Curing clamp for bonding and packaging PCB (Printed Circuit Board) and cap
By designing a clamp that includes a basket base, an L-shaped stop, a top screw bracket, and a fastening screw, the problem of cap misalignment during the bonding and encapsulation process between the PCB board and the cap was solved, achieving low-cost and simple clamping operation, improving production efficiency and optimizing the process flow.
Patent Information
- Application Number
- CN202520491664.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-20
AI Technical Summary
In the existing technology, during the process of bonding and sealing the PCB board and the cap in a vacuum oven, the cap is easily pushed open or tilted by the gas expansion force. In addition, the existing limit fixtures are difficult to process and costly, resulting in low production efficiency.
A clamping device was designed, comprising a basket base, an L-shaped stop, a top screw bracket, a movable stop, and a fastening screw. Through the combination of bolt connection and fastening screw, a stable clamping of the PCB board is achieved, ensuring that the cap does not tilt and simplifying the operation process.
It achieves low-cost and simple clamping operation, improves production efficiency, reduces cap tilting problems, optimizes the process flow, and improves the production yield of subsequent processes.
Smart Images
Figure CN223943078U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip packaging technology, and in particular to a curing fixture for bonding and packaging PCB boards and caps. Background Technology
[0002] In the chip packaging industry, when products with PCB boards and caps are bonded together, the cap adhesive can be cured in a vacuum oven. Due to the expansion of gas inside the product, the cap may be pushed open. To prevent this, there are generally two methods for fixing the caps. The first method involves stacking the PCB boards with caps into a neat cube using edge-limiting mechanisms, and then placing a heavy metal block on top. The weight of the metal block presses down on the caps of the PCB boards, preventing them from being pushed open by the gas. However, because both the caps and PCB boards have certain tolerances, some caps may not be under pressure or may only be slightly pressured. During the vacuuming process in the oven, when the gas inside the caps is expelled, these parts of the caps may shift due to the force of the exhaust, causing the caps to tilt. The second method uses a special limiting fixture to individually fix the caps of each PCB board, then stacks them, and finally places a metal block on top for pressure. This method is based on the first method and can effectively solve the cap tilting problem. However, this method also has drawbacks. Firstly, the fixtures corresponding to the cap spacing are difficult to manufacture and expensive. Utility Model Content
[0003] The purpose of this utility model is to solve at least one of the technical problems existing in the prior art, and to provide a curing fixture for bonding and encapsulating PCB boards and caps. The tool has low manufacturing cost, is simple and convenient to operate, and improves work efficiency. It can increase the pressure, effectively solve the cap misalignment problem, and optimize the process flow. Due to the simplification of manual operation and the fact that the pressure prevents the cap from shifting, the work efficiency is greatly improved, and the production yield of subsequent processes is improved.
[0004] This utility model also provides a curing fixture for bonding and encapsulating PCB boards and caps, comprising: a basket base, L-shaped blocks fixedly connected to both sides of the basket base by bolts, a set screw bracket connected to the inner side of the L-shaped blocks by a rotating shaft, a slot provided at one end of the set screw bracket, a movable block movably connected to the inner wall of the slot, the lower end of the movable block being connected to the basket base by a rotating shaft, and a fastening screw threadedly connected to the inner wall of the set screw bracket, the lower end of the fastening screw abutting against a pressure block.
[0005] According to the present invention, a curing fixture for bonding and encapsulating PCB boards and caps includes a PCB board placed between a basket base and a pressure block. The outer surface of the PCB board is in contact with the inner side of an L-shaped stop. The design between the basket base and the pressure block can effectively clamp the PCB board, ensuring that the position of the PCB board will not move during the curing process and that the pressure can be evenly distributed when applied. Since the fixture can clamp the PCB board simply and quickly, it saves tedious operation time in the production process, thereby improving production efficiency.
[0006] According to the present invention, a curing fixture for bonding and encapsulating PCB boards and caps is provided, wherein the outer surface of the pressure block is in contact with the inner side of the L-shaped stop block, and both the outer surface of the pressure block and the inner side of the L-shaped stop block are smooth surfaces. The smooth design of the pressure block and the inner side of the L-shaped stop block reduces the friction during the clamping process when clamping the PCB board, making the pressure block move more smoothly during the lifting and lowering process.
[0007] According to the present invention, a curing fixture for bonding and encapsulating PCB boards and caps has a pressure block with a boss shape that is smaller at the top and larger at the bottom, which ensures that the pressure on the bottom surface is evenly distributed during the stress process.
[0008] Beneficial effects
[0009] 1. Compared with existing technologies, this curing fixture for bonding and encapsulating PCB boards and caps has low tooling cost, is simple and convenient to operate, and improves work efficiency; it can increase pressure, effectively solve the cap misalignment problem, and optimize the process flow.
