Radiating air duct structure of radio frequency power supply

By employing a layered heat dissipation structure in the RF power supply and utilizing water-cooled radiators and air baffles to guide airflow, the problem of poor traditional heat dissipation methods is solved, achieving a more efficient heat dissipation effect and improving the stability and reliability of the equipment.

CN223957829UActive Publication Date: 2026-02-27深圳市广能达半导体科技有限公司
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Patent Information

Application Number
CN202520327091.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-26
Publication Date
2026-02-27
Estimated Expiration
2035-02-26

AI Technical Summary

Technical Problem

Traditional water cooling + air cooling methods are ineffective in RF power supplies, affecting the stability and reliability of the equipment and posing safety hazards.

Method used

The system adopts a layered heat dissipation structure, which combines upper and lower water-cooled radiators with baffles and cooling fans to form a gradually narrowing airflow channel. This guides the airflow to concentrate on high-heat-generating components, accelerates heat exchange through turbulence, and improves heat dissipation efficiency by taking into account the different heat dissipation requirements of different components.

Benefits of technology

It enhances the heat dissipation capacity of the RF power supply, reduces the internal temperature, extends the service life of the equipment, and improves the stability and reliability of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a radio frequency power supply heat radiation air duct structure comprising a power supply housing, an upper layer water cooling radiator and a lower layer water cooling radiator are arranged in the power supply housing, and the top and bottom surfaces of the upper layer water cooling radiator are provided with power amplifier circuit modules. A direct-current power source and a radio frequency circuit module are arranged on the top face of the lower-layer water-cooling radiator, an air inlet and an air outlet are formed in the two opposite sides of the power source shell correspondingly, and a cooling fan is arranged on the inner side of the air inlet. An air baffle is arranged on the side, close to the air outlet, between the upper-layer water-cooling radiator and the lower-layer water-cooling radiator, and an air supply channel with the cross section area gradually reduced is formed between the air baffle and the upper-layer water-cooling radiator. According to the utility model, the temperature of elements in the radio frequency power supply and the internal environment is effectively reduced, the service life of the product is prolonged, and the equipment has higher stability and reliability.
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Description

TECHNICAL FIELD

[0001] The utility model relates to radio frequency power supply technical field, concretely relates to a radio frequency power supply heat dissipation air duct structure. BACKGROUND

[0002] Radio frequency power supply is a kind of high-frequency ac power supply that can generate fixed frequency sine wave, and is widely used in semiconductor process equipment, LED and solar photovoltaic industry, medical cosmetology and other industries currently.As a kind of power supply device specially used for generating radio frequency electric energy, the efficiency of its thermal management is directly related to the reliability and functional stability of equipment.

[0003] With the development and progress of science and technology, the growth of radio frequency power supply power demand, radio frequency power supply volume gradually also will be bigger, internal space structure is also more and more complex.The heat dissipation mode of traditional water cooling+air cooling, due to the relatively wide internal space of radio frequency power supply, and the relatively long air duct, wind force gradually decreases at the end of air duct, and the heat dissipation effect is also greatly discounted, cannot reach ideal heat dissipation effect, seriously affect the stability and reliability of radio frequency power supply, bring certain safety hazard to product. UTILITY MODEL CONTENTS

[0004] In order to overcome the problem of poor heat dissipation effect in radio frequency power supply heat dissipation mode in prior art, which affects the stability and reliability of radio frequency power supply, the utility model provides a radio frequency power supply heat dissipation air duct structure.

[0005] The utility model technical scheme is as follows:

[0006] A radio frequency power supply heat dissipation air duct structure, including power supply shell, the inside of power supply shell is provided with upper layer water cooling radiator and lower layer water cooling radiator, the top and bottom of upper layer water cooling radiator are both provided with power amplifier circuit module, the top of lower layer water cooling radiator is provided with direct current power supply and radio frequency circuit module, the opposite sides of power supply shell are provided with air inlet and air outlet respectively, the inboard of air inlet is provided with heat dissipation fan, the side close to the air outlet between upper layer water cooling radiator and lower layer water cooling radiator is provided with baffle, the baffle and upper layer water cooling radiator form the air supply channel that cross-sectional area gradually reduces between them.

