Piezoresistor electrode slice
By using a flexible connection design between the ceramic substrate and the thermally conductive copper plate and a variety of heat dissipation structures, the problems of traditional electrode plates being difficult to disassemble and maintain and having poor heat dissipation are solved, thereby reducing maintenance costs and improving heat dissipation.
Patent Information
- Application Number
- CN202423152944.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Traditional electrode sheet structures are fixed, making them difficult to disassemble and maintain. They also have poor heat dissipation, resulting in high maintenance costs and the varistor being prone to overheating and damage.
It adopts a structure that matches the ceramic substrate and the thermally conductive copper plate. Through the design of the connecting components and heat transfer plate, it provides flexible disassembly and maintenance capabilities and a variety of heat dissipation structures. The epoxy resin encapsulation groove provides insulation and connection strength.
It eliminates the need for complete replacement when damaged, reducing maintenance costs, and improves heat dissipation to prevent overheating damage to the varistor, while providing excellent insulation and protection.
Smart Images
Figure CN223956388U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of pressure sensitive resistor, concretely is a pressure sensitive resistor electrode piece. BACKGROUND
[0002] The pressure sensitive resistor is a kind of resistor device with nonlinear volt-ampere characteristic, mainly used to carry out voltage clamping when circuit bears overvoltage, absorbs redundant current to protect sensitive device, and the pressure sensitive resistor works using its nonlinear characteristic, when voltage exceeds certain critical value, its resistance will sharply decrease, current sharply increases, thereby realizing the protection of overvoltage, and the pressure sensitive resistor can clamp voltage to a relatively fixed voltage value, to protect the later stage circuit, and the electrode piece is the important component of pressure sensitive resistor, and the electrode piece is mainly used to improve the heat conduction speed of electrode piece, to avoid the breakdown short circuit of pressure sensitive resistor, thereby improving the safety of lightning protection device.
[0003] Although the traditional electrode piece has certain heat conduction capacity, it still has some deficiencies, for example, its overall structure is relatively fixed, so when damage occurs in its interior, it is difficult to disassemble and maintain, and once damage occurs, it can only be replaced as a whole, thereby increasing the maintenance cost in later period, in addition, its heat dissipation structure is relatively single, so that its heat dissipation effect is poor, thereby easily causing the overheat damage of pressure sensitive resistor, therefore, the pressure sensitive resistor electrode piece is provided for the above problems. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a pressure sensitive resistor electrode piece, its overall structure is relatively flexible, so when damage occurs in its interior, it can be disassembled and maintained, without the need to replace it as a whole when damage occurs, thereby reducing the maintenance cost in later period, in addition, its heat dissipation structure is relatively rich, so that its heat dissipation effect is better, thereby not easy to cause the overheat damage of pressure sensitive resistor, to solve the problems proposed in the above background technology.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A pressure sensitive resistor electrode piece, comprising a ceramic substrate, the upper and lower sides of the ceramic substrate are symmetrically provided with heat-conducting copper plates, and the heat-conducting copper plates and the ceramic substrate are provided in a matched specification, a plurality of connecting components are arranged at equal intervals between the heat-conducting copper plates and the ceramic substrate, and the heat-conducting copper plates and the ceramic substrate are connected through the connecting components, a heat transfer plate is fixedly connected to one end of the heat-conducting copper plate away from the ceramic substrate, a first encapsulation groove and a second encapsulation groove are respectively arranged on the outer sides of the two heat transfer plates, and the first encapsulation groove and the second encapsulation groove are connected through a mounting assembly.
[0007] Preferably, the connecting assembly comprises a connecting block fixedly connected with the heat-conducting copper plate near one end of the ceramic substrate, and a rubber chuck is arranged on the side of the connecting block near the ceramic substrate; a plurality of connecting clamping grooves equal in number to the connecting block and the rubber chuck, corresponding in position and matched in specification are arranged on the upper and lower ends of the ceramic substrate at equal intervals.
[0008] Preferably, the rubber chuck is fixedly connected with a connecting screw block at the center of one end of the connecting block, and a connecting screw groove is arranged at the center of one end of the connecting block near the rubber chuck, and the connecting screw groove and the connecting screw block are arranged in position corresponding and matched in specification.
