Device for protecting sapphire crystal on bottom plate of growth furnace

Abstract

The utility model relates to a sapphire crystal growth furnace bottom plate protection device, which comprises a shell, a first bottom plate, a second bottom plate, a first protection plate, a second protection plate, a third protection plate and a fourth protection plate, the bottom plate protection mechanism is arranged at the bottom of the first bottom plate and the top of the second bottom plate, the bottom plate protection mechanism comprises a plurality of first insertion grooves and second insertion grooves, and the first insertion grooves and the second insertion grooves are formed in the bottom of the first bottom plate and the top of the second bottom plate respectively; the double bottom plates are arranged at the bottom end of the interior of the shell, the connecting pipes communicated with the cooling shell extend into the bottom plates, when cooling liquid circulates in the cooling shell, water can enter the inserting grooves of the two bottom plates, heat in the bottom plates is taken away, the cooling liquid is cooled, the cooling liquid is cooled, and the cooling effect is improved. And meanwhile, due to the fact that the connecting pipe is inserted into the bottom plate, when the bottom plate deforms, the bottom plate can be supported and limited through the connecting pipe, deformation of the bottom plate is avoided, and a heat insulation plate does not need to be arranged.

Description

TECHNICAL FIELD

[0001] The utility model relates to sapphire crystal field, specifically at sapphire crystal in growth furnace bottom plate protection device. BACKGROUND

[0002] The existing sapphire crystal growth furnace body is made of 304 stainless steel material, the crucible support and the crucible support supporting disc are made of tungsten, molybdenum and other materials, the crucible support and the crucible support supporting disc directly placed on the furnace body bottom plate, and the furnace body bottom is provided with a separate cooling water channel. The temperature of the temperature field in the furnace body is about 2300 DEG C, and the furnace body material 304 stainless steel can resist temperature of 1000 DEG C to 1200 DEG C. During the crystal growth process, since the metal is easy to conduct heat, the heat of the temperature field will conduct part of the heat to the furnace body bottom plate through the crucible support and the crucible support supporting disc. Although the cooling water channel is cooled, the direct contact of the heat will make the bottom plate gradually deform, cause the crucible support to tilt, and make the temperature field in the furnace body uneven, thereby affecting the growth of the sapphire crystal.

[0003] According to the disclosed patent 201320614414.4 sapphire crystal in growth furnace bottom plate protection device, including the crucible shell, the crucible shell is equipped with the crucible of storing sapphire crystal, the crucible shell bottom is equipped with the furnace body bottom plate, the furnace body bottom plate is equipped with the lower water cooling channel, the crucible is connected with the crucible support, the crucible support bottom is connected with the crucible support supporting disc, and the crucible support supporting disc is equipped with the heat insulation protection plate between the furnace body bottom plate, the corresponding part of the crucible shell and the crucible support forms the heating area of the crucible, and the heating area is equipped with the lower heat preservation screen. The utility model has the advantages of: the heat insulation protection plate is additionally arranged on the furnace body bottom plate, can effectively block the transmission of more heat in the furnace body, thereby reducing the heat transmitted to the furnace body bottom plate, preventing the furnace body bottom plate from deforming due to heat, ensuring the uniformity of the heating temperature of the crucible, and ensuring the growth and quality of the sapphire crystal. In the process of realizing the utility model, the inventors found that at least the following problems in the prior art have not been solved. Although the heat insulation protection plate is additionally arranged on the furnace body bottom plate, can effectively block the transmission of more heat in the furnace body, thereby reducing the heat transmitted to the furnace body bottom plate, preventing the furnace body bottom plate from deforming due to heat, ensuring the uniformity of the heating temperature of the crucible, and ensuring the growth and quality of the sapphire crystal, but in the process of use, the traditional sapphire crystal in growth furnace bottom plate protection device adopts the heat insulation protection plate for heat insulation to avoid the deformation of the furnace body bottom plate. This heat insulation method causes the heat to not be effectively conducted to the heat exchange structure for heat exchange, which easily leads to the high heat in the crucible. Therefore, a new technical scheme needs to be designed to solve the problem. SUMMARY

