Industrial embedded computer back heat dissipation structure

Abstract

The utility model relates to the technical field of embedded computers, and discloses an industrial embedded computer back heat dissipation structure which is provided with a cleaning mechanism and a fixing mechanism, the cleaning mechanism is used for cleaning dust on a heat conduction plate, and the fixing mechanism is used for assisting in fixing a computer. The problems that although an existing industrial embedded computer has excellent performance in the aspects of high reliability, low power consumption, severe environment resistance and the like, the design of a heat dissipation system still has obvious defects, and particularly in the aspect of dust cleaning, the traditional design usually ignores the problem that dust is prone to being accumulated in heat dissipation holes in the long-time operation process are solved. The problems that heat dissipation efficiency is greatly reduced, the overall performance and the service life of equipment are affected, and due to the fact that an effective automatic cleaning mechanism is lacked, a user has to manually clean heat dissipation holes irregularly, maintenance cost is increased, and the equipment is possibly damaged due to misoperation are solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to embedded computer technical field, especially related to an industrial embedded computer back heat dissipation structure. BACKGROUND

[0002] Industrial embedded computer is a kind of computing device specially designed for long time stable operation under harsh environmental conditions, is widely used in manufacturing, energy management, transportation, medical equipment and environmental monitoring and many other industrial fields, unlike traditional personal computer, industrial embedded computer usually has compact appearance design and highly integrated hardware configuration, can provide powerful computing capacity in limited space.

[0003] The existing industrial embedded computer lacks a back heat dissipation structure capable of cleaning dust, and the above-mentioned technology has the problems of: the existing industrial embedded computer, although it performs well in high reliability, low power consumption and resistance to harsh environment, still has significant deficiencies in the design of the heat dissipation system, especially in dust cleaning, the traditional design usually ignores the problem that the heat dissipation holes are easy to accumulate dust during long time operation, which will cause the heat dissipation efficiency to decrease greatly, and then affect the overall performance and life of the equipment, due to the lack of effective automatic cleaning mechanism, users have to clean the heat dissipation holes manually regularly, which not only increases the maintenance cost, but also may cause equipment damage due to improper operation, in addition, dust accumulation will also increase the working load of the radiator and fan, further aggravating the risk of equipment overheating. UTILITY MODEL CONTENTS

[0004] In view of the problems existing in the prior art, the utility model provides an industrial embedded computer back heat dissipation structure which can overcome the above problems or at least partially solve the above problems.

[0005] The utility model is realized in this way, an industrial embedded computer back heat dissipation structure, including computer, heat conduction plate, mounting plate, radiator and heat dissipation hole, the computer rear side surface is contacted with the heat conduction plate front side surface, the heat conduction plate rear side surface is fixedly connected with the mounting plate front side surface through bolt, the mounting plate inner wall is fixedly connected with the radiator surface, the heat dissipation hole is through and is established in heat conduction plate front side, the heat conduction plate inside is provided with cleaning mechanism, the heat conduction plate front side is provided with fixed mechanism;

[0006] The cleaning mechanism is used for cleaning the dust on the heat conduction plate;

[0007] The fixed mechanism is used for assisting the fixation of the computer.

[0008] In order to improve the efficiency of cleaning, preferably, the cleaning mechanism comprises a cleaning motor, a transmission screw, a connecting block, a fixed plate, an elastic block, a support plate and a cleaning plate, the output end of the cleaning motor is fixedly connected with the surface of one end of the transmission screw, the surface of the transmission screw is threadedly connected with the inner wall of the connecting block, the lower end of the connecting block is fixedly connected with the upper surface of the fixed plate, the lower surface of the fixed plate is fixedly connected with the upper surfaces of a plurality of elastic blocks, the lower surface of the elastic block is fixedly connected with the inner wall of the upper side of the support plate, and the lower surface of the support plate is fixedly connected with the upper surface of the cleaning plate. When the cleaning motor drives the transmission screw to rotate, the connecting block is driven to move along the transmission screw through thread cooperation, which not only ensures the accuracy and stability of the movement of the connecting block, but also allows the cleaning speed and intensity to be adjusted to adapt to different cleaning needs.

