Thermal printing head substrate capable of improving printing concentration and uniformity

Abstract

The utility model discloses a thermal printing head substrate capable of improving printing concentration and uniformity, and belongs to the technical field of thermal printing. Comprising an insulating substrate, a front wire electrode layer is arranged on the front face of the insulating substrate, a heating resistor body is arranged on the front wire electrode layer, a back wire electrode layer is arranged on the back face of the insulating substrate, and a conductive groove penetrating through the front face and the back face of the insulating substrate is formed in the insulating substrate. The conductive grooves are filled with conductive materials to form metalized conductive grooves, and the metalized conductive grooves enable the front wire electrode layer and the back wire electrode layer to be communicated to form a loop. According to the utility model, through the double-sided wiring of the insulating substrate and the design of the metalized conductive groove, the circuit resistance of a heating point is reduced, the resistance difference is eliminated, the printing concentration and uniformity are obviously improved, the process is simplified, and the high-resolution printing requirement is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermal printing technical field, concretely relates to a kind of thermal printing head substrate that can promote printing density and uniformity. BACKGROUND

[0002] Many thermal heating body units are configured on the thermal printing head according to certain resolution linearly and continuously, corresponding pulse voltage is applied to each heating body unit, the heating body unit generates Joule heat effect, converts electric energy into heat energy, the heat energy generated by the heating body unit acts on the thermal medium, the thermal medium develops color, based on the above principle, the more the number of heating points, the greater the current in the circuit, the greater the voltage drop generated by the circuit, the smaller the heating unit on the heating substrate close to the power supply end is affected by the voltage drop, the greater the distance from the power supply end is affected by the voltage drop.

[0003] The existing thermal printing head substrate wiring mode mainly includes single-sided wiring (two-end COM type wiring and middle lead type wiring) and three-sided wiring. Two-end COM type wiring causes line resistance difference due to different distances from heating point loop to power supply end, which causes uneven printing density; Middle lead type wiring can alleviate uneven density, but the overall line resistance is high due to the limitation of wire material and thickness, which reduces the printing density; Three-sided wiring can improve uniformity, but the process is complex, the yield is low, and batch production is difficult.

[0004] Therefore, a thermal printing head substrate structure that can reduce line resistance, improve density, ensure uniformity and be easy to manufacture is needed.

[0005] Therefore, a solution that can reduce line resistance, improve density, simplify process and ensure uniformity is needed. SUMMARY

[0006] The utility model aims at providing a kind of thermal printing head substrate that can promote printing density and uniformity, improve wiring structure and add metalized conductive groove, solve the problems of uneven printing density, low overall density and complex process in prior art, to adapt to high-resolution printing demand.

[0007] To achieve the above object, the technical solution adopted by the utility model is as follows:

[0008] A kind of thermal printing head substrate that can promote printing density and uniformity, including insulating substrate, the front surface of the insulating substrate is provided with front surface wire electrode layer, heating resistor is provided on the front surface wire electrode layer, the back surface of the insulating substrate is provided with back surface wire electrode layer, and the insulating substrate is provided with conductive slot penetrating the front surface and back surface of the insulating substrate, the conductive slot is filled with conductive material to form metalized conductive slot, the metalized conductive slot is communicated to form loop with the front surface wire electrode layer and the back surface wire electrode layer.

[0009] As a further scheme of the utility model: the front lead electrode layer includes a front common electrode and individual electrodes connected in parallel on the front common electrode, the heating resistor body is arranged between the front common electrode and the individual electrodes, and the front common electrode is electrically connected with the top end of the metalized conductive groove.

[0010] As a further scheme of the utility model: the back lead electrode layer includes a back common electrode, and the back common electrode is electrically connected with the bottom end of the metalized conductive groove.

[0011] As a further scheme of the utility model: a control IC and a connector are further included, the control IC is electrically connected with the individual electrodes through the connector, and is used for controlling the on-off of the heating resistor body in time.

[0012] As a further scheme of the utility model: a front protective layer is arranged on the front lead electrode layer, and a back protective layer is arranged on the back lead electrode layer.

[0013] As a further scheme of the utility model: the cross-sectional shape of the metalized conductive groove is rectangular or trapezoidal, and the metalized conductive groove is filled with silver paste or copper paste.