[0004] The utility model discloses a sapphire crystal in the growth furnace bottom plate protection device to overcome the prior art's insufficient, adapt to the reality needs, provide a sapphire crystal in the growth furnace bottom plate protection device to solve the current traditional sapphire crystal in the growth furnace bottom plate protection device, adopts the heat insulation protection plate to carry out the heat insulation, avoids the furnace body bottom plate deformation, and this kind of heat insulation mode leads to heat and can not effectively conduct to the heat exchange structure and carry out the heat exchange, is easy to lead to the heat in the crucible interior and is too high technical problem.

[0005] In order to realize the utility model's purpose, the utility model adopts the technical scheme that designs a sapphire crystal in the growth furnace bottom plate protection device, including the shell still includes:

[0006] First bottom plate and second bottom plate are installed at the bottom end in the shell respectively;

[0007] The bottom plate protection mechanism is set up in the first bottom plate bottom and the second bottom plate top, and the bottom plate protection mechanism includes a plurality of first slot and second slot, and a plurality of first slot and second slot are set up in the first bottom plate bottom and the second bottom plate top respectively;

[0008] One end of the connecting pipe is inserted into the first slot and the second slot, and the other end of the connecting pipe is communicated with the cooling shell.

[0009] Preferably, one end of the first recessed pipe and the second recessed pipe is communicated with the cooling shell on both sides, and the other end of the first recessed pipe and the second recessed pipe is communicated with the liquid pump and the liquid pump through the shell respectively.

[0010] Preferably, the liquid pump and the liquid pump are communicated with the cooling liquid tank away from one end of the first recessed pipe and the second recessed pipe.

[0011] Preferably, the cooling liquid tank is provided with a semiconductor refrigeration sheet on both sides of the front end, and the cold end of the semiconductor refrigeration sheet is attached to the surface of the cooling liquid tank.

[0012] Preferably, the front end of the cooling liquid tank is provided with an industrial computer.

[0013] Preferably, the shell is provided with a crucible body at the top end, and the crucible body is provided with a crucible support at the bottom, and the crucible support is provided with a crucible support support disc at the bottom.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] 1.The utility model discloses a bottom plate, the combination of connecting pipe and cooling shell sets up double bottom plate in the bottom end in the shell interior, and the connecting pipe that communicates with the cooling shell is inserted in the inside of bottom plate, when the cooling liquid circulates in the cooling shell interior, can make water enter the slot of two bottom plates, take away the heat in the bottom plate, improve the heat exchange effect, simultaneously, because the connecting pipe is inserted in the inside of bottom plate, can support and limit the bottom plate through the connecting pipe when the bottom plate deforms, avoid the deformation of bottom plate, need not set up the heat insulating plate, solve the traditional sapphire crystal in the growth furnace bottom plate protection device, adopt the heat insulation of heat insulation protection plate, avoid the deformation of furnace body bottom plate, this kind of heat insulation, lead to the heat can not be effectively conducted to the heat exchange structure and heat exchange, easily lead to the heat in the crucible is too high technical problem.

[0016] 2.The utility model discloses the combination of cooling liquid tank and semiconductor refrigeration piece can be with the cold end of semiconductor refrigeration piece and cooling liquid tank surface and pasting, in the process of circulating cooling liquid, can reduce the temperature of cooling liquid through semiconductor refrigeration piece, avoid the temperature of cooling liquid in the circulation process too high, influence the cooling heat exchange effect. DRAWINGS

[0017] Figure 1 It is the slot structure schematic diagram of the utility model;

[0018] Figure 2 It is the semiconductor refrigeration piece structure schematic diagram of the utility model.