[0009] In order to improve the stability of installation, preferably, the fixing mechanism comprises telescopic rods, fixed blocks and a connecting rod, the front ends of the two telescopic rods are fixedly connected with the inner walls of the two fixed blocks respectively, and the surfaces of the two fixed blocks are fixedly connected with the end surfaces of the connecting rod. The fixed block serves as a direct contact point between the computer and the heat dissipation system, provides mechanical support, and ensures effective heat conduction through sufficient contact with the surface around the computer.

[0010] In order to improve the reliability of the equipment, preferably, two guide blocks are arranged on the upper end of the fixed plate, a slide rod is arranged in the inner wall of the guide block, the lower surfaces of the two guide blocks are fixedly connected with the surfaces on both sides of the upper end of the fixed plate, and the end surfaces of the two slide rods are fixedly connected with the inner walls of the heat conduction plate. The guide block provides a solid support point for the slide rod, ensures the movement path of the slide rod in the inner wall thereof, and avoids deviation or misalignment caused by external vibration or mechanical impact.

[0011] In order to improve the flexibility of the cleaning process, preferably, the surface of the cleaning motor is fixedly connected with the outer surface of the heat conduction plate, the end surfaces of the transmission screw are rotatably connected with the inner wall of the heat conduction plate, the surface of the support plate is slidably connected with the inner wall of the fixed plate, and the lower surface of the cleaning plate is slidably connected with the surface of the heat dissipation hole. The cleaning plate can maintain stable and consistent pressure distribution during movement, ensure that the cleaning plate can fully cover the surface of the heat dissipation hole, improve the cleaning effect, and have certain flexibility to adapt to different working conditions. When facing heat dissipation holes of different shapes or sizes, the support plate can be adjusted to optimize the contact surface, ensuring the best cleaning performance.

[0012] In order to improve the installation space, preferably, the rear end of the four telescopic rods is respectively fixedly connected with the surface at both ends of the heat conduction plate, the inner surface of the fixed block is in contact with the surface around the computer, the surface of the two connecting rods is in contact with the surface at both ends of the computer, and the telescopic rod is designed to allow the length to be adjusted as required, so that sufficient installation space is provided for the computer, the equipment can be arranged in an optimal manner in a compact space, and the safe and stable operation of the equipment is ensured.

[0013] In order to improve the smooth operation, preferably, the surface of the sliding rod is in sliding connection with the inner wall of the guide block, so that the sliding rod can move along a predetermined accurate path during movement, any component arranged on the sliding rod can be accurately and smoothly moved in a specified range, and operation errors caused by deviation or misalignment are avoided.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] The utility model discloses a cleaning mechanism, fixed mechanism, transmission screw rod, connecting block, fixed plate, elastic block, support plate, cleaning plate, telescopic rod, fixed block and connecting rod are set up, and the cleaning mechanism is used for cleaning the dust on the heat conduction plate, and the fixed mechanism is used for assisting the fixation of the computer, when the transmission screw rod is rotated by the cleaning motor drive, the connecting block is driven to move along the transmission screw rod through the thread cooperation, not only the accuracy and stability of the movement of the connecting block are ensured, but also the cleaning speed and strength are adjusted to adapt to different cleaning demands, the fixed block is the direct contact point between the computer and the heat dissipation system, mechanical support is provided, and through the sufficient contact with the surface around the computer, the effective conduction of heat is ensured, the existing industrial embedded computer is good in high reliability, low power consumption and anti-severe environment, but there is still significant deficiency in the design of the heat dissipation system, especially in the dust cleaning, the traditional design usually ignores the problem that the heat dissipation hole is easy to accumulate dust in the long time operation, which can cause the heat dissipation efficiency to drop greatly, and then the overall performance and service life of the equipment are influenced, because of lacking effective automatic cleaning mechanism, the user has to clean the heat dissipation hole manually regularly, which not only increases the maintenance cost, but also can cause the damage of the equipment due to improper operation, in addition, the dust accumulation can increase the working load of the radiator and the fan, and further aggravate the risk of equipment overheating. ACCURACY

