Antenna structure applied to terahertz, terahertz system on chip and power transmission architecture

Abstract

The utility model provides an antenna structure applied to terahertz, a terahertz system-on-chip and a power transmission framework. The antenna structure is characterized in that an electromagnetic band gap structure is additionally arranged between a terahertz antenna array and a feed structure; the electromagnetic band gap structure comprises a metal frame and a plurality of electromagnetic band gap units. The plurality of electromagnetic band gap units are periodically arranged on the metal frame; and in the stacking direction, the terahertz antenna array is framed in the metal frame. The transmitting antenna of the transmitting end and the receiving antenna of the receiving end in the terahertz system on chip both adopt the antenna structure. The power output end of the first circuit in the power transmission framework is connected with the transmitting end of the terahertz system-on-chip, and the power receiving end of the second circuit is connected with the receiving end of the terahertz system-on-chip. According to the scheme, the antenna performance is optimized, the terahertz system chip scale packaging is realized, the complexity and the cost of microwave wireless power transmission are reduced, and the integration level is improved.

Description

Technical Field

[0001] This utility model relates to terahertz wave radio technology, specifically to antenna structures, terahertz system-on-a-chip, and power transmission architectures applied to terahertz. Background Technology

[0002] Currently, most board-to-board power connections in terminal products use flexible printed circuit boards (FPCs), which are more complex than microwave wireless power transmission (transmitting electrical energy from one location to another via microwave wireless means). Current microwave wireless power transmission methods are mostly used in the low-frequency band, employing wire-wound inductors / capacitors for power transmission, resulting in large coils and low transmission efficiency. Another microwave power transmission method uses a power amplifier (PA) to transmit power, which is then received by an antenna array, rectified, filtered, and connected to the power module. However, this latter method involves a significant separation between the antenna and the power amplifier (PA), leading to low integration and high product assembly complexity. Therefore, it is necessary to develop alternative microwave wireless power transmission methods that can address both the complex board-to-board connection circuitry and the high assembly costs associated with existing wireless power transmission methods, while also resolving the low integration issues of current methods.

[0003] Terahertz system-on-a-chip (SoC) refers to a chip-based terahertz wave system that utilizes patterned materials to optimize the radiation efficiency of terahertz waves, thereby achieving more efficient radiated power output. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an antenna structure, a terahertz system-on-a-chip, and a power transmission architecture for terahertz applications, which can optimize antenna performance, realize chip-level packaging of terahertz systems, reduce the complexity and cost of microwave wireless power transmission, and improve integration.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted by this utility model is as follows:

[0006] An antenna structure for terahertz applications includes a terahertz antenna array, a first dielectric, an electromagnetic bandgap structure, a reference ground, a second dielectric, and a feeding structure stacked sequentially from top to bottom; the electromagnetic bandgap structure includes a metal frame and a plurality of electromagnetic bandgap elements; the plurality of electromagnetic bandgap elements are periodically arranged on the metal frame; in the stacking direction, the metal frame encloses the terahertz antenna array therein.

[0007] Optionally, the electromagnetic bandgap unit is a tubular structure, with one end connected to the metal frame and the other end connected to the reference ground.

[0008] Optionally, the metal frame is a rectangular structure.

[0009] Optionally, the outer surfaces of the top and bottom layers are each coated with a layer of solder resist.

[0010] Optionally, the terahertz antenna array is composed of two or more terahertz antenna patches arranged together.

[0011] The second technical solution adopted in this utility model is:

[0012] A terahertz system-on-a-chip includes a transmitter and a receiver; the transmitting antenna of the transmitter and the receiving antenna of the receiver both adopt the antenna structure described above for terahertz applications.

[0013] Optionally, the terahertz antenna array corresponding to the transmitting antenna is composed of a single terahertz antenna or is composed of two or more terahertz antennas arranged together; the terahertz antenna array corresponding to the receiving antenna is composed of a single terahertz antenna or is composed of two or more terahertz antennas arranged together.

[0014] Optionally, the transmitting end further includes a signal source and a power amplifier; the receiving end further includes a matching circuit, a rectifier circuit, and an LC load circuit; the signal source, power amplifier, and transmitting antenna are connected in sequence; the receiving antenna, matching circuit, rectifier circuit, and LC load circuit are connected in sequence.

[0015] Optionally, the number of receivers and / or transmitters may be multiple.

