Power device

Abstract

The embodiment of the utility model provides a power device, the power device comprises a heat dissipation unit and a power unit, the heat dissipation unit comprises a heat conduction body and N installation parts, and N is greater than or equal to 1; the mounting part is arranged on the outer surface of the heat-conducting body; the heat conduction body is internally provided with one or more heat dissipation channels, the heat dissipation channels penetrate from one end of the heat conduction body to the other end of the heat conduction body, and opening ends are formed at the two ends of the heat conduction body respectively. The power unit is mounted on the mounting portion. The embodiment of the utility model solves the technical problem of how to dissipate heat of the power unit.

Description

Technical Field

[0001] This utility model relates to the field of electronics, and in particular to a power device. Background Technology

[0002] Power units have a wide range of applications, such as in the automotive, home appliance, and aerospace industries.

[0003] Existing power units typically do not have a heat dissipation unit. When the power unit temperature is too high, the current flowing through it is usually reduced by a temperature protection circuit to achieve the purpose of cooling. This method will affect the normal operation of the power unit. Utility Model Content

[0004] This utility model provides a power device that solves the technical problem of how to dissipate heat in a power unit.

[0005] To solve the above-mentioned technical problems, this utility model provides a power device, including a heat dissipation unit and a power unit. The heat dissipation unit includes a heat-conducting body and N mounting portions, where N is greater than or equal to 1. The mounting portions are disposed on the outer surface of the heat-conducting body. The heat-conducting body has one or more heat dissipation channels inside, which extend from one end of the heat-conducting body to the other end, and form open ends at both ends. The power unit is mounted on the mounting portions.

[0006] Beneficial effects

[0007] The power device provided in this embodiment of the utility model places the power unit on the heat dissipation unit, directly dissipates heat from the power unit, and conducts heat vertically to the heat dissipation unit. Furthermore, through the ingenious structural design of the heat dissipation unit, the overall structure is simple, low-cost, and has high heat dissipation efficiency, without affecting the normal operation of the power unit.

[0008] Other features and corresponding beneficial effects of this utility model will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in this utility model specification. Attached Figure Description

[0009] Figure 1 A schematic diagram of the heat dissipation unit provided in Embodiment 1 of this utility model;

[0010] Figure 2 for Figure 1 A schematic diagram of the heat dissipation channel of the heat dissipation unit shown;

[0011] Figure 3 A schematic diagram of another heat dissipation unit provided in Embodiment 1 of this utility model;

[0012] Figure 4 A schematic diagram of the power device provided in Embodiment 1 of this utility model;

[0013] Figure 5 This is a schematic diagram of another power device provided in Embodiment 1 of the present utility model;

[0014] Figure 6 This is a schematic diagram of the power module provided in Embodiment 1 of this utility model. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it.

[0016] Example 1:

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. An embodiment of this utility model provides a power device, including a heat dissipation unit and a power unit, wherein...

[0018] The heat dissipation unit includes a heat-conducting body and N mounting parts, where N is greater than or equal to 1. The mounting parts are disposed on the outer surface of the heat-conducting body and are used to mount the power unit. The heat-conducting body has one or more heat dissipation channels inside, which extend from one end of the heat-conducting body to the other end, and open ends are formed at both ends.

[0019] In some embodiments, the heat dissipation unit further includes a connector disposed at the open end, the connector being used to connect to an external heat dissipation system. The connector may be made of a thermally conductive material.

[0020] In some embodiments, the connector includes a hollow cylindrical connector with openings at both ends. One end of the cylindrical connector abuts against the open end, and the other end has a connecting portion for connecting to an external channel, through which it connects to an external heat dissipation system. The connecting portion includes at least one of internal threads, external threads, snap-fit, slot, and clamp.

[0021] In some embodiments, the connector is one of internal thread, external thread, snap-fit, slot, or clamp, and is disposed at the open end for connecting to an external heat dissipation system. It has a simple structure, reduces the number of parts and assembly steps, and lowers costs.

[0022] In some embodiments, the interior of the heat-conducting body may have one or more heat dissipation channels. To increase the heat dissipation area and make heat dissipation more uniform, honeycomb or spiral heat dissipation channels can be provided. The heat dissipation channels can be located in the central region of the interior of the heat-conducting body, or they can be located inside the heat-conducting body, and the heat dissipation effect is better when they are located at the position corresponding to the mounting part.

