Clamp device and polishing system

Abstract

The utility model discloses a clamp device and a polishing system, the clamp device comprises a mechanical arm, a clamp structure used for clamping a ceramic disc and a driving piece, the clamp structure comprises a fixing plate, a clamping plate and a guide assembly, the fixing plate is movably connected with the clamping plate through the guide assembly, and the clamping plate is movably connected with the mechanical arm. The driving piece is installed on the fixing plate, and an output shaft of the driving piece is connected with the clamping plate so as to drive the clamping plate to move in the direction away from or close to the fixing plate; the clamping plate and the fixing plate are each provided with an arc-shaped groove, and the two arc-shaped grooves jointly form a clamping position of the clamp structure. According to the utility model, the physical burden of employees is reduced, the fatigue problem caused by long-time repeated loading and unloading is reduced, the mild treatment on the ceramic plate in the carrying process is ensured, the wafer damage risk caused by manual contact or improper operation is reduced, and the yield of products is further improved.

Description

Technical Field

[0001] This utility model relates to the field of loading and unloading technology for wafer polishing, and in particular to a clamping device and polishing system. Background Technology

[0002] Polishing is a crucial step in semiconductor manufacturing, its primary purpose being to remove damaged layers from the wafer surface using a polishing machine, thereby ensuring wafer quality. The polishing process is typically divided into two stages: rough polishing and fine polishing. Rough polishing primarily removes damage and impurities from the wafer surface, laying the foundation for subsequent processing; while fine polishing aims to further improve the smoothness and flatness of the wafer surface based on rough polishing, meeting the stringent surface quality requirements of semiconductor devices.

[0003] Currently, the process involves employees manually mounting ceramic discs (weighing over 10kg) with wafers onto the upper platen of the polishing machine. After the rough polishing process, the discs are removed for wafer inspection or to proceed with the next process. Then, for fine polishing, the discs are mounted again. This operating mode not only increases the physical burden on employees, but the prolonged mounting and dismounting can easily lead to fatigue, thus affecting production efficiency. Furthermore, frequent manual contact increases the risk of wafer damage, resulting in lower product yield. Utility Model Content

[0004] The technical problem this invention aims to solve is that the existing loading and unloading processes for rough and fine wafer polishing are performed manually. This not only increases the physical burden on employees, but also easily leads to employee fatigue due to prolonged loading and unloading operations, thus affecting production efficiency. In addition, frequent manual contact also increases the risk of wafer damage, resulting in a decrease in product yield.

[0005] To address the aforementioned technical problems, this utility model provides a clamping device, including a robotic arm, a clamping structure for clamping a ceramic disc, and a driving component. The clamping structure includes a fixed plate, a clamping plate, and a guide assembly. The fixed plate and the clamping plate are movably connected via the guide assembly. The driving component is mounted on the fixed plate, and its output shaft is connected to the clamping plate to drive the clamping plate to move away from or towards the fixed plate. Both the clamping plate and the fixed plate have arc-shaped grooves, and the two arc-shaped grooves together constitute the clamping position of the clamping structure.

[0006] Furthermore, the guide assembly includes a linear bearing and a guide rod. The fixing plate has a mounting groove on the side facing the clamping plate, and the clamping plate has a mating groove on the side facing the fixing plate. The linear bearing is installed in the mounting groove, and one end of the guide rod passes through the linear bearing and is slidably installed in the mounting groove, while the other end is installed in the mating groove.

[0007] Furthermore, the guide assembly is of multiple types, and the multiple guide assemblies are spaced apart along the width direction of the fixed plate.

[0008] Furthermore, it also includes a vacuum suction cup and a vacuum pump. A vacuum channel is provided in the fixed plate, the vacuum suction cup is installed on the fixed plate, and is connected to the vacuum pump through the vacuum channel.

[0009] Furthermore, the fixing plate includes a main body, a support, and a connecting part. The main body and the connecting part are installed at both ends of the support. The main body has the arc-shaped groove, and the connecting part is connected to the robotic arm.

