Circulating heat closed space dehumidification system

Abstract

The utility model discloses a circulation heat closed space dehumidification system which comprises a heat exchange structure, a temperature and humidity monitoring assembly and a control structure, the heat exchange structure comprises a semiconductor chilling plate, a heating circulation bin and a condensation liquefaction circulation bin, and the semiconductor chilling plate is arranged between the heating circulation bin and the condensation liquefaction circulation bin; an air return path is arranged between the condensation and liquefaction circulation bin and the heating circulation bin, the condensation and liquefaction circulation bin is connected with an air inlet pipe, the heating circulation bin is connected with an air outlet pipe, and the condensation and liquefaction circulation bin is used for separating damp air guided into the condensation and liquefaction circulation bin and discharging condensate water. The separated air enters the heating circulation bin to be heated through the air return path or directly enters the air outlet pipe; the temperature and humidity monitoring assembly is arranged on the peripheral sides of the air inlet pipe, the air outlet pipe and the semiconductor chilling plate and used for dynamically monitoring the air states of the air inlet pipe and the air outlet pipe and the temperature of the semiconductor chilling plate. The circulating heat closed space dehumidification system can improve the dehumidification efficiency and is suitable for a narrow space.

Description

TECHNICAL FIELD

[0001] The utility model belongs to dehumidification technical field, especially relate to a heat -following closed space dehumidification system. BACKGROUND

[0002] Due to the influence of weather, some distribution cabinet, closed machine case and so on small space closed equipment are damped, and the equipment is damped and can affect its normal operation, in order to avoid the damage of these closed equipment, it needs to carry out dehumidification, and the current common dehumidification technology includes compressor refrigeration dehumidification and adsorption dehumidification and so on conventional dehumidification mode.

[0003] Among them, although the existing compressor refrigeration system is high in efficiency, but it is large in size, high in noise, and needs regular maintenance refrigerant, is not suitable for small space, in addition, the compressor refrigeration system is easy to frost in low temperature environment;The humidity saturation of adsorption type material limits the energy efficiency, and the adsorption material needs to be replaced or regenerated frequently, and the energy consumption is high;The above two kinds of dehumidification technology still lack real-time temperature and humidity feedback, cannot dynamically adjust the dehumidification intensity, and is easy to cause overcooling or overheating;The dehumidification effect is poor in the scene of low temperature, the power consumption is large in hot air mode, and the moisture cannot be discharged from the closed space, so the dehumidification effect cannot be achieved. UTILITY MODEL CONTENT

[0004] In order to solve the above problems, the utility model provides a heat -following closed space dehumidification system to solve the problems of large size of existing dehumidification equipment, poor dehumidification effect in low temperature scene, unable to dynamically adjust dehumidification intensity, easy to cause overcooling or overheating damage initial equipment and so on.

[0005] In order to achieve the above purpose, the utility model adopts the technical scheme that:

[0006] A heat -following closed space dehumidification system is used for dehumidification in closed space, comprising:

[0007] Heat exchange structure, the heat exchange structure includes semiconductor refrigeration sheet, heating circulation bin and condensation liquefaction circulation bin, the semiconductor refrigeration sheet is arranged between the heating circulation bin and the condensation liquefaction circulation bin, one end is used for refrigeration, the other end is used for heating;Condensation liquefaction circulation bin and heating circulation bin between the condensation liquefaction circulation bin are provided with back gas path, the condensation liquefaction circulation bin is connected with inlet pipe, the heating circulation bin is connected with outlet pipe, the condensation liquefaction circulation bin is used for separating the humid air introduced into the condensation liquefaction circulation bin and discharging condensate water, the separated air enters the heating circulation bin or directly enters the outlet pipe through the back gas path, and is discharged back to the closed space;

[0008] A temperature and humidity monitoring assembly is arranged on the side of the air inlet pipe, the air outlet pipe and the semiconductor refrigeration sheet, and is used for dynamically monitoring the air state of the air inlet pipe and the air outlet pipe and the temperature of the semiconductor refrigeration sheet.

[0009] A control structure is electrically connected with the heat exchange structure and the temperature and humidity monitoring assembly respectively, and is used for controlling the operation of the temperature and humidity monitoring assembly and the heat exchange structure.