[0016] The third technical solution adopted in this utility model is:

[0017] The power transmission architecture includes a first circuit, a second circuit, and the aforementioned terahertz on-chip system; the power output terminal of the first circuit is connected to the transmitter terminal of the terahertz on-chip system, and the power receiving terminal of the second circuit is connected to the receiver terminal of the terahertz on-chip system.

[0018] The beneficial effects of this invention are as follows: Firstly, by adding an electromagnetic bandgap structure between the terahertz antenna array and the feeding structure, ground bounce noise is suppressed, while antenna gain, antenna isolation, and effective bandwidth are increased, thus significantly optimizing the antenna performance of the terahertz antenna structure. Secondly, a terahertz system-on-a-chip (SoC) is obtained based on the terahertz antenna structure with added electromagnetic bandgap structure. This not only significantly improves the transmission efficiency of the terahertz antenna, helping to increase the transmission distance, but also, due to the short wavelength of terahertz, reduces the area of ​​the antenna array on the chip, making integration and packaging more convenient. Furthermore, integrating the terahertz transmission system onto a small chip reduces the system's size and complexity, facilitating convenient and high-density integration. Thirdly, a power transmission architecture is also obtained based on the above-mentioned terahertz SoC, enabling power transmission between boards via microwave wirelessly. This solves the problems of complex connection lines and high assembly costs, and compared to existing microwave wireless power transmission methods, it offers more stable energy transmission performance and higher-density integration. Attached Figure Description

[0019] Figure 1 A schematic diagram of a stacked antenna structure applied to terahertz frequencies, provided for an embodiment of this utility model;

[0020] Figure 2 A schematic diagram of the structure of a terahertz on-chip system provided in this embodiment of the present invention. Figure 1 ;

[0021] Figure 3 A schematic diagram of the structure of a terahertz on-chip system provided for a specific embodiment of this utility model. Figure 2 ;

[0022] Figure 4 A schematic diagram of the structure of a terahertz on-chip system provided for a specific embodiment of this utility model. Figure 3 ;

[0023] Figure 5 A schematic diagram of the structure of a terahertz on-chip system provided for a specific embodiment of this utility model. Figure 4 ;

[0024] Figure 6 A schematic diagram of the structure of a terahertz on-chip system provided for a specific embodiment of this utility model. Figure 5 ;

[0025] Figure 7 A schematic diagram of the structure of a terahertz on-chip system provided for a specific embodiment of this utility model. Figure 6 ;

[0026] Figure 8A schematic diagram of the structure of an open-strip microstrip line (OpenStub) in a terahertz on-chip system provided for a specific embodiment of this utility model;

[0027] Figure 9 A schematic diagram of the structure of a short-circuit microstrip line in a terahertz on-chip system provided for a specific embodiment of this utility model;

[0028] Figure 10 This is a schematic diagram of the matching circuit in a terahertz on-chip system provided for a specific embodiment of the present invention.

[0029] Label Explanation:

[0030] 1. Terahertz antenna array; 2. First dielectric; 3. Electromagnetic bandgap structure; 4. Reference ground;

[0031] 5. Second dielectric; 6. Power supply structure; 7. Solder resist;

[0032] 11. Terahertz antenna patch;

[0033] 31. Metal frame; 32. Electromagnetic bandgap unit. Detailed Implementation

[0034] To illustrate in detail the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this utility model, the following detailed description is provided in conjunction with the listed specific embodiments and accompanying drawings. The embodiments described herein are merely illustrative of the technical solutions of this utility model and are therefore intended to limit the scope of protection of this utility model.

[0035] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0036] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0037] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0038] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0039] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0040] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0041] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0042] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0043] Please refer to Figure 1 Embodiment 1 of this utility model is as follows:

[0044] This embodiment provides an antenna structure applicable to terahertz frequencies, such as... Figure 1 As shown, it includes a terahertz antenna array 1, a first dielectric 2, an electromagnetic bandgap structure 3, a reference ground 4, a second dielectric 5, and a feeding structure 6 stacked sequentially from top to bottom.

[0045] The electromagnetic bandgap structure 3 includes a metal frame 31 and a plurality of electromagnetic bandgap elements 32; the plurality of electromagnetic bandgap elements 32 are periodically arranged on the metal frame 31; in the stacking direction, the metal frame 31 encloses the terahertz antenna array 1. It can also be understood that, from a top or bottom view of the antenna structure, the terahertz antenna array 1 and the feed structure 6 are completely placed within the metal frame 31 of the electromagnetic bandgap structure 3, and do not overlap with the metal frame 31.

