Electronic equipment heat dissipation device and electronic equipment

Abstract

The utility model discloses an electronic equipment heat dissipation device and electronic equipment. The electronic equipment heat dissipation device comprises a temperature uniformizing piece, a heat conducting piece and a heat conducting piece, the temperature uniformizing piece is matched with a to-be-cooled element in a heat transfer mode, and the temperature uniformizing piece is provided with a cavity used for containing cooling liquid and a plurality of grooves separated from the cavity; the heat conduction piece is used for heat transfer cooperation; at least one part of the heat transfer part is located in the groove and matched with the inner wall of the groove in a heat transfer mode, the heat transfer part is matched with the heat conduction part in a heat transfer mode, and a medium in the heat transfer part transfers heat at the temperature equalizing part to the heat conduction part. According to the invention, the problem of poor heat dissipation effect of the electronic equipment component heat dissipation device in the prior art is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment heat dissipation device and electronic equipment. BACKGROUND

[0002] At present, due to the rapid growth of the power density of CPU, GPU and other components on the server, the traditional heat dissipation scheme has been difficult to meet the growing heat dissipation demand. The traditional air cooling scheme has reached the physical limit, and the heat pipe technology has high efficient heat transfer characteristics (the thermal conductivity coefficient can reach more than 100 times that of copper), but the traditional heat pipe radiator is limited by the linear structure of single heat source to single condensing end, and its heat dissipation capacity has a theoretical upper limit. The direct contact liquid cooling technology such as immersion and spraying has high maintenance cost and environmental safety problems, and the cold plate liquid cooling also has the problem of local hot spots when dealing with ultra-high heat flow density. Therefore, the existing server heat dissipation device has poor heat dissipation effect for components. CONTENT OF THE UTILITY MODEL

[0003] The present application provides an electronic equipment heat dissipation device and electronic equipment to at least solve the problem of poor heat dissipation effect of electronic equipment component heat dissipation device in the related art.

[0004] The present application provides an electronic equipment heat dissipation device, comprising: a temperature equalizing piece, the temperature equalizing piece is in heat transfer cooperation with a component to be cooled, the temperature equalizing piece has a cavity for accommodating cooling liquid and a plurality of grooves arranged separately from the cavity; a heat conducting piece, the heat conducting piece is used for heat transfer cooperation; a heat transfer piece, at least a part of the heat transfer piece is located in the groove and is in heat transfer cooperation with the inner wall of the groove, the heat transfer piece is in heat transfer cooperation with the heat conducting piece, and the medium in the heat transfer piece transfers heat at the temperature equalizing piece to the heat conducting piece.

[0005] The present application also provides an electronic equipment, comprising a component to be cooled and the above-mentioned electronic equipment heat dissipation device, the temperature equalizing piece of the electronic equipment heat dissipation device is arranged on the component to be cooled.

[0006] Through the application, the cavity is arranged in the uniform temperature piece, and the recess is arranged outside the uniform temperature piece, the cavity and the recess are arranged in a separated form, and the recess is provided with a plurality of recesses, thereby forming a multi-layer conduction form. When the cooling liquid in the uniform temperature piece exchanges heat with the element to be cooled, the cooling liquid absorbs heat and evaporates, and the generated evaporated gas gradually fills the cavity. In the dispersion process of the evaporated gas, the evaporated gas gradually passes through the positions of the recesses, thereby respectively conducting heat between the heat transfer pieces through the recesses. In this way, a multi-time and multi-layer heat exchange form is formed, so that the heat of the evaporated gas can be fully transferred, thereby improving the heat exchange effect between the cooling liquid and the heat transfer piece. The heat received by the heat transfer piece is transferred to the heat conduction piece, and is further processed by the heat conduction piece. The above setting mode utilizes the recess to form a multi-layer heat dissipation form between the uniform temperature piece and the element to be cooled, utilizes the three-dimensional space to further improve the heat transfer effect between the uniform temperature piece and the element to be cooled, and thereby further enhances the heat dissipation effect of the heat dissipation device on the element to be cooled. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application, the drawings required in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0008] Figure 1 The structural schematic diagram of the electronic equipment heat dissipation device provided in the embodiments of the present application is shown in the figure.

