Microwave power amplifier circuit board structure convenient to install

Abstract

The utility model discloses a microwave power amplifier circuit board structure convenient to install, and relates to the technical field of microwave power amplifiers, the microwave power amplifier circuit board structure comprises a microwave amplifier lower shell and a circuit board main body, one side of the circuit board main body is provided with an input interface, and the other side of the circuit board main body is provided with a second output interface. A first output interface is installed on one side of the outer surface of the circuit board body, a supporting frame is fixed among the first output interface, the second output interface and the input interface, and a second buffer pad is connected into the supporting frame. Through the arrangement of the input interface, the first output interface, the second output interface and the supporting frame, the circuit board main body does not need to be fastened in the upper shell and the lower shell of the microwave amplifier through bolts during installation, and only the circuit board main body needs to be placed in the lower shell of the microwave amplifier; the input interface, the first output interface and the second output interface penetrate through the lower shell of the microwave amplifier; and moreover, the structural strength is high, and the stability is good.

Description

Technical Field

[0001] This utility model relates to the field of microwave power amplifier technology, specifically to a microwave power amplifier circuit board structure that is easy to install. Background Technology

[0002] The working principle of a microwave power amplifier is based on the amplification characteristics of electronic components. Multiple electronic components on the circuit board work together to amplify the input signal according to its amplitude and phase. When the input signal is applied to the input terminal of the power amplifier, the electronic components will amplify the signal according to its strength and frequency, and then output the amplified signal to the load through the output terminal.

[0003] The existing microwave power amplifier circuit boards are cumbersome to disassemble and assemble. For example, during the production process, workers need to first pass four bolts through the mounting holes at the four corners of the circuit board and install the circuit board into the microwave power amplifier housing. Then, the microwave power amplifier housing is closed and the bolts are tightened to limit the position. The same operation is required during subsequent disassembly and maintenance. Because multiple bolts need to be operated, the disassembly and assembly operations are cumbersome and time-consuming. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a microwave power amplifier circuit board structure that is easy to install, so as to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a microwave power amplifier circuit board structure that is easy to install, comprising a lower shell of a microwave amplifier and a circuit board body. An input interface is installed on one side of the circuit board body, and a second output interface is installed on the other side of the circuit board body. A first output interface is installed on one side of the outer surface of the circuit board body, and a support frame is fixed between the first output interface, the second output interface and the input interface. A second buffer pad is connected inside the support frame. The first buffer pad is connected to the outer surface of the first output interface, one side of the second output interface and one side of the input interface.

[0006] By adopting the above technical solution, when the circuit board body wants to deflect within the two housings of the microwave amplifier, the first and second output interfaces can abut against the upper and lower housings of the microwave amplifier, thereby preventing the circuit board body from deflecting. During this process, a support frame connects the input interface, the first output interface, and the second output interface, increasing structural strength and preventing the circuit board body from bending, causing deformation and breakage. When the circuit board body wants to move horizontally, the support frame can abut against the upper and lower housings of the microwave amplifier, thereby preventing horizontal displacement of the circuit board body. If the upper and lower housings of the microwave amplifier are large, they can also be abutted by the input and second output interfaces, thereby preventing horizontal displacement of the circuit board body. During this process, the support frame distributes the pressure, preventing the input interface and the lower housing from deflecting. The second output interface detaches from the main body of the circuit board; and the first buffer pad cushions the input interface, the first output interface, and the second output interface, as well as the main body of the circuit board, reducing the impact of vibration and bumps on the main body of the circuit board, the input interface, the first output interface, and the second output interface. Since two output interfaces are provided, the first output interface and the second output interface can limit the circuit board body while also connecting cable connectors. The two output interfaces facilitate wiring in different directions. If the wiring is in the direction corresponding to the input interface, the cable can be connected to the second output interface. If the output signal cable connector is perpendicular to the input interface, it can be connected through the first output interface, avoiding the need for the cable to be bent before connecting to the first or second output interface, increasing the flexibility of wiring.

[0007] Furthermore, the axis of the input interface is aligned with the axis of the second output interface, and the first output interface and the second output interface are distributed perpendicularly.

[0008] By adopting the above technical solution, when the main body of the circuit board wants to deflect between the two shells of the microwave amplifier, the first output interface and the second output interface can abut against the upper shell and the lower shell of the microwave amplifier, thereby preventing the main body of the circuit board from deflecting; when the main body of the circuit board wants to move horizontally, it is abutted by the input interface and the second output interface, thereby preventing the main body of the circuit board from moving horizontally.