[0016] Fig. 1 It is the main body three-dimensional structure schematic diagram provided by the utility model embodiment;

[0017] Fig. 2 It is the main body vertical section three-dimensional structure schematic diagram provided by the utility model embodiment;

[0018] Fig. 3It is the cleaning mechanism three-dimensional structure schematic view provided by the embodiment of the utility model;

[0019] Fig. 4 It is the fixing mechanism three-dimensional structure schematic view provided by the embodiment of the utility model.

[0020] In the drawing: 1, cleaning mechanism;101, cleaning motor;102, transmission screw;103, connecting block;104, fixed plate;105, elastic block;106, support plate;107, cleaning plate;2, fixing mechanism;201, telescopic rod;202, fixed block;203, connecting rod;3, guide block;4, slide bar;5, computer;6, heat conduction plate;7, mounting plate;8, radiator;9, heat dissipation hole. DETAILED DESCRIPTION

[0021] In order to further understand the invention content, characteristics and efficacy of the utility model, the following examples are cited, and the detailed description is as follows in conjunction with the drawings.

[0022] The structure of the utility model is described in detail below in conjunction with the drawings.

[0023] As Figs. 1 to 4As shown, the utility model discloses a kind of industrial embedded computer back heat dissipation structure, including computer 5, heat conduction plate 6, mounting plate 7, radiator 8 and heat dissipation hole 9, computer 5 rear surface and heat conduction plate 6 front surface contact, heat conduction plate 6 rear surface and mounting plate 7 front surface are fixedly connected by bolt, mounting plate 7 inner wall and radiator 8 surface fixed connection, heat dissipation hole 9 is through and is established in heat conduction plate 6 front side, heat conduction plate 6 inside is provided with cleaning mechanism 1, heat conduction plate 6 front side is provided with fixed mechanism 2, cleaning mechanism 1 is used to clean dust on heat conduction plate 6, fixed mechanism 2 is used to assist the fixation of computer 5, cleaning mechanism 1 includes cleaning motor 101, transmission screw 102, connecting block 103, fixed plate 104, elastic block 105, support plate 106 and cleaning plate 107, cleaning motor 101 output and transmission screw 102 one end surface fixed connection, transmission screw 102 surface and connecting block 103 inner wall thread connection, connecting block 103 lower end and fixed plate 104 upper surface fixed connection, fixed plate 104 lower surface and the upper surface of a plurality of elastic blocks 105 fixed connection, elastic block 105 lower surface and support plate 106 upper side inner wall fixed connection, support plate 106 lower surface and cleaning plate 107 upper surface fixed connection, when cleaning motor 101 drive transmission screw 102 rotation, by thread cooperation drive connecting block 103 along transmission screw 102 moves, not only ensure the accuracy and stability of connecting block 103 movement, also allow adjustment cleaning speed and strength, to adapt to different cleaning needs, fixed mechanism 2 includes telescopic rod 201, fixed block 202 and connecting rod 203, two telescopic rods 201 front end are respectively fixedly connected with the inner wall of two fixed blocks 202, the surface of two fixed blocks 202 and the surface of connecting rod 203 both ends are fixedly connected, fixed block 202 as the direct contact point between computer 5 and heat dissipation system, provide mechanical support, also through with the full contact of computer 5 four around surfaces, ensure the effective conduction of heat, two guide blocks 3 are provided on the upper end of fixed plate 104, the inner wall of guide block 3 is provided with slide bar 4, the lower surface of two guide blocks 3 and the upper end of two sides of fixed plate 104 are fixedly connected, the both ends of two slide bars 4 and the both ends of heat conduction plate 6 inner wall are fixedly connected, guide block 3 provides solid support point for slide bar 4, ensure the movement path of slide bar 4 in its inner wall, avoid the deviation or misplacement phenomenon caused by external vibration or mechanical impact, the surface of cleaning motor 101 and the outer surface of heat conduction plate 6 are fixedly connected, the both ends of transmission screw 102 and the inner wall of heat conduction plate 6 are rotatably connected, the surface of support plate 106 and the inner wall of fixed plate 104 are slidably connected, the lower surface of cleaning plate 107 and the surface of heat dissipation hole 9 are slidably connected, so that cleaning plate 107 can keep stable and consistent pressure distribution during movement, ensure that cleaning plate 107 can cover the surface of heat dissipation hole 9 comprehensively, to improve cleaning effect, and have certain flexibility, can adapt to different working conditions, when facing different shapes or sizes of heat dissipation hole 9, support plate 106 can optimize contact surface through fine adjustment,To ensure the best cleaning performance, the rear end of the four telescopic rods 201 is fixedly connected with the surface of the heat conduction plate 6 at both ends, the inner side surface of the fixed block 202 is in contact with the surface of the computer 5 around, the surface of the two connecting rods 203 is in contact with the surface of the computer 5 at both ends, the design of the telescopic rod 201 allows the length to be adjusted as needed, thereby providing sufficient installation space for the computer 5, so that the equipment can realize the best layout in a compact space, while ensuring the safety and stable operation of the equipment, the surface of the sliding rod 4 is in sliding connection with the inner wall of the guide block 3, which ensures that the sliding rod 4 can move along the predetermined accurate path during movement, so that any component installed on the sliding rod 4 can move accurately and smoothly within the specified range, avoiding operation errors caused by deviation or misalignment.

