Multilayer heat sink

Abstract

The utility model discloses a multilayer heat sink, which relates to the field of semiconductor lasers, breaks the horizontal expansion limitation of a traditional single-layer heat sink through a vertical multilayer structure of a laser installation unit, and remarkably reduces the size of equipment while ensuring the number of integrated lasers. A three-dimensional heat dissipation path and an embedded heat pipe design are combined, so that heat resistance is effectively reduced, heat flux density distribution is optimized, and the problem of lagging heat dissipation of the edge of a large-size heat sink is solved; through the synergistic effect of a double-layer cascade layout and a broken line type heat dissipation path, the laser integration density per unit volume is greatly improved, and the volume of a heat conduction unit and the system energy consumption are synchronously reduced; layered independent temperature control and symmetrical heat flow distribution design are adopted, thermal interference between adjacent units is restrained, and accurate balance control over the temperature of the multi-layer laser is achieved. And efficient and reliable heat dissipation support is provided for compact integration of high-power laser equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor lasers, specifically to a multilayer heat sink. Background Technology

[0002] In the field of semiconductor laser applications, laser lights, as important equipment in the stage lighting and illumination industry, generally use TO-packaged semiconductor lasers with spatial beam combining as their core light source. In traditional TO-packaged lasers, the heat sink is usually a single-layer metal substrate, with the lasers arranged in a horizontal one-dimensional array on its surface, and a heat dissipation device installed at the bottom to meet power requirements. However, as laser power increases, the number of single-tube lasers needs to increase proportionally, resulting in a sharp increase in the planar size of the heat sink in the horizontal direction, while the space utilization in the vertical direction has not improved significantly. The heat dissipation path of a single-layer heat sink is singular, and the heat flux density is concentrated, making it difficult to balance the contradiction between high power requirements and compact size. This causes the overall size and weight of high-power lasers to increase exponentially, with some devices even exceeding 100KG. This not only significantly increases material costs and production difficulty but also leads to problems such as rising transportation costs and low engineering installation efficiency. Utility Model Content

[0003] The purpose of this utility model is to address the aforementioned problems by providing a multi-layer heat sink. Through the vertical multi-layer structure of the laser mounting unit, it breaks the horizontal expansion limitation of the traditional single-layer heat sink, significantly reducing the size of the device while ensuring the number of integrated lasers. Combined with a three-dimensional heat dissipation path and embedded heat pipe design, it effectively reduces thermal resistance and optimizes the heat flux density distribution, thus solving the problem of delayed heat dissipation at the edge of large-size heat sinks.

[0004] The technical solution adopted in this utility model is as follows:

[0005] A multi-layer heat sink includes a heat sink body, which includes a vertically arranged heat sink mounting plate and a horizontally arranged heat sink base plate. The heat sink mounting plate is located at one end of the heat sink base plate. The heat sink mounting plate has multiple laser mounting units arranged vertically, and each laser mounting unit has a plurality of laser mounting holes arranged in a straight line along the horizontal direction. The heat sink body also has a heat conducting unit, which includes a heat absorption section, a heat conducting section, and a heat release section. The heat absorption section is located horizontally on the heat sink mounting plate, and each laser mounting unit has at least one heat absorption section on its upper and / or lower side. The heat release section is located on the heat sink base plate, and the two ends of the heat conducting section are respectively connected to the heat absorption section and the heat release section.

[0006] By adopting the above technical solution, the traditional single-layer heat sink horizontal expansion mode is broken through the vertical multi-layer layout, and the heat sink plane size is greatly compressed with the same number of lasers; the three-dimensional heat dissipation path formed by the heat conduction unit effectively reduces the heat flux density compared with the traditional single-layer heat dissipation, solves the contradiction between the increase in equipment size and power, and successfully reduces the size and weight of high-power equipment.

[0007] Furthermore, the heat-conducting unit includes a heat-conducting groove disposed on the heat sink body and a heat pipe that matches the heat-conducting groove, wherein the heat pipe is embedded in the heat-conducting groove.

[0008] Thanks to the above technical solutions, the embedded heat pipe design effectively improves heat conduction power and reduces thermal resistance during heat conduction compared to traditional bottom heat dissipation devices. While maintaining the same heat dissipation power, it reduces the volume of the heat conduction unit, significantly reducing material usage and production costs.