[0009] Furthermore, the support frame and the second buffer pad have a "C" shaped cross section, and the circuit board body is in contact with the second buffer pad.

[0010] By adopting the above technical solution, the second buffer pad is used to cushion the main body of the circuit board, reducing the impact of vibration and bumps on the main body of the circuit board, the input interface, the first output interface and the second output interface.

[0011] Furthermore, the support frame is made of aluminum alloy.

[0012] By adopting the above technical solution, the input interface, the first output interface and the second output interface are connected by the support frame, which increases the structural strength and avoids deformation and breakage caused by bending of the circuit board body; and the pressure is distributed by the support frame to prevent the input interface and the second output interface from falling off the circuit board body.

[0013] Furthermore, the upper housing of the microwave amplifier is connected to the top of the lower housing of the microwave amplifier.

[0014] By adopting the above technical solution, the upper and lower outer shells of the microwave amplifier are fastened together with bolts, thereby completing the installation operation.

[0015] Furthermore, the input interface, the first output interface, and the second output interface are connected between the upper housing and the lower housing of the microwave amplifier, and the main body of the circuit board is disposed inside the upper housing and the lower housing of the microwave amplifier.

[0016] By adopting the above technical solution, it is not necessary to fasten the main body of the circuit board to the upper and lower shells of the microwave amplifier with bolts during installation. Simply place the main body of the circuit board into the lower shell of the microwave amplifier. At this time, the input interface, the first output interface and the second output interface pass through the lower shell of the microwave amplifier. Then, the upper shell and the lower shell of the microwave amplifier are fastened together with bolts, thereby completing the installation operation.

[0017] Furthermore, the first buffer pad is in contact with the upper housing and the lower housing of the microwave amplifier.

[0018] By adopting the above technical solution, the first buffer pad buffers the input interface, the first output interface, and the second output interface, reducing the impact of vibration and bumps on the circuit board body, the input interface, the first output interface, and the second output interface.

[0019] Furthermore, multiple electronic components are mounted on the top of the circuit board body.

[0020] By adopting the above technical solution, when in use, the microwave signal enters the main body of the circuit board through the input interface. Through the cooperation of multiple electronic components, it can be amplified according to the strength and frequency of the input signal. The amplified microwave signal is then output to the load through the first output interface or the second output interface.

[0021] Furthermore, both the first and second cushioning pads are made of silicone material.

[0022] By adopting the above technical solution, the silicone material has good cushioning properties, which can effectively reduce the impact of vibration on the structure. At the same time, the three first buffer pads can cushion the input interface, the first output interface and the second output interface while sealing them to prevent water from entering.

[0023] In summary, the present invention has the following main advantages:

[0024] 1. This utility model, through the arrangement of an input interface, a first output interface, a second output interface, and a support frame, eliminates the need for bolts to secure the circuit board body to the upper and lower housings of the microwave amplifier during installation. The circuit board body is simply placed inside the lower housing of the microwave amplifier, at which point the input interface, the first output interface, and the second output interface penetrate the lower housing. Because the first and second output interfaces are perpendicularly distributed, when the circuit board body attempts to deflect within the two housings, the first and second output interfaces can abut against the upper and lower housings, thus preventing deflection. The support frame further facilitates this process. The connection between the input interface, the first output interface, and the second output interface increases structural strength, preventing deformation and breakage caused by bending of the circuit board body. When the circuit board body needs to move horizontally, the support frame can hold against the upper and lower shells of the microwave amplifier, thus preventing horizontal displacement of the circuit board body. Furthermore, due to the two output interfaces, the first and second output interfaces can not only limit the circuit board body but also connect cable connectors. The two output interfaces facilitate wiring in different directions, avoiding the need for cables to bend before connecting to the first or second output interface, increasing the flexibility of wiring. It is easy to assemble and disassemble, and has high structural strength and good stability.

[0025] 2. This utility model uses a first buffer pad and a second buffer pad to buffer the input interface, the first output interface and the second output interface. The first buffer pad buffers the input interface and the second output interface, and the second buffer pad buffers the circuit board body. This reduces the impact of vibration and bumps on the circuit board body, the input interface, the first output interface and the second output interface, and facilitates structural buffering. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of this utility model;

[0027] Figure 2 This is a schematic diagram of the circuit board structure of this utility model;

[0028] Figure 3 This is a schematic diagram of the exploded structure of the circuit board of this utility model;

[0029] Figure 4 This is a schematic diagram of the support frame structure of this utility model.