[0010] Preferably, the semiconductor refrigeration sheet has a cold surface and a hot surface, the cold surface is located on the opposite side of the hot surface, the heating circulation bin is connected with the hot surface, and the condensation and liquefaction circulation bin is connected with the cold surface.

[0011] Preferably, the cold surface and the hot surface are provided with the temperature and humidity monitoring assembly.

[0012] Preferably, the air exchange member is further provided with a first channel, a second channel and the air return channel, the first channel is used for connecting the condensation and liquefaction circulation bin with the air inlet pipe, the air return channel is used for connecting the condensation and liquefaction circulation bin with the heating circulation bin, and the second channel is used for connecting the heating circulation bin with the air outlet pipe.

[0013] Preferably, the condensation and liquefaction circulation bin is provided with a condensation water receiving disc at one end away from the air exchange member, and the condensation water receiving disc is provided with a drain pipe at one end, which is used for receiving and discharging condensate water.

[0014] Preferably, the heating circulation bin is provided with a heat sink at one side away from the semiconductor refrigeration sheet.

[0015] Preferably, the heat exchange structure is provided with a temperature insulation sponge at the side away from the heat sink.

[0016] Preferably, the air pump is further provided, and the air outlet end of the air pump is connected with the air inlet pipe, which is used for guiding the humid air into the condensation and liquefaction circulation bin.

[0017] Preferably, the air pump is further provided, and the air outlet end of the air pump is connected with the air inlet pipe, which is used for guiding the humid air into the condensation and liquefaction circulation bin.

[0018] Preferably, the air pump is further provided, and the air outlet end of the air pump is connected with the air inlet pipe, which is used for guiding the humid air into the condensation and liquefaction circulation bin.

[0019] Compared with the prior art, the air conditioner has the advantages that:

[0020] 1. The heat-seeking closed space dehumidification system removes moisture from the humid air in the closed space by setting up a condensation liquefaction circulating bin and a heating circulating bin and cooperating with the air return path to condense the moisture and reheat the air to improve the dehumidification efficiency;

[0021] 2. The cold and hot surface characteristics of the semiconductor refrigeration sheet are combined to realize efficient condensation and heat energy recovery, improve energy efficiency, reduce the overall volume of the system, and solve the problems of large volume and difficult installation of traditional dehumidification equipment in a small space;

[0022] 3. The temperature and humidity monitoring assembly is arranged on the air outlet pipe, the air inlet pipe and the semiconductor refrigeration sheet to realize dynamic adjustment of the refrigeration power, avoid icing or overheating, prevent the semiconductor refrigeration sheet from being damaged due to extreme working conditions, and prolong the service life of the equipment;

[0023] 4. The closed space dehumidification does not introduce external gas;

[0024] 5. Air extraction and humidity measurement are adopted for closed-loop autonomous dehumidification;

[0025] 6. No external refrigerant or frequent maintenance is needed. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is an explosion view of the heat-seeking closed space dehumidification system of the utility model;

[0027] Figure 2 is Figure 1 is an enlarged view of A in FIG. 1;

[0028] Figure 3 is a schematic view of the internal structure of the heat-seeking closed space dehumidification system of the utility model;

[0029] Figure 4 is a schematic view of the structure of the heat-seeking closed space dehumidification system of the utility model;

[0030] Figure 5 is a schematic view of the structure of the air exchange component in the heat-seeking closed space dehumidification system of the utility model;

[0031] Figure 6 is a schematic view of an embodiment of the heat exchange structure in the heat-seeking closed space dehumidification system of the utility model;

[0032] Figure 7 is a schematic view of the working process of the heat-seeking closed space dehumidification system of the utility model;

[0033] Figure 8 is a schematic view of the working process of the heat exchange structure in the heat-seeking closed space dehumidification system of the utility model;

[0034] Figure 9is another embodiment structure schematic diagram of heat exchange structure of the heat circulation closed space dehumidification system of the utility model;

[0035] Figure 10 is the working principle schematic diagram of heat exchange structure of the heat circulation closed space dehumidification system of the utility model.