[0046] This embodiment adds an electromagnetic bandgap structure between the terahertz antenna array and the feeding structure. This electromagnetic bandgap structure is a frame structure that completely encloses both the terahertz antenna array and the feeding structure. Utilizing the bandgap characteristics formed by this electromagnetic bandgap structure, it is possible to effectively control the frequency band and polarization of the terahertz electromagnetic waves during propagation, reducing mutual coupling interference between antennas, and simultaneously enhancing the radiation intensity of the terahertz main beam. This improves antenna isolation and radiation efficiency, and enhances antenna gain and radiation efficiency. Furthermore, it effectively suppresses ground bounce noise (noise caused by electromagnetic interference on the circuit board). Therefore, the antenna structure applied to terahertz in this embodiment significantly improves antenna performance and is particularly suitable for use on circuit boards.

[0047] In some specific implementations, such as Figure 1As shown, the electromagnetic bandgap structure 3 is generally comb-shaped, with its multiple electromagnetic bandgap units 32 acting as "teeth" and arranged on the metal frame 31 at equal (preferably) or unequal intervals. This comb-shaped electromagnetic bandgap structure, through the periodically arranged tooth-shaped electromagnetic bandgap units, forms a high-density resonant unit, which can more effectively disrupt the propagation path of surface waves and convert them into radiated energy, thereby improving antenna gain while reducing return loss.

[0048] Preferably, such as Figure 1 As shown, the electromagnetic bandgap unit 32 is a tubular structure, particularly a hollow tubular structure, such as a hollow circular tube or a hollow square tube; one end is connected to the metal frame 31, and the other end is connected to the reference ground 4. Here, the tubular electromagnetic bandgap unit can generate a direction-selective bandgap based on its symmetry, and by adjusting the tube diameter and axial arrangement density, the surface wave suppression effect of different polarization directions can be independently controlled.

[0049] In some specific implementations, such as Figure 1 As shown, the metal frame 31 in the electromagnetic bandgap structure 3 serves as the overall structural frame and can be a circular frame, a rectangular frame, or other irregularly shaped frames. A rectangular frame is preferred because it is larger and easier to assemble.

[0050] In some specific embodiments, the terahertz antenna array may consist of a single terahertz antenna or may consist of two or more terahertz antenna patches arranged together. Preferably, as shown below... Figure 1 As shown, the terahertz antenna array 1 consists of four terahertz antenna patches 11 arranged at a 2*2 equidistant interval. The configuration of the number of antennas in the terahertz antenna array can be flexibly configured according to the directional and intensity requirements of the terahertz radiation field, or the needs of different application scenarios.

[0051] In some specific implementations, such as Figure 1 As shown, the outer surfaces of the top and bottom layers of the antenna structure are coated with a layer of solder resist 7. That is, solder resist 7 is applied to the upper surface of the layer containing the terahertz antenna array 1 and the lower surface of the layer containing the feed structure 6, respectively. Here, by applying solder resist 7 to the outer surfaces of the antenna structure exposed to air, the terahertz antenna array and the feed structure can be protected from the influence of external substances.

[0052] The terahertz antenna structure provided in this embodiment incorporates an electromagnetic bandgap structure with a frame structure, which can significantly enhance the gain and increase the effective bandwidth of the terahertz antenna, thereby significantly improving the transmission efficiency of the terahertz antenna. At the same time, it can effectively suppress ground bounce noise, making it more suitable for use in the circuit board field.

[0053] Please refer to Figures 2 to 7 Embodiment two of this utility model is as follows:

[0054] This embodiment is a further extension of the above embodiment one, providing a terahertz system-on-a-chip.

[0055] The aforementioned terahertz system-on-a-chip refers to a system that integrates the generation, transmission, and reception of terahertz electromagnetic waves onto a single chip. It features high integration, small system size, strong stability, and convenient assembly.

[0056] The terahertz on-chip system provided in this embodiment includes a transmitter and a receiver; the transmitter includes a transmitting antenna; the receiver includes a receiving antenna; both the transmitting antenna and the receiving antenna adopt the antenna structure for terahertz described in Embodiment 1.