[0010] Furthermore, the connecting part has a connecting hole and a plurality of locking holes, the plurality of locking holes being spaced apart around the axis of the connecting hole and surrounding the periphery of the connecting hole.

[0011] Furthermore, it also includes a push rod and a fixing block, the fixing block being disposed on the side of the clamping plate opposite to the clamping position, and the push rod being connected to the clamping plate through the fixing block.

[0012] Furthermore, the extension direction of the push rod is perpendicular to the movement direction of the clamping plate.

[0013] This utility model also provides a polishing system, including a coarse polisher, a fine polisher, a transfer frame for placing ceramic discs, and a clamping device as described above. The transfer frame and the clamping device are disposed between the fine polisher and the coarse polisher. The clamping device is used to transport the ceramic discs to the coarse polisher or the fine polisher.

[0014] Furthermore, the coarse polishing machine includes a first body, a first water-blocking gate, and a first upper fixed plate. The first body has a coarse polishing cavity, the first upper fixed plate is disposed in the coarse polishing cavity, and the first water-blocking gate is installed in the coarse polishing cavity to open or close the coarse polishing cavity.

[0015] The polishing machine includes a second body, a second water baffle, and a second upper fixed plate. The second body has a polishing cavity, the second upper fixed plate is disposed in the polishing cavity, and the second water baffle is installed in the polishing cavity to open or close the polishing cavity.

[0016] Compared with the prior art, the advantages of the clamping device and polishing system of this utility model embodiment are as follows:

[0017] When the driving component is working, this embodiment of the invention can push the clamping plate toward or away from the fixed plate, thereby clamping or releasing the ceramic disc. This embodiment replaces manual operation with an automated clamping device, reducing the physical burden on employees, minimizing fatigue caused by prolonged repetitive loading and unloading, and achieving automated handling. This reduces time delays caused by manual intervention, improves the continuity and efficiency of the overall process, ensures gentle handling of the ceramic disc during handling, reduces the risk of wafer damage caused by human contact or improper operation, and ultimately improves product yield. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the polishing system provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the clamping device provided in an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the clamping device provided in this embodiment of the utility model, excluding the robotic arm.

[0021] Figure 4 This is a front view of the clamping device provided in this embodiment of the utility model, excluding the robotic arm;

[0022] Figure 5 This is provided along with the embodiments of the present utility model. Figure 4 A cross-sectional view along the AA direction;

[0023] Figure 6 This is provided by the embodiment of the present utility model. Figure 5 A magnified view of part A, circled in the diagram;

[0024] Figure 7 This is a rear view of the clamping device provided in this embodiment of the utility model, excluding the robotic arm;

[0025] In the diagram, 1. Rough polishing machine; 11. First machine body; 111. Rough polishing chamber; 12. First water-blocking gate; 2. Fine polishing machine; 21. Second machine body; 211. Fine polishing chamber; 22. Second water-blocking gate; 3. Ceramic disc; 4. Transfer frame; 5. Clamping device; 51. Mechanical arm; 52. Clamping structure; 521. Fixing plate; 5211. Mounting groove; 5212. Main body; 5213. Support part; 5214. Connecting part; 52141. Connecting hole; 52142. Locking hole; 522. Clamping plate; 5221. Mating groove; 523. Guide assembly; 5231. Linear bearing; 5232. Guide rod; 53. Drive component; 54. Arc groove; 55. Vacuum suction cup; 56. Push rod; 57. Fixing block. Detailed Implementation

[0026] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0027] like Figure 1 As shown, this utility model provides a polishing system, including a coarse polisher 1, a fine polisher 2, a transfer frame 4 for placing a ceramic disc 3, and a clamping device 5. The transfer frame 4 and the clamping device 5 are disposed between the fine polisher 2 and the coarse polisher 1. The clamping device 5 is used to transport the ceramic disc 3 to the coarse polisher 1 or the fine polisher 2.