[0019] In the drawing: 1, shell;101, crucible main body;102, crucible support;103, crucible support support disc;2, cooling shell;201, first slot;202, connecting pipe;203, cooling liquid tank;204, liquid pump;205, first recessed pipe;206, second bottom plate;207, liquid pump;208, second recessed pipe;209, industrial computer;210, first bottom plate;211, second slot;3, semiconductor refrigeration piece. SPECIFIC IMPLEMENTATION

[0020] The utility model is further explained in connection with the drawings and examples:

[0021] Example 1: a kind of sapphire crystal in the growth furnace bottom plate protection device, refer to Figures 1 to 2, including the shell 1, further comprising: a first bottom plate 210 and a second bottom plate 206, respectively installed at the bottom end inside the shell 1; a bottom plate protection mechanism is opened at the bottom of the first bottom plate 210 and the top of the second bottom plate 206, the bottom plate protection mechanism comprises a plurality of first slots 201 and second slots 211, a plurality of first slots 201 and second slots 211 are respectively opened at the bottom of the first bottom plate 210 and the top of the second bottom plate 206; one end of the connecting pipe 202 is inserted into the first slot 201 and the second slot 211, the other end of the connecting pipe 202 is communicated with the cooling shell 2, when heat exchange is needed, open the liquid pump 207 and the liquid pump 204, the liquid pump 204 draws the cooling liquid in the cooling liquid tank 203 into the second recessed pipe 208, so that the cooling liquid enters the cooling shell 2 and the plurality of connecting pipes 202, the liquid pump 204 can reabsorb the cooling liquid in the cooling shell 2 into the cooling liquid tank 203, so as to realize the circulation of the cooling liquid, when the cooling liquid circulates in the cooling shell 2, water can enter the slot 201 of the two bottom plates, taking away the heat in the bottom plate, improving the heat exchange effect, at the same time, since the connecting pipe 202 is inserted into the bottom plate, when the bottom plate deforms, the connecting pipe 202 can support and limit the bottom plate, avoiding the deformation of the bottom plate, without setting the heat insulation plate, solving the technical problem that the traditional sapphire crystal grows in the furnace bottom plate protection device, using heat insulation protection plate for heat insulation, avoiding the deformation of the furnace bottom plate, this heat insulation method can not effectively conduct heat to the heat exchange structure for heat exchange, which is easy to cause the heat in the crucible to be too high.

[0022] Specifically, referring to Figure 1 , the two sides of the cooling shell 2 are respectively communicated with one end of the first recessed pipe 205 and the second recessed pipe 208, and the other end of the first recessed pipe 205 and the second recessed pipe 208 penetrates through the shell 1 and is respectively communicated with the liquid pump 204 and the liquid pump 207.

[0023] Further, referring to Figure 1 , the liquid pump 204 and the liquid pump 207 are respectively communicated with the cooling liquid tank 203 away from one end of the first recessed pipe 205 and the second recessed pipe 208.

[0024] It is worth noting that, referring to Figure 2 , the front end of the cooling liquid tank 203 is provided with a semiconductor refrigeration piece 3 on both sides, and the cold end of the semiconductor refrigeration piece 3 is attached to the surface of the cooling liquid tank 203. After the cold end of the semiconductor refrigeration piece 3 is attached to the surface of the cooling liquid tank 203, the temperature of the cooling liquid can be reduced by the semiconductor refrigeration piece 3 during the circulation process, avoiding the influence of the cooling heat exchange effect caused by the high temperature of the cooling liquid during the circulation process.

[0025] It is worth noting that, referring to Figure 2 , the front end of the cooling liquid tank 203 is provided with a work computer 209.

[0026] It is worth mentioning that, referring to Figure 1 The top end of the shell 1 is provided with a crucible body 101, the bottom of the crucible body 101 is provided with a crucible support 102, and the bottom of the crucible support 102 is provided with a crucible support 102 support plate.