[0023] In some embodiments, the heat dissipation channel includes heat dissipation holes, heat sinks, heat sinks, devices made of phase change materials, etc., and is disposed inside the heat-conducting body to achieve the effect of heat dissipation. The heat dissipation holes can be filled with phase change materials, thermal paste, coolant, etc., for heat dissipation. The coolant includes, but is not limited to, a 50% ethylene glycol aqueous solution with a freezing point of -40°C and a boiling point of 110°C, providing both antifreeze and thermal conductivity, with a thermal conductivity of approximately 0.4 W / m·K. An external heat dissipation system, such as a water-cooling system or an air-cooling system, can also be connected via connectors. A water-cooling system can inject water into the heat dissipation holes, and an air-cooling system can inject airflow into the heat dissipation holes to further accelerate heat dissipation. The heat dissipation channel can be fabricated using metal 3D printing (such as SLM technology). Spiral water-cooled heat dissipation channels or honeycomb air-cooled heat dissipation channels can be configured, utilizing natural convection or forced airflow for heat dissipation. Water-cooled heat dissipation channels are suitable for high-power applications, such as electric vehicle inverters, while air-cooled heat dissipation channels are suitable for medium- and low-power applications, such as industrial and automotive-grade motor drives.

[0024] In some embodiments, the cross-sectional shape of the heat dissipation holes can be circular, semi-circular, square, polygonal, etc. In some embodiments, in order to accelerate heat dissipation and achieve more uniform heat dissipation, the interior of the heat-conducting body has multiple heat dissipation holes with a diameter of 0.5 mm to 1 mm, which are connected to an external water cooling system via connectors, with a water flow velocity of 0.8 m / s to 1.2 m / s.

[0025] In some embodiments, the mounting portion is an insulating portion, or the heat dissipation unit further includes an insulating portion disposed on the mounting portion, and the power unit is mounted on the insulating portion. If the heat-conducting body is made of a conductive material, the insulating portion can provide insulation between the power unit and the heat-conducting body; for example, the heat-conducting body is made of copper. The aforementioned insulating portion can be an insulating heat-conducting portion.

[0026] In some embodiments, N mounting portions are symmetrically arranged on the outer surface of the heat-conducting body. Since the mounting portions are used to mount power units, the symmetrical arrangement of the power units on the outer surface of the heat-conducting body facilitates uniform heat dissipation.

[0027] In some embodiments, the heat-conducting body has two ends and a sidewall portion located between the two ends. Each mounting portion is disposed on the outer surface of the sidewall portion of the heat-conducting body. The heat dissipation channel extends from one end of the heat-conducting body to the other end of the heat-conducting body, and an opening end is formed at each of the two ends.

[0028] In some embodiments, the heat-conducting body is a cylinder or a polyhedron. This eliminates the redundant structure of traditional heat sinks, directly utilizing the geometric symmetry and internal space of the cylinder or polyhedron to achieve efficient heat dissipation and reduce costs.

[0029] In some embodiments, the heat-conducting body is one of a cylinder, a triangular prism, a square prism, a pentagonal prism, or a hexagonal prism.

[0030] In some embodiments, the mounting portion is a plane. A plane facilitates the mounting of the power unit.

[0031] In some embodiments, at least two of the mounting portion, connector, and heat-conducting body are integrally formed structures.

[0032] In some embodiments, the outer surface of the heat-conducting body has N planes, which serve as mounting portions; or the outer surface of the heat-conducting body is surrounded by M planes, where M is greater than or equal to N, and N of the M planes serve as mounting portions respectively.

[0033] In some embodiments, the heat-conducting body has an internal thread or an external thread, which is provided at the open end as a connector.

[0034] In some embodiments, the thermally conductive body, mounting portion, and / or connector are made of a highly thermally conductive material.

[0035] In some embodiments, a thermally conductive coating may be provided on the outer surface of the thermally conductive body and / or the outer surface of the mounting portion.

[0036] In some embodiments, the outer surface of the heat-conducting body may also be provided with a fin structure to increase the surface area and improve the heat dissipation effect.