[0009] Figure 2 The structural schematic diagram of the uniform temperature piece in the Figure 1 The main sectional view of the

[0010] Figure 3 The structural schematic diagram of the uniform temperature piece in the Figure 2 The main sectional view of the

[0011] Figure 4 The structural schematic diagram of the uniform temperature piece when the first side surface is the heat transfer surface.

[0012] Figure 5 The structural schematic diagram of the heat transfer piece with throttling section.

[0013] Among them, the above drawings include the following reference signs:

[0014] 10, uniform temperature piece; 11, cavity; 111, heat transfer section; 112, communication section; 12, recess; 13, heat transfer surface; 20, heat conduction piece; 30, heat transfer piece; 31, throttling section; 40, liquid cooling assembly; 41, liquid cooling distribution device; 42, cold plate; 43, water distributor; 50, heat conduction layer; 60, element to be cooled. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present application.

[0016] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skill in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0017] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0018] In order to solve the problem of poor heat dissipation effect of electronic device component heat dissipation device in the related art, the present application provides an electronic device heat dissipation device and an electronic device.

[0019] As Figure 1An electronic equipment heat dissipation device is shown, which comprises a temperature equalizing member 10, a heat conducting member 20 and a heat transferring member 30. The temperature equalizing member 10 is in heat transfer cooperation with a component 60 to be cooled. The temperature equalizing member 10 has a cavity 11 for containing cooling liquid and a plurality of grooves 12 arranged separately from the cavity 11. The heat conducting member 20 is arranged for heat transfer cooperation. At least a part of the heat transferring member 30 is arranged in the groove 12 and in heat transfer cooperation with the inner wall of the groove 12. The heat transferring member 30 is in heat transfer cooperation with the heat conducting member 20. The medium in the heat transferring member 30 transfers the heat at the temperature equalizing member 10 to the heat conducting member 20.

[0020] In the embodiment, the cavity 11 is arranged in the temperature equalizing member 10 and the grooves 12 are arranged outside the temperature equalizing member 10. The cavity 11 and the grooves 12 are arranged separately. The grooves 12 are arranged in multiple layers. When the cooling liquid in the temperature equalizing member 10 exchanges heat with the component 60 to be cooled, the cooling liquid absorbs heat and evaporates. The generated evaporated gas gradually fills the cavity 11. During the diffusion of the evaporated gas, the evaporated gas gradually passes through the positions of the grooves 12. Thus, the heat transfer between the grooves 12 and the heat transferring member 30 can be achieved. The multiple layers of heat exchange are formed. The heat of the evaporated gas can be fully transferred. Thus, the heat exchange effect between the cooling liquid and the heat transferring member 30 is improved. The heat received by the heat transferring member 30 is transferred to the heat conducting member 20. The heat conducting member 20 is further processed. The arrangement of the grooves 12 forms multiple layers of heat dissipation between the temperature equalizing member 10 and the component 60 to be cooled. The heat transfer effect between the temperature equalizing member 10 and the component 60 to be cooled is further improved in three-dimensional space. Thus, the heat dissipation effect of the heat dissipation device on the component 60 to be cooled is further improved.

[0021] As shown in Figure 2 and Figure 3 In the embodiment, the temperature equalizing member 10 comprises a shell. The cavity 11 is formed in the shell. The shell of the embodiment is in the shape of a cuboid. Of course, the specific shape can be adjusted as required. The shell has opposite first and second sides. A part of the second side is recessed towards the first side and forms the groove 12. Since the grooves 12 are arranged in multiple layers, a plurality of parts of the second side are recessed towards the first side and form the grooves 12. Thus, the grooves 12 are formed on the second side by the recessed form. Since the grooves 12 are recessed, the area of the inner wall of the groove 12 is large. When the heat transferring member 30 is inserted into the groove 12, the heat transferring member 30 is in contact with the inner wall of the groove 12. Thus, the heat in the cavity 11 can be transferred to the heat transferring member 30 as much as possible. The arrangement of the multiple grooves 12 can greatly improve the heat transfer amount of the heat transfer process as a whole. Thus, the heat dissipation effect is improved.

