Rapid water making device and water purifier

Abstract

The utility model discloses a rapid water making device and a water purifier, and belongs to the technical field of water purification, the rapid water making device comprises a water box, a semiconductor refrigeration part and a heat dissipation assembly, a first water flow channel is formed in the water box, the first water flow channel is bent and extends, the semiconductor refrigeration part is attached to the water box, and the heat dissipation assembly is connected with the semiconductor refrigeration part. The semiconductor refrigeration piece can transfer heat or cold to the water box; the heat dissipation assembly is arranged on the side, away from the water box, of the semiconductor refrigeration part, a second water flow channel is formed in the heat dissipation assembly, and the second water flow channel extends in a bent mode. The water purifier comprises a purifier body and the rapid water making device, a filtering assembly is arranged in the purifier body, and the rapid water making device is located in the purifier body. Due to the fact that the semiconductor refrigeration part is adopted, heat or cold transferred to the water box by the semiconductor refrigeration part can be changed by changing the power-on state, occupied space is reduced, cost is reduced, and water can be quickly refrigerated and heated.

Description

TECHNICAL FIELD

[0001] The utility model relates to water purification technical field especially, relate to a kind of fast water device and water purifier. BACKGROUND

[0002] The existing water purifier integrates multiple functions, such as water purification and drinking function, heating function, fast water outlet function, etc. The water purifier with fast water outlet function adopts a compressor refrigeration system, which drives the refrigerant to circulate into the evaporator for phase change evaporation and heat absorption by suction and compression of the compressor, and the local part of the evaporator contacts the water in the water box, thereby realizing the process of refrigerated water. The structure of the compressor refrigeration system is complex, occupies a large space and has high cost. SUMMARY

[0003] The utility model aims at providing a kind of fast water device and water purifier to solve the technical problems of complex structure, large space occupation and high cost of compressor refrigeration system in the prior art when fast water is adopted.

[0004] According to the above idea, the technical scheme adopted by the utility model is as follows:

[0005] A fast water device includes:

[0006] A water box, the inside of the water box forms a first water flow channel, and the first water flow channel is bent and extended;

[0007] A semiconductor refrigerating component is attached to the water box, and the semiconductor refrigerating component can transfer heat or cold to the water box;

[0008] A heat dissipation assembly is arranged on the side of the semiconductor refrigerating component away from the water box, the inside of the heat dissipation assembly forms a second water flow channel, and the second water flow channel is bent and extended.

[0009] As a preferred embodiment, the water box is flat and attached to the semiconductor refrigerating component face to face.

[0010] As a preferred embodiment, the semiconductor refrigerating component is provided with two groups, and the water box is clamped between the two groups of semiconductor refrigerating components.

[0011] As a preferred embodiment, the water box includes two box covers arranged at intervals and a box body arranged between the two box covers, the box cover and the box body enclose a water storage cavity, the box cover is a metal component and is attached to the semiconductor refrigerating component.

[0012] As a preferred embodiment, the heat dissipation assembly includes at least two heat sinks, each group of semiconductor refrigerating components is provided with a heat sink on the side away from the water box, and the heat sinks on both sides of the water box are connected in series through an adapter pipeline to form the second water flow channel.

[0013] As preferred, the heat dissipating assembly comprises a heat sink, which is flat and is in surface-to-surface contact with the semiconductor refrigerating piece.

[0014] As preferred, the heat sink comprises a first cover plate and a second cover plate which are detachably connected, the first cover plate and the second cover plate enclose a heat dissipating cavity, the first cover plate is a metal piece and is in contact with the semiconductor refrigerating piece, a plurality of second fins are arranged on the inner wall of the first cover plate, and the second cover plate is a plastic piece.

[0015] As preferred, the first water flow channel extends from one end of the water box to the other end of the water box along a first direction, and the second water flow channel extends from one end of the heat sink to the other end of the heat sink along a second direction, and the second direction is perpendicular to the first direction.

[0016] A water purifier comprises a machine body and the rapid water making device as described above, the machine body is internally provided with a filtering assembly, and the rapid water making device is located in the machine body.