[0037] The following is for reference. Figure 1 The figure shows a schematic diagram of a heat dissipation unit provided in Embodiment 1 of this utility model. The heat dissipation unit includes a heat-conducting body 41, three mounting parts 412 (only two are shown in the figure) and two connectors 43. The heat-conducting body 41 and the three mounting parts 412 are integrally formed structures.

[0038] The heat-conducting body 41 is made of metal and is a triangular prism. The mounting part 412 is a plane. The heat-conducting body 41 has two ends 411 (only one is shown in the figure) and a side wall part located between the two ends 411. The side wall part includes three side walls. The outer surface of the heat-conducting body 41 is surrounded by five planes, wherein the outer surface of the two ends 411 is a plane, the outer surface of the three side walls is a plane, and the outer surface of the three side walls is a mounting part 412.

[0039] refer to Figure 2The interior of the heat-conducting body 41 has multiple straight and parallel heat dissipation holes 413 arranged in a honeycomb pattern. Each heat dissipation hole 413 extends from one end 411 of the heat-conducting body 41 to the other end 411 (not shown in the figure), and an opening end 413a is formed at each end 411. The cross-sectional shape of the heat dissipation hole 413 is circular, and the hole diameter is 0.8 mm.

[0040] The two connectors 43 are identical in material, structure, and arrangement. Taking one connector 43 as an example, connector 43 is made of metal and includes a hollow cylindrical connector with open ends. One end of the cylindrical connector is welded to one end 411 of the heat-conducting body 41, which is adapted to the position of the opening 413a formed by the heat dissipation through hole 413 at that end 411 and is mated with the opening 413a. The other end has a connecting part 43a for connecting to an external channel, which connects to an external heat dissipation system. In this embodiment, the connecting part 43a is externally threaded for connecting to an external water pipe with internal threads, which connects to an external water cooling system. Of course, in other embodiments, the material, structure, and arrangement of the two connectors 43 may be different. In other embodiments, the two connectors 43 may also be integrally formed with the heat-conducting body 41.

[0041] Three mounting parts 412 are used to mount power units. Each power unit may include three power sub-units. One power sub-unit is set on each of the three mounting parts 412. Since the three mounting parts 412 are symmetrically arranged on the outer surface of the heat-conducting body 41, the three power sub-units are also symmetrically arranged on the outer surface of the heat-conducting body 41. The symmetrical arrangement is conducive to uniform heat dissipation.

[0042] In this embodiment, a water pipe is connected via connector 43, and then an external water cooling system is connected. The water cooling system can inject water into the heat dissipation hole 413, and the heat dissipation is further accelerated through water circulation.

[0043] The following is for reference. Figure 3 This is a schematic diagram of another heat dissipation unit provided in Embodiment 1 of the present invention. The heat dissipation unit includes a heat-conducting body 51, three mounting portions 512a, and two connecting members 53. Figure 1The heat dissipation unit shown differs in that the three mounting portions 512a, two connectors 53, and the heat-conducting body 51 are integrally formed. The heat-conducting body 51 is cylindrical and has two ends 511 (only one is shown in the figure), and a sidewall portion 512 located between the two ends 511. The outer surface of the sidewall portion 512 has six planes symmetrically arranged, and three of these symmetrically arranged planes are selected as mounting portions 512a. The interior of the heat-conducting body 51 has a straight heat dissipation through hole 513, which extends from one end 511 to the other end 511, and forms an opening end 513a at each end 511. The cross-sectional shape of the heat dissipation through hole 513 is circular. The two connectors 53 and the heat-conducting body 51 are integrally formed. The connecting portion 43a of the two connectors 53 has an internal thread for connecting an external water pipe with an external thread, which connects to an external water cooling system.

[0044] The power device provided in this embodiment includes the aforementioned heat dissipation unit, and further includes a power unit comprising N power sub-units, with one power sub-unit disposed on each mounting portion of the heat dissipation unit. Each power sub-unit includes a power circuit disposed on the mounting portion; or the power sub-unit includes a substrate and a power circuit disposed on the substrate, with the substrate disposed on the mounting portion.

[0045] In some embodiments, the power unit may include a power sub-unit. For example, the power unit is a half-bridge power unit, which includes a power sub-unit, and the power circuit in the power sub-unit is a half-bridge circuit.