[0009] Preferably, one side of the heat-conducting plate away from the heat-conducting copper plate is arranged in a wave-shaped concave-convex manner, and one end of the inner cavities of the first and second sealing grooves near the adjacent heat-conducting plate is arranged in a wave-shaped concave-convex manner matched in specification with the wave-shaped surface of the heat-conducting copper plate.
[0010] Preferably, the mounting assembly comprises a mounting plug rod fixedly connected to the bottom of the two side walls of the first sealing groove, and an installation chuck is fixedly connected to the end of the mounting plug rod; the installation chuck is arranged in an arrow shape with a wider bottom and forked ends; the top of the two side walls of the second sealing groove is provided with a mounting plug groove corresponding in position to the installation chuck, and the width of the installation chuck is greater than the width of the mounting plug groove.
[0011] Compared with the prior art, the utility model has the advantages that:
[0012] The utility model discloses a ceramic substrate can provide semiconductor nature through setting, the good heat conduction capacity can be provided through the setting heat conduction copper sheet, can therefore carry out the quick absorption of the heat generated on ceramic substrate, the good connecting ability between heat conduction copper sheet and ceramic substrate can be provided through the setting connecting component, therefore not only can provide the good connecting strength between ceramic substrate and heat conduction copper sheet when using, guarantee the structural stability between ceramic substrate and heat conduction copper sheet, and can be disassembled when ceramic substrate or heat conduction copper sheet is damaged, need not when being damaged overall replacement, thereby the maintenance cost of late stage will be reduced, the heat dissipation effect of heat conduction copper sheet can be improved through the setting heat transfer plate, therefore make the whole heat dissipation effect better, thereby the overheat damage of piezo -resistor is not easy to cause, the whole can be encapsulated through the setting first encapsulation groove and second encapsulation groove, therefore can provide the good protection ability for the whole, and because first encapsulation groove and second encapsulation groove are epoxy resin material quality, thereby can provide the good insulation ability for the whole, the good connecting ability between first encapsulation groove and second encapsulation groove can be provided through the setting mounting assembly, therefore not only can provide the good connecting strength between first encapsulation groove and second encapsulation groove when using, guarantee the structural stability between first encapsulation groove and second encapsulation groove, and can be disassembled when inside is damaged, need not when being damaged overall replacement, thereby the maintenance cost of late stage will be reduced. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 Structure diagram of the utility model Figure 1 ;
[0014] Figure 2 Structure diagram of the utility model Figure 2 ;
[0015] Figure 3 Structure diagram of the connecting block of the utility model Figure 1 ;
[0016] Figure 4 Structure diagram of the connecting block of the utility model Figure 2 ;
[0017] Figure 5 Structure diagram of the mounting assembly of the utility model.
[0018] In the drawing: 1, ceramic substrate;2, heat conduction copper sheet;3, connecting component;301, connecting block;302, rubber clamp head;303, connecting slot;304, connecting screw block;305, connecting screw groove;4, heat transfer plate;5, first encapsulation groove;6, second encapsulation groove;7, mounting assembly;701, mounting plug rod;702, mounting clamp head;703, mounting slot. DETAILED DESCRIPTION
[0019] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0020] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the protection scope of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.
[0021] In addition, it should be noted that the use of "first", "second" and the like to limit parts is only for the convenience of distinguishing the corresponding parts, and if there is no further declaration, the above words have no special meaning, therefore, it cannot be understood as a limitation on the protection scope of the present application.
[0022] Please refer to Figures 1-5 The present application provides a technical scheme:
[0023] A piezoresistor electrode sheet, comprising a ceramic substrate 1, the upper and lower sides of the ceramic substrate 1 are symmetrically provided with heat-conducting copper plates 2, and the heat-conducting copper plates 2 and the ceramic substrate 1 are matched in size, a plurality of connecting components 3 are arranged at equal intervals between the heat-conducting copper plates 2 and the ceramic substrate 1, and the heat-conducting copper plates 2 and the ceramic substrate 1 are connected through the connecting components 3, a heat transfer plate 4 is fixedly connected to one end of the heat-conducting copper plate 2 away from the ceramic substrate 1, a first sealing groove 5 and a second sealing groove 6 are respectively arranged on the outer sides of the two heat transfer plates 4, and the first sealing groove 5 and the second sealing groove 6 are connected through a mounting component 7.