[0017] As preferred, the waste water outlet of the filtering assembly can supply waste water which has passed through the heat dissipating assembly once to the heat dissipating assembly.

[0018] The beneficial effects of the present application are as follows:

[0019] The rapid water making device provided by the present application has the following advantages: the inside of the water box forms a first water flow channel, the first water flow channel is bent and extended, so as to increase the contact area between the water flow inside the water box and the semiconductor refrigerating piece and improve the water making efficiency; the heat dissipating assembly takes away the heat of the semiconductor refrigerating piece, the inside of the heat dissipating assembly forms a second water flow channel, the second water flow channel is bent and extended, so as to increase the contact area between the water flow inside the heat dissipating assembly and the semiconductor refrigerating piece and further improve the water making efficiency, and ensure the smooth rapid water making; since the semiconductor refrigerating piece is adopted, the heat or cold quantity transferred from the semiconductor refrigerating piece to the water box can be changed by changing the power-on state, the space occupation is reduced and the cost is lowered, the rapid chilled water and the rapid hot water can be made. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Fig. 1 is a structural schematic view of a rapid water making device according to an embodiment of the present application;

[0021] Figure 2 Fig. 2 is a side view of the rapid water making device according to the embodiment of the present application;

[0022] Figure 3 Fig. 3 is a sectional view of A-A of the rapid water making device according to the embodiment of the present application; Figure 2

[0023] Figure 4 Fig. 4 is a sectional view of B-B of the rapid water making device according to the embodiment of the present application; and Figure 2 ​B-B toward sectional view of figure

[0024] Figure 5 C-C toward sectional view of figure Figure 2 C-C toward sectional view of figure

[0025] Figure 6 D toward enlarged view of figure Figure 5 D toward enlarged view of figure

[0026] Figure 7 Figure is structural schematic view of water box provided by embodiment one of the utility model;

[0027] Figure 8 Figure is structural schematic view of water box and semiconductor refrigeration piece cooperation provided by embodiment one of the utility model;

[0028] Figure 9 Figure is structural schematic view of heat dissipation assembly provided by embodiment one of the utility model;

[0029] Figure 10 Figure is structural schematic view of quick water making device provided by embodiment two of the utility model;

[0030] Figure 11 Figure is side view of quick water making device provided by embodiment two of the utility model.

[0031] Figure:

[0032] 10, water box;11, first water flow passage;111, first water inlet;112, first water outlet;113, first flow guide port;12, box body;13, box cover;14, first fin;15, first sealing ring;16, accommodating groove;

[0033] 20, semiconductor refrigeration piece;

[0034] 30, heat dissipation assembly;31, second water flow passage;311, second water inlet;312, second water outlet;313, second flow guide port;32, radiator;321, first cover plate;322, second cover plate;323, second fin;3231, second flow guide fin;3232, second shunt fin;324, second sealing ring;33, adapter pipeline. DETAILED DESCRIPTION

[0035] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the utility model, and cannot be understood as the limitation of the utility model.

[0036] In the description of the utility model, unless another definite provision and limitation, the term "connect", "connection", "fixed" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integral ; can be mechanical connection, also can be electrical connection ; can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication or the interaction of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according of the specific circumstances.

[0037] In the utility model, unless another definite provision and limitation, the first feature is "on" or "under" the second feature can include the first and second features direct contact, also can include the first and second features is not direct contact but is through the contact between other features of them. Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than the second feature. The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than the second feature.

[0038] The technical scheme of the utility model is further illustrated below by specific embodiments in conjunction with the drawings.

[0039] Embodiment one

[0040] Referring to Figures 1 to 9 , the embodiment provides a kind of fast water device, including water box 10, semiconductor refrigeration piece 20 and heat dissipation component 30, the inside of water box 10 forms first water flow passage 11, and first water flow passage 11 is bent and extends;Semiconductor refrigeration piece 20 is attached with water box 10, and semiconductor refrigeration piece 20 can transfer heat or cold to water box 10;Heat dissipation component 30 is set to one side of semiconductor refrigeration piece 20 away from water box 10, and the inside of heat dissipation component 30 forms second water flow passage 31, and second water flow passage 31 is bent and extends.