[0014] As a further scheme of the utility model: the length of the metalized conductive groove in the main scanning direction is the same as the effective printing width of the thermal print head.

[0015] As a further scheme of the utility model: the width of the metalized conductive groove in the sub-scanning direction is greater than or equal to 0.2 mm.

[0016] As a further scheme of the utility model: the distance between the lower edge of the metalized conductive groove and the center of the heating resistor body is greater than or equal to 0.3 mm.

[0017] As a further scheme of the utility model: the substrate is suitable for a thermal print head with a resolution greater than or equal to 400 dpi.

[0018] The utility model has the advantages of:

[0019] The utility model discloses a double-sided wiring and a metalized conductive groove are arranged on the front and back of the insulating substrate, the current passes through the front common electrode and the back common electrode of the insulating substrate through the metalized conductive groove to form a low-resistance loop, the heating resistor body is uniformly heated, the heating point loop resistance is reduced, the resistance difference is eliminated, the thermal paper is uniformly heated, the printing density and uniformity are improved, the process is simplified, and the utility model is suitable for high-resolution (resolution greater than or equal to 400 dpi) printing requirements. BRIEF DESCRIPTION OF DRAWINGS

[0020] The utility model makes further description in combination with the drawings.

[0021] Figure 1 It is a heat sensitive printing head base plate structure schematic diagram of the utility model that can promote printing density and uniformity;

[0022] Figure 2 It is a heat sensitive printing head base plate structure overhead schematic diagram of the utility model that can promote printing density and uniformity.

[0023] In the drawing: 1, insulating base plate;2, metallized conductive groove;3, back common electrode;4, back protective layer;5, connector;6, control IC;7, front protective layer;8, individual electrode;9, heating resistance body;10, front common electrode. Specific implementation

[0024] The technical scheme in the embodiment of the utility model is described clearly and completely below, obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the scope of the utility model protection.

[0025] In the description of the utility model, it is understood that the terms "upper", "lower", "left", "right", "front", "back" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, and a particular orientation configuration and operation, therefore, it cannot be understood as a limitation on the utility model.

[0026] In addition, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected;It can be mechanical connection, or electrical connection;It can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For the person skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0027] Please refer to Figure 1The utility model discloses a kind of thermal print head substrates capable of improving printing density and uniformity, including insulating substrate 1, insulating substrate 1 preferably adopts ceramic substrate made of aluminum oxide ceramic. Insulating substrate 1 front surface is laid with front surface wire electrode layer, and front surface wire electrode layer is provided with heating resistor body 9, and insulating substrate 1 back surface is laid with back surface wire electrode layer. It is worth noting that, conductive slot is opened in insulating substrate 1, and the conductive slot can be formed by laser etching, and the conductive slot is filled with conductive material to form metallized conductive slot 2, and the metallized conductive slot 2 is communicated with the front surface wire electrode layer and the back surface wire electrode layer to form a loop.

[0028] The utility model discloses a kind of thermal print head substrates capable of improving printing density and uniformity, including insulating substrate 1, insulating substrate 1 preferably adopts ceramic substrate made of aluminum oxide ceramic. Insulating substrate 1 front surface is laid with front surface wire electrode layer, and front surface wire electrode layer is provided with heating resistor body 9, and insulating substrate 1 back surface is laid with back surface wire electrode layer. It is worth noting that, conductive slot is opened in insulating substrate 1, and the conductive slot can be formed by laser etching, and the conductive slot is filled with conductive material to form metallized conductive slot 2, and the metallized conductive slot 2 is communicated with the front surface wire electrode layer and the back surface wire electrode layer to form a loop.

[0029] Please refer to Figure 2 As shown, the front surface wire electrode layer includes a front surface common electrode 10 and individual electrodes 8 connected in parallel to the front surface common electrode 10, and the heating resistor body 9 is arranged between the front surface common electrode 10 and the individual electrodes 8, and the front surface common electrode 10 is electrically connected to the top end of the metallized conductive slot 2. Please refer to Figure 1 As shown, the back surface wire electrode layer includes a back surface common electrode 3, and the back surface common electrode 3 is electrically connected to the bottom end of the metallized conductive slot 2. The front surface wire electrode layer is provided with a front surface protective layer 7 made of polyimide, and the back surface wire electrode layer is provided with a back surface protective layer 4 made of polyimide. The current passes through the front surface common electrode 10 and the back surface common electrode 3 to form a low-resistance loop through the metallized slot, drives the heating resistor body 9 to heat uniformly, and ensures that the thermal paper is heated uniformly, thereby improving the printing density and uniformity.