[0024] The connecting assembly 3 includes a connecting support block 301 fixedly connected to one end of the heat-conducting copper plate 2 near the ceramic substrate 1. A rubber clamp 302 is provided on the side of the connecting support block 301 near the ceramic substrate 1. Multiple connecting slots 303, equal in number, position, and specifications as the connecting support blocks 301 and rubber clamps 302, are equidistantly arranged at both ends of the ceramic substrate 1. A connecting screw block 304 is fixedly connected to the center of one end of the rubber clamp 302 near the connecting support block 301. A connecting screw groove 305 is provided at the center of one end of the connecting support block 301 near the rubber clamp 302. The connecting screw groove 305 and the connecting screw block 304 are positioned and matched in specifications. The connecting assembly 3 provides good connection capability between the heat-conducting copper plate 2 and the ceramic substrate 1. Therefore, it not only provides good connection strength between the ceramic substrate 1 and the heat-conducting copper plate 2 during use to ensure structural stability, but also allows for disassembly when either the ceramic substrate 1 or the heat-conducting copper plate 2 is damaged, eliminating the need for manual disassembly upon damage. The entire plate is replaced, which reduces subsequent maintenance costs. The side of the heat transfer plate 4 away from the heat-conducting copper plate 2 has a wavy, uneven design. The inner cavities of the first sealing groove 5 and the second sealing groove 6, near the adjacent heat transfer plate 4, have a wavy, uneven design that matches the specifications of the wavy surface of the heat-conducting copper plate 2. The wavy, uneven design of the heat transfer plate 4 can increase the heat conduction area, thereby improving the heat dissipation effect of the heat-conducting copper plate 2. This results in better overall heat dissipation and reduces the risk of overheating damage to the varistor. Furthermore, the first sealing groove 5... The matching arrangement of the second sealing groove 6 ensures a good fit with the adjacent heat transfer plate 4 after installation. The mounting assembly 7 includes mounting rods 701 fixedly connected to the bottom of the two side walls of the first sealing groove 5. The ends of the mounting rods 701 are fixedly connected to mounting clips 702, which are arrow-shaped with a wider bottom and forked ends. The top of the two side walls of the second sealing groove 6 are provided with mounting slots 703 corresponding to the positions of the mounting clips 702, and the width of the mounting clips 702 is greater than the width of the mounting slots 703.
[0025] Workflow: The ceramic substrate 1 can provide semiconductor properties, and the heat-conducting copper plate 2 can provide good heat conduction capacity, so it can quickly absorb the heat generated on the ceramic substrate 1, and the connecting assembly 3 can provide good connection between the heat-conducting copper plate 2 and the ceramic substrate 1. Therefore, not only can it provide good connection strength between the ceramic substrate 1 and the heat-conducting copper plate 2 during use to ensure the structural stability between the ceramic substrate 1 and the heat-conducting copper plate 2, but also can be disassembled when the ceramic substrate 1 or the heat-conducting copper plate 2 is damaged, without the need for overall replacement when damaged, thereby reducing the maintenance cost later. When the heat-conducting copper plate 2 is connected with the ceramic substrate 1, only the multiple connecting blocks 301 and rubber clamping heads 302 on the heat-conducting copper plate 2 need to be inserted into the corresponding connecting clamping grooves 303 on the ceramic substrate 1 for clamping. Because of the flexible structure between the connecting blocks 301 and the rubber clamping heads 302, the rubber clamping heads 302 can be replaced when they are damaged and affect the clamping effect. When installing the rubber clamping heads 302, only the connecting screw blocks 304 need to be aligned with the connecting screw grooves 305 at the end of the connecting blocks 301 and then rotated and screwed. Similarly, when disassembling, the heat-conducting plate 4 can improve the heat-conducting area through the wavy concave-convex arrangement on its surface, thereby improving the heat dissipation effect of the heat-conducting copper plate 2, making the overall heat dissipation effect better, so that the piezoresistor is not easily damaged by overheating. The matching arrangement of the first and second encapsulating grooves 5 and 6 can ensure the degree of adhesion with the adjacent heat-conducting plates 4 after mutual installation. The first and second encapsulating grooves 5 and 6 can encapsulate the whole, thereby providing good protection for the whole. Because the first and second