Semiconductor test equipment

Abstract

The utility model discloses a semiconductor test device, which belongs to the test field and comprises a box body, a fixed frame, a piece to be cooled and a fan. The fixed frame is connected in the box body, and the fan is connected to the box body; one side of the fixed frame and the box body form an air inlet channel, and the opposite side of the fixed frame and the box body form an air outlet channel; the fixing frame comprises an air inlet hole communicated with the air inlet channel and an air outlet hole communicated with the air outlet channel, the box body comprises a plurality of air exhaust holes, and the fan, the air inlet channel, the air inlet hole, the part to be cooled, the air outlet channel and the air exhaust holes form a penetrating cooling air channel. The LED lamp has the advantage of being good in heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of semiconductor test technical field, and especially a kind of semiconductor test equipment. BACKGROUND

[0002] With the development of technology, the application of power semiconductor IGBT, MOSFET module gradually popular. In the process of device development, manufacturing process and application, its reliability needs to be evaluated. In the test process, different power conditions need to be applied to the measured piece to measure its performance under certain power conditions, such as insulation capacity and conduction loss information.

[0003] In the test process, the connection of the measured piece and different test units needs to be switched constantly, so a large number of relays are needed to support this rapid switching action. In the use process, the current flowing through the coil and load current of the relay will generate a lot of heat, which will cause the temperature of the relay to rise and affect the service life.

[0004] Providing a suitable heat dissipation channel for the relay can greatly reduce the problem of reduced equipment life caused by heat accumulation.

[0005] The information disclosed in this background section is intended only to increase an understanding of the general background of the present utility model and should not be construed as an acknowledgment or any form of suggestion that this information has been known or is public knowledge in the art before the present utility model. SUMMARY

[0006] The technical problem to be solved by the present utility model is to solve the problem of reduced equipment life caused by poor heat dissipation of relays in current semiconductor module testing.

[0007] The present utility model solves the above technical problems by the following technical means:

[0008] A semiconductor test device, comprising a box body, a fixed frame, a heat dissipation piece, and a fan. The fixed frame is connected inside the box body, and the fan is connected to the box body to form an air inlet end. The heat dissipation piece is connected to the fixed frame.

[0009] One side of the fixed frame forms an air inlet channel with the box body, and the opposite side of the fixed frame forms an air outlet channel with the box body. The fixed frame includes an air inlet hole for the air inlet channel and an air outlet hole for the air outlet channel. The box body includes a plurality of air outlet holes. The fan, air inlet channel, air inlet hole, heat dissipation piece, air outlet channel, and air outlet hole form a through heat dissipation air duct.

[0010] The utility model discloses, fan introduces the wind of outside into the box, enters the air inlet channel, and the air inlet channel introduces the wind from the air inlet hole on fixed frame into the heat dissipation piece, and the heat is taken away after passing the gap of heat dissipation piece, and the hot air is discharged from the air outlet, enters the air outlet channel, and the hot air of air outlet channel is discharged from the exhaust hole on the box. The fan and air inlet channel, air inlet hole, heat dissipation piece, air outlet channel, exhaust hole form the heat dissipation air duct of through -penetration, because air inlet channel and air outlet channel are located on the opposite side of fixed frame, and the wind is limited to basically only can along the set channel circulation, thereby flowing through all heat sources, and good heat dissipation effect is possessed.

[0011] Preferably, the top of the fixed frame is spaced apart from the top surface of the box to form an air inlet channel, and the top surface of the fixed frame is provided with a plurality of uniformly distributed air inlet holes, and the air inlet holes are partially or entirely covered by the heat dissipation piece.

[0012] Preferably, the bottom of the fixed frame is spaced apart from the bottom surface of the box to form an air outlet channel, and the bottom surface of the fixed frame is provided with a plurality of uniformly distributed air outlet holes, and the air outlet holes are partially or entirely covered by the heat dissipation piece.

[0013] The air inlet holes and the air outlet holes are uniformly arranged and substantially cover the position of the relay board set, so that the heat dissipation is more uniform.

[0014] Preferably, the box comprises at least two support frames, the support frames are fixed at both ends of the bottom surface of the box, the both ends of the fixed frame are connected to the support frames, and the air outlet channel is formed between the fixed frame and the support frames.

[0015] The air outlet channel can avoid the problem of poor air outlet effect caused by the misalignment of the air outlet hole and the exhaust hole, and reduce the entry of external dust into the box.

[0016] Preferably, the bottom surface of the box comprises a plurality of uniformly distributed exhaust holes.