[0028] In this embodiment, the rough polishing machine 1 is a device for preliminary surface treatment of wafers, used to remove damaged layers and impurities from the wafer surface, laying the foundation for subsequent fine polishing processes. The fine polishing machine 2 is a device for further refining the rough polishing process to improve the surface smoothness and flatness of the wafers. The transfer rack 4 is a rack for temporarily storing ceramic discs 3 (with the wafers to be processed attached to them), located between the rough polishing machine 1 and the fine polishing machine 2, facilitating the transfer of wafers between the two machines. This helps maintain a smooth workflow and reduces waiting time caused by movement. The clamping device 5 is responsible for removing the ceramic discs 3 from the transfer rack 4 and transporting them to the rough polishing machine 1 for the rough polishing process. After the rough polishing is completed, the ceramic discs 3 are moved to the fine polishing machine 2 for fine processing. Finally, after the fine polishing is completed, the processed wafers, along with the ceramic discs 3, are placed back into the transfer rack 4.

[0029] This embodiment employs an automated handling mechanism to reduce manual intervention, lower the risk of wafer damage, and also reduce the physical labor intensity of operators. It realizes a fully automated processing of wafers from rough polishing to fine polishing, which not only improves work efficiency but also reduces the probability of product damage by reducing human contact, thereby improving the quality and yield of the final product.

[0030] See also Figure 2 and Figure 3The clamping device 5 includes a robotic arm 51, a clamping structure 52 for holding the ceramic disc 3, and a drive unit 53. The robotic arm 51 is used to precisely move the clamping structure 52 to a designated position (such as the position of the transfer frame 4, the rough polisher 1, and the fine polisher 2). The clamping structure 52 includes a fixed plate 521, a clamping plate 522, and a guide assembly 523. The fixed plate 521 and the clamping plate 522 are movably connected by the guide assembly 523 to ensure that the clamping plate 522 can smoothly move away from or towards the fixed plate 521 along a predetermined trajectory, ensuring smooth operation. To ensure stability and accuracy during the process, the drive unit 53 is mounted on the fixed plate 521, and the output shaft of the drive unit 53 is connected to the clamping plate 522 to drive the clamping plate 522 to move away from or towards the fixed plate 521, thereby clamping or releasing the ceramic disk 3. Both the clamping plate 522 and the fixed plate 521 have arc-shaped grooves 54. The two arc-shaped grooves 54 together form the clamping position of the clamping structure 52 to better adapt to the shape of the ceramic disk 3, provide a more stable clamping force, and reduce potential damage to the ceramic disk 3 and the wafer on it.

[0031] Based on the above structure, when the driving component 53 operates, it can push the clamping plate 522 toward or away from the fixed plate 521, thereby achieving the clamping or release of the ceramic disk 3. This embodiment replaces manual operation with an automated clamping device 5, reducing the physical burden on employees, minimizing fatigue caused by prolonged repetitive loading and unloading, and achieving automated handling. This reduces the time delay caused by manual intervention, improves the continuity and efficiency of the overall process flow, ensures gentle handling of the ceramic disk 3 during handling, reduces the risk of wafer damage caused by human contact or improper operation, and thus improves product yield.

[0032] like Figure 5 and Figure 6 As shown, the guide assembly 523 includes a linear bearing 5231 and a guide rod 5232. The fixing plate 521 has a mounting groove 5211 on the side facing the clamping plate 522, and the clamping plate 522 has a mating groove 5221 on the side facing the fixing plate 521. The linear bearing 5231 is installed in the mounting groove 5211, providing a stable track for the guide rod 5232 to slide inside it. One end of the guide rod 5232 passes through the linear bearing 5231 and is slidably installed in the mounting groove 5211, and the other end is installed in the mating groove 5221.