[0022] Preferably, the second side is recessed towards the first side by a depth greater than half the distance between the first side and the second side, so that the depth of the groove 12 can be larger, so that the heat exchange area between the groove 12 and the heat transfer member 30 can be larger, thereby facilitating the improvement of the heat exchange effect.

[0023] It should be noted that although the groove 12 is recessed from the second side to the first side, the groove 12 of the present embodiment does not penetrate the first side, i.e. the groove 12 is spaced apart from the first side, so that it is helpful for the smooth flow of the evaporated gas inside the cavity 11, avoiding the situation that the evaporated gas cannot disperse to part of the space or the dispersion speed is too slow due to the broken or narrow position, so as to ensure good heat transfer effect.

[0024] The groove 12 of the present embodiment adopts a flat cuboid shape, and each groove 12 is arranged in parallel and spaced apart on the second side, so that the evaporated gas can be uniformly exchanged with the heat transfer member 30 at the inner wall of each groove 12 during the dispersion process.

[0025] In the present embodiment, the shell further has a third side and a fourth side adjacent to the first side and the second side, and the third side and the fourth side are two opposite sides, and the present embodiment adopts a groove 12 penetrating the third side and the fourth side, so that the area of the inner wall surface of the groove 12 can be as large as possible, thereby improving the heat exchange effect with the heat transfer member 30. Of course, the groove 12 can also not penetrate the third side and the fourth side or only penetrate one of the third side and the fourth side.

[0026] In the present embodiment, the shell further has a fifth side adjacent to the first side, the second side and the third side, and a sixth side opposite to the fifth side, and the above six sides are six outer surfaces of the cuboid shell, and the connecting line between the fifth side and the sixth side is parallel to the arrangement direction of the groove 12, and the groove 12 is arranged in parallel and spaced apart along the distance from the fifth side to the sixth side.

[0027] Taking the direction in the following formula as an example: Figure 3 The first side is the left side, the second side is the right side, the third side and the fourth side are the front and rear sides, and the fifth side and the sixth side are the upper and lower sides.

[0028] In the embodiment, the cavity 11 comprises a plurality of heat transfer segments 111 and communication segments 112, the heat transfer segments 111 are located at the side of the grooves 12, each heat transfer segment 111 is arranged in the arrangement direction of the grooves 12, the heat transfer segment 111 is actually the part of the cavity between the grooves 12, the evaporated gas enters the heat transfer segment 111 so as to exchange heat with the heat transfer member 30 through the inner side wall of the groove 12. The interval between the groove 12 and the first side forms the communication segment 112, the communication segment 112 mainly plays a role of connecting the heat transfer segments 111 together, so that the heat transfer segments 111 are connected through the communication segment 112, so that the cavity 11 forms a form of being connected with each other, so as to ensure that the evaporated gas can diffuse to each position of the cavity 11, so as to ensure the heat exchange effect between the grooves 12.

[0029] As shown in the figure, Figure 3 In the embodiment, the outer surface of the uniform temperature member 10 has a heat transfer surface 13 for heat transfer cooperation with the element to be cooled 60, the heat transfer surface 13 is the surface closest to the element to be cooled 60, which is the main part of heat exchange with the element to be cooled 60, the cooling liquid is gathered at the heat transfer surface 13 so as to realize sufficient heat exchange with the element to be cooled 60. Which outer surface of the shell is used as the heat transfer surface 13 can be set as needed, and in the embodiment, the outer surface perpendicular to the arrangement direction of the grooves 12, that is, the fifth side or the sixth side is used as the heat transfer surface 13, so that the uniform temperature member 10 as a whole forms a vertical E-shaped structure, and the bottom surface is the fifth side or the sixth side. At this time, the grooves 12 and the heat transfer segments 111 are horizontally extended and arranged in an up-down manner, so that when the uniform temperature member 10 exchanges heat with the element to be cooled 60, the cooling liquid at the bottom is evaporated by heat, and the evaporated gas can diffuse upward and quickly fill the cavity 11, so as to exchange heat with the heat transfer member 30 in each groove 12, so as to form a multi-layer and multi-time heat exchange form, so that the evaporated gas can fully exchange heat, and the above setting mode utilizes not only the area of the horizontal two-dimensional plane, but also the height direction of the space three-dimensional, so that the uniform temperature member 10 can adjust its height according to different heat dissipation requirements, that is, the number of up-down arranged grooves 12 can be adjusted, so as to increase the number of times of heat exchange of the evaporated gas rising, improve the heat exchange effect, and further improve the heat dissipation effect.