[0010] 2. Compared with existing technologies, the curing fixture for bonding and encapsulating PCB boards and caps greatly improves work efficiency and increases the yield of subsequent processes due to the simplification of manual operation and the pressure that prevents the caps from shifting. Attached Figure Description
[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0012] Figure 1 This is an overall structural diagram of the curing fixture for bonding and encapsulating PCB boards and caps according to this utility model.
[0013] Figure 2 This is a schematic diagram of the top screw bracket connection of the curing fixture for bonding and encapsulating PCB boards and caps according to this utility model.
[0014] Figure 3 This is a schematic diagram of the pressure block connection of the curing fixture for bonding and encapsulating PCB boards and caps according to this utility model.
[0015] Figure 4This is a schematic diagram of the basket base connection of the curing fixture used for bonding and encapsulating PCB boards and caps according to this utility model.
[0016] Legend:
[0017] 1. Basket base; 2. L-shaped stop; 3. Top screw bracket; 4. Movable stop; 5. Fastening screw; 6. Pressure block. Detailed Implementation
[0018] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.
[0019] Reference Figure 1-4 This utility model embodiment discloses a curing fixture for bonding and encapsulating PCB boards and caps, comprising: a basket base 1, L-shaped blocks 2 fixedly connected to both sides of the basket base 1 by bolts, a set screw bracket 3 connected to the inner side of the L-shaped blocks 2 by a rotating shaft, a slot provided at one end of the set screw bracket 3, a movable block 4 movably connected to the inner wall of the slot, the lower end of the movable block 4 connected to the basket base 1 by a rotating shaft, a fastening screw 5 threadedly connected to the inner wall of the set screw bracket 3, a pressure block 6 abutting the lower end of the fastening screw 5, a PCB board placed between the basket base 1 and the pressure block 6, the outer surface of the PCB board fitting against the inner side of the L-shaped blocks 2, the outer surface of the pressure block 6 fitting against the inner side of the L-shaped blocks 2, both the outer surface of the pressure block 6 and the inner side of the L-shaped blocks 2 being smooth surfaces, and the shape of the pressure block 6 being a boss type with a smaller top and a larger bottom;
[0020] Specifically, first open the movable stop 4 on the basket base 1 and the top screw bracket 3 on the L-shaped stop 2 to facilitate the stacking of PCB boards. After stacking the PCB boards on top of the basket base 1, place the pressure block 6 on the stacked PCB boards. Then, turn the top screw bracket 3 on the L-shaped stop 2 back and raise the movable stop 4 on the basket base 1 to engage with the slot of the top screw bracket 3. The movable stop 4 can both limit the PCB boards and serve as a locking slot for the top screw bracket 3. Then, according to the height of the oven, use a suitable fastening screw 5 to engage the top screw bracket 3. A longer fastening screw 5 prevents insufficient material from being pressurized, while a shorter fastening screw 5 prevents the overall stacking height from being too high and preventing the boards from entering the oven. Rotate the fastening screw 5 downwards until it contacts the pressure block 6 and can no longer rotate, thus completing the clamping of the PCB boards.
[0021] Working principle: When in use, first open the movable stop 4 on the basket base 1 and the set screw bracket 3 on the L-shaped stop 2. Then stack the PCB board on top of the basket base 1, place the pressure block 6 on the stacked PCB board, turn the set screw bracket 3 on the L-shaped stop 2 back, raise the movable stop 4 on the basket base 1 and insert it into the slot of the set screw bracket 3. Then, according to the height of the oven, use the appropriate fastening screw 5 to turn into the set screw bracket 3 and rotate it downwards until it abuts the pressure block 6 and can no longer be rotated, thus completing the clamping of the PCB board.
[0022] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.
Claims
1. A curing fixture for bonding and encapsulating PCB boards and caps, characterized in that, include: The basket base (1) has L-shaped blocks (2) fixedly connected to both sides of the basket base (1) by bolts. The inner side of the L-shaped blocks (2) is connected to a top screw bracket (3) by a rotating shaft. One end of the top screw bracket (3) is provided with a slot. The inner wall of the slot is movably connected to a movable block (4). The lower end of the movable block (4) is connected to the basket base (1) by a rotating shaft. The inner wall of the top screw bracket (3) is threaded with a fastening screw (5). The lower end of the fastening screw (5) abuts against a pressure block (6).
2. The curing fixture for bonding and encapsulating PCB boards and caps according to claim 1, characterized in that, A PCB board is placed between the basket base (1) and the pressure block (6), and the outer surface of the PCB board is in contact with the inner side of the L-shaped block (2).
3. The curing fixture for bonding and encapsulating PCB boards and caps according to claim 1, characterized in that, The outer surface of the pressure block (6) is in contact with the inner side of the L-shaped stop block (2), and both the outer surface of the pressure block (6) and the inner side of the L-shaped stop block (2) are smooth surfaces.
4. The curing fixture for bonding and encapsulating PCB boards and caps according to claim 1, characterized in that, The shape of the pressure block (6) is a boss type with a smaller top and a larger bottom.