[0033] Based on the above structure, in this embodiment, under the drive of the drive member 53, the clamping plate 522 drives the guide rod 5232 to move back and forth along a predetermined path under the guidance of the linear bearing 5231, thereby driving the clamping plate 522 to move closer to or away from the fixed plate 521, realizing reliable clamping and release of the ceramic disc 3, effectively solving the problems caused by traditional manual operation, and improving production efficiency and product quality.

[0034] It should be noted that the driving component 53 in this embodiment is a cylinder or motor, etc.

[0035] Furthermore, there are multiple guide components 523, which are spaced apart along the width direction of the fixed plate 521. These multiple guide components 523 provide more uniform support, increasing the overall stability and rigidity of the clamping structure 52 and ensuring a more precise and smooth movement trajectory of the clamping plate 522. In addition, the presence of multiple guide components 523 helps to distribute the force applied to a single guide component 523, reducing the risk of wear or damage due to localized overload.

[0036] like Figure 4 As shown, it also includes a vacuum suction cup 55 and a vacuum pump. A vacuum channel is provided in the fixing plate 521. The vacuum suction cup 55 is installed on the fixing plate 521 and is used to directly contact the ceramic disk 3 (or the wafer on it). It firmly grasps the ceramic disk 3 by generating an adsorption force. The vacuum suction cup 55 is connected to the vacuum pump through the vacuum channel. The vacuum pump creates a negative pressure by extracting air from the vacuum channel, so that the vacuum suction cup 55 can firmly adsorb the ceramic disk 3.

[0037] This embodiment improves the gripping stability of the ceramic disk 3 by using a vacuum suction cup 55 and a vacuum pump. Compared to mechanical clamping alone, vacuum adsorption can fix the ceramic disk 3 in a gentler manner, reducing scratches or other forms of damage caused by physical contact. Furthermore, it enhances stability and safety during wafer handling.

[0038] like Figure 4 As shown, the fixing plate 521 includes a main body 5212, a support part 5213, and a connecting part 5214. The main body 5212 and the connecting part 5214 are mounted at both ends of the support part 5213. Through the connecting part 5214, the fixing plate 521 can be stably mounted on the robotic arm 51, allowing the entire clamping device 5 to move freely in space and perform tasks such as picking up and placing ceramic discs 3. This ensures that the fixing plate 521 can withstand the dynamic load during the handling process and can be accurately positioned to the required location. The main body 5212 has an arc-shaped groove 54, which, together with the arc-shaped groove 54 on the clamping plate 522, forms a complete clamping position to more stably fix the ceramic disc 3 and reduce the potential risk of damage to the wafer. The connecting part 5214 is connected to the robotic arm 51.

[0039] like Figure 7As shown, the connecting portion 5214 has a connecting hole 52141 and multiple locking holes 52142. The multiple locking holes 52142 are spaced apart around the axis of the connecting hole 52141 and are arranged around the periphery of the connecting hole 52141 to further reinforce the connection between the fixing plate 521 and the robotic arm 51. In this embodiment, each locking hole 52142 allows the use of additional bolts or other types of fasteners, increasing the number of connection points between the fixing plate 521 and the robotic arm 51, distributing the load, and reducing the risk of single-point failure. Specifically, in this embodiment, the central connecting hole 52141 is used as the basis for initial positioning, and then reinforced by the surrounding locking holes 52142, thereby enhancing the connection strength and stability between the fixing plate 521 and the robotic arm 51.

[0040] like Figure 1 As shown, the rough polishing machine 1 includes a first body 11, a first water baffle 12, and a first upper fixed plate. The first body 11 is the basic frame of the rough polishing machine 1, providing space to support and accommodate other key components. The first body 11 has a rough polishing cavity 111 for performing the rough polishing process. The first upper fixed plate is set inside the rough polishing cavity 111, specifically a working platform or fixing device set inside the rough polishing cavity 111, for placing the ceramic disc 3 (i.e., the carrier with the wafer attached) that needs to be rough polished. The first water baffle 12 is installed in the rough polishing cavity 111 to open or close the rough polishing cavity 111 to prevent the leakage of liquid or particulate matter generated during the polishing process, and also to facilitate the loading and unloading of the wafer to be processed.