[0007] As a preferred scheme of the utility model, the baffle is made of insulating high-temperature-resistant material.

[0008] As a preferred scheme of the utility model, the left and right sides of the baffle extend upwards to form wind collecting side plates.

[0009] As one preferred scheme of the utility model, the upper fixed frame is fixed with the upper layer water cooling radiator through a screw fixing part.

[0010] As one preferred scheme of the utility model, the upper fixed frame is fixed with the upper layer water cooling radiator through a screw fixing part.

[0011] As one preferred scheme of the utility model, the lower fixed frame is fixed with the lower layer water cooling radiator through a screw fixing part.

[0012] As one preferred scheme of the utility model, the air inlet includes an upper layer air inlet located above the upper layer water cooling radiator and a lower layer air inlet located below the upper layer water cooling radiator.

[0013] The air outlet includes an upper layer air outlet located above the upper layer water cooling radiator and a lower layer air outlet located below the upper layer water cooling radiator.

[0014] As one preferred scheme of the utility model, the inner side of each upper layer air inlet and each lower layer air inlet is provided with the cooling fan.

[0015] As one preferred scheme of the utility model, the upper layer water cooling radiator is internally provided with upper layer water inlet channels and upper layer water outlet channels side by side, one end of the upper layer water inlet channel is provided with an upper layer water inlet interface, one end of the upper layer water inlet channel is provided with an upper layer water outlet interface, and the other end of the upper layer water inlet channel is communicated with the other end of the upper layer water outlet channel.

[0016] As one preferred scheme of the utility model, the lower layer water cooling radiator is internally provided with lower layer water inlet channels and lower layer water outlet channels side by side, one end of the lower layer water inlet channel is provided with a lower layer water inlet interface, one end of the lower layer water inlet channel is provided with a lower layer water outlet interface, and the other end of the lower layer water inlet channel is communicated with the other end of the lower layer water outlet channel.

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] The radio frequency power supply heat dissipation air duct structure provided by the utility model, through setting the power amplifier circuit module with many high heat generating components on the upper layer water cooler, cooperating with the heat dissipation fan, can take away the heat on the surface of the power amplifier circuit module in time, and through increasing a baffle, gradually reducing the cross section area of the air supply channel, guiding the flow direction of the air in the power supply, thereby changing the heat dissipation air duct, making the cold air more concentrated in the complex internal space structure, accelerating the airflow, changing the airflow from laminar flow to turbulent flow, further enhancing the heat exchange, namely enhancing the heat dissipation capacity, directly guiding the power amplifier circuit module with high heat, taking away the heat generated by the power amplifier circuit module, thereby reducing the temperature of the components and internal environment in the radio frequency power supply, achieving the effect of prolonging the service life of the product, making the equipment more stable and reliable. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0020] Figure 1 It is the internal side view of the radio frequency power supply heat dissipation air duct structure in an embodiment of the utility model;

[0021] Figure 2 It is the structural schematic diagram of the radio frequency power supply heat dissipation air duct structure in an embodiment of the utility model;

[0022] Figure 3 It is the structural schematic diagram of another view of the radio frequency power supply heat dissipation air duct structure in an embodiment of the utility model;

[0023] Figure 4 It is the structural schematic diagram of the baffle in an embodiment of the utility model.

[0024] In the drawings,

[0025] 1, power supply shell; 101, air inlet; 1011, upper air inlet; 1012, lower air inlet; 102, air outlet; 1021, upper air outlet; 1022, lower air outlet; 2, upper water-cooled radiator; 201, upper water inlet; 202, upper water outlet; 3, lower water-cooled radiator; 301, lower water inlet; 302, lower water outlet; 4, power amplifier circuit module; 5, DC power supply; 6, radio frequency circuit module; 7, cooling fan; 8, baffle; 801, wind gathering side plate; 802, upper fixed frame; 803, lower fixed frame; 9, air supply channel. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects of the utility model to be solved more clear and obvious, the utility model will be further described in detail below in combination with the drawings and examples. It should be noted that similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, it is declared that the following described examples are only used to explain the utility model, and are not used to limit the utility model.

