Efficient energy-saving fermentation temperature control device
By incorporating an internal insulation layer and a semiconductor cooling chip for heat recovery in the fermentation device, combined with temperature control via a temperature sensor and a fan, the energy waste problem of the fermentation device is solved, achieving high efficiency, energy saving, and temperature uniformity, thus improving the fermentation quality and efficiency of fermented bean curd.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-03-03
AI Technical Summary
Existing fermentation equipment cannot effectively recover and utilize heat dissipation during temperature control, resulting in energy waste and affecting the quality and efficiency of fermented bean curd.
An internal insulation layer is used to reduce heat loss, and heat is recovered and utilized in the top heat exchange box through the heat dissipation end of the semiconductor cooling chip. Temperature sensors and fans are used to promote temperature uniformity inside the box, and precise temperature control is achieved using semiconductor cooling chips and electric heaters.
It achieves precise control of fermentation temperature and efficient heat recovery and utilization, improving fermentation efficiency and energy saving effect, and ensuring the consistency of fermented bean curd quality.
Smart Images
Figure CN223963520U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of fermented bean curd equipment, specifically to a high-efficiency and energy-saving fermentation temperature control device. Background Technology
[0002] Fermented bean curd, a traditional fermented food loved by many, involves a complex fermentation process. Temperature is a crucial factor in the fermentation process, as it directly affects the growth and metabolic activities of microorganisms, thus influencing the taste and flavor of the fermented bean curd. If the fermentation temperature is not properly controlled, it may cause microorganisms to grow too fast or too slow, affecting the fermentation cycle and the final quality of the fermented bean curd.
[0003] Traditional natural fermentation methods are greatly affected by environmental factors, making it difficult to guarantee the quality of fermented bean curd. In order to improve the production efficiency and quality of fermented bean curd, modern fermented bean curd production uses corresponding fermentation devices that can control the temperature. There are many types of fermentation devices on the market. Most of them are equipped with corresponding heating and cooling elements and use temperature sensors for temperature control.
[0004] However, most fermentation temperature control devices on fermentation equipment can only control the temperature and cannot recover and utilize the heat dissipated by the corresponding refrigeration elements, resulting in some heat waste and hindering energy conservation. Therefore, we propose a high-efficiency, energy-saving fermentation temperature control device. Utility Model Content
[0005] The purpose of this invention is to provide a highly efficient and energy-saving fermentation temperature control device to address the deficiencies mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A high-efficiency and energy-saving fermentation temperature control device includes a fermentation chamber. An inner insulation layer is provided on the inner surface of the fermentation chamber. An electric heater is fixedly installed on the inner wall of the fermentation chamber. A temperature sensor is also fixedly installed on the inner wall of the fermentation chamber. Two symmetrically hinged insulation doors are connected to the front side of the fermentation chamber. A top heat exchange box is fixedly installed on the top of the fermentation chamber. Multiple equally spaced semiconductor cooling chips are fixedly installed on the front and rear inner walls of the top heat exchange box. A conductive chamber is provided between each adjacent semiconductor cooling chip. The cooling end of the semiconductor cooling chip passes through the bottom plate of the top heat exchange box and the top wall plate of the fermentation chamber and is inserted into the fermentation chamber. The heat dissipation end of the semiconductor cooling chip is located inside the top heat exchange box. A sealed top cover is fixedly installed on the top surface of the top heat exchange box. An inlet pipe and an outlet pipe are fixedly installed on the left and right side plates of the top heat exchange box, respectively.
[0008] Preferably, the fermentation box consists of an outer heat-insulating substrate on the outermost layer and an inner heat-insulating board on the innermost layer, with a vacuum heat-insulating board between the outer heat-insulating substrate and the inner heat-insulating board.
[0009] Preferably, a plurality of support pads arranged in a matrix are fixedly installed on the bottom surface of the fermentation tank, and the height of the support pads is greater than 5cm.
[0010] Preferably, a controller is fixedly installed on the outer surface of the fermentation tank, and the controller is equipped with a display screen.
[0011] Preferably, an air inlet pipe and an air outlet pipe are fixedly installed on one side plate of the fermentation box, and a fan is provided between the air inlet pipe and the air outlet pipe.
[0012] Preferably, the blower is located outside the fermentation tank, the air inlet pipe is installed at the air inlet end of the blower, and the air outlet pipe is installed at the air outlet end of the blower.
[0013] Preferably, the bottom end of the air inlet pipe is located near the bottom wall of the fermentation box, and the top end of the air outlet pipe is located near the top wall of the fermentation box.
[0014] Preferably, the inner diameters of the inlet pipe and the outlet pipe are equal, and both the inlet pipe and the outlet pipe are located near the bottom wall of the top heat exchange box.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] 1. This utility model features a fermentation chamber with an inner insulation layer to reduce heat loss and further reduce energy consumption during heating by the electric heater, achieving energy saving. In addition, a semiconductor cooling chip is used for cooling. The heat dissipation end of the semiconductor cooling chip exchanges heat with water or air in the top heat exchange box. The water or hot air after heat exchange can be supplied to the outside, realizing the recovery and utilization of this part of the heat, achieving a highly efficient energy saving effect.