[0046] In some embodiments, the power unit may also include two power sub-units. For example, the power unit is an H-bridge power unit, which includes two power sub-units. The power circuits in the two power sub-units constitute an H-bridge circuit, wherein the power circuit in each power sub-unit can be a half-bridge circuit, and the two half-bridge circuits constitute an H-bridge circuit.

[0047] In some embodiments, the power unit may also include three power sub-units. For example, the power sub-unit is a three-phase full-bridge power unit, which includes three power sub-units. The power circuits in the three power sub-units constitute a three-phase full-bridge circuit. The power circuit in each power sub-unit can be a one-phase circuit, such as a half-bridge circuit. The three one-phase circuits constitute a three-phase full-bridge circuit.

[0048] Each power subunit is mounted on a separate mounting section, making full use of the installation space and facilitating heat dissipation.

[0049] The power circuit can be directly mounted on the mounting section, which can be an insulated mounting section. Alternatively, the power circuit can be mounted on the mounting section using a substrate with a thickness of 0.1 mm to 10 mm. The substrate can be mounted on the mounting section by soldering. The substrate can be an insulating substrate, such as a ceramic substrate, preferably an insulating and thermally conductive substrate, which can be selected according to actual needs.

[0050] The power circuit has a current output terminal, a current input terminal, and a control terminal, and may also have a detection terminal. The substrate can be equipped with current output pins, current input pins, control pins, and detection pins. The current output pins are internally connected to the current output terminal of the power circuit and externally connected to the current output circuit. The current input pins are internally connected to the current input terminal of the power circuit and externally connected to the current input circuit. The control pins are internally connected to the control terminal of the power circuit and externally connected to the drive circuit. The detection pins are internally connected to the detection terminal of the power circuit, such as in a temperature monitoring circuit, and externally connected to a detection circuit.

[0051] In some embodiments, the power circuit includes at least a power module, power electronic devices, and / or a power chip, with the power module containing the power electronic devices and / or the power chip. The power circuit is used to implement a preset function and may also include other auxiliary electronic devices and auxiliary circuits, such as resistors and control circuits. Power electronic devices include, but are not limited to, power semiconductor devices, such as MOSFETs, silicon controlled rectifier transistors (SCRs), insulated-gate bipolar transistors (IGBTs), etc. MOSFETs include, but are not limited to, silicon carbide MOSFETs. The power module, power electronic devices, and other auxiliary electronic devices in the power circuit can be mounted on a mounting portion or substrate by soldering, including but not limited to surface mount technology (SMT). The power chip can be mounted on the mounting portion or substrate by die bonding. The traces in the power circuit can be fabricated on the mounting portion or substrate using photolithography, etching, electroplating, printing, etc.

[0052] In some embodiments, the power circuit may further include a temperature monitoring circuit, which is connected to an external heat dissipation system. The temperature monitoring circuit sends a monitoring signal to the external heat dissipation system, which controls the heat dissipation efficiency; for example, a water-cooling system controls the flow rate of water flowing into the heat dissipation holes, and an air-cooling system controls the airflow speed.

[0053] In some embodiments, the power unit includes three power sub-units, and the power circuits in the three power sub-units constitute a three-phase full-bridge circuit.

[0054] In some embodiments, the power device further includes a housing that surrounds the heat dissipation unit and the power unit, serving to protect the power unit and the heat dissipation unit. The housing may be a thermally conductive housing. A circular housing may be used to improve vibration resistance.

[0055] In some embodiments, the power device further includes a filling unit that fills the space between the housing and the power unit and the heat dissipation unit. The filling module enhances shock resistance and water resistance in the gap between the housing and the power unit and the heat dissipation unit. The filling unit may be obtained by filling with a thermally conductive material.