[0057] Here, by optimizing the antenna structure in the terahertz on-chip system and adding an electromagnetic bandgap structure to the frame structure, the terahertz electromagnetic wave transmission efficiency between the transmitting and receiving antennas in the terahertz on-chip system can be significantly enhanced; at the same time, it can effectively suppress ground bounce noise, enabling the terahertz on-chip system to be better used in the circuit board field.

[0058] like Figure 2 As shown, the transmitting end of the terahertz on-chip system further includes a signal source Vin and a power amplifier PA; the signal source Vin, the power amplifier PA, and the transmitting antenna are connected in sequence. The receiving end further includes a matching circuit Z, a rectifier circuit R, and an LC load circuit; the receiving antenna, the matching circuit Z, the rectifier circuit R, and the LC load circuit are connected in sequence.

[0059] The working principle of the terahertz on-chip system based on the above structure is as follows:

[0060] In a terahertz on-chip system, the transmitting antenna at the transmitting end amplifies the signal source Vin through a power amplifier PA and radiates the energy into free space in the form of circularly or linearly polarized terahertz electromagnetic waves. The receiving antenna at the receiving end receives the energy, performs impedance matching through a matching circuit to reduce signal standing waves, and then rectifies the energy into DC power through a rectifier circuit. The DC power is then efficiently magnetically coupled through an LC load circuit, multiplied to the required voltage, and stored.

[0061] The terahertz on-chip system provided in this embodiment improves antenna gain and increases transmission distance by modifying the antenna structure, while effectively suppressing ground bounce noise. Furthermore, by configuring a rectified and regulated voltage at the receiver, it utilizes rectification and regulation technology to provide stable and long-distance energy transmission. Therefore, the terahertz on-chip system of this embodiment can achieve efficient and stable energy transmission via wireless microwave.

[0062] The terahertz on-chip system provided in this embodiment, whether it's the terahertz antenna array corresponding to the transmitting antenna or the terahertz antenna array corresponding to the receiving antenna, can be composed of a single terahertz antenna or arranged from two or more terahertz antennas. The specific configuration can be flexibly tailored according to the directional and intensity requirements of the terahertz radiation field, or the needs of different application scenarios. In particular, due to the short wavelength of terahertz electromagnetic waves, the terahertz on-chip system of this embodiment has a single antenna size of approximately 0.2-0.5 mm and an antenna array size of approximately 1 nm-3 mm, which can significantly reduce the area of ​​the terahertz antenna array and is more conducive to integration and packaging.

[0063] In some specific implementations, such as Figure 2 As shown, the terahertz antenna array corresponding to the transmitter of the terahertz on-chip system consists of a single terahertz antenna; the terahertz antenna array corresponding to the receiver also consists of a single terahertz antenna.

[0064] In some specific implementations, such as Figure 3 As shown, the terahertz antenna array corresponding to the transmitter of the terahertz on-chip system consists of three terahertz antennas; the terahertz antenna array corresponding to the receiver consists of one terahertz antenna.

[0065] In some specific implementations, such as Figure 4 As shown, the terahertz antenna array corresponding to the transmitter of the terahertz on-chip system consists of one terahertz antenna; the terahertz antenna array corresponding to the receiver consists of three terahertz antennas.

[0066] The terahertz on-chip system provided in this embodiment, based on the above-mentioned basic architecture, can be further expanded to have multiple transmit and receive paths to further enhance signal stability, improve signal coverage, and further increase transmission rate and transmission capacity.

[0067] In some specific implementations, such as Figure 5 As shown, the terahertz on-chip system has one group of transmitters and N groups of receivers, where N is an integer greater than or equal to 2. By increasing the number of receivers, multiple groups of receivers can simultaneously receive energy, ensuring reliable reception of the energy emitted by the transmitters.

[0068] In some specific implementations, such as Figure 6 As shown, the terahertz on-chip system has N sets of transmitters, where N is an integer greater than or equal to 2; and one set of receivers. By increasing the number of transmitters, multiple sets of transmitters can simultaneously transmit energy, ensuring reliable energy transmission.

[0069] Specifically, in both of the above-described embodiments, the number of terahertz antennas included in the terahertz antenna arrays of both the transmitting and receiving ends can be flexibly configured according to requirements. Preferably, Figure 5 In a specific implementation, the terahertz antenna array corresponding to the transmitting end consists of one terahertz antenna, and the terahertz antenna array corresponding to each receiving end consists of four terahertz antennas. Figure 6 In a specific implementation, the terahertz antenna array corresponding to each transmitter consists of one terahertz antenna, and the terahertz antenna array corresponding to the receiver consists of four terahertz antennas.