[0041] The fine polishing machine 2 includes a second body 21, a second water baffle 22, and a second upper platen. The second body 21 is the basic frame of the fine polishing machine 2, supporting and protecting the internal components. It has a fine polishing cavity 211 for performing fine polishing tasks. The second upper platen is set inside the fine polishing cavity 211 to hold the wafers after rough polishing, so as to further improve their surface quality and flatness. Similarly, it is specifically set inside the rough polishing cavity 111 as a work platform or fixing device. The second water baffle 22 is installed in the fine polishing cavity 211 to open or close the fine polishing cavity 211 to prevent the leakage of liquid or particulate matter generated during the polishing process, and also to facilitate the loading and unloading of wafers to be processed.

[0042] It should be noted that the first water-blocking gate 12 in this embodiment can be pulled 360° around the axis of the first body 11. Similarly, the second water-blocking gate 22 can also be pulled 360° around the axis of the second body 21.

[0043] like Figure 3As shown, it also includes a push rod 56 and a fixing block 57. The fixing block 57 is disposed on the side of the clamping plate 522 away from the clamping position, and the push rod 56 is connected to the clamping plate 522 through the fixing block 57. In this embodiment, the fixing block 57 increases the stability of the connection between the push rod 56 and the clamping plate 522, reduces the offset or shaking caused by uneven force distribution, and ensures stability and accuracy during operation. It should be noted that the push rod 56 is used to push or pull the first water baffle 12 or the second water baffle 22 by physical movement, thereby realizing the opening or closing of the first water baffle 12 or the second water baffle 22. When the rough polishing machine 1 or the fine polishing machine 2 is working, the first water baffle 12 or the second water baffle 22 is closed to prevent polishing machine water from splashing out.

[0044] Furthermore, the extension direction of the push rod 56 is set perpendicular to the movement direction of the clamping plate 522, which helps to optimize the spatial configuration of the entire device. In addition, since the direction of the force applied by the push rod 56 is independent of the movement direction of the clamping plate 522, this reduces the possible offset or shaking during operation, thereby ensuring the accuracy and stability of the clamping action.

[0045] Specifically, the ceramic disc 3 with the wafer is placed upright on the transfer frame 4; the robotic arm 51 moves to the ceramic disc 3, and the fixing plate 521 clamps the ceramic disc 3 by opening and closing the cylinder, while the vacuum suction cup 55 on the fixing plate 521 holds the ceramic disc 3; the robotic arm 51 fixes the ceramic disc 3 on the first upper fixed plate of the rough polishing machine 1, and the vacuum suction of the first upper fixed plate of the rough polishing machine 1 holds the ceramic disc 3 while the vacuum suction cup 55 on the fixing plate 521 is released from the clamping plate 522, transferring the ceramic disc 3 to the rough polishing machine 1; finally, the push rod 56 closes the first water baffle 12 of the rough polishing machine 1; after the rough polishing is completed, the push rod 56 on the robotic arm 51 opens the first water baffle 12 of the rough polishing machine 1, and the ceramic disc 3 is clamped by opening and closing the cylinder while the vacuum suction cup 55 holds the ceramic disc 3, the vacuum suction of the first upper fixed plate of the rough polishing machine 1 is released, and the ceramic disc 3 is transferred to the robotic arm 51. The ceramic disc 3 is unloaded and mounted on the polishing machine 2. After polishing is completed, the robotic arm 51 removes the ceramic disc 3 from the polishing machine 2 and places the ceramic disc 3 with wafers onto the transfer machine. This completes the rough polishing and fine polishing loading and unloading process by the robotic arm 51, reducing the steps of unloading and unmounting after rough polishing, thus improving production efficiency and product yield. Automated loading and unmounting replaces manual loading and unmounting, reducing employee fatigue.