[0030] Of course, in addition to the above setting mode, the first side can also be used as the heat transfer surface 13, as shown in the figure, Figure 4As shown, at this time, the temperature equalizing member 10 forms a W-like structure, and the heat transfer segments 111 are arranged longitudinally. In this case, the evaporated cooling liquid at different horizontal positions will enter different heat transfer segments 111 during the rising process, and then exchange heat with the heat transfer members 30 in the corresponding grooves 12. When it is necessary to increase the heat exchange amount, the length of the heat transfer segments 111, i.e. the height, can be increased, so that the heat exchange path of the evaporated gas in the heat transfer segments 111 is prolonged, thereby improving the heat exchange effect.

[0031] The heat conducting members 20 and the heat transfer members 30 in this embodiment are both multiple and arranged in one-to-one correspondence with the grooves 12, i.e. one heat transfer member 30 is inserted into each groove 12, and the different heat transfer members 30 and the heat conducting members 20 are arranged independently relative to each other, so that the heat transfer members 30 and the heat conducting members 20 will not affect each other and can exchange heat respectively. Of course, when better heat dissipation effect is needed, the number of heat conducting members 20 and heat transfer members 30 can be increased, so that one heat transfer member 30 cooperates with multiple heat conducting members 20 to exchange heat, or one groove 12 cooperates with multiple heat conducting members 20 to exchange heat.

[0032] In this embodiment, based on the structure that the fifth side surface or the sixth side surface is used as the heat transfer surface 13 and cooperates with the multiple grooves 12 of the temperature equalizing member 10, the high-temperature evaporated gas has buoyancy, so the heat near the grooves 12 at higher positions is higher than that near the grooves 12 at lower positions. Therefore, the heat transfer members 30 are further designed in this embodiment. Specifically, the size of the smallest flow cross section of the heat transfer members 30 gradually increases in the direction away from the heat transfer surface 13, i.e. from bottom to top, so that the heat exchange amount that can be carried by the heat transfer members 30 in the upper grooves 12 is greater than that in the lower grooves 12. In this way, the heat transfer members 30 in the upper grooves 12 can cooperate with the heat at high positions, so that the heat at high positions can be timely transferred through the heat transfer members 30, and the cavity 11 can be fully cooled everywhere, thereby avoiding the situation that the temperature of the heat conducting members 20 is too high or too low due to uneven heat distribution, which leads to reduced or even lost heat dissipation efficiency, and further leads to poor heat dissipation effect of the element 60 to be cooled.

[0033] The heat transfer member 30 in this embodiment includes a heat transfer pipe, and the heat transfer pipe is used for medium flow. The heat transfer pipe can adopt a structure with the same diameter, and the internal passage has the same cross-sectional area everywhere. At this time, the cross section of the heat transfer pipe at any position is the flow cross section. Alternatively, the heat transfer pipe can adopt a structure with variable diameter, and the internal passage can have a throttling segment 31 with a smaller diameter than other segments. At this time, the cross section of the throttling segment 31 is the flow cross section, as shown in Figure 5 .

[0034] AsFigure 1 As shown, in the embodiment, the electronic equipment heat dissipation device further comprises a liquid cooling assembly 40, which comprises a liquid cooling distribution device 41 for heat exchange with the outside, cold plates 42 and a water distributor 43. The cold plates 42 are in heat transfer cooperation with the heat conduction members 20. Since the heat conduction members 20 are provided in multiple, the cold plates 42 are also provided in multiple, and each cold plate 42 is in cooperation with the heat conduction member 20. The water distributor 43 is arranged between the cold plates 42 and the liquid cooling distribution device 41, and is communicated through a pipeline. The refrigerant in the liquid cooling distribution device 41 is distributed to each cold plate 42 through the water distributor 43, and exchanges heat with the medium in the heat conduction member 20 in the cold plate 42, so as to exchange the heat in the heat conduction member 20 to the liquid cooling assembly 40, and further process by the liquid cooling assembly 40.