[0036] In the drawing, 100 - shell, 101 - installation cavity, 102 - external joint, 103 - mounting plate, 104 - external power supply, 1 - heat exchange structure, 11 - semiconductor refrigeration sheet, 12 - heating circulation bin, 121 - second air inlet joint, 122 - second air outlet joint, 123 - radiator, 13 - condensation liquefaction circulation bin, 131 - first air inlet joint, 132 - first air outlet joint, 14 - temperature insulation sponge, 2 - temperature and humidity monitoring assembly, 21 - temperature and humidity sensor, 22 - temperature sensor, 3 - control structure, 31 - control circuit board, 32 - switch, 4 - air exchange component, 41 - return air path, 42 - first channel, 43 - second channel, 5 - air inlet pipe, 6 - air outlet pipe, 7 - gas reversing valve, 8 - condensation water pan, 81 - overflow plate, 82 - water guide pipe, 9 - drain pipe, 91 - drain control valve, 10 - air pump. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the utility model more clear, the following will combine the drawings to make the further detailed description of the utility model embodiment mode.

[0038] The following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following example embodiments do not represent all embodiments consistent with the utility model. Instead, they are merely examples of some embodiments consistent with the utility model and methods as detailed in the appended claims.

[0039] In the description of the utility model, it is understood that the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances. In addition, in the description of the utility model, unless otherwise specified, "multiple" means two or more than two. "And / or", the association between the associated objects, means that there may be three kinds of relationships, for example, A and / or B, which can represent the following three cases: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents that the associated objects before and after are a kind of "or" relationship.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. The use herein of the terms "and / or" includes a set of one or more associated listed items.

[0041] To solve the above problems, please refer to Figures 1 to 10 The utility model provides a kind of heat following closed space dehumidification system, for closed space dehumidification, this dehumidification system mainly includes heat exchange structure 1, temperature and humidity monitoring component 2 and control structure 3.The heat exchange structure 1 includes semiconductor refrigerating sheet 11, heating circulation bin 12 and condensation liquefaction circulation bin 13, the semiconductor refrigerating sheet 11 is arranged between the heating circulation bin 12 and the condensation liquefaction circulation bin 13, one end is used for refrigeration, the other end is used for heating;Condensation liquefaction circulation bin 13 with heating circulation bin 12 between being provided with back gas path 41, condensation liquefaction circulation bin 13 is connected with air inlet pipe 5, heating circulation bin 12 is connected with air outlet pipe 6, condensation liquefaction circulation bin 13 is used to separate the humid air of import condensation liquefaction circulation bin 13 and discharge condensate, separated air enters heating circulation bin 12 heating or directly enters air outlet pipe 6 by back gas path 41, and exhausts back closed space.The temperature and humidity monitoring component 2 is arranged in the periphery of air inlet pipe 5, air outlet pipe 6 and semiconductor refrigerating sheet 11, for dynamically monitoring the air state of air inlet pipe 5 and air outlet pipe 6 and the temperature of semiconductor refrigerating sheet 11.The control structure 3 is electrically connected with the heat exchange structure 1 and the temperature and humidity monitoring component 2 respectively, for controlling temperature and humidity monitoring component 2 and the operation of heat exchange structure 1.

[0042] As Figure 7 As shown in the temperature and humidity monitoring component 2 includes temperature and humidity sensor 21 and temperature sensor 22, temperature and humidity sensor 21 is arranged in the periphery of air inlet pipe 5 and air outlet pipe 6, respectively monitor the humidity and temperature of humid air entering condensation liquefaction circulation bin 13 and monitor the air temperature and humidity after being treated through condensation liquefaction circulation bin 13 or after being treated through condensation liquefaction circulation bin 13 and heating circulation bin 12, temperature and humidity sensor 21 is electrically connected with control structure 3, and controller is judged whether the data monitored by temperature and humidity sensor 21 meets the set temperature value and humidity value, if not, adjust the power of semiconductor refrigerating sheet 11, in this embodiment, space humidity set value is ≤40%RH.Further, control structure 3 includes control circuit board 31 and switch 32, control circuit board 31 is electrically connected with semiconductor refrigerating sheet 11, temperature and humidity monitoring component 2, and control circuit board 31 and switch 32 can be connected in the mode of wireless connection or wired connection.