encapsulating grooves 5 and 6 are made of epoxy resin, they can provide good insulation for the whole. The installation assembly 7 can provide good connection between the first and second encapsulating grooves 5 and 6, thereby not only providing good connection strength between the first and second encapsulating grooves 5 and 6 during use to ensure the structural stability between the first and second encapsulating grooves 5 and 6, but also allowing disassembly when damaged, without the need for overall replacement when damaged, thereby reducing the maintenance cost later. When installing the first and second encapsulating grooves 5 and 6, first place the first and second encapsulating grooves 5 and 6 above and below the two heat-conducting plates 4, respectively, and then move them closer to each other. The installation insertion rod 701 and the installation clamping head 702 thereon are inserted into the corresponding installation insertion groove 703. Because the installation clamping head 702 is made of rubber and the width of the installation insertion groove 703 is less than the width of the installation clamping head 702, the end of the installation clamping head 702 is squeezed when the installation clamping head 702 is inserted into the installation insertion groove 703, and the two ends of the installation clamping head 702 are firmly clamped in the installation insertion groove 703.
[0026] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. The standard parts used in the utility model can be purchased from the market, and the special-shaped parts can be ordered according to the description and the drawings, the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail here.
[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the spirit and scope of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A piezoresistive electrode sheet comprising a ceramic substrate (1), characterized in that: The upper and lower sides of the ceramic substrate (1) are symmetrically provided with heat-conducting copper plates (2) which are matched in size with the ceramic substrate (1), a plurality of connecting components (3) are arranged at equal intervals between the heat-conducting copper plates (2) and the ceramic substrate (1) and the heat-conducting copper plates (2) and the ceramic substrate (1) are connected through the connecting components (3), heat-conducting plates (4) are fixedly connected to the ends of the heat-conducting copper plates (2) away from the ceramic substrate (1), first and second enclosing grooves (5, 6) are respectively arranged on the outer sides of the two heat-conducting plates (4), and the first and second enclosing grooves (5, 6) are connected through mounting components (7).
2. A piezoresistive electrode sheet according to claim 1, wherein: The connecting component (3) comprises a connecting block (301) fixedly connected to the end of the heat-conducting copper plate (2) close to the ceramic substrate (1), a rubber chuck (302) is arranged on the side of the connecting block (301) close to the ceramic substrate (1), and a plurality of connecting chuck grooves (303) which are equal in number to the connecting block (301) and the rubber chuck (302), correspond in position and are matched in size are arranged at equal intervals on the upper and lower ends of the ceramic substrate (1).
3. A piezoresistive electrode sheet according to claim 2, wherein: The rubber chuck (302) is fixedly connected with a connecting screw block (304) at the center of the end close to the connecting block (301), the connecting block (301) is provided with a connecting screw groove (305) at the center of the end close to the rubber chuck (302), and the connecting screw groove (305) and the connecting screw block (304) are corresponded in position and matched in size.
4. A piezoresistive electrode sheet according to claim 1, wherein: The side of the heat-conducting plate (4) away from the heat-conducting copper plate (2) is provided with a wave-shaped concave-convex structure, and the inner cavities of the first and second enclosing grooves (5, 6) close to the ends of the adjacent heat-conducting plates (4) are provided with wave-shaped concave-convex structures matched in size with the wave-shaped surface of the heat-conducting copper plate (2).
5. A piezoresistive electrode sheet according to claim 1, wherein: The mounting component (7) comprises a mounting plug rod (701) fixedly connected to the bottom of the two side walls of the first enclosing groove (5), the end of the mounting plug rod (701) is fixedly connected with a mounting chuck (702), the mounting chuck (702) is provided in the shape of an arrow with a wider bottom and forked ends, the top of the two side walls of the second enclosing groove (6) is provided with a mounting plug groove (703) corresponding in position to the mounting chuck (702), and the width of the mounting chuck (702) is greater than the width of the mounting plug groove (703).