[0009] Furthermore, the heat absorption section has a closed end and a connected end at both ends along its length, and the closed ends and connected ends of adjacent heat absorption sections are arranged alternately; the heat conduction section located on the heat sink assembly plate is arranged vertically on the side of the heat sink assembly plate, and the connected end of each heat absorption section is connected to the corresponding heat conduction section; the heat absorption section and the heat conduction section on the heat sink assembly plate cooperate with each other to form a heat dissipation structure of at least partially surrounding the laser mounting unit.

[0010] Thanks to the above technical solution, the staggered heat conduction path makes the heat dissipation contact area uniformly distributed for the heat conduction path corresponding to the multi-layer laser mounting unit, effectively reducing the temperature difference between different areas on the heat sink body and ensuring improved heat dissipation performance.

[0011] Furthermore, the heat release section is located in the middle of the heat sink base plate, and the heat conduction section on the heat sink base plate is an inclined structure that is obliquely arranged from the edge to the middle. The heat conduction section and the heat release section on the heat sink base plate cooperate with each other to form a zigzag structure.

[0012] Thanks to the aforementioned technical solution, the zigzag heat dissipation path creates a centrally concentrated heat dissipation structure at the heat sink base plate, optimizing the heat dissipation path. When multiple heat sinks are installed together, it effectively reduces the mutual interference of heat dissipation at the edges of adjacent heat sinks. Furthermore, a cooling device can be used at the heat sink base plate, significantly reducing the size and energy consumption of the supporting heat dissipation system and solving the inherent edge heat dissipation lag problem of large-size single-layer heat sinks.

[0013] Furthermore, the heat absorption section is located above the corresponding laser mounting unit.

[0014] By adopting the above technical solution, the straight-line distance between the heat absorption section and the heat release section of the bottom plate is increased while maintaining the overall volume of the heat sink. This allows a gradient heat dissipation buffer zone to be formed through the heat conduction section, thereby improving the heat dissipation efficiency per unit area.

[0015] Furthermore, the laser mounting unit has two layers.

[0016] Thanks to the above technical solutions, the dual-layer cascaded structure can improve the laser integration density and achieve a breakthrough in the device volume factor (power / volume) while maintaining the same projected area as the traditional single-layer heat sink.

[0017] Furthermore, the heat-conducting unit includes a first heat-conducting unit corresponding to the first layer laser mounting unit and a second heat-conducting unit corresponding to the second layer laser mounting unit.

[0018] Thanks to the aforementioned technical solutions, the dual-layer cascaded structure of the laser mounting unit simplifies and facilitates the implementation of the corresponding heat dissipation unit structure. Simultaneously, the layered physical isolation of the heat dissipation units successfully reduces thermal interference between adjacent laser mounting units, allowing for precise control of temperature differences between layers within the required range. This significantly reduces spectral drift compared to traditional overall heat dissipation methods, meeting the stringent requirements of stage lighting for color temperature consistency across multiple lasers.

[0019] Furthermore, the length of the heat absorption section matches the laser mounting unit, and the heat release section, heat absorption section, and laser mounting unit are parallel to each other. The heat absorption section, heat conduction section, and heat release section cooperate to form a C-shaped or C-shaped laser heat dissipation structure.

[0020] Due to the adoption of the above technical solution, the heat conduction units corresponding to the dual-layer laser mounting unit are mirrored, that is, one positive C and one negative C, and the two heat conduction units are nested with each other. The heat conduction units form a bidirectional fluid channel through the positive and negative nesting layout, which effectively improves the heat dissipation efficiency. At the same time, the temperature difference between each layer of laser mounting units is effectively reduced through the symmetrical heat flow distribution.

[0021] Furthermore, the lengths of each of the aforementioned heat-conducting units are equal.

[0022] By adopting the above technical solution, the heat dissipation effect of each heat conduction unit is basically consistent, effectively controlling the temperature difference between laser mounting units of each layer.

[0023] Furthermore, the heat sink base plate is provided with mounting holes for matching connectors.

[0024] Thanks to the above technical solution, the heat sink base plate can be fixed in the target area by using the mounting holes and connectors.