[0030] In the figure: 1. Upper shell of microwave amplifier; 2. Lower shell of microwave amplifier; 3. Input interface; 4. First output interface; 5. Second output interface; 6. Circuit board body; 7. Electronic components; 8. Support frame; 9. First buffer pad; 10. Second buffer pad. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] The embodiments of this utility model will be described below based on its overall structure.

[0033] Example 1:

[0034] An easy-to-install microwave power amplifier circuit board structure, such as... Figures 1-4 As shown, the system includes a lower housing 2 of a microwave amplifier and a circuit board body 6. An input interface 3 is mounted on one side of the circuit board body 6, and a second output interface 5 is mounted on the other side. The axis of the input interface 3 is aligned with the axis of the second output interface 5. A first output interface 4 is mounted on one side of the outer surface of the circuit board body 6, and the first output interface 4 and second output interface 5 are perpendicularly distributed. A support frame 8 is fixed between the first output interface 4, the second output interface 5, and the input interface 3. The support frame 8 is made of aluminum alloy and has a second buffer pad 10 connected inside. The support frame 8 and the second buffer pad 10 have a "C"-shaped cross-section and are in contact with the second buffer pad 10. First buffer pads 9 are connected to the outer surface of the first output interface 4, one side of the second output interface 5, and one side of the input interface 3. The first buffer pads 9 are in contact with the upper housing 1 and the lower housing 2 of the microwave amplifier. When the circuit board body 6 is to deflect between the two housings of the microwave amplifier, the first output interface 4 and the second output interface 5 can resist the upper housing of the microwave amplifier. The upper shell 1 and the lower shell 2 of the microwave amplifier prevent the circuit board body 6 from deflecting. During this process, the input interface 3, the first output interface 4, and the second output interface 5 are connected by the support frame 8, which increases the structural strength and prevents the circuit board body 6 from bending, causing deformation and breakage. When the circuit board body 6 wants to move horizontally, the support frame 8 can hold the upper shell 1 and the lower shell 2 of the microwave amplifier, thereby preventing the circuit board body 6 from moving horizontally. If the upper shell 1 and the lower shell 2 of the microwave amplifier are large, they can also be held by the input interface 3 and the second output interface 5, thereby preventing the circuit board body 6 from moving horizontally. During this process, the support frame 8 distributes the pressure and prevents the input interface 3 and the second output interface 5 from falling off the circuit board body 6. Furthermore, the first buffer pad 9 buffers the input interface 3, the first output interface 4, and the second output interface 5, and the second buffer pad 10 buffers the circuit board body 6, reducing the impact of vibration and bumps on the circuit board body 6, the input interface 3, the first output interface 4, and the second output interface 5.

[0035] See Figures 1-3 In the above embodiment, the top of the lower housing 2 of the microwave amplifier is connected to the upper housing 1 of the microwave amplifier. The input interface 3, the first output interface 4, and the second output interface 5 are connected between the upper housing 1 and the lower housing 2 of the microwave amplifier. During installation, it is not necessary to fasten the circuit board body 6 to the upper and lower housings of the microwave amplifier with bolts. Simply place the circuit board body 6 into the lower housing 2 of the microwave amplifier. At this time, the input interface 3, the first output interface 4, and the second output interface 5 pass through the lower housing 2 of the microwave amplifier. Then, the upper housing 1 and the lower housing 2 of the microwave amplifier are fastened together with bolts to complete the installation operation. The circuit board body 6 is located inside the upper housing 1 and the lower housing 2 of the microwave amplifier. Multiple electronic components 7 are installed on the top of the circuit board body 6. In use, the microwave signal enters the circuit board body 6 through the input interface 3. Through the cooperation of multiple electronic components 7, the signal can be amplified according to the strength and frequency of the input signal. The amplified microwave signal is output to the load through the first output interface 4 or the second output interface 5.

[0036] Example 2:

[0037] Based on the above embodiment one, the following settings are now implemented to improve sealing.

[0038] See Figures 1-4 In the above embodiments, the first buffer pad 9 and the second buffer pad 10 are both made of silicone material. Silicone material has good cushioning properties and can effectively reduce the impact of vibration on the structure. At the same time, the three first buffer pads 9 can seal the input interface 3, the first output interface 4 and the second output interface 5 while buffering them, preventing water from entering.

[0039] The implementation principle of this utility model is as follows: First, during installation, it is not necessary to fasten the circuit board body 6 to the upper and lower shells of the microwave amplifier with bolts. Simply place the circuit board body 6 into the lower shell 2 of the microwave amplifier. At this time, the input interface 3, the first output interface 4, and the second output interface 5 pass through the lower shell 2 of the microwave amplifier. Then, the upper shell 1 and the lower shell 2 of the microwave amplifier are fastened together with bolts, thereby completing the installation operation.