[0070] In some specific implementations, such as Figure 7 As shown, the terahertz on-chip system has N sets of transmitters, where N is an integer greater than or equal to 2; and also N sets of receivers, where N is an integer greater than or equal to 2. By simultaneously increasing the number of transmitters and receivers, reliable energy transmission and reception can be ensured.

[0071] Preferably, Figure 7 In a specific implementation, the terahertz antenna array corresponding to each transmitter consists of one terahertz antenna, and the terahertz antenna array corresponding to each receiver consists of four terahertz antennas.

[0072] As a preferred embodiment of this invention, the terahertz system-on-a-chip is packaged using a flip-chip architecture, which enables it to achieve advantages such as smaller size, better electrical performance, better heat dissipation, and stronger shock resistance.

[0073] Please refer to Figures 8 to 10 Embodiment three of this utility model is as follows:

[0074] This embodiment is a further extension of the above embodiment 2, specifically refining the components of the receiver in the terahertz on-chip system.

[0075] In this embodiment, the matching circuit of the receiving end consists of a short stub and an open stub.

[0076] like Figure 8 As shown in the figure, the lower part of the figure is a schematic diagram of the structure of an open stub, and the upper part is its equivalent circuit diagram. The open stub is a transmission line (such as a microstrip line, stripline, or coaxial line) of a specific length. One end is denoted as P1; one end is open-circuited (not connected to any load, presenting an open-circuit state, theoretically with infinite impedance); the other end is connected to the main transmission line or circuit network, usually as a parallel branch, and is denoted as P2.

[0077] like Figure 9 As shown in the figure, the lower part of the figure is a structural schematic of a short-circuited microstrip line, and the upper part is its equivalent circuit diagram. The short-circuited microstrip line is a coaxial line, microstrip line, stripline, etc., with a specific characteristic impedance (usually the same as or different from the main transmission line). One end is denoted as P1; the other end is directly connected to ground through a conductor, forming a short-circuit point GND; the other end is connected to the main transmission line, usually in parallel through a T-connector or other means, and is denoted as P2.

[0078] When the length of a microstrip line stub is an integer multiple of 1 / 4 wavelength, its input impedance will behave as a pure reactance. Therefore, by precisely designing the length of the short-circuited microstrip line, the required impedance adjustment can be achieved at a specific frequency, thereby improving the matching performance of the receiver.

[0079] The basic characteristics of a short-circuited microstrip line are as follows: the transmission line equation for the input impedance Zin is: Zin = j*Z0*tan(βl); when l = λ / 4 (a quarter wavelength), the input impedance Zin approaches infinity, exhibiting open-circuit characteristics. When l = λ / 2 (half a wavelength), the input impedance Zin is zero, exhibiting short-circuit characteristics. For other lengths, the input impedance can be inductive (positive imaginary number) or capacitive. The short-circuited microstrip line utilizes this characteristic for impedance matching.

[0080] The basic characteristics of an open stub are as follows: The input impedance Zin of an open stub can be derived using transmission line theory: Zin = j*Z0*tan(βl); when l = λ / 4 (a quarter wavelength), the open stub exhibits short-circuit characteristics. As Zin approaches infinity, it exhibits open-circuit characteristics. For other lengths, the input impedance can be inductive (positive imaginary) or capacitive.

[0081] In some specific implementations, such as Figure 8 As shown, the open stub is composed of a main transmission line connected in parallel with an open transmission line.

[0082] In some specific implementations, such as Figure 9 As shown, the short-circuited microstrip line consists of a main transmission line connected in parallel with a grounded transmission line.

[0083] In some other specific embodiments, the structure of the matching circuit is as follows: Figure 10As shown, it consists of an antenna feeder circuit connected in parallel with an open stub and then connected in parallel with a short stub. Optionally, the open stub and the short stub can be one or more sets.

[0084] In this embodiment, the rectifier circuit at the receiving end can be implemented using special diodes, such as Schottky diodes or tunnel diodes, which have lower junction voltages and higher switching speeds, making them more suitable for high-frequency operation.

[0085] In some specific embodiments, the rectifier circuit can be a half-wave microwave rectifier circuit, which uses one half-cycle of the microwave signal for rectification and has the characteristics of simple structure; it can also be a full-wave microwave rectifier circuit, which uses two half-cycles of the microwave signal for rectification and has the characteristics of high efficiency; preferably, it can also be a bridge microwave rectifier circuit, which is composed of four microwave diodes and can provide a more stable DC output.