[0035] It should be noted that since the heat exchange amount of the heat conduction members 30 in different grooves 12 is different, the heat exchange of the heat conduction members 20 can also be adjusted as needed. Specifically, the heat conduction member 20 in the embodiment adopts a heat conduction plate, which is arranged in a stacked form with the cold plates 42 of the liquid cooling assembly 40, and exchanges heat through contact. According to the different heat exchange amounts of the heat conduction members 30, the thickness of the heat conduction plate can be adjusted as needed. The thickness of the heat conduction plate connected to the heat conduction member 30 with high heat exchange amount is thicker, so that the heat exchange amount of the heat conduction plate is also higher, and the cooperation between them ensures good heat exchange effect.

[0036] The surface of the heat conduction plate of the embodiment in cooperation with the cold plate 42 adopts a flat form to ensure the heat exchange effect. Therefore, the heat conduction member 30 can be embedded or inserted into the heat conduction plate, so as to maintain the flat structure of the surface of the heat conduction plate, facilitate the lamination with the cold plate 42, and ensure the heat dissipation effect.

[0037] Optionally, the inner wall surface of the cavity 11 can be provided with a reinforcing structure such as a wire mesh, a groove or a powder sintering structure as needed. The reinforcing structure can improve the heat exchange effect between the evaporated gas and the heat conduction member 30 through the inner wall of the cavity 11.

[0038] The heat conduction layer 50 is further arranged on the heat transfer surface 13 of the embodiment, which can be formed of a heat conduction material, so as to improve the heat exchange effect between the shell and the element to be cooled 60.

[0039] The embodiment further provides an electronic equipment, which comprises an element to be cooled 60 and the above-mentioned electronic equipment heat dissipation device. The uniform temperature member 10 of the electronic equipment heat dissipation device is arranged on the element to be cooled 60. The embodiment takes a server as an example of the electronic equipment. The element to be cooled 60 can be a central processing unit, a graphics processing unit, a memory or the like as needed.

[0040] It should be noted that the plurality in the above-mentioned embodiment means at least two.

[0041] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

[0042] The present embodiment sets a cavity 11 in the uniform temperature piece 10, and sets a groove 12 outside the uniform temperature piece 10, the cavity 11 and the groove 12 are in a separated form, and the groove 12 is provided with a plurality of grooves, thereby forming a multi-layer conduction form. When the cooling liquid in the uniform temperature piece 10 exchanges heat with the element to be cooled 60, the cooling liquid absorbs heat and evaporates, and the generated evaporated gas gradually fills the cavity 11. In the dispersion process of the evaporated gas, the evaporated gas gradually passes through the position of each groove 12, thereby heat exchange between each groove 12 and the heat transfer piece 30 can be carried out. In this way, a multi-time and multi-layer heat exchange form is formed, so that the heat of the evaporated gas can be fully transferred, thereby improving the heat exchange effect between the cooling liquid and the heat transfer piece 30. The heat received by the heat transfer piece 30 is transferred to the heat conduction piece 20 for further processing. The above setting mode utilizes the setting of the groove 12 to form a multi-layer heat dissipation form between the uniform temperature piece 10 and the element to be cooled 60, and utilizes the three-dimensional space to further improve the heat transfer effect between the uniform temperature piece 10 and the element to be cooled 60, thereby further enhancing the heat dissipation effect of the heat dissipation device on the element to be cooled 60.

[0043] The electronic equipment heat dissipation device and electronic equipment provided by the present application are described in detail above. The principles and implementation modes of the present application are described by applying specific examples in this paper. The above embodiment is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. An electronic device heat dissipation apparatus, characterized by comprising: The electronic equipment heat dissipation device comprises: a temperature equalizing member (10) in heat transfer cooperation with an element (60) to be cooled, the temperature equalizing member (10) having a cavity (11) for containing cooling liquid and a plurality of grooves (12) arranged separately from the cavity (11); a heat conducting member (20) for heat transfer cooperation; a heat transfer member (30), at least a part of the heat transfer member (30) being located in the grooves (12) and in heat transfer cooperation with the inner walls of the grooves (12), the heat transfer member (30) being in heat transfer cooperation with the heat conducting member (20), and a medium in the heat transfer member (30) transferring heat at the temperature equalizing member (10) to the heat conducting member (20).