[0027] It should be noted that the terms "set", "connect", "fix" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements or the interaction between two elements, unless otherwise specified. Indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawing, or the orientation or positional relationship of the product in use, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship of the product in use, only for the convenience of describing the application and simplifying the description, and is not indicative or implied that the device or element must have a specific orientation, structure and operation, therefore, it cannot be understood as a limitation on the application.

[0028] Please refer to Figures 1 to 4The embodiment provides a radio frequency power supply heat dissipation air duct structure, which comprises a power supply shell 1, an upper layer water-cooled radiator 2 and a lower layer water-cooled radiator 3 are arranged in the power supply shell 1, power amplifier circuit modules 4 are arranged on the top and bottom surfaces of the upper layer water-cooled radiator 2, a direct current power supply 5 and a radio frequency circuit module 6 are arranged on the top surface of the lower layer water-cooled radiator 3, air inlets 101 and air outlets 102 are arranged on the opposite sides of the power supply shell 1, heat dissipation fans 7 are arranged on the inner sides of the air inlets 101, an inclined baffle plate 8 is arranged on the side of the upper layer water-cooled radiator 2 and the lower layer water-cooled radiator 3 close to the air outlet 102, and the baffle plate 8 and the upper layer water-cooled radiator 2 form an air supply channel 9 with gradually reduced cross-sectional area. Since the power amplifier circuit modules 4 have many high-heat-generating components, the power amplifier circuit modules 4 are arranged on the upper layer water-cooled radiator 2 and cooperate with the heat dissipation fans 7 to timely take away the heat on the surfaces of the power amplifier circuit modules 4, and the cross-sectional area of the air supply channel 9 is gradually reduced by arranging the baffle plate 8, the flow direction of the air in the power supply is guided, the heat dissipation air duct is changed, the cold air is more concentrated in the complex internal space structure, the airflow is accelerated, the airflow is changed from laminar flow to turbulent flow, heat exchange is further enhanced, that is, the heat dissipation capacity is enhanced, the power amplifier circuit modules 4 directly radiate high heat, the heat generated by the power amplifier circuit modules 4 is taken away, the temperature of the components and the internal environment of the radio frequency power supply is reduced, the product service life is prolonged, the device is more stable and reliable, the heat dissipation of the direct current power supply 5 and the radio frequency circuit module 6 with small heat generation is achieved by only the lower layer water-cooled radiator 3, the layered heat dissipation and targeted heat dissipation mode fully considers the heat dissipation requirement difference of different components, and the overall heat dissipation efficiency is improved.

[0029] In one embodiment, the baffle plate 8 is made of Teflon insulation high-temperature-resistant material, but is not limited to any insulation high-temperature-resistant material. Since various circuit modules exist in the radio frequency power supply, electrical signals are generated during work. The good insulation performance of Teflon can prevent the baffle plate 8 from causing short circuit and other circuit faults due to conduction, ensures the stable and safe operation of the internal circuit of the power supply, and avoids the influence of electrical faults on the normal work and heat dissipation effect of the radio frequency power supply. In addition, when the radio frequency power supply works, the internal components, especially the power amplifier circuit modules 4, generate a large amount of heat, causing the internal temperature to rise. The high-temperature-resistant property of Teflon enables it to remain stable in physical and chemical properties in a high-temperature environment, without deformation, aging or release of harmful gases and other problems, guarantees the structural integrity and functional effectiveness of the baffle plate 8, and continuously plays the role of guiding the air flow and optimizing the heat dissipation air duct.

[0030] Please refer to Figure 4In one embodiment, the wind baffle 8 extends upward on both sides to form wind gathering side plates 801. The wind gathering side plates 801 can limit the spread of wind flow to both sides, concentrate the wind flow in the air supply channel 9, further guide the wind flow in a specific direction, let more cold air directly blow to the power amplifier circuit module 4 and other heat generating elements, improve the heat dissipation efficiency, and strengthen the heat dissipation effect on the high heat area.

