affecting luminous efficiency and device lifespan. At the same time, the mismatch of thermal expansion coefficients causes mechanical stress failure of solder joints, affecting product reliability and long-term stability.
The design incorporates a multi-layer MINILED circuit board, including a substrate, heat sink, and reinforcement components, which are connected by a thermally conductive adhesive layer. The heat sink has heat dissipation fins at its bottom, and the reinforcement component has a thermally conductive structure and clearance openings at its bottom, forming a multi-layer structure to improve heat dissipation and load-bearing capacity.
Significantly improves the heat dissipation and stress resistance of the circuit board, ensures the stable operation of the MINILED beads, and enhances the durability and reliability of the circuit board.
Smart Images
Figure CN223942895U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of circuit board, especially to a multilayer MINILED circuit board. BACKGROUND
[0002] With the rapid development of Mini LED technology, its backlight product puts forward higher requirements to the supporting printed circuit board (PCB). The core challenge faced by the current industry is that under the dual pressure of miniaturization chip and dense heat source, the traditional PCB manufacturing process and substrate performance have shown obvious limitations.
[0003] In terms of material performance, the traditional epoxy resin substrate (such as FR-4) has essential constraints: on the one hand, its thermal conductivity (usually ≤0.3W / m·K) cannot effectively conduct dense heat source, leading to local temperature rise, affecting the luminous efficiency and device life; on the other hand, the coefficient of thermal expansion (CTE) between the substrate and the LED chip (the CTE of FR-4 is about 13-17ppm / ℃ vs the CTE of chip-level packaging material is about 6-8ppm / ℃), which is easy to cause mechanical stress failure of solder joints under thermal cycle conditions, directly affecting the product reliability and long-term stability.
[0004] Therefore, in order to further optimize the heat dissipation capacity of the existing circuit board, we propose a multilayer MINILED circuit board. SUMMARY
[0005] The utility model aims at solving the existing technology has the shortcomings that the thermal conductivity cannot effectively conduct dense heat source, leading to local temperature rise, and proposes a multilayer MINILED circuit board.
[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0007] A multilayer MINILED circuit board is designed, which comprises:
[0008] The substrate is provided with a welding layer;
[0009] A heat dissipation piece and a reinforcing piece are arranged in sequence on the lower side of the substrate;
[0010] The heat dissipation piece and the lower side of the substrate are thermally conductive, the heat dissipation piece has heat dissipation fins at the bottom, and the lower end of the reinforcing piece has a heat conduction structure adapted to the heat dissipation fins.
[0011] Further, the heat dissipation piece is bonded to the substrate through a heat conduction adhesive layer;
[0012] A plurality of through holes are also provided on the end face of the substrate, and the plurality of through holes are sequentially located at the solder pads of the welding layer.
[0013] Further, the reinforcing member is adhered to the lower side of the heat dissipation member through an insulating adhesive layer, wherein the reinforcing member is a stainless steel sheet.
[0014] Further, the heat dissipation fins are arranged in groups, and the groups of heat dissipation fins are arranged in a matrix on the lower part of the heat dissipation member.
[0015] The bottom of the reinforcing member is provided with a plurality of avoiding openings, each of which avoids and accommodates a group of heat dissipation fins, wherein the bottom of the heat dissipation fin does not protrude from the lower bottom surface of the reinforcing member.
[0016] Further, the heat conduction structure comprises a plurality of groove groups formed in the bottom of the reinforcing member, and each groove group is opposite to an avoiding opening, and the groove group is connected between the avoiding opening and the side edge of the reinforcing member.
[0017] Further, the heat dissipation member is an aluminum substrate or a copper substrate, and the thickness is 1mm.
[0018] The multi-layer MINILED circuit board has the advantages that the heat dissipation member and the reinforcing member are arranged at the bottom of the traditional substrate to form a multi-layer structure circuit board structure, the structure can significantly improve the heat dissipation capacity and stress capacity of the entire circuit board, so that the MINILED lamp bead can work stably, and the durability of the circuit board is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0019] Fig. 1 It is a perspective view of the utility model;
[0020] Fig. 2 It is a structure schematic view of the heat conduction structure of the utility model;
[0021] Fig. 3 It is a sectional structure schematic view of the utility model.
[0022] In the drawing: 1, substrate; 11, welding layer; 12, through hole; 2, heat dissipation member; 21, heat dissipation fin; 3, reinforcing member; 31, heat conduction structure; 32, avoiding opening; 4, heat conduction adhesive layer; 5, insulating adhesive layer. DETAILED DESCRIPTION
[0023] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.
[0024] Reference Figs. 1-3For an embodiment of the utility model, a kind of multilayer MINILED circuit board, specifically the circuit board includes the substrate 1 with welding layer 11, welding pad is provided on the welding layer 11, MINILED lamp bead is connected on welding pad to realize electrically conductive, of course welding layer 11 is metal layer;
[0025] Further, heat sink 2 and reinforcing member 3 are sequentially arranged on the lower side of the substrate 1;Wherein the lower side of the heat sink 2 and the substrate 1 are thermally conductive, the bottom of the heat sink 2 has a heat dissipation fin 21, and the lower end of the reinforcing member 3 has a heat conduction structure 31 adapted to the heat dissipation fin 21.
[0026] In some embodiments, the heat sink 2 in the utility model is bonded to the substrate 1 by a thermally conductive adhesive layer 4. By designing the thermally conductive adhesive layer 4, the heat from the back end of the substrate 1 can be stably conducted to the heat sink 2 while ensuring stable connection of the heat sink 2 and the substrate 1, thereby achieving heat dissipation of the substrate 1.
