Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, which is characterized by comprising a heat conduction leveling plate, an air duct and a fan, the heat conduction leveling plate comprises a transverse plate and a vertical plate, and the vertical plate is vertically mounted on one side of the transverse plate; the other side of the transverse plate is in contact with a heat source of equipment to be cooled and is used for conducting heat of the heat source to the vertical plate; the vertical plate is in contact with the side wall of the air duct and is used for conducting heat to the air duct; the air duct is used for penetrating through a shell of the to-be-cooled equipment, and the fan is mounted at one end of the air duct; the fan is used for dissipating heat of the air channel in a heat convection mode and discharging heat out of the shell. The device is suitable for heat dissipation of high-power and large-size equipment which works in a field high-altitude environment and is in a moving posture, and has the advantages of low cost, high stability, full-sealing heat dissipation and the like.

Description

TECHNICAL FIELD

[0001] The utility model belongs to equipment heat dissipation and heat management field relates to a heat dissipation device. BACKGROUND

[0002] In the design and application of high-power equipment (such as server, power supply, detector, etc.), heat design is a work with wisdom, which combines with actual application scene, cooperates with equipment structure, and carries out heat dissipation or heat management to functional components or target components to guarantee the equipment in safe, stable or good working state. Common heat dissipation modes include natural heat dissipation, air cooling heat dissipation, liquid cooling heat dissipation and deep space radiation.

[0003] Air cooling heat dissipation accelerates air flow through fan to further strengthen heat exchange between equipment interior and outside to cool the equipment. Common air cooling heat dissipation equipment includes desktop computer, server and switch. Air cooling heat dissipation has low cost and high heat dissipation efficiency, but the equipment cooled by air cooling heat dissipation generally works in clean and dry indoor environment to avoid dust and liquid pollution and loss.

[0004] Natural heat dissipation is to dissipate heat through natural heat exchange between equipment shell and outside. Natural heat dissipation is usually suitable for small and light equipment with small heat generation, such as mobile phone.

[0005] Liquid cooling heat dissipation cools cooling liquid through compressor and then delivers the cooling liquid to equipment through pipeline. Liquid cooling can reduce equipment temperature to minus one hundred degrees Celsius or even lower. However, cooling liquid, compressor and delivery pipeline are very expensive and need professional maintenance. Especially when the equipment is in motion, the laying and maintenance cost of pipeline will greatly increase. Meanwhile, the use environment of cooling liquid also has strong limitations, such as ice formation of cheap water below 0℃.

[0006] Deep space radiation is generally applied to space station or satellite detection equipment.

[0007] For high-power large-size equipment working in field high-altitude environment and in motion, how to realize low-cost, high-stability and full-sealing heat dissipation will be a big problem, and the above common heat dissipation modes are not suitable. CONTENT OF UTILITY MODEL

[0008] To address the problems existing in the prior art, the purpose of this utility model is to provide a heat dissipation device. This utility model, based on a spatially independent air duct, a heat-conducting plate, and a fan, designs and implements a pipe-free, coolant-free, fully sealed, low-cost, and low-weight heat dissipation device for high-power, large-size equipment operating in high-altitude outdoor environments and in motion. Simultaneously, this utility model also designs a method for evaluating the thermal conductivity of the heat-conducting plate, used for testing or batch testing the thermal conductivity of the plate. The equipment casing is sealed. This application installs an air duct through an opening in the side wall of the casing, penetrating the interior of the equipment. A fan is installed at one end of the air duct to achieve airflow within the duct, turning the duct into a "cooling body" for heat dissipation. A heat-conducting plate is installed on the heat source inside the equipment casing, contacting both the heat source and the air duct, conducting heat from the heat source to the air duct for cooling. Conventional equipment involves drilling holes in the casing to install a fan, and drilling holes on the other side of the casing for air outlet, dissipating heat through direct air circulation with the outside environment. This method is not conducive to sealing. This application uses air ducts to prevent external air from polluting the inside of the equipment with sand, dust, and moisture.

[0009] The technical solution of this utility model is as follows:

[0010] A heat dissipation device, characterized in that it includes a heat-conducting plate, an air duct, and a fan;

[0011] The heat-conducting plate includes a horizontal plate and a vertical plate. The vertical plate is vertically mounted on one side of the horizontal plate. The other side of the horizontal plate is in contact with the heat source of the device to be cooled, and is used to conduct the heat from the heat source to the vertical plate.