[0017] 2. This utility model uses a temperature sensor for temperature detection and an air inlet pipe, fan and air outlet pipe to promote airflow in the fermentation chamber and make the temperature of all parts inside the fermentation chamber uniform. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the exploded structure of this utility model;
[0020] Figure 3 This is a cross-sectional view of the fermentation box of this utility model;
[0021] Figure 4 This is a partial structural schematic diagram of the present invention;
[0022] The meanings of the labels in the diagram are as follows:
[0023] 1. Fermentation chamber; 10. External insulation base plate; 11. Vacuum insulation board; 12. Inner insulation board; 13. Inner insulation layer; 14. Insulated door panel; 15. Electric heater; 16. Temperature sensor; 17. Controller; 18. Support pad;
[0024] 2. Air inlet duct; 20. Fan; 21. Air outlet duct;
[0025] 3. Top heat exchange box; 30. Semiconductor cooling chip; 31. Conductive chamber; 32. Inlet pipe; 33. Outlet pipe; 34. Sealed top cover. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Please see Figures 1-4 This utility model provides a technical solution: a high-efficiency and energy-saving fermentation temperature control device, including a fermentation box 1, an inner heat insulation layer 13 is provided on the inner surface of the fermentation box 1, the inner heat insulation layer 13 is used to reduce heat loss; an electric heater 15 is fixedly installed on the inner wall of the fermentation box 1, the electric heater 15 is used for heating operation; a temperature sensor 16 is also fixedly installed on the inner wall of the fermentation box 1, the temperature sensor 16 is used for temperature detection operation.
[0028] Two symmetrical heat-insulating door panels 14 are hinged to the front side of the fermentation box 1. A top heat exchange box 3 is fixedly installed on the top of the fermentation box 1. Multiple equally spaced semiconductor cooling chips 30 are fixedly installed on the inner walls of the front and rear sides of the top heat exchange box 3. A conductive chamber 31 is provided between each adjacent semiconductor cooling chip 30. The bottom cooling end of the semiconductor cooling chip 30 passes through the bottom plate of the top heat exchange box 3 and the top wall plate of the fermentation box 1 and is inserted into the fermentation box 1. The heat dissipation end of the semiconductor cooling chip 30 is located at the top. Inside the heat exchange box 3, a sealed top cover 34 is fixedly installed on the top surface of the top heat exchange box 3. An inlet pipe 32 and an outlet pipe 33 are fixedly installed on the left and right side plates of the top heat exchange box 3, respectively, so as to realize the cooling operation of the fermentation box 1 by using the cooling end of the semiconductor cooling chip 30. The heat dissipated by the heat dissipation end of the semiconductor cooling chip 30 can be exchanged by passing water or ventilation in the top heat exchange box 3. The water or hot air after heat exchange can be supplied to the outside, so as to achieve the effect of recovering and utilizing the heat dissipation end of the semiconductor cooling chip 30.
[0029] In this embodiment, the fermentation box 1 is composed of an outer heat insulation substrate 10 on the outermost layer and an inner heat insulation board 12 on the innermost layer. A vacuum heat insulation board 11 is provided between the outer heat insulation substrate 10 and the inner heat insulation board 12. The vacuum heat insulation board 11 is a vacuum structure, which can reduce heat loss.
[0030] Specifically, multiple support blocks 18 arranged in a matrix are fixedly installed on the bottom surface of the fermentation box 1. The height of the support blocks 18 is greater than 5cm, so that the support blocks 18 can be used for support operation.
[0031] Furthermore, an air inlet pipe 2 and an air outlet pipe 21 are fixedly installed on one side panel of the fermentation box 1. A fan 20 is installed between the air inlet pipe 2 and the air outlet pipe 21. The fan 20 is located outside the fermentation box 1. The air inlet pipe 2 is installed at the air inlet end of the fan 20, and the air outlet pipe 21 is installed at the air outlet end of the fan 20. The bottom end of the air inlet pipe 2 is located near the bottom wall of the fermentation box 1, and the top end of the air outlet pipe 21 is located near the top wall of the fermentation box 1. This promotes airflow inside the fermentation box 1 and achieves a more uniform temperature in all parts.
[0032] In addition, the inner diameters of the inlet pipe 32 and the outlet pipe 33 are equal, and both the inlet pipe 32 and the outlet pipe 33 are located near the bottom wall of the top heat exchange box 3, so that water or gas can flow more smoothly in the inlet pipe 32, the outlet pipe 33 and the top heat exchange box 3.
[0033] It is worth noting that a controller 17 is fixedly installed on the outer surface of the fermentation tank 1. The controller 17 is equipped with a display screen, and the temperature sensor 16 is used to monitor the temperature inside the fermentation tank 1 in real time. The temperature sensor 16 can be an electronic component such as a thermocouple or a thermistor, which can convert the sensed temperature signal into an electrical signal and send it to the controller 17. The controller 17 is responsible for receiving the temperature signal from the temperature sensor 16 and processing and analyzing it through the built-in control algorithm. According to the preset fermentation temperature range, the controller will determine whether to heat or cool the fermentation tank 1. When heating, the controller controls the electric heater 15 to heat; when cooling, the controller controls the semiconductor cooling chip 30 to cool.