[0041] By setting first water flow passage 11 bent and extends, to increase the contact area of the water flow in water box 10 and semiconductor refrigeration piece 20, improve water production efficiency;Heat of semiconductor refrigeration piece 20 is taken away by heat dissipation component 30, and the inside of heat dissipation component 30 forms second water flow passage 31, and second water flow passage 31 is bent and extends, to increase the contact area of the water flow in heat dissipation component 30 and semiconductor refrigeration piece 20, further improve water production efficiency, guarantee that fast water production is successfully carried out. Since semiconductor refrigeration piece 20 is used, heat or cold can be transferred to water box 10 by changing energization state, reduce space occupation and reduce cost, both can quickly refrigerate water, and also can quickly heat water.

[0042] The shape of the water box 10 can be set according to actual needs, such as a cuboid or a cylinder. In the embodiment, the water box 10 is flat and is in surface-to-surface contact with the semiconductor refrigeration element 20 to increase the contact area and improve the heat exchange efficiency. Specifically, the water box 10 is flat and rectangular.

[0043] The heat dissipation assembly 30 and the water box 10 can be locked by a locking member to fix the semiconductor refrigeration element 20. For example, the locking member is a conventional bolt.

[0044] The semiconductor refrigeration element 20 includes a plurality of semiconductor refrigeration pieces, each of which has a first side and a second side arranged oppositely, the first side being in contact with the heat dissipation assembly 30, and the second side being in contact with the water box 10. In different power-on states, one of the first side and the second side is a hot end and the other is a cold end. When refrigerating water, the second side is the cold end to transfer cold to the water box 10, and the first side is the hot end to use the heat dissipation assembly 30 to take away heat. When heating water, the second side is the hot end to transfer heat to the water box 10, and the first side is the cold end to use the heat dissipation assembly 30 to take away cold.

[0045] The number and size of the semiconductor refrigeration pieces can be set according to actual needs to ensure that the plurality of semiconductor refrigeration pieces can be in contact with the water box 10 to achieve sufficient heat exchange. The working principle of the semiconductor refrigeration piece is conventional technology, which will not be described here.

[0046] The first water flow channel 11 has a first water inlet 111 and a first water outlet 112, and the rapid water making device further includes a first water supply assembly for supplying water to the water box 10. For example, the first water supply assembly includes a first water pump and a first water supply pipe, one end of the first water supply pipe being connected to the first water pump, and the other end of the first water supply pipe being in communication with the first water inlet 111. When rapid water making is needed, the first water pump is turned on to guide water flow along the first water supply pipe into the first water inlet 111 and then out of the first water outlet 112 through the bent first water flow channel 11. Optionally, a flow meter is arranged on the first water supply pipe to monitor the flow of water supplied to the water box 10, so as to stop water injection in time.

[0047] The water box 10 has an integrated structure or a detachable structure. The first water flow channel 11 is bent to extend to lengthen the water flow path. For example, the first water flow channel 11 extends in an S shape, or the first water flow channel 11 extends in a reciprocating and bending manner. In the embodiment, the water box 10 includes a box body 12 and a box cover 13 which are detachably connected, the box body 12 and the box cover 13 enclosing a water storage cavity, a plurality of first fins 14 being arranged in the water storage cavity in a spaced manner, and the plurality of first fins 14 enclosing the reciprocating and bending first water flow channel 11. Through the detachable connection, the water box 10 is convenient to install, disassemble and maintain.

[0048] Optionally, the box body 12 and the box cover 13 can be locked by a locking member. For example, the locking member is a bolt. Optionally, the box body 12 and the box cover 13 are clamped. Optionally, the box cover 13 is embedded in one side of the box body 12, so that the box cover 13 and the edge of the box body 12 form a containing groove 16, and the semiconductor refrigeration element 20 is arranged in the containing groove 16, and the containing groove 16 limits the semiconductor refrigeration element 20.

[0049] The first sealing ring 15 is arranged between the box body 12 and the box cover 13 to ensure the sealing of the water storage cavity. For example, the first installation groove is arranged on the box body 12, and the first sealing ring 15 is inserted into the first installation groove and abuts against the box cover 13.