[0012] The vertical plate contacts the side wall of the air duct and is used to conduct heat to the air duct;

[0013] The air duct is used to pass through the housing of the device to be cooled, and the fan is installed at one end of the air duct.

[0014] The fan is used to dissipate heat from the air duct through thermal convection, expelling heat to the outside of the housing.

[0015] Furthermore, a layer of graphite material is applied to the non-heat source contact surface and non-air duct contact surface of the heat-conducting plate to enhance the surface heat conduction efficiency and the heat conduction efficiency of the horizontal and vertical plate contact surfaces.

[0016] Furthermore, the air duct is a sealed tubular structure, and heat dissipation fins are provided at the corresponding positions of the inner side wall in contact with the vertical plate; when there are multiple air ducts inside the equipment to be cooled, the airflow of adjacent air ducts is directed to blow in opposite directions to improve the temperature uniformity inside the equipment to be cooled.

[0017] Further, the fan is assembled to the port of the air duct through a fan mounting plate, and each fan is independently powered.

[0018] Further, the horizontal plate is provided with a groove as a contact coupling surface of the horizontal plate and the vertical plate, and the vertical plate is embedded in the groove and connected and fastened with the horizontal plate through a heat-conducting long bolt.

[0019] Further, the horizontal plate is in contact with the heat source and the substrate where the heat source is located, and is used for conducting heat of the heat source and the substrate where the heat source is located to the vertical plate.

[0020] Further, the heat-conducting leveling plate is in contact with the heat source and the substrate through an interface material to enhance the heat conduction effect.

[0021] Further, the vertical plate is in contact with the outer side wall of the air duct.

[0022] Further, the vertical plate and the outer side wall of the air duct are in contact through an interface material layer and a film layer in sequence, the interface material layer is used for enhancing the heat conduction effect between the vertical plate and the air duct, and the film layer is used for facilitating plugging and dismounting of the heat-conducting leveling plate and the air.

[0023] The advantages of the utility model are as follows:

[0024] The utility model is based on the air duct, the heat-conducting leveling plate and the fan which are independent in space, and a heat dissipation device without pipeline, cooling liquid, full sealing, low cost and low weight is designed and realized for the high-power large-size equipment which works in a high-altitude environment in the wild and is in a moving posture, and the heat dissipation device has the advantages of low cost, high stability, full sealing and the like. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a heat-conducting leveling plate structure diagram.

[0026] Figure 2 It is an air duct (including fins) and fan structure diagram.

[0027] Figure 3 It is a device internal heat source heat dissipation structure side view.

[0028] Figure 4 It is a heat-conducting leveling plate thermal resistance test schematic diagram.

[0029] The drawings show that 1 is a horizontal plate, 2 is a vertical plate, 3 is a heating sheet, 4 is a heat insulation material plate, and 5 is a direct current power supply. DETAILED DESCRIPTION

[0030] The utility model will be further described in detail in combination with the drawings, and the examples are only used for explaining the utility model and are not used for limiting the range of the utility model.

[0031] The utility model discloses a heat conduction leveling plate, heat conduction and heat convection combined heat dissipation device, heat conduction leveling plate heat conduction effect evaluation method, fan installation work method and so on several parts constitute. Among them:

[0032] As Figure 1 Indicated, heat conduction leveling plate is composed by transverse plate and vertical plate. Heat conduction leveling plate is contacted with air duct and equipment heat source simultaneously. On the one hand, transverse plate is contacted with equipment heat source according to the specific heat distribution and shape structure of equipment heat source, and the heat of equipment heat source is conducted to vertical plate. In addition, transverse plate is contacted with not only heat source itself, but also the base plate where heat source is, and the heat conduction effect is increased. That is, transverse plate is contacted with heat source and its base plate through interface material. Heat conduction leveling plate is contacted with electronic board through interface material to enhance the heat conduction effect, and is fixed in structure through bolt. When electronic board needs to be maintained and disassembled, it is extracted from the main body of equipment together with electronic board. On the other hand, vertical plate is contacted with the outer wall of air duct, and the heat is conducted to air duct. In addition, vertical plate is not only contacted with the outer wall of air duct through interface material, but also contacted with the outer wall of air duct through a layer of film between interface material and the outer wall of air duct, which is used for reducing the adsorption force between vertical plate, interface material and the outer wall of air duct to facilitate the insertion and disassembly between heat conduction leveling plate and air duct. One side of transverse plate is contacted and coupled with equipment heat source and its base plate, and the other side is coupled with vertical plate. Interface material is generally heat conduction gel or heat conduction silicone grease, which is used for enhancing the heat conduction between two surfaces.

