Wedge block type MOS (Metal Oxide Semiconductor) tube fixing structure

Abstract

The utility model provides a wedge block type MOS (Metal Oxide Semiconductor) tube fixing structure, which relates to the technical field of controllers and comprises a shell, an MOS tube, a mainboard and a wedge block structure, the MOS tube is installed on the main board, the main board provided with the MOS tube is fixedly arranged in the shell, a groove structure is further arranged in the shell, and the MOS tube partially extends into a gap between the groove structure and the inner wall of the shell; the wedge block structure is configured between the groove structure and the MOS tube, the wedge block structure comprises a first wedge block and a second wedge block, and the first wedge block, the second wedge block and the MOS tube are sequentially and mutually abutted and matched. According to the utility model, the wedge block structure is arranged, and the wedge block structure is adjusted by the fastener, so that the MOS tube has enough installation gap during installation, and the MOS tube is pressed on the shell by the wedge block structure after being installed in place, thereby ensuring the stability of fitting between the MOS tube and the shell, and ensuring the heat dissipation effect of the MOS tube.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, specifically to a wedge-type MOS transistor fixing structure. Background Technology

[0002] As the core component of a two-wheeled electric system, the stability of the controller determines the quality of motor operation. A good controller can not only improve the motor's working efficiency and make its power output more stable, thereby improving the riding experience and safety, but also extend the motor's lifespan.

[0003] The core of the controller is the MOSFET, which is like the heart of the controller. Its quality affects the stability of the controller's output voltage and current. Heat generation is the biggest problem with MOSFETs, and a good heat dissipation solution directly affects the lifespan of the controller and its current output capability.

[0004] Chinese patent document CN214012931U discloses a MOSFET retaining structure for an electric vehicle controller, including a housing, a circuit board disposed inside the housing, and a MOSFET disposed on the circuit board. The MOSFET retaining structure for the electric vehicle controller further includes an elastic element and a support element. A slot and a locking block are provided on the inner wall of the housing. Before the elastic element presses the MOSFET, one end of the elastic element is installed in the slot, and the other end abuts against the MOSFET through the support element. After the elastic element presses the MOSFET, one end of the elastic element abuts against the locking block, and the other end presses the MOSFET against the inner wall of the housing through the support element.

[0005] Existing technology uses elastic elements to press the MOSFET together, but due to the elastic deformation of the elastic elements, the pressing structure is unstable and the effect of fixing the MOSFET is poor, which needs to be improved. Utility Model Content

[0006] In view of the deficiencies in the existing technology, the purpose of this utility model is to provide a wedge-type MOS transistor fixing structure.

[0007] According to the present invention, a wedge-type MOSFET fixing structure includes: a housing, a MOSFET, a main board, and a wedge structure;

[0008] The MOSFET is mounted on the motherboard, and the motherboard with the MOSFET is fixedly installed inside the housing. The housing also has a groove structure, and the MOSFET partially extends into the gap between the groove structure and the inner wall of the housing.

[0009] The wedge structure is disposed between the groove structure and the MOS transistor. The wedge structure includes a first wedge and a second wedge, and the first wedge, the second wedge, and the MOS transistor are sequentially engaged with each other.

[0010] Preferably, a cover plate is fixedly installed on the housing, the cover plate is provided with a first threaded hole, the first wedge is provided with a second threaded hole, and the first threaded hole and the second threaded hole coincide;

[0011] The cover plate and the first wedge are connected by fasteners, a first threaded hole and a second threaded hole;

[0012] Before the fastener connects the cover plate and the first wedge, there is an installation gap between the first wedge, the second wedge, and the MOS transistor.

[0013] After the fastener connects the cover plate and the first wedge, the first wedge, the second wedge, and the MOS transistor abut against each other in sequence.

[0014] Preferably, the inner wall of the housing is provided with a horizontal slot, and the motherboard is snapped into the horizontal slot.

[0015] Preferably, the material of the housing includes one or more of aluminum, silver, and copper.

[0016] Preferably, a rubber pad is provided between the housing and the cover plate; the rubber pad has a through hole, which coincides with the first threaded hole.

[0017] Preferably, multiple MOS transistors are spaced apart on the motherboard along a first direction.

[0018] Preferably, during the process of the fastener connecting the cover plate and the first wedge, the fastener generates a tensile force along the fastener axis towards the first wedge, and the first wedge generates a thrust perpendicular to the contact surface towards the second wedge.