[0056] refer to Figure 4 The power device shown has a heat dissipation unit that... Figure 1 Taking the heat dissipation unit shown as an example, the power unit includes three power sub-units 61 (only two power sub-units 61 are shown in the figure). The power circuits in the three power sub-units 61 constitute a three-phase full-bridge circuit. The power sub-unit 61 includes a substrate 611 and a power circuit (not shown in the figure) disposed on the substrate. The substrate 611 is disposed on the mounting part 412, and each power sub-unit 61 is disposed on one mounting part 412, symmetrically disposed on the outer surface of the heat-conducting body 41. The two ends of the substrate 611 facing the connector 43 have a current output pin 611a, which is internally connected to the current output terminal of the power circuit and externally connected to the current output circuit. The other end has a current input pin 611b, a control pin 611c, and a detection pin 611d. The current input pin 611b is internally connected to the current input terminal of the power circuit and externally connected to the current input circuit. The control pin 611c is internally connected to the control terminal of the power circuit and externally connected to the drive circuit. The detection pin 611d is internally connected to the detection terminal of the power circuit, such as a temperature monitoring circuit, and externally connected to a detection circuit. The manufacturing process of the power device can be as follows: first, the substrate 611 is mounted on the mounting section 412 using a soldering process, and then the power circuit is set on the substrate 611. (Reference) Figure 5 As shown, the power device also includes a housing 71, which is fitted outside the heat dissipation unit and the power unit.

[0057] The heat-conducting body is perfectly matched to the three-phase topology of the three-phase full-bridge circuit. Water flows through the heat dissipation channels within the heat-conducting body, directly carrying away the heat from the three-phase full-bridge circuit. This direct water-cooling design reduces the need for external heat sinks and lowers system complexity. It also reduces parasitic inductance and wiring complexity. The three-phase magnetic fields cancel each other out, reducing common-mode noise and electromagnetic radiation. The symmetrical design of the mounting section ensures that the temperatures of the three power sub-units are essentially uniform, avoiding localized overheating and reliability issues caused by single-phase overheating. The symmetrical layout also reduces unbalanced current. The cylindrical or polyhedral structure of the heat-conducting body also facilitates multi-module combination and modular expansion to form larger power systems.

[0058] Power modules include, but are not limited to, the following two types:

[0059] One approach involves arranging power sub-circuits on a circuit board and encapsulating the circuit board and power sub-circuits together as a module. This module has current input, current output, and control terminals. The power sub-circuit includes at least power electronic devices and / or power chips. The current input, current output, and control terminals are typically located on one side of the circuit board, and the power module is powered on only one side.

[0060] Another type includes a power module bracket and a power sub-circuit. The power module bracket includes an upper bracket and a lower bracket for vertical assembly. The upper bracket is provided with a first electrical connection portion. The lower bracket is provided with a second electrical connection portion and a third electrical connection portion, which are separately arranged. The power sub-circuit is mounted on the upper surface of the lower bracket and includes at least a power electronic device and / or a power chip. The power sub-circuit has a current input terminal, a current output terminal, and a control terminal. The upper end of the second electrical connection portion is electrically connected to the current input terminal, and the lower end is used for electrical connection to an external current input circuit. The upper end of the third electrical connection portion is electrically connected to the current output terminal, and the lower end is used for electrical connection to an external current output circuit. The lower end of the first electrical connection portion is electrically connected to the control terminal, and the upper end is used for electrical connection to an external drive circuit.

[0061] refer to Figure 6 The power module bracket includes an upper bracket 11 and a lower bracket 12 for upper and lower assembly. The upper bracket 11 is provided with a first electrical connection part 111; the lower bracket 12 is provided with a second electrical connection part 121 and a third electrical connection part 122, and the second electrical connection part 121 and the third electrical connection part 122 are provided separately.

[0062] The upper bracket 11 may also be provided with a fourth electrical connection portion 112, which is separate from the first electrical connection portion 111. The lower end of the fourth electrical connection portion 112 is used to electrically connect to the upper end of the second electrical connection portion 121 or the current input terminal of the power circuit, and the upper end is used to electrically connect to an external circuit. The external circuit connected to the upper end of the fourth electrical connection portion 112 includes, but is not limited to, a detection circuit.

[0063] The upper bracket 11 may also be provided with at least one fifth electrical connection part 113, the upper end of which is used for electrical connection with an external circuit, the first electrical connection part 111 and / or the fourth electrical connection part 112. Each fifth electrical connection part 113 is provided separately from each other, from the fifth electrical connection part 113 to the fourth electrical connection part 112, and from the fifth electrical connection part 113 to the first electrical connection part 111.