[0025] In summary, due to the adoption of the above technical solutions, the beneficial effects of this application are as follows: The vertical multi-layer structure of the laser mounting unit breaks the horizontal expansion limitation of traditional single-layer heat sinks, significantly reducing the device size while ensuring the number of integrated lasers. Combined with a three-dimensional heat dissipation path and embedded heat pipe design, it effectively reduces thermal resistance and optimizes heat flux density distribution, solving the problem of delayed heat dissipation at the edges of large-size heat sinks. Through the synergistic effect of the double-layer cascaded layout and the zigzag heat dissipation path, the laser integration density per unit volume is greatly improved, simultaneously reducing the volume of the heat conduction unit and system energy consumption. The layered independent temperature control and symmetrical heat flux distribution design suppress thermal interference between adjacent units, achieving precise and balanced temperature control of the multi-layer lasers. This provides efficient and reliable heat dissipation support for the compact integration of high-power laser equipment. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the multilayer heat sink of this utility model;

[0027] Figure 2 This is a front view of the multilayer heat sink of this utility model;

[0028] Figure 3 This utility model relates to Figure 2 A cross-sectional view along the BB direction;

[0029] Figure 4 This is a bottom view of the multi-layer heat sink of this utility model;

[0030] Figure 5 This is a schematic diagram of the beam combining achieved by the dual-layer laser of this utility model.

[0031] The markings in the diagram are: 1-Heat sink body, 101-Heat sink assembly plate, 102-Heat sink base plate, 2-Laser mounting unit, 201-Laser mounting hole, 3-Heat conduction unit, 301-Heat absorption section, 302-Heat conduction section, 303-Heat release section, 4-First heat conduction unit, 5-Second heat conduction unit, 6-Mounting hole, 7-Heat pipe, 8-Heat conduction groove, 9-Laser, 10-Cylindrical mirror, 11-Reflecting mirror group, 12-Polarizing beam splitter. Detailed Implementation

[0032] The present invention will now be described in detail with reference to the accompanying drawings.

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0034] Example 1

[0035] A multi-layer heat sink, such as Figures 1-4 As shown, the device includes a heat sink body 1, which comprises a vertically arranged heat sink mounting plate 101 and a horizontally arranged heat sink base plate 102. The heat sink mounting plate 101 is located at one end of the heat sink base plate 102, forming an L-shaped structure. Two layers of laser mounting units 2 are vertically arranged on the heat sink mounting plate 101. Each laser mounting unit 2 contains nine laser mounting holes 201 arranged horizontally in a straight line. The number of laser mounting holes 201 can be adjusted as needed. Any value is not limited here; the heat sink body 1 is also provided with a heat conduction unit 3, which includes a heat absorption section 301, a heat conduction section 302 and a heat release section 303. The heat absorption section 301 is arranged horizontally on the heat sink assembly plate 101. Each laser mounting unit 2 has a corresponding heat absorption section 301 on its upper side. The heat release section 303 is arranged on the heat sink base plate 102. The two ends of the heat conduction section 302 are respectively connected to the heat absorption section 301 and the heat release section 303.

[0036] Specifically, the vertical multi-layer layout breaks the traditional horizontal expansion mode of single-layer heat sinks, significantly compressing the heat sink planar size with the same number of lasers 9; the three-dimensional heat dissipation path formed by the heat conduction unit 3 effectively reduces the heat flux density compared to traditional single-layer heat dissipation, resolving the contradiction between equipment volume and power growth, and successfully reducing the volume and weight of high-power equipment; the double-layer cascaded structure increases the integration density of lasers 9 while maintaining the same projected area as traditional single-layer heat sinks, achieving an effective breakthrough in the equipment volume factor (power / volume); the top-mounted heat absorption section 301 increases the straight-line distance between the heat absorption section 301 and the bottom plate heat release section 303 while maintaining the overall volume of the heat sink, thus forming a gradient heat dissipation buffer zone through the heat conduction section 302, improving the heat dissipation efficiency per unit area.

[0037] The heat-conducting unit 3 includes a heat-conducting groove 8 disposed on the heat sink body 1 and a heat pipe 7 that matches the heat-conducting groove 8. The heat pipe 7 is embedded in the heat-conducting groove 8.

[0038] Specifically, the embedded heat pipe 7 design effectively improves heat conduction power and reduces thermal resistance during heat conduction compared to traditional bottom heat dissipation devices. While maintaining the same heat dissipation power, it reduces the volume of the heat conduction unit 3, significantly reducing material usage and production costs.

