Heat dissipation mechanism and probe station

Abstract

The utility model provides a heat dissipation mechanism and a probe station, the heat dissipation mechanism comprises a base, a camera assembly, a cover plate, a fan assembly and a plurality of heat dissipation fins, the base is provided with an accommodating cavity, and the camera assembly is arranged in the accommodating cavity; the cover plate covers the base; the fan assembly is arranged on at least one side of the base, and an air inlet of the fan assembly communicates with the containing cavity. The heat dissipation fins are arranged outside the containing cavity and arranged at the air outlet of the fan assembly, the fan assembly can directly dissipate heat in the containing cavity where the heating source of the camera assembly is located after being started, the heat dissipation fins can further improve the heat dissipation efficiency, and the influence of high temperature on the camera assembly is reduced.

Description

Technical Field

[0001] This application relates to the technical field of wafer inspection, specifically to a heat dissipation mechanism and a probe station. Background Technology

[0002] Probe stations are widely used in wafer testing. For large-scale testing, fully automated probe stations are often used. A fully automated probe station includes multiple controllable servo motor-driven lead screw drive components and a camera component. The camera obtains the target position difference, which is processed by the equipment's computer and then guides the drive components to drive the product to correct positional deviations, thereby achieving precise alignment testing.

[0003] With the widespread application of fully automated probe stations, high-temperature testing has become a demand. High-temperature environments can negatively impact the accuracy of moving and camera components, as most materials change size with temperature. Testing products at different temperatures requires meeting specific requirements, necessitating measures to minimize the impact of high-temperature testing on various components. Therefore, improving the heat dissipation efficiency of the probe station's cooling mechanism and reducing the impact of high temperatures on the camera has become a crucial technical challenge. Utility Model Content

[0004] This application provides a heat dissipation mechanism and a probe station that can improve the heat dissipation efficiency of the heat dissipation mechanism on the probe station and reduce the impact of high temperature on the camera.

[0005] In a first aspect, this application provides a heat dissipation mechanism applied to a probe station, comprising:

[0006] The base has a receiving cavity;

[0007] The camera assembly is disposed within the receiving cavity;

[0008] A cover plate that covers the base;

[0009] A fan assembly is disposed on at least one side of the base, and the air inlet of the fan assembly communicates with the receiving cavity;

[0010] A plurality of heat dissipation fins are disposed outside the receiving cavity and at the air outlet of the fan assembly.

[0011] This application provides a heat dissipation mechanism for a probe station. The heat dissipation mechanism includes a base, a camera assembly, a cover plate, a fan assembly, and several heat dissipation fins. The base has a receiving cavity, and the camera assembly is disposed inside the receiving cavity. The cover plate closes to the base. The fan assembly is disposed on at least one side of the base, and the air inlet of the fan assembly communicates with the receiving cavity. Several heat dissipation fins are disposed outside the receiving cavity and at the air outlet of the fan assembly. When the fan assembly is turned on, it can directly dissipate heat from the receiving cavity where the heat source of the camera assembly is located. The several heat dissipation fins can further improve the heat dissipation efficiency and reduce the impact of high temperature on the camera assembly.

[0012] In one optional embodiment, the cover plate is provided with a plurality of ventilation holes facing the camera assembly and communicating with the receiving cavity.

[0013] In one optional embodiment, the heat dissipation mechanism further includes a heat-conducting plate, which includes a first heat-conducting sub-plate and a second heat-conducting sub-plate. The first heat-conducting sub-plate is disposed on the bottom surface of the base, and the second heat-conducting sub-plate extends out of the base. The plurality of heat dissipation fins are disposed on the second heat-conducting sub-plate.

[0014] In one optional embodiment, the heat dissipation mechanism further includes a heat reflector plate disposed on the side of the heat-conducting plate away from the base.

[0015] In one optional embodiment, the heat dissipation mechanism further includes a heat insulation pad layer located between the heat-conducting plate and the base.