[0019] Preferably, the side with the largest surface area of ​​the MOS transistor is fitted to the inner wall of the housing.

[0020] Preferably, the surface of the MOS transistor body does not contact the motherboard.

[0021] Preferably, the outer surface of the sidewall of the housing that is in contact with the MOS transistor is provided with a continuous toothed structure.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. This utility model, by setting a wedge structure and using fasteners to adjust the wedge structure, ensures that the MOSFET has sufficient installation clearance during installation. After the MOSFET is installed in place, it is pressed against the housing by the wedge structure, which helps to improve the stability of the fit between the MOSFET and the housing and helps to improve the heat dissipation effect of the MOSFET.

[0024] 2. This utility model sets up a wedge structure and uses fasteners to adjust the wedge structure, allowing the wedge structure to move within a certain space, thereby pressing the MOSFET against the housing and ensuring good heat dissipation for the MOSFET. Attached Figure Description

[0025] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0026] Figure 1 This is a schematic diagram of the wedge-type MOS transistor fixing structure of this utility model;

[0027] Figure 2 This is a cross-sectional view of the connection between the wedge-type MOS transistor fixing structure, the cover plate, and the fasteners of this utility model.

[0028] Figure 3 This is a force analysis diagram of the first and second wedge blocks of this utility model.

[0029] The diagram shows:

[0030] Case 1 MOSFET 2

[0031] Motherboard 3 Wedge structure 4

[0032] First wedge 41 Second wedge 42

[0033] 5 rubber pads, 6 cover plates

[0034] Fastener 7 Detailed Implementation

[0035] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0036] A wedge-type MOSFET fixing structure includes a housing 1, a MOSFET 2, a main board 3, and a wedge structure 4. The MOSFET 2 is fixedly mounted on the main board 3, and the main board 3 and the wedge structure 4 are fixedly mounted inside the housing 1.

[0037] The housing 1 has a groove structure inside, and part of the MOSFET 2 extends into the gap between the groove structure and the inner wall of the housing 1. The wedge structure 4 is disposed between the groove structure and the MOSFET 2, and the wedge structure 4 and the MOSFET 2 abut against each other. The inner wall of the housing 1 also has a horizontal slot, and the motherboard 3 is snapped into the horizontal slot and fixedly installed inside the housing 1.

[0038] The wedge structure 4 includes a first wedge 41 and a second wedge 42. The first wedge 41 and the second wedge 42 are wedge-shaped connected. The side of the second wedge 42 away from the first wedge 41 abuts against the MOS transistor 2. The opposite side of the MOS transistor 2 that contacts the second wedge 42 abuts against the inner wall of the housing 1. The opposite side of the first wedge 41 that contacts the second wedge 42 abuts against the inner wall of the groove. The first wedge 41 serves as a limiting block.

[0039] A cover plate 6 is fixedly mounted on the housing 1. The cover plate 6 has a first threaded hole, and the first wedge 41 has a second threaded hole; the first and second threaded holes coincide. A fastener 7 connects the cover plate 6 and the first wedge 41 through the first and second threaded holes. Before the fastener 7 connects the cover plate 6 and the first wedge 41, there is an installation gap between the first wedge 41, the second wedge 42, and the MOSFET 2, which facilitates the installation of the MOSFET 2. After the fastener 7 connects the cover plate 6 and the first wedge 41, the first wedge 41, the second wedge 42, and the MOSFET 2 abut against each other in sequence, eliminating the installation gap and allowing the MOSFET 2 to fit tightly against the inner wall of the housing 1, improving heat dissipation efficiency. During the process of the fastener 7 connecting the cover plate 6 and the first wedge 41, the fastener 7 generates a tensile force F along the axial direction of the fastener 7 towards the first wedge 41, and the first wedge 41 generates a thrust F2 perpendicular to the contact surface towards the second wedge 42.

[0040] A rubber pad 5 is provided between the housing 1 and the cover plate 6. The rubber pad 5 has a through hole that coincides with the first threaded hole.

[0041] The material of the housing 1 can be a metal or a non-metal with good thermal conductivity. In a preferred embodiment, the material of the housing 1 includes any one or more of aluminum, silver, and copper.

[0042] In a preferred embodiment, multiple MOSFETs 2 are spaced apart on the motherboard 3 along a first direction, wherein the length direction of the wedge structure 4 is the first direction. The spacing between the MOSFETs 2 prevents them from contacting each other, which helps increase heat dissipation efficiency.