[0017] Preferably, the fixed frame has a rectangular cavity structure, and the both ends of the fixed frame have a sealing shape.

[0018] Preferably, the heat dissipation piece comprises at least one relay board set; a relay exchange air duct is formed between adjacent relay board sets, the relay exchange air duct is directly connected to the air inlet channel through the air inlet hole, and the relay exchange air duct is directly connected to the air outlet channel through the air outlet.

[0019] Preferably, the relay board set comprises a mounting plate and a relay body, the relay body is connected to the mounting plate, and the top surface and / or the bottom surface inside the fixed frame comprises a mounting groove, and the mounting plate is connected to the mounting groove.

[0020] Preferably, the end of the box includes an air inlet grid, and the fan is installed at the air inlet grid.

[0021] Preferably, the fan is connected to one side of the end of the box, and the side of the fixed frame is arranged in a spaced manner with the side of the box to form a lateral air duct, and the fan is aligned with the lateral air duct.

[0022] After the lateral air duct is arranged, the air enters the inside of the fixed frame along the lateral air duct and the air inlet channel of the top, and the air inlet amount is increased.

[0023] The utility model discloses the advantages are:

[0024] In the utility model, the fan introduces the air of outside into the box, enters the air inlet channel, and the air inlet channel introduces the air from the air inlet hole on the fixed frame into the heat dissipation piece, carries away the heat after passing through the gap of the heat dissipation piece, and flows out from the air outlet, enters the air outlet channel, and the hot air of the air outlet channel is discharged from the exhaust hole on the box. The fan and the air inlet channel, the air inlet hole, the heat dissipation piece, the air outlet channel and the exhaust hole form the heat dissipation air duct, and since the air inlet channel and the air outlet channel are located on the opposite sides of the fixed frame, the air is limited to basically only be able to flow along the set channel, so as to flow through all heat sources, and the heat dissipation effect is better.

[0025] The air inlet hole and the air outlet hole are evenly arranged and basically cover the position of the relay board set, so that the heat dissipation is more uniform.

[0026] The air outlet channel can avoid the problem that the air outlet effect is poor due to the misalignment of the air outlet hole and the exhaust hole.

[0027] After the lateral air duct is arranged, the air enters the inside of the fixed frame along the lateral air duct and the air inlet channel of the top, and the air inlet amount is increased.

[0028] The structure is relatively simple, and compared with the state without the heat dissipation system, only the part of holes of the top and the bottom and the fan of the front panel are added, and the influence on the size, weight, manufacturing cost and the like of the equipment is relatively small. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is the sectional view of the semiconductor test equipment of the utility model embodiment;

[0030] Figure 2 It is the front view of the semiconductor test equipment of the utility model embodiment;

[0031] Figure 3 It is Figure 2 the sectional view of B-B in it;

[0032] Figure 4 It is the bottom view of the semiconductor test equipment of the utility model embodiment;

[0033] Numbering on the map:

[0034] 1. Housing; 11. Air inlet grille; 12. Air outlet; 2. Fixing frame; 21. Air inlet; 22. Air outlet; 3. Relay board kit; 4. Fan; 5. Support frame. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] Example 1:

[0037] like Figure 1 As shown, a semiconductor testing device includes a housing 1, a fixed frame 2, multiple relay board kits 3, and a fan 4. The fixed frame 2 is connected inside the housing 1, the relay board kits 3 are connected at intervals inside the fixed frame 2, the fan 4 is connected to the housing 1 to form an air inlet, and the component to be cooled is connected inside the fixed frame 2. One side of the fixed frame 2 forms an air inlet channel with the housing 1, and the opposite side of the fixed frame 2 forms an air outlet channel with the housing 1. The fixed frame 2 includes multiple holes that communicate with the air inlet channel and the air outlet channel, respectively, and the housing 1 includes multiple holes that communicate with the air outlet channel.

[0038] Box 1 is a rectangular box commonly used in existing technology. It can also be deformed to meet the basic requirement of accommodating the internal fixed frame 2.

[0039] In this embodiment, the component to be cooled is the relay board kit 3. However, this application is not limited to cooling a certain type of device and can be extended to other devices that require cooling.

[0040] In this embodiment, there are multiple relay board kits 3, each mounting various large and small relays. Therefore, gaps exist within the relay board kits 3 themselves. However, to ensure heat dissipation, the multiple relay board kits 3 are arranged at intervals, forming relay exchange air ducts between adjacent relay board kits 3. If there is only one relay board kit 3, it is still preferable that a gap is also formed between the relay board kit 3 and the inner wall of the fixing frame 2. In any case, a through-flow heat dissipation air duct is necessary to meet the heat dissipation requirements of the relay board kit 3.