[0027] In use of the sapphire crystal in the growth furnace bottom plate protection device, the liquid outlet pump 207 and the liquid suction pump 204 are opened, the liquid suction pump 204 sucks the cooling liquid in the cooling liquid tank 203 into the second concave pipe 208, so that the cooling liquid enters the cooling shell 2 and the plurality of connecting pipes 202, and the liquid suction pump 204 can suck the cooling liquid in the cooling shell 2 into the cooling liquid tank 203, so that the circulation of the cooling liquid is realized. When the cooling liquid circulates in the cooling shell 2, water can enter the two bottom plate insertion grooves 201, and the heat in the bottom plate is taken away, and the heat exchange effect is improved. At the same time, since the connecting pipe 202 is inserted in the bottom plate, when the bottom plate deforms, the connecting pipe 202 can support and limit the bottom plate, so that the bottom plate does not deform. After the cold end of the semiconductor refrigeration piece 3 is attached to the surface of the cooling liquid tank 203, in the process of circulating the cooling liquid, cold air can be generated by opening the semiconductor refrigeration piece 3 to reduce the temperature of the cooling liquid, so that the temperature of the cooling liquid in the circulation process is not too high, and the cooling and heat exchange effect is affected.

[0028] In addition, the components designed in the utility model are general standard components or components known by those skilled in the art, the structure and principle of which can be known by the technical personnel through a technical manual or through a conventional experimental method, and the technical personnel in the art can completely realize it without unnecessary description, and the content protected by the utility model does not involve improvement of the internal structure and method.

[0029] The embodiments of the utility model disclose preferable embodiments, but are not limited thereto, and those skilled in the art can easily understand the spirit of the utility model according to the above-mentioned embodiments, and make different inferences and changes, but as long as the spirit of the utility model is not deviated, it is within the protection scope of the utility model.

Claims

1. A protection device for a growth furnace bottom plate of a sapphire crystal, comprising a housing (1), characterized in that, Also include: The first bottom plate (210) and the second bottom plate (206) are respectively installed at the inner bottom end of the shell (1); The bottom plate protection mechanism is opened at the bottom of the first bottom plate (210) and the top of the second bottom plate (206), and the bottom plate protection mechanism comprises a plurality of first slots (201) and second slots (211), and a plurality of first slots (201) and second slots (211) are respectively opened at the bottom of the first bottom plate (210) and the top of the second bottom plate (206); The first slot (201) and the second slot (211) are inserted with one end of the connecting pipe (202), and the other end of the connecting pipe (202) is communicated with the cooling shell (2).

2. A sapphire crystal growth furnace bottom protection device as claimed in claim 1, wherein, The two sides of the cooling shell (2) are respectively communicated with one end of the first concave pipe (205) and the second concave pipe (208), and the other end of the first concave pipe (205) and the second concave pipe (208) is communicated with the liquid pump (204) and the liquid pump (207) through the shell (1).

3. A sapphire crystal growth furnace bottom protection device as claimed in claim 2, wherein, The liquid pump (204) and the liquid pump (207) are communicated with the cooling liquid tank (203) away from one end of the first concave pipe (205) and the second concave pipe (208).

4. A protection device for the bottom plate of a growth furnace for sapphire crystals as claimed in claim 3, characterized in that The two sides of the front end of the cooling liquid tank (203) are respectively installed with the semiconductor refrigeration sheet (3), and the cold end of the semiconductor refrigeration sheet (3) is attached to the surface of the cooling liquid tank (203).

5. A protection device for the bottom plate of a growth furnace for sapphire crystals as claimed in claim 3, characterized in that The front end of the cooling liquid tank (203) is installed with the industrial computer (209).

6. A sapphire crystal growth furnace bottom protection device as claimed in claim 1, wherein, The inside top end of the shell (1) is installed with the crucible main body (101), the bottom of the crucible main body (101) is installed with the crucible support (102), and the bottom of the crucible support (102) is installed with the crucible support (102) support disc.

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