[0043] In an optional embodiment, as shown in Figure 8 The semiconductor refrigeration sheet 11 has a cold face and a hot face, the cold face is located on the opposite side of the hot face, the heating circulation bin 12 is connected with the hot face to realize heating of the heating circulation bin, and the condensation liquefaction circulation bin 13 is connected with the cold face to realize refrigeration of the condensation liquefaction circulation bin. The semiconductor refrigeration sheet 11 is composed of P-type and N-type semiconductors. When current passes through, the P-type semiconductor absorbs heat and the N-type semiconductor releases heat to form a cold face and a hot face, respectively. The P-type semiconductor and the N-type semiconductor are electrically connected with the control structure 3, respectively. By changing the current size through the P-type semiconductor and the N-type semiconductor, the power of the semiconductor refrigeration sheet 11 is adjusted to adapt the heat exchange structure 1 to different environments and setting parameters.

[0044] In an optional embodiment, as shown in Figure 7 The cold face and the hot face are provided with the temperature and humidity monitoring assembly 2. Specifically, temperature sensors 22 are arranged at the cold face and the hot face. There are at least two temperature sensors 22, and at least one temperature sensor 22 is arranged at the cold face and the hot face to monitor the temperature of the cold face and the hot face in real time. When the temperature exceeds a threshold value, a protection mechanism is triggered to prevent the semiconductor refrigeration sheet 11 from being damaged due to extreme working conditions, such as supercooling icing or overheating damage.

[0045] In an optional embodiment, as shown in Figure 3 The air exchange member 4 is formed with a first channel 42, a second channel 43 and the return air path 41. The first channel 42 is used to connect the condensation liquefaction circulation bin 13 and the air inlet pipe 5. The return air path 41 is used to connect the condensation liquefaction circulation bin 13 and the heating circulation bin 12. The second channel 43 is used to connect the heating circulation bin 12 and the air outlet pipe 6. Figure 2 and Figure 5 The air exchange member 4 is an integrally formed structure formed by injection molding. The condensation liquefaction circulation bin 13 is provided with a first air inlet joint 131 and a first air outlet joint 132. The heating circulation bin 12 is provided with a second air inlet joint 121 and a second air outlet joint 122. The first air inlet joint 131 of the condensation liquefaction circulation bin 13 is inserted into the first channel 42 of the air exchange member 4 to communicate with the air inlet pipe 5. The first air outlet joint 132 is inserted into the air inlet end of the return air path 41 to complete the connection of the condensation liquefaction circulation bin 13 and the air exchange member 4. The second air inlet joint 121 of the heating circulation bin 12 is inserted into the air outlet end of the return air path 41, and the second air outlet joint 122 is inserted into the second channel 43 of the air exchange member 4 to communicate with the air outlet pipe 6 to complete the connection of the heating circulation bin 12 and the air exchange member 4. To further improve the stability of the air exchange member 4, a locking screw can be used for fixation. In a preferred embodiment, as shown in Figure 8As shown, the gas reversing valve 7 is arranged in the air return path 41, and the opening and closing of the gas reversing valve 7 can be manually or automatically controlled. In the automatic control mode, the gas reversing valve 7 is electrically connected to the control structure 3, and when the temperature of the air passing through the condensation and liquefaction circulation bin 13 is close to the temperature of the enclosed space, the air can be directly introduced into the air outlet pipe 6 and discharged.

[0046] In an optional embodiment, as shown in Figure 9 As shown, the condensation and liquefaction circulation bin 13 is provided with a condensation water pan 8 at one end away from the air exchanger 4, and the condensation water pan 8 is provided with a drain pipe 9 at one end for receiving and discharging condensed water. The condensation water pan 8 can be connected to the condensation and liquefaction circulation bin 13 by buckling or locking screws. In a specific embodiment, the condensation and liquefaction circulation bin 13 is provided with a water guide pipe 82 corresponding to the condensation water pan 8, and the interiors of the condensation and liquefaction circulation bin 13 and the heating circulation bin 12 are both serpentine flow channels. The humid air enters the condensation and liquefaction circulation bin 13, contacts the surface of the serpentine flow channel, and condenses into water droplets. The water droplets are collected at the bottom of the condensation and liquefaction circulation bin 13 along the length direction of the serpentine flow channel, and are guided into the condensation water pan 8 through the water guide pipe 82. The condensation water pan 8 is provided with an overflow plate 81, and the condensed water flows to the drain pipe 9 by overflow. Figure 8 As shown in

[0047] In an optional embodiment, as shown in Figure 1 As shown, the heating circulation bin 12 is provided with a heat sink 123 at one side away from the semiconductor refrigeration sheet 11 for heat dissipation. The heat sink 123 dissipates heat by natural convection, and good heat dissipation can reduce energy waste, improve the overall efficiency of the semiconductor refrigeration sheet 11, and prevent the temperature of the hot surface from being too high, thereby prolonging the service life of the semiconductor refrigeration sheet 11.