[0024] The working principle of the utility model is:

[0025] When installing the heat dissipation system of the industrial embedded computer 5, first of all, it is necessary to ensure that the mounting plate 7 is stably fixed in the specified position through bolts, and this process is the basic step to ensure the stability of the whole heat dissipation structure, then the heat sink 8 is fixed on the mounting plate 7 to obtain the maximum heat conduction efficiency, after the above steps are completed, the heat conduction plate 6 is fixed on the mounting plate 7 through bolts, so that a closed channel formed between the two is used to guide the heat generated by the operation of the computer 5 to be discharged, and in order to facilitate the installation of the computer 5, the connecting rod 203 at the front side of the heat conduction plate 6 needs to be pulled, so that the telescopic rod 201 is elongated, providing sufficient installation space for the computer 5, at this time, it should be ensured that the computer 5 is in full contact with the surface of the fixed block 202 around, then the connecting rod 203 is loosened, and the elastic force of the telescopic rod 201 makes the fixed block 202 and the connecting rod 203 firmly clamp the computer 5 at both ends, thereby preliminarily completing the positioning work, in order to further enhance the heat dissipation effect, the heat dissipation part at the rear side of the computer 5 needs to be tightly connected with the heat dissipation hole 9 on the heat conduction plate 6 by using bolts, so as to ensure that the heat can be directly introduced into the heat conduction plate 6, when the internal temperature of the computer 5 exceeds the safety range, the heat sink 8 pre-installed in the mounting plate 7 can be started to cool down, effectively avoiding the damage of the equipment caused by overheating, and as time goes by, dust will gradually accumulate on the surface of the heat dissipation hole 9, affecting the heat dissipation efficiency, therefore, the cleaning motor 101 equipped on one side of the mounting plate 7 can be started, the output end of the cleaning motor 101 drives the transmission screw 102 to rotate, and the threaded connecting block 103 inside is driven to move along the transmission screw 102 through thread cooperation, in this process, the connecting block 103 drives the cleaning plate 107 at the bottom of the fixed plate 104 to slide on the surface of the heat dissipation hole 9 to remove dust, and the existence of the elastic block 105 ensures that the cleaning plate 107 and the heat dissipation hole 9 maintain good contact state, thereby realizing comprehensive and thorough cleaning of the heat dissipation hole 9.