[0031] Please refer to Figure 4 In one embodiment, the wind baffle 8 is provided with upper fixing frames 802 on both sides near one end of the air outlet 102, the upper fixing frames 802 are fixed with the upper water-cooled radiator 2, the wind baffle 8 is provided with lower fixing frames 803 on both sides near one end of the air inlet 101, and the lower fixing frames 803 are fixed with the lower water-cooled radiator 3. The upper fixing frames 802 connect the end of the wind baffle 8 near the air outlet 102 with the upper water-cooled radiator 2, and the lower fixing frames 803 connect the end of the wind baffle 8 near the air inlet 101 with the lower water-cooled radiator 3, forming a stable fixing structure, which can ensure that the wind baffle 8 does not shake or shift even if it is impacted by the airflow generated by the heat dissipation fan 7 during the operation of the radio frequency power supply, and always remains in the designed position, continuously and stably plays the role of guiding the wind flow and optimizing the heat dissipation air duct.

[0032] In one embodiment, the upper fixing frames 802 are fixed with the upper water-cooled radiator 2 through screw fixing members, and the lower fixing frames 803 are fixed with the lower water-cooled radiator 3 through screw fixing members. The screw fixing members can accurately position the upper fixing frames 802 and the lower fixing frames 803 during installation. Through the pre-designed screw hole positions, it can be ensured that the wind baffle 8 is in the accurate position after installation, so as to ensure that the relative position relationship between the wind baffle 8 and the upper and lower water-cooled radiators 3 meets the design requirements, and further ensure the accuracy and stability of the heat dissipation air duct, and ensure that the heat dissipation effect is not affected.

[0033] Please refer to Figure 2 , Figure 3In an embodiment, the air inlet 101 includes an upper row of air inlets 1011 above the upper water-cooled heat sink 2 and a lower row of air inlets 1012 below the upper water-cooled heat sink 2; the air outlet 102 includes an upper row of air outlets 1021 above the upper water-cooled heat sink 2 and a lower row of air outlets 1022 below the upper water-cooled heat sink 2. The inner side of each upper air inlet 1011 and each lower air inlet 1012 is provided with a cooling fan 7. By arranging an upper row of air inlets 1011 and a lower row of air inlets 1012, and equipping each air inlet 101 with a cooling fan 7 on the inner side, the amount of cold air entering the interior of the power supply can be significantly increased. More cold air can come into contact with the internal heat-generating components (especially for components such as the power amplifier circuit module 4 that generate a large amount of heat) more quickly, taking away heat, thereby effectively reducing the internal temperature of the radio frequency power supply and greatly improving the heat dissipation efficiency.

[0034] Referring to Figure 2 In an embodiment, the upper water-cooled heat sink 2 is provided with left and right side-by-side upper water inlet channels and upper water outlet channels, one end of the upper water inlet channel is provided with an upper water inlet interface 201, one end of the upper water inlet channel is provided with an upper water outlet interface 202, and the other end of the upper water inlet channel is in communication with the other end of the upper water outlet channel. The upper water outlet interface 202 is used to connect an external water source (such as a water pump or a water tank) to introduce cooling water into the upper water-cooled heat sink 2. The upper water outlet interface 202 is the outlet for cooling water to flow out of the upper water-cooled heat sink 2, and is usually connected to another part of the circulating system or a drainage device. After the cooling water enters the upper water inlet channel from the upper water outlet interface 202, it then flows into the upper water outlet channel, absorbs the heat generated by the power amplifier circuit module 4 and warms up, and finally flows out through the upper water outlet interface 202.