[0030] The thermal print head further includes a control IC 6 and a connector 5, the control IC 6 is electrically connected to the individual electrodes 8 through the connector 5, and the control IC 6 drives the individual electrodes 8 through the connector 5 to control the on-off of the heating resistor body 9.

[0031] In specific implementation, the cross-sectional shape of the metallized conductive slot 2 is rectangular or trapezoidal, formed by laser etching, and the metallized conductive slot 2 is filled with silver paste or copper paste and sintered and solidified. The length of the metallized conductive slot 2 in the main scanning direction is the same as the effective printing width of the thermal print head. The width of the metallized conductive slot 2 in the sub-scanning direction is greater than or equal to 0.2 mm. The distance from the lower edge of the metallized conductive slot 2 to the center of the heating resistor body 9 is greater than or equal to 0.3 mm. The heating resistor body 9 is made of a nitrogenated tantalum material, and the thickness is 10-50 μm.

[0032] Compared with the existing single-sided wiring and three-sided wiring heat-sensitive printing head substrate, the heat-sensitive printing head substrate provided by the utility model reduces the heat point loop line resistance, eliminates the resistance difference, significantly improves the printing density and uniformity, simultaneously simplifies the process, and is suitable for high-resolution printing requirements.

[0033] The preferred embodiments of the utility model are described in detail above, and should not be considered as limiting the implementation scope of the utility model. Any equivalent changes and improvements made within the scope of the utility model application should still belong to the patent coverage scope of the utility model.

Claims

1. A thermal printhead substrate capable of improving print density and uniformity, comprising an insulating substrate (1), characterized in that: The front surface of the insulating substrate (1) is provided with a front surface lead electrode layer, a heating resistor (9) is arranged on the front surface lead electrode layer, the back surface of the insulating substrate (1) is provided with a back surface lead electrode layer, and a conductive slot is arranged on the insulating substrate (1) and penetrates the front surface and the back surface of the insulating substrate (1), the conductive slot is filled with conductive material to form a metalized conductive slot (2), and the metalized conductive slot (2) communicates the front surface lead electrode layer and the back surface lead electrode layer to form a loop.

2. The thermal printhead substrate capable of improving print density and uniformity according to claim 1, wherein: The front surface lead electrode layer comprises a front surface common electrode (10) and individual electrodes (8) connected in parallel to the front surface common electrode (10), the heating resistor (9) is arranged between the front surface common electrode (10) and the individual electrodes (8), and the front surface common electrode (10) is electrically connected to the top end of the metalized conductive slot (2).

3. The thermal printhead substrate of claim 2, wherein: The back surface lead electrode layer comprises a back surface common electrode (3) electrically connected to the bottom end of the metalized conductive slot (2).

4. The thermal printhead substrate of claim 3, wherein: A control IC (6) is further included, which is electrically connected to the individual electrodes (8) through a connector (5) and is used for controlling the on-off of the heating resistor (9) in time.

5. The thermal printhead substrate of claim 1, wherein: A front surface protective layer (7) is arranged on the front surface lead electrode layer, and a back surface protective layer (4) is arranged on the back surface lead electrode layer.

6. The thermal printhead substrate of claim 1, wherein: The cross-sectional shape of the metalized conductive slot (2) is rectangular or trapezoidal, and the metalized conductive slot (2) is filled with silver paste or copper paste.

7. The thermal printhead substrate of claim 6, wherein: The length of the metalized conductive slot (2) in the main scanning direction is the same as the effective printing width of the thermal printhead.

8. The thermal printhead substrate of claim 7, wherein: The width of the metalized conductive slot (2) in the sub-scanning direction is greater than or equal to 0.2 mm.

9. The thermal printhead substrate of claim 8, wherein: The distance from the lower edge of the metalized conductive slot (2) to the center of the heating resistor (9) is greater than or equal to 0.3 mm.

10. The thermal printhead substrate of claim 1, wherein: The substrate is suitable for a thermal printhead with a resolution greater than or equal to 400 dpi.

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