[0016] In one optional embodiment, the heat dissipation mechanism further includes at least one reinforcing bracket, which is connected to the outer side of the base and the second heat-conducting subplate.

[0017] In one optional embodiment, the heat dissipation mechanism further includes a dust cover located within the receiving cavity and mounted on the base, the dust cover covering the lens of the camera assembly.

[0018] In one optional embodiment, the heat dissipation mechanism further includes a controller electrically connected to the fan assembly, the controller being configured to drive the fan assembly to rotate in order to dissipate heat from the camera assembly; and / or,

[0019] The heat dissipation mechanism also includes a controller and a temperature sensor. The controller is electrically connected to the fan assembly, and the temperature sensor is located inside the base and is used to detect the temperature of the area where the camera assembly is located. The temperature sensor is electrically connected to the controller, and the controller is used to turn on the fan assembly or control the speed of the fan assembly according to the temperature of the temperature sensor.

[0020] In one optional embodiment, the base plate is further provided with light-transmitting holes;

[0021] The camera assembly includes a light source, a reflector, a first beam splitter, and a first microscope, wherein the reflecting surface of the reflector is positioned opposite to the light-transmitting aperture.

[0022] The light emitted by the light source sequentially passes through the first beam splitter, the reflector, and the light-transmitting hole to illuminate the wafer;

[0023] The reflector is used to receive reflected light reflected by the wafer;

[0024] The first beam splitter is used to receive the reflected light transmitted by the mirror and split the reflected light reflected by the mirror into a first sub-reflected light and a first sub-transmitted light. The first microscope is used to receive one of the first sub-reflected light and the first sub-transmitted light. The light source is used to receive the other of the first sub-reflected light and the first sub-transmitted light.

[0025] Alternatively, the camera assembly includes a light source, a reflector, a first beam splitter, a second beam splitter, a first microscope, and a second microscope, wherein the reflecting surface of the reflector is positioned opposite to the light-transmitting aperture.

[0026] The light emitted by the light source sequentially passes through the first beam splitter, the second beam splitter, the reflector, and the light-transmitting hole to illuminate the wafer;

[0027] The reflector is used to receive reflected light reflected by the wafer;

[0028] The first beam splitter is used to receive the reflected light transmitted by the mirror and divide the reflected light reflected by the mirror into a first sub-reflected light and a first sub-transmitted light. The first microscope is used to receive the first sub-reflected light. The second beam splitter is used to receive the first sub-transmitted light and divide the first sub-transmitted light into a second sub-reflected light and a second sub-transmitted light. The second microscope is used to receive one of the second sub-reflected light and the second sub-transmitted light. The light source is used to receive the other of the second sub-reflected light and the second sub-transmitted light.

[0029] On the other hand, this application provides a probe station, including a probe station body and a heat dissipation mechanism as described in the first aspect. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below.

[0031] Figure 1 This is a side view schematic diagram of a probe station provided in an embodiment of this application;

[0032] Figure 2 This is a partial top view of a probe station provided in an embodiment of this application. Figure 1 ;

[0033] Figure 3 This is a schematic diagram of a heat dissipation mechanism provided in an embodiment of this application;

[0034] Figure 4 This is a partial top view of a probe station provided in an embodiment of this application. Figure 2 ;

[0035] Figure 5 This is a partial top view of a heat dissipation mechanism with the base removed, as provided in an embodiment of this application. Figure 1 ;

[0036] Figure 6 This is a partial top view of a probe station provided in an embodiment of this application. Figure 3 ;

[0037] Figure 7 This is a partial top view of a probe station provided in an embodiment of this application. Figure 4 ;

[0038] Figure 8 This is a partial top view of a probe station provided in an embodiment of this application. Figure 5 ;

[0039] Figure 9 This is a partial top view of a probe station provided in an embodiment of this application. Figure 6 ;

[0040] Figure 10 This is a three-dimensional partial schematic diagram of a heat dissipation mechanism provided in an embodiment of this application. Figure 1 ;

[0041] Figure 11 This is a three-dimensional partial schematic diagram of a heat dissipation mechanism provided in an embodiment of this application. Figure 2 ;

[0042] Figure 12 This is a three-dimensional partial schematic diagram of a heat dissipation mechanism provided in an embodiment of this application. Figure 3 ;

[0043] Figure 13 This is a partial top view of a heat dissipation mechanism with the base removed, as provided in an embodiment of this application. Figure 2 .