[0043] In a preferred embodiment, the side with the largest surface area of ​​the MOS transistor 2 is attached to the inner wall of the housing 1 to increase the heat exchange area.

[0044] In a preferred embodiment, the main surface of the MOSFET 2 does not contact the motherboard 3, but is electrically connected to the motherboard 3 through metal pins. When the motherboard 3 heats up, it will not transfer heat to the MOSFET 2.

[0045] In a preferred embodiment, the outer surface of the sidewall where the housing 1 and the MOS tube 2 are attached is provided with a continuous toothed structure, which increases the heat exchange area with the air.

[0046] Working principle: MOSFET 2 is mounted on motherboard 3 and installed in housing 1 through a slot. Rubber pad 5 and cover plate 6 are fixed to one end of housing 1. After fixing, wedge structure 4 is installed in the groove inside housing 1. Fastener 7 is locked onto first wedge 41 from outside cover plate 6. When fastener 7 is locked, it will generate a pulling force F on first wedge 41. The left side of first wedge 41 is limited by housing 1. The inclined surface of first wedge 41 will generate a pushing force F2 on second wedge 42. F2 can be decomposed into a rightward force F1 and a downward force F3. F1 causes second wedge 42 to move to the right, and F3 causes wedge to move downward. The lower part of second wedge 42 is limited by cover plate 6, so wedge can only move to the right, thereby pressing multiple MOSFETs 2 on the right side against the side wall of housing 1, so that MOSFETs 2 can be smoothly dissipated from housing 1 to the outside.

[0047] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0048] The specific embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the substantive content of this utility model. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A wedge-type MOS transistor fixing structure, characterized in that, The application relates to a MOS tube fixing device. The MOS tube (2) is installed on the mainboard (3), the mainboard (3) provided with the MOS tube (2) is fixedly arranged in the shell (1), a groove structure is further arranged in the shell (1), and the MOS tube (2) partially extends into the gap between the groove structure and the inner wall of the shell (1). The wedge block structure (4) is arranged between the groove structure and the MOS tube (2), the wedge block structure (4) comprises a first wedge block (41) and a second wedge block (42), and the first wedge block (41), the second wedge block (42) and the MOS tube (2) are sequentially and abuttingly matched. The cover plate (6) is fixedly installed on the shell (1), the cover plate (6) is provided with a first threaded hole, the first wedge block (41) is provided with a second threaded hole, and the first threaded hole and the second threaded hole are coincident.

2. The wedge MOSFET mounting structure of claim 1, wherein The cover plate (6) and the first wedge block (41) are connected through the fastener (7), the first threaded hole and the second threaded hole. Before the fastener (7) connects the cover plate (6) and the first wedge block (41), an installation gap exists among the first wedge block (41), the second wedge block (42) and the MOS tube (2). After the fastener (7) connects the cover plate (6) and the first wedge block (41), the first wedge block (41), the second wedge block (42) and the MOS tube (2) are sequentially and abuttingly matched. The inner wall of the shell (1) is provided with a horizontal clamping groove, and the mainboard (3) is clamped in the horizontal clamping groove.

3. The wedge MOSFET mounting structure of claim 1, wherein The material of the shell (1) comprises any one of aluminum, silver and copper.

4. The wedge MOSFET mounting structure of claim 1, wherein A rubber pad (5) is arranged between the shell (1) and the cover plate (6).

5. The wedge MOSFET mounting structure of claim 2, wherein The rubber pad (5) is provided with a through hole, and the through hole is coincident with the first threaded hole. The MOS tube (2) is spaced apart in a first direction on the mainboard (3).

6. The wedge MOS transistor securing structure of claim 1, wherein During the process that the fastener (7) connects the cover plate (6) and the first wedge block (41), the fastener (7) generates a pulling force along the axial direction of the fastener (7) to the first wedge block (41), and the first wedge block (41) generates a pushing force perpendicular to the contact surface to the second wedge block (42).

7. The wedge MOSFET mounting structure of claim 2, wherein The side surface with the largest surface area of the MOS tube (2) is attached to the inner wall of the shell (1).

8. The wedge MOS transistor securing structure of claim 1, wherein The main surface of the MOS tube (2) is not in contact with the mainboard (3).

9. The wedge MOS transistor securing structure of claim 1, wherein The outer surface of the side wall, where the shell (1) is attached to the MOS tube (2), is provided with a continuous tooth-shaped structure.

10. The wedge MOS transistor securing structure of claim 1, wherein ​

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