[0050] In the embodiment, the box cover 13 is attached to the semiconductor refrigeration element 20, and the box cover 13 is a metal member to improve the heat transfer efficiency, for example, an aluminum member or a stainless steel member. The first fin 14 can be made of metal to improve the heat transfer efficiency. For example, the box cover 13 and the first fin 14 are integrally formed, and the first fin 14 has a strong heat exchange effect. For example, the box body 12 is made of plastic to reduce the weight. In other embodiments, the box cover 13, the box body 12 and the first fin 14 are metal members.

[0051] In the embodiment, a plurality of first fins 14 are arranged in parallel and spaced apart in the water storage cavity, one end of the first fin 14 is sealingly connected to the inner wall of the water storage cavity, the other end of the first fin 14 is spaced apart from the inner wall of the water storage cavity to form a first flow port 113, and a plurality of first flow ports 113 are arranged alternately on opposite sides of the water storage cavity. The water flow entering from the first water inlet 111 can flow along the first fin 14 to the first flow port 113, and then flow through the two sides of each first fin 14 and flow out from the first water outlet 112. The more the number of first fins 14, the more tortuous the first water flow channel 11, so as to prolong the residence time of the water flow in the first water flow channel 11 and improve the heat exchange efficiency.

[0052] In other embodiments, a plurality of first fins 14 are arranged in parallel and spaced apart in the water storage cavity, one end of part of the first fins 14 is sealingly connected to the inner wall of the water storage cavity to form a first flow fin, the other end of the first flow fin is spaced apart from the inner wall of the water storage cavity to form a first flow port 113, a plurality of first flow ports 113 are arranged alternately on opposite sides of the water storage cavity, both ends of part of the first fins 14 are spaced apart from the inner wall of the water storage cavity to form a first shunt fin, and the first shunt fin is arranged between two adjacent first flow fins. By arranging the first shunt fin, the water flow is divided into at least two paths when flowing between adjacent first flow ports 113, the contact between the water flow and the first shunt fin increases the heat exchange area, and the heat exchange efficiency is improved.

[0053] The second water flow channel 31 has a second water inlet 311 and a second water outlet 312. The rapid water making device further comprises a second water supply assembly for supplying water to the heat dissipation assembly 30. For example, the second water supply assembly comprises a second water pump and a second water supply pipe. One end of the second water supply pipe is connected to the second water pump, and the other end of the second water supply pipe is in communication with the second water inlet 311. When rapid water making is needed, the second water pump is started to guide the water flow along the second water supply pipe into the second water inlet 311, and then out of the second water outlet 312 through the second water flow channel 31.

[0054] In a conventional arrangement, a circulating pump is used to drive the water flow into and out of the heat dissipation assembly 30. The water flow out of the heat dissipation assembly 30 is then driven by the circulating pump to re-enter the heat dissipation assembly 30, thereby achieving water flow circulation. Due to water flow circulation, the heated water is used multiple times, resulting in a decrease in heat dissipation effect.

[0055] In the present embodiment, the second water supply assembly guides the water flow to pass through the heat dissipation assembly 30 only once and then be discharged. The water flow passes through the heat dissipation assembly 30 only once and is not recycled, that is, the water flow enters the heat dissipation assembly 30 from the second water inlet 311 and exits the heat dissipation assembly 30 from the second water outlet 312. The water flow out of the second water outlet 312 will not re-enter the heat dissipation assembly 30 from the second water inlet 311. The water flow is not circulated and is directly discharged after flowing through the heat dissipation assembly 30. A sufficient water source is needed to continuously supply water to the second water inlet 311. During the process of the water flow passing through the second water flow channel 31, the water flow carries away heat, causing the heated water to be discharged, thereby ensuring the heat dissipation effect.