[0086] Embodiment four of this utility model is as follows:

[0087] This embodiment is a further extension of any of the above embodiments, providing a terahertz-based wireless microwave power transmission architecture.

[0088] The terahertz-based wireless microwave power transmission architecture provided in this embodiment includes a first circuit, a second circuit, and a terahertz on-chip system as described in any one of the embodiments 2 to 3 above; the power output terminal of the first circuit is connected to the transmitting terminal of the terahertz on-chip system, and the power receiving terminal of the second circuit is connected to the receiving terminal of the terahertz on-chip system.

[0089] The terahertz-based wireless microwave power transmission architecture provided in this embodiment can efficiently and stably transmit the energy of the first circuit to the second circuit via a terahertz on-chip system using wireless microwave. Compared with existing physical circuit power transmission architectures, it not only reduces product design complexity and cost, but also provides more stable energy transmission performance and higher integration density.

[0090] Specifically, due to the addition of an electromagnetic bandgap structure to the antenna structure of the terahertz on-chip system in the power transmission architecture of this embodiment, the terahertz electromagnetic wave transmission efficiency between the transmitting and receiving antennas is significantly enhanced, increasing antenna bandwidth and extending transmission distance. Simultaneously, it effectively suppresses ground bounce clutter and is more conducive to shielding EMI interference during power transmission. Furthermore, the power transmission architecture, based on the terahertz on-chip system, significantly optimizes the size and complexity of the power transmission architecture, contributing to convenience and high-density integration. Finally, the terahertz on-chip system provides various transmitter and receiver configurations for flexible selection, such as one-transmit-one-receive, multiple-transmit-one-receive, one-transmit-multiple-receive, and multiple-transmit-multiple-receive paths, which can further improve transmission rate and capacity, while enhancing signal transmission stability and signal coverage.

[0091] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An antenna structure for terahertz applications, characterized in that, The device includes a terahertz antenna array, a first dielectric, an electromagnetic bandgap structure, a reference ground, a second dielectric, and a feeding structure stacked sequentially from top to bottom. The electromagnetic bandgap structure includes a metal frame and a plurality of electromagnetic bandgap elements. The plurality of electromagnetic bandgap elements are periodically arranged on the metal frame. In the stacking direction, the metal frame encloses the terahertz antenna array within it.

2. The antenna structure for terahertz applications as described in claim 1, characterized in that, The electromagnetic bandgap unit is a tubular structure, with one end connected to the metal frame and the other end connected to the reference ground.

3. The antenna structure applied to terahertz frequencies as described in claim 1, characterized in that, The metal frame has a rectangular structure.

4. The antenna structure applied to terahertz frequencies as described in claim 1, characterized in that, The outer surfaces of its top and bottom layers are each coated with a layer of solder resist.

5. The antenna structure applied to terahertz frequencies as described in claim 1, characterized in that, The terahertz antenna array is composed of two or more terahertz antenna patches arranged together.

6. A terahertz on-chip system, characterized in that, It includes a transmitter and a receiver; the transmitting antenna of the transmitter and the receiving antenna of the receiver both adopt the antenna structure for terahertz as described in any one of claims 1 to 4.

7. The terahertz on-chip system as described in claim 6, characterized in that, The terahertz antenna array corresponding to the transmitting antenna consists of one terahertz antenna or is composed of two or more terahertz antennas arranged together; the terahertz antenna array corresponding to the receiving antenna consists of one terahertz antenna or is composed of two or more terahertz antennas arranged together.

8. The terahertz on-chip system as described in claim 7, characterized in that, The transmitting end further includes a signal source and a power amplifier; the receiving end further includes a matching circuit, a rectifier circuit, and an LC load circuit; the signal source, power amplifier, and transmitting antenna are connected in sequence; the receiving antenna, matching circuit, rectifier circuit, and LC load circuit are connected in sequence.

9. The terahertz system-on-a-chip as described in claim 6, characterized in that, The number of receivers and / or transmitters is multiple.

10. A power transmission architecture, characterized in that, It includes a first circuit, a second circuit, and the terahertz on-chip system according to any one of claims 6 to 9; the power output terminal of the first circuit is connected to the transmitter terminal of the terahertz on-chip system, and the power receiving terminal of the second circuit is connected to the receiver terminal of the terahertz on-chip system.

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