[0033] In the process of designing heat conduction leveling plate and realizing low cost, a groove is dug in the contact and coupling surface of transverse plate and vertical plate, and vertical plate is embedded in the groove. Vertical plate is contacted with groove through interface material, and the two are fastened through long bolt with better heat conduction performance, as Figure 1 Indicated. The non-heat source contact surface and non-air duct contact surface of heat conduction leveling plate are pasted with a layer of graphite material, which is used for enhancing the surface heat conduction efficiency and the heat conduction efficiency of the contact surface of transverse plate and vertical plate. The coupling and assembly position of vertical plate on transverse plate is related to the distribution of equipment heat source. Transverse plate does not directly contact with air duct, which can facilitate the free assembly and disassembly of heat conduction leveling plate.

[0034] The size and shape of air duct match the internal space of equipment, and the greater the air flux, the better the heat dissipation effect. The existing fan has fixed size and model, and the fan mounting plate designed to match the size and appearance of air duct and fan can realize the matching installation of fan and air duct and the maximum air flux of air duct. For example, the flat tubular air duct with the cross section of 180mm*60mm can be combined with three fans with the diameter of 60mm through fan mounting plate, which can realize the maximum air flux of air duct and guarantee the air flow of air duct in the state of fan failure, so that the equipment does not stop running because of one fan failure.

[0035] The air duct main body is a tubular structure (including but not limited to a square tube, a round tube or other shaped tubes) with good sealing, and the inner side wall is provided with fins. The number and size of the fins need to be considered comprehensively in terms of heat dissipation effect and weight. According to the simulation results, the longer the size of the fins and the larger the contact area of the fins with the airflow, the better the heat dissipation effect. However, when the size of the fins increases to a certain extent, the heat dissipation effect tends to be saturated, and the weight continues to increase. With the increase in the number of fins, the heat dissipation effect first becomes better and then worse, but the weight continues to increase. The reason is that although the contact area with the airflow increases, the air resistance also increases, causing the airflow speed to slow down, thus being detrimental to heat dissipation. In order to reduce the weight of the air duct, the device is provided with fins only on the inner wall of the side of the air duct in contact with the vertical plate. The air duct is sealingly installed in the equipment shell. The air duct is installed with a fan at one end and an air flow meter at the other end. The fan carries away the heat of the air duct through forced air convection. The air flow meter is used to monitor the air speed of the air duct and the working state of the fan. When there are multiple or multiple layers of heat sources inside the equipment, the number and size of the air ducts are adjusted according to the distribution of the heat sources. When there are multiple air ducts inside the equipment, the directions of the airflows of adjacent air ducts are adjusted to be opposite, which can improve the temperature uniformity inside the equipment.

[0036] Figure 3 It is a side sectional view of the heat dissipation structure for the heat source inside the equipment. The other end of the air duct is also provided with fins for contacting and dissipating heat from the heat source on the other side of the air duct. A group of sub-modules inside the equipment, the heat source has two parts, the left heat source contacts the left side wall of the air duct through multiple layers of heat-conducting pads and PCBs for heat dissipation, and the bottom heat source contacts the right side plate of the air duct through the vertical plate of the heat-conducting leveling plate for heat dissipation; the air flow directions inside adjacent air ducts are opposite. During the operation of the equipment, the first step is to open the fan and detect the air speed in the air duct. If the airflow speed in the air duct is less than the reference threshold, the heat dissipation system is repaired. If the airflow speed in the air duct is greater than the reference threshold, the second step is operated. The second step: the equipment is started and operated, and temperature sensors are arranged near each heat source of the equipment. Different operating temperature red lines are set according to different heat sources. When the operating temperature is lower than the operating temperature red line, the equipment is normally operated. When the operating temperature is higher than the operating temperature red line, the equipment is shut down and operated for repair. When the operating temperature is too low, one or more fans are turned off.