[0056] For example, the second water supply assembly comprises a water inlet valve and a water outlet valve. The water inlet valve is arranged upstream of the second water inlet 311, and the water outlet valve is arranged downstream of the second water outlet 312. In use, both the water inlet valve and the water outlet valve are opened. The water pressure of the water inlet is used to cause the water flow to enter the heat dissipation assembly 30 from the second water inlet 311 and exit from the second water outlet 312. For example, the second water supply assembly comprises a second water pump and a second water supply pipe. One end of the second water supply pipe is connected to the second water pump, and the other end of the second water supply pipe is in communication with the second water inlet 311 of the heat dissipation assembly 30. When heat dissipation is needed, the second water pump is started to guide the water flow along the second water supply pipe into the heat dissipation assembly 30.

[0057] The heat dissipation assembly 30 comprises a heat sink 32. The shape of the heat sink 32 can be arranged according to actual needs. In the present embodiment, the heat sink 32 is flat and face-to-face adheres to the semiconductor refrigeration element 20, so as to increase the contact area of the heat sink 32 and the semiconductor refrigeration element 20 and improve the heat dissipation efficiency. The heat sink 32 achieves heat dissipation through water cooling, and the heat sink 32 can also be assisted by a fan to dissipate heat. In other embodiments, the heat sink 32 can be a heat pipe type heat sink.

[0058] The number and size of the heat sink 32 can be set according to actual needs. In the embodiment, one heat sink 32 is arranged on the side of the semiconductor refrigerator 20 away from the water box 10. Preferably, the area of the heat sink 32 is not less than the area of the semiconductor refrigerator 20 to ensure a large contact area and improve heat exchange efficiency. In other embodiments, a plurality of heat sinks 32 are arranged on the side of the semiconductor refrigerator 20 away from the water box 10. Preferably, the total area of the plurality of heat sinks 32 is not less than the area of the semiconductor refrigerator 20 to ensure a large contact area and improve heat exchange efficiency. The plurality of heat sinks 32 can be connected in parallel or in series. One set of second water supply assemblies can be arranged for one heat sink 32, or two heat sinks 32 can share one set of second water supply assemblies.

[0059] The heat sink 32 adopts an integrated structure or a detachable structure. The second water flow channel 31 is bent to extend to lengthen the water flow path. For example, the second water flow channel 31 extends in an S shape, or the second water flow channel 31 extends in a reciprocating bending manner. In the embodiment, the heat sink 32 includes a first cover plate 321 and a second cover plate 322 detachably connected, the first cover plate 321 and the second cover plate 322 surround a heat dissipation cavity, and a plurality of second fins 323 are arranged on the inner wall of the first cover plate 321. For example, the plurality of second fins 323 are arranged at intervals to surround the reciprocating bending second water flow channel 31. Through the detachable connection mode, the heat sink 32 is convenient to install, disassemble and maintain.

[0060] The first cover plate 321 and the second cover plate 322 can be locked by a locking member. For example, the locking member adopts an existing bolt. A second sealing ring 324 is arranged between the first cover plate 321 and the second cover plate 322 to ensure the sealing property of the heat dissipation cavity. For example, a second mounting groove is formed in the second cover plate 322, and the second sealing ring 324 is inserted into the second mounting groove and abuts against the first cover plate 321.

[0061] In the embodiment, the first cover plate 321 is attached to the semiconductor refrigerator 20, and the first cover plate 321 is a metal piece to improve heat transfer efficiency, for example, an aluminum piece or a stainless steel piece. The second fin 323 can be made of metal to improve heat transfer efficiency. For example, the first cover plate 321 and the second fin 323 are integrally formed, and the second fin 323 has a strong heat exchange effect. For example, the second cover plate 322 is a plastic piece, that is, is made of plastic to reduce weight. In other embodiments, the second cover plate 322, the first cover plate 321 and the second fin 323 are metal pieces.

[0062] Optionally, a plurality of second fins 323 are arranged in parallel and spaced apart in the heat dissipation cavity, one end of the second fin 323 is sealingly connected with the inner wall of the heat dissipation cavity, the other end of the second fin 323 is arranged spaced apart from the inner wall of the heat dissipation cavity to form a second flow port 313, and a plurality of second flow ports 313 are arranged alternately on opposite sides of the heat dissipation cavity. The water flow entering from the second water inlet 311 can flow along the second fin 323 to the second flow port 313, and then flow through the two sides of each second fin 323 in turn and flow out from the second water outlet 312. The more the number of second fins 323 arranged, the more tortuous the second water flow channel 31 is, so as to prolong the residence time of water flow in the second water flow channel 31 and improve the heat exchange efficiency.