[0027] In addition, a plurality of through holes 12 are also provided on the end face of the substrate 1, and the plurality of through holes 12 are sequentially located at the welding pads of the welding layer 11. Specifically, the through holes 12 in the embodiment are also used for heat transfer. The through holes 12 are arranged at the welding pads of the welding layer 11. When the MINILED lamp bead is working and generating heat, the heat will be transferred along the through holes 12 and finally transferred to the heat sink 2 through the thermally conductive adhesive layer 4. In this way, stable heat dissipation of the entire circuit board is achieved, and the stability of heat dissipation is improved.
[0028] Preferably, the reinforcing member 3 in the embodiment is bonded to the lower side of the heat sink 2 by an insulating adhesive layer 5. The reinforcing member 3 is a stainless steel sheet. By adhering the stainless steel sheet, the entire circuit board is reinforced to prevent warping and improve the load-bearing capacity after installation.
[0029] Based on the above embodiment, the heat dissipation fins 21 in the embodiment are provided in multiple groups, and the multiple groups of heat dissipation fins 21 are matrix-distributed at the lower part of the heat sink 2.
[0030] The bottom of the reinforcing member 3 is provided with a plurality of avoiding openings 32, and each avoiding opening 32 avoids and accommodates a group of heat dissipation fins 21. The bottom of the heat dissipation fin 21 does not protrude from the lower bottom surface of the reinforcing member 3.
[0031] Preferably, in this embodiment, four clearance openings 32 are provided, and four sets of heat dissipation fins 21 are also provided. The four clearance openings 32 are arranged in a rectangular shape. The insulating adhesive layer 5 is hollowed out at the clearance openings 32 to ensure that the heat dissipation fins 21 can be freely distributed in the clearance openings 32 for heat dissipation. In addition, in this embodiment, the bottom of the heat dissipation fins 21 is at the same level as the lower surface of the reinforcing member 3. Preferably, the bottom of the heat dissipation fins 21 is recessed above the lower surface of the reinforcing member 3. This design is to avoid the heat dissipation fins 21 affecting the flatness of the bottom of the reinforcing member 3.
[0032] In an optional embodiment, the heat-conducting structure 31 of the present invention includes a plurality of groove groups formed at the bottom of the reinforcing member 3, and the plurality of groove groups and the plurality of clearance openings 32 are opposite to each other. That is, in this embodiment, the groove groups are also set to four groups, wherein the groove groups are composed of multiple slots, and the slots can be set to rectangular grooves or semi-circular grooves.
[0033] The groove group connects the clearance opening 32 and the side of the reinforcing member 3. In other words, in order to ensure that the heat of the heat dissipation fin 21 can be stably dissipated, this embodiment uses a groove group design at the bottom of the reinforcing member 3 to form a heat dissipation channel.
[0034] In actual operation, the heat on the substrate 1 will enter the surface of the heat sink 2 along the thermally conductive adhesive layer 4. Since the bottom of the heat sink 2 is provided with heat dissipation fins 21, the heat will be dissipated along the heat dissipation fins 21. At the same time, since the heat dissipation fins 21 are housed inside the relief opening 32, in order to prevent the relief opening 32 from affecting the heat dissipation of the heat dissipation fins 21, multiple slots are opened at the bottom of the relief opening 32. The slots connect the relief opening 32 and the outside of the reinforcing member 3 to form a heat dissipation channel, thus achieving the stability of heat dissipation.
[0035] It should be noted that the heat sink 2 described in this embodiment is an aluminum substrate or a copper substrate with a thickness of 1 mm.
[0036] In summary, by adding a heat sink 2 and a reinforcing member 3 to the bottom of the traditional substrate 1, a multi-layer circuit board structure is formed in this utility model. This structure can significantly improve the heat dissipation and stress resistance of the entire circuit board, thus ensuring the stable operation of the MINILED beads and the durability of the circuit board.
[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A multilayer MINILED circuit board, characterized in that, include: A substrate (1) having a welding layer (11) configured; A heat dissipation component (2) and a reinforcing component (3) are sequentially arranged on the lower side of the substrate (1); The heat sink (2) and the substrate (1) are bonded together for heat conduction. The heat sink (2) has heat dissipation fins (21) at the bottom. The lower end of the reinforcing member (3) has a heat conduction structure (31) adapted to the heat dissipation fins (21).
2. The multilayer MINILED circuit board according to claim 1, characterized in that: The heat sink (2) is bonded to the substrate (1) through a thermally conductive adhesive layer (4); A plurality of through holes (12) are also provided on the end face of the substrate (1), and the plurality of through holes (12) are located sequentially at the pads of the welding layer (11).
3. A multilayer MINILED circuit board according to claim 1, characterized in that: The reinforcing member (3) is bonded to the lower side of the heat sink (2) by an insulating adhesive layer (5), wherein the reinforcing member (3) is a stainless steel sheet.
4. A multilayer MINILED circuit board according to claim 1, characterized in that: The heat dissipation fins (21) are provided in multiple sets, and the multiple sets of heat dissipation fins (21) are distributed in an array at the lower part of the heat dissipation component (2); The bottom of the reinforcing member (3) is provided with several clearance openings (32), each clearance opening (32) avoids and accommodates a set of heat dissipation fins (21), wherein the bottom of the heat dissipation fins (21) does not protrude from the bottom surface of the reinforcing member (3).
5. A multilayer MINILED circuit board according to claim 4, characterized in that: The heat-conducting structure (31) includes a plurality of grooves formed at the bottom of the reinforcing member (3), and the plurality of grooves and the plurality of clearance openings (32) are opposite to each other. The grooves are connected between the clearance openings (32) and the side of the reinforcing member (3).
6. A multilayer MINILED circuit board according to claim 5, characterized in that: The heat sink (2) is an aluminum substrate or a copper substrate with a thickness of 1 mm.