[0064] The upper ends of the first electrical connection 111, the fourth electrical connection 112, and / or the fifth electrical connection 113 are exposed on the upper surface of the upper bracket 11; the lower ends of the second electrical connection 121 and / or the third electrical connection 122 are exposed on the lower surface of the lower bracket 12. This exposed design facilitates connection to external circuits and also promotes heat dissipation, especially since the second electrical connection 121 and the third electrical connection 122 are often used to carry large currents, and being exposed on the lower surface of the lower bracket 12 allows for faster heat dissipation.

[0065] The lower ends of the first electrical connection 111, the fourth electrical connection 112, and / or the fifth electrical connection 113 are exposed on the lower surface of the upper bracket 11; the upper ends of the second electrical connection 121 and / or the third electrical connection 122 are exposed on the upper surface of the lower bracket 12. These exposed designs facilitate electrical connection with power circuits mounted on the upper surface of the lower bracket.

[0066] In some embodiments, the lower end of the second electrical connection portion 121 is exposed on the lower surface of the lower bracket 12, and the lower end of the second electrical connection portion 121 is planar. The lower end of the third electrical connection portion 122 is exposed on the lower surface of the lower bracket 12, and the lower end of the third electrical connection portion 122 is planar. Since the second electrical connection portion 121 and the third electrical connection portion 122 are often used to carry large currents, the lower ends being exposed on the lower surface of the lower bracket 12, and the lower ends being planar with a slightly larger area, is beneficial for connecting to external circuits and also for heat dissipation. The lower ends of the second electrical connection portion 121 and the lower ends of the third electrical connection portion 122 can be mounted to the heat dissipation unit by being close to the mounting portion of the heat dissipation unit or close to the substrate on the mounting portion. The close contact method also facilitates heat dissipation.

[0067] In some embodiments, the upper end of the second electrical connection portion 121 is exposed on the upper surface of the lower bracket 12, and the upper end of the second electrical connection portion 121 is planar. The upper end of the third electrical connection portion 122 is exposed on the upper surface of the lower bracket 12, and the upper end of the third electrical connection portion 122 is planar. The planar design facilitates connection with the current input and current output terminals of the power sub-circuit.

[0068] In some embodiments, at least one of the first electrical connection portion 111, the second electrical connection portion 121, the third electrical connection portion 122, the fourth electrical connection portion 112, and the fifth electrical connection portion 113 is an integrally formed structure, such as a metal column, a metal block, etc. The integral forming method can simplify the structure and facilitate circuit connection on the upper and lower surfaces of the upper bracket 11 and the lower bracket 12.

[0069] In some embodiments, since the fifth electrical connection portion 113 is only used for making circuit connections on the upper surface of the upper bracket 11 and does not need to extend into the interior or lower surface of the upper bracket 11, the fifth electrical connection portion 113 may also be provided only on the upper surface of the upper bracket 11, for example, by plating a copper layer on the upper surface of the upper bracket 11 made of insulating material.

[0070] As one embodiment, taking the first electrical connection 111 as an example, the first electrical connection 111 includes an upper end and a lower end, and a middle end connecting the two; the upper end is exposed on the upper surface of the upper bracket 11, and the lower end is exposed on the lower surface of the upper bracket 11; the first electrical connection 111 is an integrally formed structure, and the first electrical connection 111 penetrates the upper surface and the lower surface of the upper bracket 11. The first electrical connection 111 can be a metal pillar, metal block, etc., penetrating the upper and lower surfaces of the upper bracket 11. The structures of the second electrical connection 121, the third electrical connection 122, the fourth electrical connection 112, and the fifth electrical connection 113 are the same as the structure of the first electrical connection 111. The upper bracket 11 and the lower bracket 12 are used for vertical assembly, and the shapes of the upper bracket 11 and the lower bracket 12 are not limited.

[0071] The power sub-circuit is mounted on the upper surface of the lower bracket 12. The upper end of the second electrical connection part 121 is electrically connected to the current input terminal of the power sub-circuit, and the lower end is used to be electrically connected to an external current input circuit. The upper end of the third electrical connection part 122 is electrically connected to the current output terminal of the power sub-circuit, and the lower end is used to be electrically connected to an external current output circuit. The lower end of the first electrical connection part 111 is electrically connected to the control terminal of the power sub-circuit, and the upper end is used to be electrically connected to an external drive circuit.