[0040] When the circuit board body 6 wants to deflect between the two housings of the microwave amplifier, the first output interface 4 and the second output interface 5 can abut against the upper housing 1 and the lower housing 2 of the microwave amplifier, thereby preventing the circuit board body 6 from deflecting. During this process, the support frame 8 connects the input interface 3, the first output interface 4 and the second output interface 5, increasing the structural strength and preventing the circuit board body 6 from bending, causing deformation and breakage. When the circuit board body 6 wants to move horizontally, the support frame 8 can abut against the upper housing 1 and the lower housing 2 of the microwave amplifier, thereby preventing the circuit board body 6 from moving horizontally. If the upper housing 1 and the lower housing 2 of the microwave amplifier are large, they can also be abutted by the input interface 3 and the second output interface 5, thereby preventing the circuit board body 6 from moving horizontally. During this process, the support frame 8 distributes the pressure, preventing the input interface 3 and the second output interface 5 from falling off the circuit board body 6. Furthermore, the first buffer pad 9 buffers the input interface 3, the first output interface 4 and the second output interface 5, and the second buffer pad 10 buffers the circuit board body 6, reducing the impact of vibration and bumps on the circuit board body 6, the input interface 3, the first output interface 4 and the second output interface 5.

[0041] Before use, simply connect the input microwave signal cable connector to the input interface 3, and then connect the output microwave signal cable connector to the first output interface 4 or the second output interface 5. Since two output interfaces are provided, the first output interface 4 and the second output interface 5 can limit the circuit board body 6 while also connecting the cable connector. The two output interfaces facilitate wiring in different directions. If the wiring is in the direction corresponding to the input interface 3, the cable can be connected to the second output interface 5. If the output signal cable connector is perpendicular to the input interface 3, it can be connected through the first output interface 4, avoiding the need to bend the cable before connecting it to the first output interface 4 or the second output interface 5, thus increasing the flexibility of wiring.

[0042] In use, the microwave signal enters the circuit board body 6 through the input interface 3. Through the cooperation of multiple electronic components 7, it can be amplified according to the strength and frequency of the input signal. The amplified microwave signal is then output to the load through the first output interface 4 or the second output interface 5.

[0043] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A microwave power amplifier circuit board structure that is easy to install, comprising a lower housing (2) of the microwave amplifier and a circuit board body (6), characterized in that: An input interface (3) is installed on one side of the circuit board body (6), and a second output interface (5) is installed on the other side of the circuit board body (6). A first output interface (4) is installed on one side of the outer surface of the circuit board body (6), and a support frame (8) is fixed between the first output interface (4), the second output interface (5) and the input interface (3). A second buffer pad (10) is connected inside the support frame (8). A first buffer pad (9) is connected to the outer surface of the first output interface (4), one side of the second output interface (5) and one side of the input interface (3).

2. The microwave power amplifier circuit board structure for easy installation according to claim 1, characterized in that: The axis of the input interface (3) is aligned with the axis of the second output interface (5), and the first output interface (4) and the second output interface (5) are distributed perpendicularly.

3. The microwave power amplifier circuit board structure for easy installation according to claim 1, characterized in that: The support frame (8) and the second buffer pad (10) have a "C" shaped cross section, and the circuit board body (6) is in contact with the second buffer pad (10).

4. The microwave power amplifier circuit board structure for easy installation according to claim 3, characterized in that: The support frame (8) is made of aluminum alloy.

5. The microwave power amplifier circuit board structure for easy installation according to claim 1, characterized in that: The upper casing (1) of the microwave amplifier is connected to the top of the lower casing (2) of the microwave amplifier.

6. The microwave power amplifier circuit board structure for easy installation according to claim 5, characterized in that: The input interface (3), the first output interface (4) and the second output interface (5) are connected between the upper shell (1) and the lower shell (2) of the microwave amplifier, and the circuit board body (6) is located inside the upper shell (1) and the lower shell (2) of the microwave amplifier.

7. The microwave power amplifier circuit board structure for easy installation according to claim 6, characterized in that: The first buffer pad (9) is in contact with the upper housing (1) and the lower housing (2) of the microwave amplifier.

8. The microwave power amplifier circuit board structure for easy installation according to claim 6, characterized in that: Multiple electronic components (7) are mounted on the top of the circuit board body (6).

9. The microwave power amplifier circuit board structure for easy installation according to claim 1, characterized in that: Both the first buffer pad (9) and the second buffer pad (10) are made of silicone material.

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