[0048] In an optional embodiment, as shown in Figure 6 As shown, the heat exchange structure 1 is provided with a temperature insulation sponge 14 at the periphery of the heat sink 123. The temperature insulation sponge 14 arranged at the periphery of the heat exchange structure 1 can reduce the heat exchange between the cold surface and the outside environment, ensure that the cold energy is concentrated in the condensation and liquefaction circulation bin 13, avoid the loss of cold energy, improve the refrigeration efficiency, and reduce energy waste.

[0049] In an optional embodiment, as shown in Figure 1 As shown, the air pump 91 is further connected to the air inlet pipe 5 at the air outlet end for guiding the humid air into the condensation and liquefaction circulation bin 13. Further, the air pump 91 is further connected to an external power supply 104 for providing power to the air pump 91.

[0050] In an optional embodiment, as shown inFigure 1 、 Figure 3 and Figure 4 The shell 100 is formed by two shells being closed to each other, and each of the shells is provided with a mounting position. The two shells are connected by means of locking screws to form the mounting cavity 101. One of the shells is provided with two external connectors 102 which are connected to the air inlet pipe 5 and the air outlet pipe 6 respectively to enable the humid air to enter the condensation and liquefaction circulating bin 13 and the air passing through the heat exchange structure 1 to be discharged back into the enclosed space.

[0051] In an alternative embodiment, as shown in Figure 1 The shell 100 is provided with mounting plates 103 which are used to limit the installation of the heat exchange structure 1 and the control structure 3. Specifically, one of the shells is provided with mounting plates 103. The mounting plates 103 are provided in two, and the two mounting plates 103 are parallel to each other and different in size. A clamping space for installing the heat exchange structure 1 is formed between the two mounting plates 103. The cross section of the mounting plate 103 is in the shape of L. One side of the mounting plate 103 is threadedly connected to the cavity bottom wall of the mounting cavity 101. The smaller mounting plate 103 is used to threadedly install the radiator 123, and the larger mounting plate 103 is used to threadedly install the air pump 91. The larger mounting plate 103 for installing the air pump 91 is connected to the other side of the radiator 123 through screws on the opposite side of the shell 100, so that the heat exchange structure 1 is stably connected to the shell 100 and ensures stable operation.

[0052] After assembling the components according to the positional relationship, the air pump 91 and the semiconductor refrigeration sheet 11 are turned on by using the switch 32. The humid air in the enclosed space enters the condensation and liquefaction circulating bin 13 through the external connector 102, the air inlet pipe 5 and the first passage 42. At this time, the temperature and humidity of the humid air are detected by the temperature and humidity sensor 21 of the air inlet pipe 5 and transmitted to the control circuit board 31 for recording. The water vapor in the humid air is condensed and dropped under the influence of the cold surface of the semiconductor refrigeration sheet 11 in the condensation and liquefaction circulating bin 13, and collected in the condensation water pan 8. The dry air enters the heating circulating bin 12 through the air return path 41 of the air exchange piece 4. The dry air is heated in the heating circulating bin 12 under the influence of the heating surface. After a certain period of time or reaching a certain temperature, the dry air is sent back to the enclosed space through the air outlet pipe 6, the second passage 43 and the external connector 102, forming a cycle to accelerate the dehumidification efficiency in the enclosed space.

[0053] In summary, the heat following closed space dehumidification system sets the condensation liquefaction circulating bin 13 and the heating circulating bin 12 and cooperates with the return air gas path 41 to condense the moisture in the closed space and remove the water, and then heats the air to improve the dehumidification efficiency, and combines the cold and hot surface characteristics of the semiconductor refrigeration sheet 11 to realize efficient condensation and heat energy recovery and improve energy efficiency, reduce the overall volume of the system, solve the problem of large volume and difficult installation of traditional dehumidification equipment in a small space, set the temperature and humidity monitoring assembly 2 on the outlet air pipe 6, the inlet air pipe 5 and the semiconductor refrigeration sheet 11 to realize dynamic regulation of refrigeration power, avoid icing or overheating, prevent the semiconductor refrigeration sheet 11 from being damaged due to extreme working conditions, and prolong the service life of the equipment; the closed space dehumidification does not introduce external gas; the air extraction and humidity measurement are used for closed-loop autonomous dehumidification; no external refrigerant or frequent maintenance is required.