[0041] In this embodiment, the relay board assembly 3 is arranged vertically. Therefore, in order to ensure that the air can enter the relay switching duct smoothly, the air inlet channel and the air outlet channel are set on two sides, or on the top and bottom surfaces. That is, the air inlet channel and the air outlet channel are preferably set on opposite sides, forming a direct through channel with the relay switching duct. In this embodiment, the air inlet channel is set at the top, and the air outlet channel is set at the bottom.

[0042] Specifically, the fixed frame 2 is a rectangular cavity structure, such as... Figure 1 As shown, the two ends of the fixed frame 2 are closed, and the front and rear sides are also closed. This embodiment uses openings on the top and bottom surfaces as an example for illustration. Figure 1 In the middle, the front and rear sides and the left end of the fixed frame 2 are sealed by the fixed frame 2 itself, and the right end is sealed by the fixed plate of the relay board kit 3.

[0043] The top of the fixed frame 2 and the top surface of the box 1 are spaced apart to form an air intake channel.

[0044] The air intake channel can increase the air intake volume, allowing more air to enter between the top surface of the fixed frame 2 and the housing 1, and also ensure that the air intake hole 21 located at the end away from the fan can take in air.

[0045] The top surface of the fixed frame 2 has multiple evenly distributed air inlets 21, and the air inlets 21 partially or completely cover the relay board assembly 3. The bottom of the fixed frame 2 and the bottom surface of the housing 1 are spaced apart to form an air outlet channel, and the bottom surface of the fixed frame 2 has multiple evenly distributed air outlets 22, and the air outlets 22 partially or completely cover the relay board assembly 3.

[0046] It should be noted that the area occupied by the air inlet 21 and the air outlet 22 is preferably able to cover all the relay board kits 3 so that all the relay board kits 3 are cooled by airflow; and each relay board kit 3 is fitted with at least one air inlet 21 and air outlet 22 on its top and bottom.

[0047] Furthermore, the air inlet 21 and air outlet 22 are evenly arranged, making heat dissipation more uniform.

[0048] In this embodiment, the fan 4 is not limited to a specific specification, and can also be replaced by a blower or other device that can introduce air.

[0049] like Figure 1 As shown, it also includes at least two support frames 5, which are fixed parallel to each other at both ends of the bottom surface of the housing 1. The two ends of the fixing frame 2 are connected to the support frames 5, so that an air outlet channel is formed between the bottom surface of the fixing frame 2 and the support frames 5. The support frames 5 have an inverted U-shaped structure, and connecting plates extend from the bottom to both sides.

[0050] The fixed frame 2 forms a suspended state, which has the advantages that, on the one hand, since the air of the air outlet hole 22 also needs to be discharged from the air exhaust hole 12, if the air outlet hole 22 is not completely aligned with the air exhaust hole 12, the air volume is reduced, the heat cannot be discharged in time, and the heat dissipation effect is poor; on the other hand, if the air outlet hole 22 is completely aligned with the air exhaust hole 12, the external dust, impurities and the like are easy to enter the relay board kit 3, and the dust accumulation also easily causes poor heat dissipation effect or affects the test, therefore, the air outlet channel is arranged to ensure the heat dissipation effect.

[0051] As shown in Figure 2 , the end of the box 1 is mainly provided with an air inlet grille 11 at the front panel, and the fan 4 is installed at the air inlet grille 11. Figure 4 As shown in , the bottom surface of the box 1 includes a plurality of uniformly distributed air exhaust holes 12.

[0052] As shown in Figure 1 , the thick solid line in the figure represents the direction of the air, and only the case of passing through one relay exchange channel is shown in the figure, and in actual use, the air can pass through all the relay exchange channels. The fan 4 introduces the external air into the box 1, enters the air inlet channel, and introduces the air from the air inlet hole 21 of the fixed frame 2 into the relay board kit 3, passes through the relay exchange channel between the relay board kit 3, and then carries away the heat of the relay board kit 3, and then enters the air outlet hole 22 of the air outlet channel, and the hot air of the air outlet channel is discharged from the air exhaust hole 12 on the box 1. Since the air inlet channel and the air outlet channel are located on the opposite sides of the fixed frame 2, and the front and back and both ends of the fixed frame 2 are sealed, the air is limited to flow through the above-mentioned channels, so as to flow through all heat sources, and has a good heat dissipation effect.

