OCA film sandwich structure for preventing glue overflow

By using a special design of light and heavy release films in the OCA membrane sandwich structure, the problem of adhesive overflow at the edge of the OCA membrane is solved, achieving the effect of preventing adhesive overflow and improving processing efficiency and precision.

CN223963443UActive Publication Date: 2026-03-03万年联创显示科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-20
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

In existing OCA membrane sandwich structures, the 1:1 size design of the OCA layer and release film makes it easy for adhesive to overflow at the edges of the OCA after lamination.

Method used

A sandwich structure is formed by using a light release film and a heavy release film. The perimeter of the heavy release film is at least 0.25 mm larger than the edge of the OCA layer, and the perimeter of the light release film is also larger than the edge of the OCA layer. Combined with a specific thickness design, it prevents adhesive overflow and optionally sets scale lines and anti-glare treatment on the heavy release film.

Benefits of technology

It effectively prevents adhesive overflow in the OCA membrane sandwich structure, improves processing efficiency and precision, and reduces the defect rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an OCA (Optical Clear Adhesive) film sandwich structure for preventing glue overflow, which comprises an OCA layer with the thickness of 0.1 + / -0.02 mm; the light release film covers the upper surface of the OCA layer, and the thickness of the light release film is 0.05 mm; and the heavy release film covers the lower surface of the OCA layer, and the thickness of the heavy release film is 0.125 mm. According to the OCA film sandwich structure for preventing glue overflow provided by the embodiment of the invention, the sandwich structure is formed by the light release film, the OCA layer and the heavy release film, the peripheral edge of the heavy release film is at least 0.25 mm larger than the edge of the OCA layer, and the peripheral edge of the light release film is larger than the edge of the OCA layer; meanwhile, the thicknesses of the OCA layer, the light release film and the heavy release film are limited, so that a function of preventing glue overflow is realized.
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Description

Technical Field

[0001] This application belongs to the field of OCA membrane technology, and particularly relates to an OCA membrane sandwich structure for preventing adhesive overflow. Background Technology

[0002] OCA film (Optically Clear Adhesive) is an optically transparent adhesive film primarily used for bonding electronic devices such as touchscreens and displays. It features high light transmittance, strong adhesion, and good weather resistance, and is commonly used to bond touchscreens to displays, ensuring a clear and bubble-free display.

[0003] However, in the existing OCA membrane sandwich structure, the 1:1 size design of the OCA layer and the release membrane makes it easy for adhesive to overflow at the edges of the OCA after lamination. Utility Model Content

[0004] One of the objectives of this application is to provide an OCA film sandwich structure for preventing adhesive overflow, thereby solving the aforementioned technical problems.

[0005] To achieve the above-mentioned objectives, the technical solution adopted in this application is as follows:

[0006] This application provides an OCA film sandwich structure for preventing adhesive overflow, comprising:

[0007] The OCA layer has a thickness of 0.1 ± 0.02 mm.

[0008] A light release film is applied to the upper surface of the OCA layer, and the thickness of the light release film is 0.05 mm.

[0009] A secondary release film is applied to the lower surface of the OCA layer. The thickness of the secondary release film is 0.125 mm, and the edges of the secondary release film are at least 0.25 mm larger than the edges of the OCA layer.

[0010] Optionally, the edges of the light release film are all larger than the edges of the OCA layer.

[0011] Optionally, graduation lines are provided around the periphery of the release film to improve processing efficiency and accuracy.

[0012] Optionally, the release film is designed to have a transparency of over 90% and its surface is treated with an anti-glare coating.

[0013] Compared with the prior art, the beneficial effects of the embodiments of this application are:

[0014] This application provides an OCA film sandwich structure for preventing adhesive overflow. The sandwich structure is formed by a light release film, an OCA layer, and a heavy release film. The perimeter of the heavy release film is at least 0.25 mm larger than the edge of the OCA layer, and the perimeter of the light release film is also larger than the edge of the OCA layer. At the same time, the thickness of the OCA layer, the light release film, and the heavy release film is limited, thereby having the function of preventing adhesive overflow and solving the problems of the prior art. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This illustration shows a front view of an OCA membrane sandwich structure for preventing adhesive spillage, provided in an embodiment of this application.

[0017] Figure 2 A top view of an OCA membrane sandwich structure for preventing adhesive overflow, provided in an embodiment of this application, is shown.

[0018] Illustration:

[0019] 10. OCA layer; 11. Light release film; 12. Heavy release film. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] To illustrate the technical solution described in this application, specific embodiments are provided below.

[0024] Please see Figure 1 and Figure 2 As shown, this application embodiment provides an OCA film sandwich structure for preventing adhesive overflow, including: an OCA layer 10, a light release film 11, and a heavy release film 12. The thickness of the OCA layer 10 is 0.1 ± 0.02 mm. The light release film 11 is applied to the upper surface of the OCA layer 10, and its thickness is 0.05 mm. The heavy release film 12 is applied to the lower surface of the OCA layer 10, and its thickness is 0.125 mm. The peripheral edges of the heavy release film 12 are all at least 0.25 mm larger than the edges of the OCA layer 10. The peripheral edges of the light release film 11 are all larger than the edges of the OCA layer 10.

[0025] The aforementioned OCA film sandwich structure for preventing adhesive overflow forms a sandwich structure with a light release film 11, an OCA layer 10, and a heavy release film 12. The periphery of the heavy release film 12 is at least 0.25 mm larger than the edge of the OCA layer 10, and the periphery of the light release film 11 is larger than the edge of the OCA layer 10. At the same time, the thickness of the OCA layer 10, the light release film 11, and the heavy release film 12 is limited, thereby having the function of preventing adhesive overflow.

[0026] In some embodiments of this application, graduation lines are provided around the periphery of the release film 12 to improve processing efficiency and accuracy. Specifically, this design allows operators to quickly identify the position and size of the release film 12, thereby improving processing efficiency and accuracy.

[0027] In some embodiments of this application, the release film 12 is designed to have a transparency of over 90%, and its surface is treated with an anti-glare coating. Specifically, this design improves visibility during the lamination process, making it easier for operators to observe the bonding effect and reducing the defect rate.

[0028] Specifically, please refer to Figure 2 As shown, some specific dimensions of the OCA membrane sandwich structure for preventing adhesive overflow provided in the embodiments of this application are disclosed.

[0029] For example, the width of OCA is 69.73±0.1mm, the width of heavy release film 12 is 74.73±0.15mm, and the width of light release film 11 is 78.73±0.5mm.

[0030] For example, the lengths of the heavy release membrane 12 and the light release membrane 11 are 156.86±0.15 mm, and the length of the OCA layer 10 is 152.86±0.1 mm.

[0031] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An OCA film sandwich structure for preventing adhesive overflow, characterized in that, include: The OCA layer has a thickness of 0.1 ± 0.02 mm; A light release film is applied to the upper surface of the OCA layer, and the thickness of the light release film is 0.05 mm. A release film is provided, which is applied to the lower surface of the OCA layer. The release film has a thickness of 0.125 mm and its surrounding edges are at least 0.25 mm larger than the edges of the OCA layer.

2. The OCA film sandwich structure for preventing adhesive overflow according to claim 1, characterized in that, The edges of the light release film are all larger than the edges of the OCA layer.

3. The OCA film sandwich structure for preventing adhesive overflow according to claim 1, characterized in that, Gradient lines are provided around the periphery of the release film to improve processing efficiency and accuracy.

4. The OCA film sandwich structure for preventing adhesive overflow according to claim 1, characterized in that, The release film is designed to have a transparency of over 90% and its surface is treated with an anti-glare coating.