[0046] In summary, this embodiment of the invention provides a clamping device 5 and a polishing system. When the driving component 53 operates, it can push the clamping plate 522 toward or away from the fixed plate 521, thereby achieving the clamping or release of the ceramic disc 3. This embodiment replaces manual operation with an automated clamping device 5, reducing the physical burden on employees, minimizing fatigue caused by prolonged repetitive loading and unloading, and achieving automated handling. This reduces the time delay caused by manual intervention, improves the continuity and efficiency of the overall process flow, ensures gentle handling of the ceramic disc 3 during handling, reduces the risk of wafer damage caused by human contact or improper operation, and thus improves product yield.

[0047] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A clamp device, characterized by The utility model provides a ceramic plate clamping device, including mechanical arm, the fixture structure for clamping ceramic plate and drive part, the fixture structure includes fixed plate, clamping plate and guide assembly, the fixed plate with clamping plate is through guide assembly swing joint between, drive part is installed to fixed plate, and the output shaft of drive part is connected with clamping plate, to drive clamping plate to the direction of moving away or close to fixed plate, clamping plate with fixed plate all have arc groove, two arc grooves jointly constitute the clamping position of fixture structure.

2. The clamp apparatus of claim 1, wherein, The guide assembly includes a linear bearing and a guide rod, the fixed plate is provided with a mounting groove on the side facing the clamping plate, the clamping plate is provided with a matching groove on the side facing the fixed plate, the linear bearing is installed in the mounting groove, and one end of the guide rod is slidably installed in the mounting groove through the linear bearing, and the other end is installed in the matching groove.

3. The gripper device according to claim 1 or 2, characterized in that The guide assembly has a plurality of guide assemblies, and the plurality of guide assemblies are arranged along the width direction of the fixed plate.

4. The gripper device of claim 1, wherein The utility model further includes a vacuum chuck and a vacuum pump, the fixed plate is provided with a vacuum channel, the vacuum chuck is installed on the fixed plate and communicates with the vacuum pump through the vacuum channel.

5. The gripper device of claim 1, wherein, The fixed plate includes a main body, a support and a connecting portion, the main body and the connecting portion are installed on both ends of the support, the main body has the arc groove, and the connecting portion is connected with the mechanical arm.

6. The gripper device of claim 5, wherein, The connecting portion is provided with a connecting hole and a plurality of locking holes, the plurality of locking holes are arranged around the axis of the connecting hole and are arranged on the circumferential side of the connecting hole.

7. The gripper device of claim 1, wherein The utility model further includes a push rod and a fixed block, the fixed block is arranged on the side of the clamping plate away from the clamping position, and the push rod is connected with the clamping plate through the fixed block.

8. The clamp apparatus of claim 7, wherein, The extension direction of the push rod is perpendicular to the movement direction of the clamping plate.

9. A polishing system characterized by, The utility model provides a ceramic plate clamping device, including rough polishing machine, fine polishing machine, transfer frame for placing ceramic plate and fixture device as claimed in any one of claims 1-8, the transfer frame and the fixture device are arranged between the fine polishing machine and the rough polishing machine, and the fixture device is used for transporting the ceramic plate to the rough polishing machine or the fine polishing machine.

10. The polishing system of claim 9, wherein, The rough polishing machine includes a first machine body, a first water blocking door and a first upper disc setting plate, the first machine body has a rough polishing cavity, the first upper disc setting plate is arranged in the rough polishing cavity, and the first water blocking door is installed in the rough polishing cavity to open or close the rough polishing cavity. The fine polishing machine includes a second machine body, a second water blocking door and a second upper disc setting plate, the second machine body has a fine polishing cavity, the second upper disc setting plate is arranged in the fine polishing cavity, and the second water blocking door is installed in the fine polishing cavity to open or close the fine polishing cavity.

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