[0037] The size and shape of the air duct main body are matched with the structure of the equipment. The fan mounting plate is designed according to the shape and size of the air duct port and the size of the fan. The fan mounting plate carries N fans (N≥2) and is assembled on the air duct port. The N fans are independently powered and independently operated. On the one hand, the air flow in the air duct can be adjusted by changing the number of operating fans. On the other hand, the failure influence rate can be reduced and the parts can be used as backup for each other, so as to avoid the risk that a fan failure causes all fan failures or a fan failure causes the entire equipment to shut down.

[0038] The utility model discloses a heat conduction effect of the heat conduction leveling plate is evaluated through the heat resistance test mode, as shown in the figure. Figure 4 In the specific execution heat resistance test method process: heating piece is placed in the farthest end of horizontal plate, and is coupled with horizontal plate through interface material;First temperature sensor is placed in the vicinity of heating piece, and second temperature sensor is placed in the farthest end of vertical plate;Heating piece is powered through power supply, and heating piece heating power is equal to the square of power output current times heating piece resistance;The heat resistance of heat conduction leveling plate is obtained through the temperature value difference between first temperature sensor and second temperature sensor divided by heating piece heating power. The smaller heat resistance is, the better heat conduction effect is. In the specific execution process, the two most critical points are: 1, heating piece and temperature sensor all need to contact with horizontal plate through interface material and are fixed well;2, the measured heat conduction leveling plate, heating piece and temperature sensor all are in the heat insulation state with the outside world, and the heat insulation method includes but is not limited to: heat insulation through thermal insulation cotton, foam cotton, vacuum.

[0039] Although the specific embodiments of the utility model are disclosed for the purpose of illustration, the purpose is to help understanding the content of the utility model and to be implemented, and the person skilled in the art can understand that: various replacements, changes and modifications are possible without departing from the spirit and scope of the utility model and the appended claims. Therefore, the utility model should not be limited to the disclosed content of the best mode of implementation, and the scope of the utility model claimed is the scope defined by the claims.

Claims

1. A heat dissipation device, characterized in that, This includes heat-conducting flat plates, air ducts, and fans; The heat-conducting plate includes a horizontal plate and a vertical plate. The vertical plate is vertically mounted on one side of the horizontal plate. The other side of the horizontal plate is in contact with the heat source of the device to be cooled, and is used to conduct the heat from the heat source to the vertical plate. The vertical plate contacts the side wall of the air duct and is used to conduct heat to the air duct; The air duct is used to pass through the housing of the device to be cooled, and the fan is installed at one end of the air duct. The fan is used to dissipate heat from the air duct through thermal convection, expelling heat to the outside of the housing.

2. The heat dissipation device according to claim 1, characterized in that, The non-heat source contact surface and non-air duct contact surface of the heat-conducting plate are all coated with a layer of graphite material to enhance the surface heat conduction efficiency and the heat conduction efficiency of the horizontal and vertical plate contact surfaces.

3. The heat dissipation device according to claim 1, characterized in that, The air duct is a sealed tubular structure, and heat dissipation fins are provided at the corresponding positions of the inner side wall in contact with the vertical plate. When there are multiple air ducts inside the equipment to be cooled, the airflow of adjacent air ducts is directed to blow in opposite directions to improve the temperature uniformity inside the equipment to be cooled.

4. The heat dissipation device according to claim 1, 2, or 3, characterized in that, The fan is mounted on the port of the air duct via a fan mounting plate, and each fan is powered independently.

5. The heat dissipation device according to claim 1, characterized in that, The horizontal plate has a groove, which serves as the contact and coupling surface between the horizontal plate and the vertical plate. The vertical plate is embedded in the groove and is connected and fastened to the horizontal plate by a thermally conductive long bolt.

6. The heat dissipation device according to claim 1, characterized in that, The horizontal plate is in contact with the heat source and the substrate on which it is located, and is used to conduct the heat from the heat source and the substrate on which it is located to the vertical plate.

7. The heat dissipation device according to claim 6, characterized in that, The heat-conducting plate contacts the heat source and the substrate through an interface material to enhance the heat conduction effect.

8. The heat dissipation device according to claim 1, characterized in that, The vertical plate is in contact with the outer wall of the air duct.

9. The heat dissipation device according to claim 1, characterized in that, The vertical plate and the outer wall of the air duct are in contact sequentially through an interface material layer and a thin film layer. The interface material layer is used to enhance the heat conduction effect between the vertical plate and the air duct, and the thin film layer is used to facilitate the insertion and removal of the heat-conducting plate and the air duct.

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