[0026] It is to be noted that the relational terms herein, such as first and second, and the like, are used solely to distinguish one from another entity or action without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0027] The above description merely provides preferred embodiments of the present application and is not intended to limit the present application in any form. Although the present application has been disclosed with reference to the preferred embodiments, the present application is not limited to the preferred embodiments. Any person skilled in the art to which the present application pertains can make modifications and changes without departing from the scope of the present application.

Claims

1. An industrial embedded computer rear heat dissipation structure, comprising a computer (5), a heat-conducting plate (6), a mounting plate (7), a heat sink (8), and heat dissipation holes (9), wherein the rear surface of the computer (5) contacts the front surface of the heat-conducting plate (6), the rear surface of the heat-conducting plate (6) is fixedly connected to the front surface of the mounting plate (7) by bolts, the inner wall of the mounting plate (7) is fixedly connected to the surface of the heat sink (8), and the heat dissipation holes (9) are through-holes opened on the front side of the heat-conducting plate (6), characterized in that: A cleaning mechanism (1) is provided on the inner side of the heat-conducting plate (6), and a fixing mechanism (2) is provided on the front side of the heat-conducting plate (6); The cleaning mechanism (1) is used to clean the dust on the heat-conducting plate (6); The fixing mechanism (2) is used to assist in fixing the computer (5).

2. The industrial embedded computer back heat dissipation structure as described in claim 1, characterized in that: The cleaning mechanism (1) includes a cleaning motor (101), a transmission screw (102), a connecting block (103), a fixing plate (104), an elastic block (105), a support plate (106), and a cleaning plate (107). The output end of the cleaning motor (101) is fixedly connected to one end surface of the transmission screw (102). The surface of the transmission screw (102) is threadedly connected to the inner wall of the connecting block (103). The lower end of the connecting block (103) is fixedly connected to the upper surface of the fixing plate (104). The lower surface of the fixing plate (104) is fixedly connected to the upper surface of several elastic blocks (105). The lower surface of the elastic blocks (105) is fixedly connected to the upper inner wall of the support plate (106). The lower surface of the support plate (106) is fixedly connected to the upper surface of the cleaning plate (107).

3. The industrial embedded computer back heat dissipation structure as described in claim 2, characterized in that: The fixing mechanism (2) includes a telescopic rod (201), a fixing block (202) and a connecting rod (203). The front ends of the two telescopic rods (201) are fixedly connected to the inner walls of the two fixing blocks (202) respectively, and the surfaces of the two fixing blocks (202) are fixedly connected to the surfaces of the two ends of the connecting rod (203).

4. The industrial embedded computer back heat dissipation structure as described in claim 3, characterized in that: Two guide blocks (3) are provided on both sides of the upper end of the fixed plate (104). The inner wall of the guide block (3) is provided with a slide rod (4). The lower surface of the two guide blocks (3) is fixedly connected to the upper side surfaces of the fixed plate (104), and the two ends of the slide rod (4) are fixedly connected to the two ends of the inner wall of the heat-conducting plate (6).

5. The industrial embedded computer back heat dissipation structure as described in claim 2, characterized in that: The surface of the cleaning motor (101) is fixedly connected to the outer surface of the heat-conducting plate (6), the two ends of the transmission screw (102) are rotatably connected to the inner wall of the heat-conducting plate (6), the surface of the support plate (106) is slidably connected to the inner wall of the fixing plate (104), and the lower surface of the cleaning plate (107) is slidably connected to the surface of the heat dissipation hole (9).

6. The industrial embedded computer back heat dissipation structure as described in claim 3, characterized in that: The rear ends of the four telescopic rods (201) are fixedly connected to the two ends of the heat-conducting plate (6), the inner surface of the fixing block (202) is in contact with the surrounding surface of the computer (5), and the surfaces of the two connecting rods (203) are in contact with the two ends of the computer (5).

7. The industrial embedded computer back heat dissipation structure as described in claim 4, characterized in that: The surface of the slide rod (4) is slidably connected to the inner wall of the guide block (3).

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