[0072] In some embodiments, the power module further includes a first electrical connector 31, a second electrical connector 32, and / or a third connector 33. The upper end of the first electrical connector 31 is electrically connected to the lower end of the first electrical connection portion 111, and the lower end of the first electrical connector 31 is electrically connected to the control terminal of the power sub-circuit. The upper end of the second electrical connector 32 is electrically connected to the lower end of the fourth electrical connection portion 112, and the lower end of the second electrical connector 32 is electrically connected to the upper end of the second electrical connection portion 121 or the current input terminal. One end of the third connector 33 is electrically connected to the current input terminal, and the other end is electrically connected to the upper end of the second electrical connection portion 32. The first electrical connector 31 and the second electrical connector 32 can be copper sheets or copper pillars. The first electrical connector 31 can be disposed on the lower surface of the upper bracket 11, with its upper end fixedly connected to the lower end of the first electrical connection part 111 and its lower end extending downward to above the control terminal of the power sub-circuit. The second electrical connector 32 can be disposed on the lower surface of the lower bracket 12, with its lower end fixedly connected to the upper end of the second electrical connection part 121 and its upper end extending upward to the lower end of the fourth electrical connection part 112. Alternatively, the third connector 33 can also be disposed on the lower surface of the upper bracket 11, with its upper end fixedly connected to the lower end of the fourth electrical connection part 112 and its lower end extending downward to the upper end of the second electrical connection part 121. The third connector 33 can be a metal wire.

[0073] As one embodiment, the power sub-circuit includes a power chip, which is a MOSFET chip, integrating a MOSFET. The source S of the MOSFET is the current input terminal of the power circuit, the drain D (not shown in the figure) of the MOSFET is the current output terminal of the power circuit, and the gate G of the MOSFET is the control terminal of the power circuit. The drain D of the MOSFET is disposed on the lower surface of the MOSFET, and the source S and gate G of the MOSFET are disposed on the upper surface of the MOSFET. The MOSFET is mounted on the upper end of the third electrical connection portion 122. The drain D of the MOSFET is connected to the upper end of the third electrical connection portion 122 in close contact. The gate G of the MOSFET is electrically connected to the lower end of the first electrical connection portion 111 through the first electrical connection member 31. The source S of the MOSFET is electrically connected to the upper end of the second electrical connection portion 121 through the third electrical connection member 33. The source S of the MOSFET is also electrically connected to the lower end of the fourth electrical connection portion 112 through the second electrical connection member 32.

[0074] In one embodiment, the upper bracket 11 is provided with three separate fifth electrical connection portions 113. The upper ends of two fifth electrical connection portions 113 located in the middle region of the upper bracket 11 can be used to connect the thermistor NTC and the external heat dissipation system. The upper end of the other fifth electrical connection portion 13 can be used to connect the external driving circuit to one end of the gate resistor R, and the other end of the gate resistor R is electrically connected to the upper end of the first electrical connection portion 111. That is to say, in the power module bracket and power module provided in this embodiment, the external driving circuit can be directly electrically connected to the upper end of the first electrical connection portion 111; or the gate resistor R can be connected between the upper end of one fifth electrical connection portion 13 and the upper end of the first electrical connection portion 111, the external driving circuit can be electrically connected to the upper end of the fifth electrical connection portion 13, and the upper end of the fifth electrical connection portion 13 can be electrically connected to the upper end of the first electrical connection portion 111 through the gate resistor R.

[0075] The aforementioned power module, with its control terminal of the power sub-circuit mounted within the power module bracket connected to the external circuit via the upper bracket, and its current input and output terminals connected to the external circuit via the lower bracket respectively, achieves a layered circuit configuration within the power module. The power module is powered on from both sides and connected to the external circuit. Furthermore, the control terminal of the power sub-circuit typically carries a small current, while the current input and output terminals typically carry a large current. The small current flows from the top of the power module, and the large current flows from the bottom, achieving a layered arrangement of small and large currents. When this power module is installed as a whole, such as on a heat dissipation unit, the lower ends of the second and third electrical connections on the lower surface of the lower bracket can be in close contact with the mounting portion of the heat dissipation unit or the substrate on the mounting portion, which is beneficial for heat dissipation of large currents. In addition, the overall circuit layout is more orderly, while reducing the size of the power module. By encapsulating the power sub-circuit into a double-layered power module, the power module, as an independent electronic device, is easy to install and replace, and its manufacturing method is simpler, allowing general engineers to implement it without requiring specialized personnel for fabrication and installation.