2. The electronic device heat dissipation apparatus of claim 1, wherein, The temperature equalizing member (10) comprises a shell, the shell forming the cavity (11) inside, the shell having opposite first and second sides, and a part of the second side being recessed towards the first side and forming the grooves (12).

3. The electronic device heat dissipation apparatus of claim 2, wherein, The depth of the recess of the second side towards the first side is greater than half the distance between the first and second sides.

4. The electronic device heat dissipation apparatus of claim 2, wherein, The grooves (12) are arranged in parallel and spaced apart on the second side.

5. The electronic device heat dissipation apparatus of claim 2, wherein, The cavity (11) comprises a plurality of heat transfer segments (111) and communication segments (112), the heat transfer segments (111) being located at the sides of the grooves (12), the heat transfer segments (111) being arranged in spaced apart relation along the arrangement direction of the grooves (12), the grooves (12) being spaced apart from the first side and forming the communication segments (112), and the heat transfer segments (111) being communicated through the communication segments (112).

6. The electronic device heat dissipation apparatus of claim 2, wherein, The outer surface of the temperature equalizing member (10) has a heat transfer surface (13) for heat transfer cooperation with the element (60) to be cooled, the first side serving as the heat transfer surface (13), or the outer surface perpendicular to the arrangement direction of the grooves (12) serving as the heat transfer surface (13).

7. The electronic device heat dissipation apparatus according to any one of claims 1 to 5, characterized by, The outer surface of the temperature equalizing member (10) has a heat transfer surface (13) for heat transfer cooperation with the element (60) to be cooled, and the heat transfer member (30) comprises a heat transfer pipe, the minimum flow cross section of the heat transfer pipe gradually increasing in size in the direction away from the heat transfer surface (13).

8. The electronic device heat dissipation apparatus according to any one of claims 1 to 6, characterized in that, The electronic equipment heat dissipation device further comprises a liquid cooling assembly (40), the liquid cooling assembly (40) comprising: a liquid cooling distribution device (41) for heat exchange with the outside; a cold plate (42) in heat transfer cooperation with the heat conducting member (20); a water distributor (43) arranged between the cold plate (42) and the liquid cooling distribution device (41), the coolant in the liquid cooling distribution device (41) being distributed to the cold plate (42) through the water distributor (43) and being in heat exchange with the medium in the heat conducting member (20) in the cold plate (42).

9. The electronic equipment heat dissipation device according to claim 1, wherein The uniform temperature device (10) comprises a shell, the shell forms the cavity (11) inside, the shell has opposite first and second sides, parts of the second side are recessed to the first side and form a plurality of recesses (12), each recess (12) is arranged along the surface of the second side; The shell also has third and fourth sides adjacent to the first and second sides, the recesses (12) pass through the third and fourth sides; The shell also has a fifth side adjacent to the first, second and third sides and a sixth side opposite to the fifth side, the line between the fifth and sixth sides is parallel to the arrangement direction of the recesses (12), the fifth side or the sixth side serves as the heat transfer surface (13) for heat transfer with the element (60) to be cooled, or the first side serves as the heat transfer surface (13) for heat transfer with the element (60) to be cooled; The heat conduction device (20) and the heat transfer device (30) are a plurality of and one-to-one corresponding, each recess (12) is provided with the heat transfer device (30), the heat transfer devices (30) in different recesses (12) are relatively independently arranged, when the fifth side or the sixth side serves as the heat transfer surface (13), the size of the minimum flow cross section of the heat transfer device (30) gradually increases in the direction away from the heat transfer surface (13).

10. An electronic device, comprising: The electronic equipment heat dissipation device comprises an element (60) to be cooled and the electronic equipment heat dissipation device of any one of claims 1 to 9, and the uniform temperature device (10) of the electronic equipment heat dissipation device is arranged on the element (60) to be cooled.

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