[0053] Example two:

[0054] As shown in Figure 1 , on the basis of the above-mentioned example one, the relay board kit 3 includes a mounting plate and a relay body, the relay body is connected to the mounting plate, and the mounting plate is vertically connected to the inside of the fixed frame 2; the top surface and / or the bottom surface of the inside of the fixed frame 2 includes a mounting groove, and the mounting plate is connected in the mounting groove.

[0055] The clamping mode is convenient for disassembly and installation.

[0056] The relay body can have large relays and small relays, which can be installed as needed.

[0057] Example three:

[0058] As shown in Figure 3As shown, on the basis of the above-mentioned embodiment one and two, the fan 4 is connected to one side of the end of the box 1, and in the figure, the fan 4 is located at the right side, the side of the fixed frame 2 is arranged in a spaced manner with the side of the box 1 to form a lateral air duct, and the fan 4 is aligned with the lateral air duct.

[0059] After the lateral air duct is arranged, the air will enter the inside of the fixed frame 2 along the lateral air duct and the top air inlet channel, the air inlet amount is improved, and the heat dissipation effect is further improved.

[0060] The fixed frame on the side opposite to the lateral air duct can be arranged in a spaced manner with the box or can be directly connected, and the use is not affected.

[0061] In the above-mentioned embodiment one to embodiment five, the air is introduced from the front panel and flows through all the heat sources (relays) structures; the overall structure is relatively simple, and compared with the state without the heat dissipation system, only the top and bottom parts of holes and the fan 4 of the front panel are added, and the influence on the size, weight, manufacturing cost and the like of the equipment is relatively small.

[0062] The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor testing apparatus, characterized by comprising: Including box, fixed frame, to be radiated part, fan, the fixed frame is connected in the box, the fan is connected on the box and forms the air inlet end, to be radiated part is connected in the fixed frame; The side of the fixed frame forms the air inlet channel with the box, and the opposite side of the fixed frame forms the air outlet channel with the box;The fixed frame includes air inlet holes of the air inlet channel and air outlet holes communicated with the air outlet channel, and the box includes a plurality of exhaust holes, and the fan forms a through heat dissipation air duct with the air inlet channel, the air inlet hole, the to-be-radiated part, the air outlet channel and the exhaust hole.

2. The semiconductor testing apparatus according to claim 1, wherein The top of the fixed frame is spaced apart from the top surface of the box to form an air inlet channel, and a plurality of uniformly distributed air inlet holes are formed in the top surface of the fixed frame, and the air inlet hole is partially or entirely covered by the to-be-radiated part.

3. The semiconductor testing apparatus according to claim 1, wherein The bottom of the fixed frame is spaced apart from the bottom surface of the box to form an air outlet channel, and a plurality of uniformly distributed air outlet holes are formed in the bottom surface of the fixed frame, and the air outlet hole is partially or entirely covered by the to-be-radiated part.

4. The semiconductor testing apparatus according to claim 1 or 3, wherein The box includes at least two support frames, the support frames are fixed at both ends of the bottom surface of the box, the fixed frame is connected with the support frames, and the air outlet channel is formed between the fixed frame and the support frames.

5. The semiconductor testing apparatus according to claim 1, wherein The bottom surface of the box includes a plurality of uniformly distributed exhaust holes.

6. The semiconductor testing apparatus according to claim 1, wherein The fixed frame is in a rectangular cavity structure, and the two ends of the fixed frame are in a sealing shape.

7. The semiconductor testing apparatus according to claim 1, wherein The to-be-radiated part includes at least one relay board kit;Adjacent relay board kits form a relay exchange air duct, which is directly connected with the air inlet channel through the air inlet hole, and is directly connected with the air outlet channel through the air outlet hole.

8. A semiconductor testing apparatus according to claim 7, wherein The relay board kit includes a mounting plate and a relay body, the relay body is connected to the mounting plate, and the top surface or / and the bottom surface inside the fixed frame includes a mounting groove, and the mounting plate is connected in the mounting groove.

9. The semiconductor testing apparatus according to claim 1, wherein The end of the box includes an air inlet grid, and the fan is installed at the air inlet grid.

10. The semiconductor testing apparatus according to claim 1, wherein The fan is connected to one side of the end of the box, the side surface of the fixed frame is spaced apart from the side surface of the box to form a lateral air duct, and the fan is aligned with the lateral air duct.

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