[0076] The power device provided in this embodiment of the utility model sets the power unit on the heat dissipation unit, and through the ingenious structural design of the heat dissipation unit, the overall structure is simple, the cost is low, the heat dissipation efficiency is high, and it does not affect the normal operation of the power unit.

[0077] The above description, in conjunction with specific implementation methods, provides a further detailed explanation of the embodiments of this utility model. It should not be construed that the specific implementation of this utility model is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this utility model, and all such modifications and substitutions should be considered within the protection scope of this utility model.

Claims

1. A power device, characterized by, The power unit comprises a heat dissipation unit and a power unit, wherein, The heat dissipation unit comprises a heat conduction body and N mounting parts, N is greater than or equal to 1; the mounting parts are arranged on the outer surface of the heat conduction body; the heat conduction body has one or more heat dissipation channels in the inside, the heat dissipation channels pass through from one end of the heat conduction body to the other end of the heat conduction body, and open ends are formed at the two ends respectively; The power unit is mounted on the mounting part.

2. The power device of claim 1, wherein, The heat dissipation unit further comprises a connecting part, the connecting part is arranged on the open end, and the connecting part is used for connecting an external heat dissipation system.

3. The power device of claim 1, wherein, The power unit comprises N power sub-units, one power sub-unit is arranged on each mounting part; the power sub-unit comprises a power circuit, the power circuit is arranged on the mounting part; or the power sub-unit comprises a substrate and a power circuit arranged on the substrate, and the substrate is arranged on the mounting part.

4. The power device of claim 3, wherein, The power circuit at least comprises a power module, a power electronic device and / or a power chip, and the power module is arranged with the power electronic device and / or the power chip.

5. The power device of claim 3, wherein, The power circuit comprises a temperature monitoring circuit, and the temperature monitoring circuit is connected with the external heat dissipation system.

6. The power device of claim 4, wherein, The power module comprises a power module support and a power sub-circuit, wherein, The power module support comprises an upper support and a lower support for assembly from top to bottom; the upper support is provided with a first electrical connection part; the lower support is provided with a second electrical connection part and a third electrical connection part, and the second electrical connection part and the third electrical connection part are arranged separately; The power sub-circuit is mounted on the upper surface of the lower support, and the power sub-circuit at least comprises a power electronic device and / or a power chip; the power sub-circuit has a current input end, a current output end and a control end; The upper end of the second electrical connection part is electrically connected with the current input end, and the lower end is used for electrically connecting with an external current input circuit; The upper end of the third electrical connection part is electrically connected with the current output end, and the lower end is used for electrically connecting with an external current output circuit; The lower end of the first electrical connection part is electrically connected with the control end, and the upper end is used for electrically connecting with an external driving circuit.

7. The power device of claim 3, wherein, The power unit comprises three power sub-units, and the power circuits in the three power sub-units form a three-phase full-bridge circuit.

8. The power device of claim 1, wherein, Further comprising a shell, the shell is sleeved outside the heat dissipation unit and the power unit.

9. The power device of claim 1, wherein, N mounting parts are symmetrically arranged on the outer surface of the heat conduction body.

10. The power device of claim 1, wherein, The heat conduction body has two end parts and a side wall part between the two end parts, each mounting part is arranged on the outer surface of the side wall part of the heat conduction body, and the heat dissipation channel passes through from one end part of the heat conduction body to the other end part of the heat conduction body, and open ends are formed at the two end parts respectively.

11. The power device of claim 10, wherein, The heat conduction body is a column or a polyhedron.

12. The power device of claim 11, wherein, The heat conduction body is one of a cylinder, a triangular prism, a quadrangular prism, a pentagonal prism and a hexagonal prism.

13. The power device of claim 2, wherein, At least two of the mounting part, the connecting part and the heat conduction body are integrally formed.

14. The power device of claim 13, wherein, The outer surface of the heat-conducting body has M planes; or the outer surface of the heat-conducting body is surrounded by M planes; M is greater than or equal to N, and N planes of the M planes are respectively used as the mounting portions.

15. The power device of claim 13, wherein, The heat-conducting body has an inner thread or an outer thread, and the inner thread or the outer thread is arranged at the opening end and used as the connecting member.

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