[0034] Finally, it should be noted that the temperature sensor 16, electric heater 15, semiconductor refrigeration chip 30, fan 20 and controller 17 involved in this utility model are all general standard parts or parts known to those skilled in the art. Their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power elements, electrical components and the matching controller and power supply, are connected by wires. The specific connection method should refer to the working principle of this utility model. The electrical connection between each electrical component is completed in the order of operation. The detailed connection method is a technology known in the art.
[0035] When using the high-efficiency and energy-saving fermentation temperature control device of this utility model, place the container of fermented bean curd into the fermentation box 1, close the heat preservation door 14, connect the fan 20 to the external power supply and make it work. The operation of the fan 20 can promote the air flow in the fermentation box 1 and keep the temperature of each part consistent.
[0036] When the temperature sensor 16 detects that the temperature inside the fermentation chamber 1 is lower than the set temperature, the controller 17 controls the electric heater 15 to connect to the external power supply and start working. The electric heater 15 starts to heat up and raises the temperature inside the fermentation chamber 1.
[0037] When the temperature sensor 16 detects that the temperature inside the fermentation chamber 1 is higher than the set temperature, the controller 17 controls the semiconductor cooling chip 30 to connect to an external power source and start working. When the semiconductor cooling chip 30 is working, its cooling end can cool, thereby cooling the fermentation chamber 1. When using the semiconductor cooling chip 30 for cooling, the inlet pipe 32 and the outlet pipe 33 are connected to the external air or water input and output pipes, respectively. After the water or air enters the top heat exchange box 3, it can cool the heat dissipation end of the semiconductor cooling chip 30. The water or hot air after heat exchange can be supplied to the outside.
[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A high-efficiency energy-saving fermentation temperature control device, comprising a fermentation tank (1), characterized in that: The inner surface of the fermentation tank (1) is provided with an inner heat preservation layer (13), an electric heater (15) is fixedly installed on the inner wall of the fermentation tank (1), and a temperature sensor (16) is also fixedly installed on the inner wall of the fermentation tank (1); two left and right symmetrical heat preservation door plates (14) are hingedly connected to the front side of the fermentation tank (1) through hinges; a top heat exchange box (3) is fixedly installed on the top of the fermentation tank (1); a plurality of semiconductor refrigerating fins (30) are fixedly installed on the inner walls of the front and rear sides of the top heat exchange box (3) at equal intervals; a conduction cavity (31) is arranged between two semiconductor refrigerating fins (30) adjacent to each other; the bottom refrigeration end of the semiconductor refrigerating fin (30) penetrates through the bottom plate of the top heat exchange box (3) and the top wall plate of the fermentation tank (1) and is inserted into the fermentation tank (1); the heat dissipation end of the semiconductor refrigerating fin (30) is located in the top heat exchange box (3); a sealing top cover (34) is fixedly installed on the top surface of the top heat exchange box (3); an inlet pipe (32) and an outlet pipe (33) are respectively fixedly installed on the left and right side plates of the top heat exchange box (3).
2. The high-efficiency energy-saving fermentation temperature control device according to claim 1, characterized in that: The fermentation tank (1) is composed of an outer temperature insulation base plate (10) arranged at the outermost layer and an inner heat preservation plate (12) arranged at the innermost layer, and a vacuum heat preservation plate (11) is arranged between the outer temperature insulation base plate (10) and the inner heat preservation plate (12).
3. The energy-efficient fermentation temperature control device of claim 1, wherein: A plurality of support pads (18) arranged in a matrix are fixedly installed on the bottom surface of the fermentation tank (1), and the height of the support pad (18) is greater than 5 cm.
4. The energy efficient fermentation temperature control device of claim 1, wherein: A controller (17) is fixedly installed on the outer side of the fermentation tank (1), and a display screen is arranged on the controller (17).
5. The energy efficient fermentation temperature control device of claim 1, wherein: An air inlet pipe (2) and an air outlet pipe (21) are fixedly installed on one side plate of the fermentation tank (1), and a fan (20) is arranged between the air inlet pipe (2) and the air outlet pipe (21).
6. The energy-efficient fermentation temperature control device of claim 5, wherein: The fan (20) is located outside the fermentation tank (1), the air inlet pipe (2) is installed at the air inlet end of the fan (20), and the air outlet pipe (21) is installed at the air outlet end of the fan (20).
7. The energy-efficient fermentation temperature control device of claim 6, wherein: The bottom end of the air inlet pipe (2) is located close to the bottom wall of the fermentation tank (1), and the top end of the air outlet pipe (21) is located close to the top wall of the fermentation tank (1).
8. The energy efficient fermentation temperature control device of claim 1, wherein: The inner diameters of the inlet pipe (32) and the outlet pipe (33) are equal, and the inlet pipe (32) and the outlet pipe (33) are located close to the bottom wall of the top heat exchange box (3).