[0054] The same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components; in the description of the utility model, it is understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the indicated device or element must have a specific orientation, structure and operation, therefore, the positional relationship described in the drawings is only used for exemplary illustration, and cannot be understood as a limitation of the utility model, for ordinary skilled in the art, the specific meaning of the above terms can be understood according to the specific situation.

[0055] The above is only the preferred embodiment of the utility model, and does not limit the utility model, any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A thermosiphon enclosed space dehumidification system for dehumidifying an enclosed space, comprising: The application relates to a heat exchange structure, a temperature and humidity monitoring assembly and a control structure. The heat exchange structure comprises a semiconductor refrigerating sheet, a heating circulation bin and a condensation and liquefaction circulation bin, the semiconductor refrigerating sheet is arranged between the heating circulation bin and the condensation and liquefaction circulation bin, one end of the semiconductor refrigerating sheet is used for refrigeration, and the other end is used for heating; a gas return channel is arranged between the condensation and liquefaction circulation bin and the heating circulation bin, the condensation and liquefaction circulation bin is connected with an air inlet pipe, the heating circulation bin is connected with an air outlet pipe, the condensation and liquefaction circulation bin is used for separating humid air introduced into the condensation and liquefaction circulation bin and discharging condensed water, and the separated air enters the heating circulation bin through the gas return channel for heating or directly enters the air outlet pipe and is discharged back to a closed space. The temperature and humidity monitoring assembly is arranged on the periphery of the air inlet pipe, the air outlet pipe and the semiconductor refrigerating sheet and is used for dynamically monitoring the air state of the air inlet pipe and the air outlet pipe and the temperature of the semiconductor refrigerating sheet. The control structure is electrically connected with the heat exchange structure and the temperature and humidity monitoring assembly respectively and is used for controlling the operation of the temperature and humidity monitoring assembly and the heat exchange structure. The semiconductor refrigerating sheet has a cold surface and a hot surface, the cold surface is located on the opposite side of the hot surface, the heating circulation bin is connected with the hot surface, and the condensation and liquefaction circulation bin is connected with the cold surface.

2. The heat-seeking enclosed space dehumidification system according to claim 1, wherein, The cold surface and the hot surface are provided with the temperature and humidity monitoring assembly.

3. The heat-seeking enclosed space dehumidification system according to claim 2, wherein, The air exchange member is internally formed with a first channel, a second channel and the gas return channel, the first channel is used for connecting the condensation and liquefaction circulation bin with the air inlet pipe, the gas return channel is used for connecting the condensation and liquefaction circulation bin with the heating circulation bin, and the second channel is used for connecting the heating circulation bin with the air outlet pipe.

4. The heat-seeking enclosed space dehumidification system according to claim 1, wherein, One end of the condensation and liquefaction circulation bin away from the air exchange member is provided with a condensation water receiving disc, one end of the condensation water receiving disc is provided with a drain pipe and is used for receiving and discharging condensed water.

5. The heat-trapping enclosed space dehumidification system of claim 4, wherein, One side of the heating circulation bin away from the semiconductor refrigerating sheet is provided with a heat radiator.

6. The heat-trapping enclosed space dehumidification system according to any one of claims 1 to 4, wherein, The periphery of the heat exchange structure without the heat radiator is provided with a temperature insulation sponge.

7. The heat-trapping enclosed space dehumidification system of claim 6, wherein, The air pump is connected with the air inlet pipe at the air outlet end and is used for introducing humid air into the condensation and liquefaction circulation bin.

8. The heat-seeking enclosed space dehumidification system according to claim 1, wherein, The shell is provided with two external connectors, and the two external connectors are respectively connected with the air inlet pipe and the air outlet pipe.

9. The heat-seeking enclosed space dehumidification system according to claim 1, wherein, The shell is provided with a mounting plate used for limiting the installation of the heat exchange structure and the control structure.

10. The heat tracing enclosed space dehumidification system of claim 9, wherein, ​

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