[0035] Referring to Figure 2 In an embodiment, the lower water-cooled heat sink 3 is provided with left and right side-by-side lower water inlet channels and lower water outlet channels, one end of the lower water inlet channel is provided with a lower water inlet interface 301, one end of the lower water inlet channel is provided with a lower water outlet interface 302, and the other end of the lower water inlet channel is in communication with the other end of the lower water outlet channel. The lower water outlet interface 302 is used to connect an external water source (such as a water pump or a water tank) to introduce cooling water into the lower water-cooled heat sink 3. The lower water outlet interface 302 is the outlet for cooling water to flow out of the lower water-cooled heat sink 3, and is usually connected to another part of the circulating system or a drainage device. After the cooling water enters the lower water inlet channel from the lower water outlet interface 302, it then flows into the lower water outlet channel, absorbs the heat generated by the direct current power supply 5 and the radio frequency circuit module 6 and warms up, and finally flows out through the lower water outlet interface 302.

[0036] It should be understood that, for those skilled in the art, improvements or changes can be made according to the above description, and all these improvements and changes shall belong to the protection scope of the appended claims of the utility model.

[0037] The utility model patent is exemplarily described above in combination with the drawings, obviously, the implementation of the utility model patent is not limited by the above-mentioned mode, as long as various improvements are made by using the method concept and technical scheme of the utility model patent, or the concept and technical scheme of the utility model patent are directly applied to other occasions without improvement, all are within the protection scope of the utility model.

Claims

1. A radio frequency power supply heat dissipation air duct structure, characterized in that, The utility model provides a power supply shell is arranged with upper layer water cooling radiator and lower layer water cooling radiator inside, the top and bottom of upper layer water cooling radiator are provided with power amplifier circuit module, the top of lower layer water cooling radiator is provided with direct current power supply and radio frequency circuit module, the opposite sides of power supply shell are provided with air inlet and air outlet respectively, the inner side of air inlet is provided with heat dissipation fan, the side of upper layer water cooling radiator and lower layer water cooling radiator is provided with baffle plate near air outlet, the baffle plate and upper layer water cooling radiator form the air supply channel of cross section area gradually reducing.

2. The radio frequency power supply heat dissipation air duct structure according to claim 1, characterized in that, The baffle plate is made of insulating high-temperature-resistant material.

3. The radio frequency power supply heat dissipation air duct structure according to claim 1, characterized in that, The left and right sides of the baffle plate extend upward to form wind gathering side plates.

4. The radio frequency power supply heat dissipation air duct structure of claim 1, wherein, The left and right sides of the end of the baffle plate near the air outlet are provided with upper fixing frames, the upper fixing frames are fixed with the upper layer water cooling radiator, the left and right sides of the end of the baffle plate near the air inlet are provided with lower fixing frames, and the lower fixing frames are fixed with the lower layer water cooling radiator.

5. The radio frequency power supply heat dissipation air duct structure according to claim 4, characterized in that, The upper fixing frames are fixed with the upper layer water cooling radiator through screw fixing members.

6. The radio frequency power supply heat dissipation air duct structure according to claim 4, characterized in that, The lower fixing frames are fixed with the lower layer water cooling radiator through screw fixing members.

7. The radio frequency power supply heat dissipation air duct structure of claim 1, wherein, The air inlet includes an upper air inlet above the upper layer water cooling radiator and a lower air inlet below the upper layer water cooling radiator. The air outlet includes an upper air outlet above the upper layer water cooling radiator and a lower air outlet below the upper layer water cooling radiator.

8. The radio frequency power supply heat dissipation air duct structure according to claim 7, characterized in that, The inner sides of each upper air inlet and each lower air inlet are provided with heat dissipation fans.

9. The radio frequency power supply heat dissipation air duct structure of claim 1, wherein, The upper layer water cooling radiator is provided with left and right upper water inlet channels and upper water outlet channels, one end of the upper water inlet channel is provided with an upper water inlet interface, one end of the upper water outlet channel is provided with an upper water outlet interface, and the other end of the upper water inlet channel is connected with the other end of the upper water outlet channel.

10. The radio frequency power supply heat dissipation air duct structure of claim 1, wherein, The lower layer water cooling radiator is provided with left and right lower water inlet channels and lower water outlet channels, one end of the lower water inlet channel is provided with a lower water inlet interface, one end of the lower water outlet channel is provided with a lower water outlet interface, and the other end of the lower water inlet channel is connected with the other end of the lower water outlet channel.