[0039] The heat absorption section 301 has a closed end and a connected end at its two ends along its length, and the closed ends and connected ends of adjacent heat absorption sections 301 are arranged alternately. The heat conduction section 302 located on the heat sink assembly plate 101 is arranged vertically on the side of the heat sink assembly plate 101, and the connected end of each heat absorption section 301 is connected to the corresponding heat conduction section 302. The heat absorption section 301 and the heat conduction section 302 on the heat sink assembly plate 101 cooperate with each other to form a heat dissipation structure of at least partially surrounding the laser mounting unit 2.

[0040] Specifically, the staggered heat conduction path makes the heat dissipation contact area uniformly distributed for the heat conduction path corresponding to the multilayer laser mounting unit 2, effectively reducing the temperature difference between different areas on the heat sink body 1 and ensuring improved heat dissipation effect.

[0041] The heat release section 303 is located in the middle of the heat sink base plate 102. The heat conduction section 302 on the heat sink base plate 102 is an inclined structure that is obliquely arranged from the edge to the middle. The inclination angle of the inclined structure is preferably between 30 and 60 degrees, and the optimal angle is 45 degrees. The heat conduction section 302 and the heat release section 303 on the heat sink base plate 102 cooperate with each other to form a zigzag structure.

[0042] Specifically, the zigzag heat dissipation path creates a centrally concentrated heat dissipation structure at the heat sink base plate 102, optimizing the heat dissipation path. When multiple heat sink bodies 1 are installed together, it effectively reduces the problem of mutual influence of heat dissipation at the edges of adjacent heat sink bodies 1. Cooling devices, such as miniaturized water cooling devices, can also be used at the heat sink base plate 102, significantly reducing the volume and energy consumption of the supporting heat dissipation system and solving the inherent problem of edge heat dissipation lag in large-size single-layer heat sinks.

[0043] The heat-conducting unit 3 includes a first heat-conducting unit 4 corresponding to the first layer laser mounting unit and a second heat-conducting unit 5 corresponding to the second layer laser mounting unit.

[0044] Specifically, the dual-layer cascaded structure of the laser mounting unit 2 simplifies and facilitates the implementation of the corresponding heat dissipation unit 3. Simultaneously, the layered physical isolation of the heat dissipation unit 3 successfully reduces thermal interference between adjacent laser mounting units 2, allowing the temperature difference between each layer to be precisely controlled within the required range. This effectively reduces spectral drift compared to traditional overall heat dissipation methods, meeting the stringent requirements of stage lighting for color temperature consistency across multiple lasers.

[0045] The length of the heat absorption section 301 matches that of the laser mounting unit 2. The heat release section 303, the heat absorption section 301, and the laser mounting unit 2 are parallel to each other. The heat absorption section 301, the heat conduction section 302, and the heat release section 303 cooperate to form a C-shaped heat dissipation structure for the laser 9.

[0046] Specifically, the heat conduction units 3 corresponding to the dual-layer laser mounting unit 2 are mirrored, that is, the first heat conduction unit 4 is positive C and the second heat conduction unit 5 is negative C, and the two heat conduction units 3 are nested with each other. The heat conduction units 3 form a bidirectional fluid channel through the positive and negative nesting layout, which effectively improves the heat dissipation efficiency. At the same time, the symmetrical heat flow distribution effectively reduces the temperature difference between each layer of laser mounting unit 2.

[0047] Each of the heat-conducting units 3 has the same length.

[0048] Specifically, this ensures that the heat dissipation effect of each heat-conducting unit 3 is basically consistent, effectively controlling the temperature difference between each layer of laser mounting units 2.

[0049] The heat sink base plate 102 is provided with mounting holes 6 for matching connectors.

[0050] Specifically, the heat sink base plate 102 can be fixed in the target area by using the mounting hole 6 and the connector.