[0063] Optionally, a plurality of second fins 323 are arranged in parallel and spaced apart in the heat dissipation cavity, one end of the second fin 323 is sealingly connected with the inner wall of the heat dissipation cavity to form a second flow fin 3231, the other end of the second flow fin 3231 is arranged spaced apart from the inner wall of the heat dissipation cavity to form a second flow port 313, a plurality of second flow ports 313 are arranged alternately on opposite sides of the heat dissipation cavity, both ends of part of the second fins 323 are arranged spaced apart from the inner wall of the heat dissipation cavity to form a second shunt fin 3232, and the second shunt fin 3232 is arranged between two adjacent second flow fins 3231. By arranging the second shunt fin 3232, the water flow is divided into at least two paths when flowing between adjacent second flow ports 313, the contact between the water flow and the second shunt fin 3232 increases the heat exchange area, and the heat exchange efficiency is improved.

[0064] For the water box 10, the first water inlet 111 and the first water outlet 112 are arranged spaced apart at opposite ends of the water box 10 along a first direction, and the first water flow channel 11 extends from one end of the water box 10 to the other end of the water box 10 along the first direction; the second water inlet 311 and the second water outlet 312 are arranged spaced apart at opposite ends of the radiator 32 along a second direction, and the second water flow channel 31 extends from one end of the radiator 32 to the other end of the radiator 32 along the second direction, and the second direction is perpendicular to the first direction. The first water flow channel 11 and the second water flow channel 31 not only extend tortuously, but also have different flow directions, so as to ensure the water production efficiency and the heat dissipation effect. Figure 3 and Figure 4 In X represents the first direction, and Y represents the second direction.

[0065] Embodiment two

[0066] Figure 10 and Figure 11Embodiment two is shown, wherein the same or corresponding parts as in embodiment one are designated with the same reference numerals. For the sake of brevity, only the differences between embodiment two and embodiment one are described. The difference is that the semiconductor refrigeration device 20 is provided in two groups, and the water box 10 is flat and sandwiched between the two groups of semiconductor refrigeration devices 20. Since the semiconductor refrigeration devices 20 are provided on both sides of the water box 10 and the water box 10 is flat, the heat exchange efficiency can be greatly improved.

[0067] The water box 10 includes two box covers 13 arranged at intervals and a box body 12 arranged between the two box covers 13, and the box cover 13 and the box body 12 enclose a water storage cavity. The box cover 13 is a metal piece and is attached to the semiconductor refrigeration device 20. A first sealing ring 15 is arranged between the box body 12 and the box cover 13 to ensure the sealing of the water storage cavity. Exemplarily, a first mounting groove is formed on the box body 12, and the first sealing ring 15 is inserted into the first mounting groove and abuts against the box cover 13.

[0068] For the two groups of semiconductor refrigeration devices 20, one group of semiconductor refrigeration devices 20 is attached to one box cover 13, and the other group of semiconductor refrigeration devices 20 is attached to the other box cover 13.

[0069] The heat dissipation assembly 30 includes at least two heat sinks 32, and each group of semiconductor refrigeration devices 20 is provided with a heat sink 32 away from the water box 10. The heat sinks 32 on both sides of the water box 10 are connected in series through an adapter pipe 33 to form a second water flow channel 31. The heat sink 32 and the adapter pipe 33 cooperate to form the second water flow channel 31. The heat sink 32 can be provided with fins or not, which is beneficial to simplify the structure of the heat sink 32.

[0070] The adapter pipe 33 extends in a bent manner, which can extend in a U-shaped manner or an arc-shaped manner to avoid interfering with the semiconductor refrigeration device 20.

[0071] The number and size of the heat sinks 32 provided on each group of semiconductor refrigeration devices 20 can be set according to actual needs. For each group of semiconductor refrigeration devices 20, one group of heat sinks 32 can be provided, or multiple groups of heat sinks 32 can be provided. Exemplarily, one heat sink 32 is provided on each group of semiconductor refrigeration devices 20 away from the water box 10, and two heat sinks 32 can be connected in series or in parallel. One group of second water supply assemblies can be provided for one group of heat sinks 32, or two groups of heat sinks 32 can share one group of second water supply assemblies. In this embodiment, the two heat sinks 32 are connected in series through the adapter pipe 33, and therefore can share one group of second water supply assemblies.

[0072] Embodiment three

[0073] The embodiment provides a water purifier, which comprises a machine body and the rapid water making device of any one of the above embodiments, a filter assembly is arranged in the machine body, and the rapid water making device is located in the machine body. The water outlet of the filter assembly can be communicated with the first water pump of the first water supply assembly, so that the water used in the water box 10 is purified water.

[0074] In some embodiments, the waste water outlet of the filter assembly can supply the waste water through the heat dissipation assembly 30 once to the heat dissipation assembly 30, so that the waste water is fully utilized. The waste water can flow through the second water flow channel 31 by using its own water pressure or gravity, or the second water supply assembly guides the waste water to pass through the second water flow channel 31 once and be discharged. Since the waste water is not generated in real time, a waste water tank can be arranged, so that the waste water is stored in the waste water tank, and when water is made, the waste water flows through the second water flow channel 31 under the action of gravity, or the second water supply assembly guides the waste water in the waste water tank to pass through the second water flow channel 31 once and be discharged.

[0075] The above embodiments only illustrate the basic principles and characteristics of the present application, and the present application is not limited to the above embodiments. Without departing from the spirit and scope of the present application, various changes and modifications can be made to the present application, and these changes and modifications all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A rapid water production device, characterized by, The application relates to a rapid water making device. The water box (10) is flat and is in surface-to-surface contact with the semiconductor refrigerating element (20). The semiconductor refrigerating element (20) is provided with two groups, and the water box (10) is clamped between the two groups of semiconductor refrigerating elements (20). The water box (10) comprises two box covers (13) arranged at intervals and a box body (12) arranged between the two box covers (13), the box cover (13) and the box body (12) form a water storage cavity, the box cover (13) is a metal piece and is in contact with the semiconductor refrigerating element (20).

2. The point-of-use water treatment device of claim 1, wherein The heat dissipation assembly (30) comprises at least two heat sinks (32), each group of semiconductor refrigerating elements (20) is provided with the heat sink (32) away from the water box (10), and the heat sinks (32) on the two sides of the water box (10) are connected in series through an adapter pipeline (33) to form the second water flow channel (31).

3. The point-of-use water treatment device of claim 2, wherein, The heat dissipation assembly (30) comprises a heat sink (32), the heat sink (32) is flat and is in surface-to-surface contact with the semiconductor refrigerating element (20).

4. The point-of-use water treatment device of claim 3, wherein, The heat sink (32) comprises a first cover plate (321) and a second cover plate (322) which can be detachably connected, the first cover plate (321) and the second cover plate (322) form a heat dissipation cavity, the first cover plate (321) is a metal piece and is in contact with the semiconductor refrigerating element (20), a plurality of second fins (323) are arranged on the inner wall of the first cover plate (321), and the second cover plate (322) is a plastic piece.

5. The point-of-use water treatment device of claim 3, wherein, The first water flow channel (11) extends from one end of the water box (10) to the other end of the water box (10) in a first direction, the second water flow channel (31) extends from one end of the heat sink (32) to the other end of the heat sink (32) in a second direction, and the second direction is perpendicular to the first direction.

6. The point-of-use water treatment device of claim 1, wherein, The application relates to a rapid water making device.

7. The point-of-use water treatment device of claim 6, wherein, The waste water outlet of the filter assembly can supply waste water which passes through the heat dissipation assembly (30) once to the heat dissipation assembly (30).

8. The point-of-use water treatment device of claim 6, wherein, ​ 9. A water purifier characterized by comprising: ​ 10. The water purifier according to claim 9, wherein ​

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