[0051] In use, the heat sink base plate 102 is fixed to the base of the laser emitting device through the mounting holes 6. The laser tube is inserted into the double-layer laser mounting holes 201 of the heat sink assembly plate 101, and the gaps are filled with thermally conductive silicone grease or other thermally conductive media to ensure contact with the heat absorption section 301. After the laser 9 is started, heat is transferred from the heat absorption section 301 through the embedded heat pipe 7 along the heat conduction section 302 to the heat release section 303 at the base plate for heat release. Here, an external water cooling system, air cooling system, or other heat dissipation system can be used to effectively dissipate heat from the laser 9. The temperature difference between each layer is monitored in real time by a temperature sensor. When the temperature of a certain layer exceeds the threshold, an alarm is issued to the user. During maintenance, the connectors at the mounting holes 6 can be removed to replace the entire multi-layer heat sink, or the laser 9 in the laser mounting unit 2 can be replaced individually. The multi-layer heat sink provided in this embodiment combines a three-dimensional heat dissipation path and a layered temperature control mechanism to achieve stable operation of the high-power laser 9 in a compact space.

[0052] Example 2

[0053] Example 2 is a specific application of Example 1; such as Figure 5 As shown, the laser 9 is mounted in two layers. The multi-layer heat sink is not shown in the figure. The beams emitted by the lasers 9 in the first and second layers are shaped by several cylindrical mirrors 10. After the beams are shaped, they are guided to the combining region by the reflecting mirror group 11. By using polarization beam combining technology, the polarization characteristics of light are utilized, and the polarization beam splitter 12 is used to combine the two orthogonally polarized laser beams into a single beam. This achieves precise superposition of the output beams of the upper and lower double-layer lasers 9, and finally realizes the combined output of the laser beam.

[0054] This document uses specific embodiments to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

[0055] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0056] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A multilayer heat sink, characterized in that, The device includes a heat sink body, comprising a vertically arranged heat sink assembly plate and a horizontally arranged heat sink base plate. The heat sink assembly plate is located at one end of the heat sink base plate. The heat sink assembly plate has multiple laser mounting units arranged vertically, and each laser mounting unit has several laser mounting holes arranged in a straight line along the horizontal direction. The heat sink body also has a heat conducting unit, which includes a heat absorption section, a heat conducting section, and a heat release section. The heat absorption section is located horizontally on the heat sink assembly plate, and each laser mounting unit has at least one heat absorption section on its upper and / or lower side. The heat release section is located on the heat sink base plate, and the two ends of the heat conducting section are connected to the heat absorption section and the heat release section, respectively.

2. The multilayer heat sink as described in claim 1, characterized in that, The heat-conducting unit includes a heat-conducting groove disposed on the heat sink body and a heat pipe that matches the heat-conducting groove, wherein the heat pipe is embedded in the heat-conducting groove.

3. The multilayer heat sink as described in claim 1, characterized in that, The heat absorption section has a closed end and a connected end at both ends along its length, and the closed ends and connected ends of adjacent heat absorption sections are arranged alternately; the heat conduction section located on the heat sink assembly plate is arranged vertically on the side of the heat sink assembly plate, and the connected end of each heat absorption section is connected to the corresponding heat conduction section; the heat absorption section and the heat conduction section on the heat sink assembly plate cooperate with each other to form a heat dissipation structure of at least partially surrounding the laser mounting unit.

4. The multilayer heat sink as described in claim 1, characterized in that, The heat release section is located in the middle of the heat sink base plate, and the heat conduction section on the heat sink base plate is an inclined structure that is obliquely arranged from the edge to the middle. The heat conduction section and the heat release section on the heat sink base plate cooperate with each other to form a zigzag structure.

5. The multilayer heat sink as described in claim 1, characterized in that, The heat absorption section is located above the corresponding laser mounting unit.

6. The multilayer heat sink according to any one of claims 1-5, characterized in that, The laser mounting unit has two layers.

7. The multilayer heat sink as described in claim 6, characterized in that, The heat-conducting unit includes a first heat-conducting unit corresponding to the first layer laser mounting unit and a second heat-conducting unit corresponding to the second layer laser mounting unit.

8. The multilayer heat sink as described in claim 7, characterized in that, The length of the heat absorption section matches the laser mounting unit. The heat release section, heat absorption section, and laser mounting unit are parallel to each other. The heat absorption section, heat conduction section, and heat release section cooperate to form a C-shaped or C-shaped laser heat dissipation structure.

9. The multilayer heat sink as described in claim 8, characterized in that, Each of the aforementioned heat-conducting units has the same length.

10. The multilayer heat sink as described in claim 1, characterized in that, The heat sink base plate is provided with mounting holes for matching connectors.

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