[0044] Explanation of icon numbers:

[0045] Probe stage 1000; heat dissipation mechanism 100; base 10; camera assembly 20; cover plate 30; fan assembly 40; heat dissipation fins 50; receiving cavity 10a; base plate 11; first side plate 12; second side plate 13; third side plate 14; fourth side plate 15; worktable to be tested 200; wafer 300; testing chamber 200a; fan 41; ventilation hole 31; heat conduction plate 60; first heat conduction sub-plate 61; second heat conduction sub-plate 62; heat reflector 63; heat insulation pad 64; reinforcing bracket 65; dust cover 66; light source 21; reflector 22; first beam splitter 23; first microscope 24; light source reflector 27; second beam splitter 25; second microscope 26. Detailed Implementation

[0046] The technical solution of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the embodiments described in this application are only a part of the embodiments, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without creative effort are within the protection scope of this application.

[0047] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment to other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0048] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a particular order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, an assembly or device comprising one or more components is not limited to the one or more components listed, but may optionally also include one or more components not listed but inherent to the exemplified product, or one or more components that it should have based on the described function.

[0049] This application provides a probe station. The probe station provides a stable testing platform for the electrical parameter testing of semiconductor chips and is equipped with multiple adjustable test probes and probe holders to meet different testing needs. The probe station can perform semiconductor testing, optoelectronic testing, integrated circuit testing, and packaging testing. In conjunction with measuring instruments, the probe station can detect parameters such as voltage, current, resistance, and capacitance-voltage characteristic curves. The probe station can inspect different chips and wafers and, through the cooperation of XY motion devices and a microscope, locate the positions to be probed.

[0050] With the widespread application of fully automated probe stations, high-temperature testing has become a demand. High-temperature environments can affect the accuracy of motion components and camera components because most materials change size with temperature. When testing products at different temperatures, requirements must be met, so it is necessary to reduce the impact of high-temperature testing on each component.

[0051] This application provides a heat dissipation mechanism for use on a probe station.

[0052] Please see Figure 1 and Figure 2 This application also provides a probe station 1000. The probe station 1000 includes the heat dissipation mechanism 100 described in any embodiment of this application.

[0053] The heat dissipation mechanism 100 is illustrated in the following figure with specific examples.

[0054] Please see Figure 3 The heat dissipation mechanism 100 includes a base 10, a camera assembly 20, a cover plate 30, a fan assembly 40, and several heat dissipation fins 50.

[0055] Please see Figure 3 The base 10 has a receiving cavity 10a. Optionally, the base 10 includes a base plate 11 and a plurality of side plates surrounding the base plate 11. The plurality of side plates include a first side plate 12, a second side plate 13, a third side plate 14, and a fourth side plate 15 connected sequentially. The first side plate 12 and the third side plate 14 are disposed opposite to each other. The second side plate 13 and the fourth side plate 15 are disposed opposite to each other. Optionally, the first side plate 12 and the third side plate 14 are long side plates, and the second side plate 13 and the fourth side plate 15 are short side plates. The length of the long side plate is greater than the length of the short side plate.

[0056] Optionally, the base 10 can be installed below the cover plate 30 of the probe station 1000 and close to the cover plate 30. When the base 10 is installed on the probe station 1000, the base 10 is installed laterally on the probe station 1000. For example, the first side plate 12 and the third side plate 14 are arranged along the width direction of the probe station 1000, and the second side plate 13 and the fourth side plate 15 are arranged along the length direction of the probe station 1000.

[0057] Please see Figure 3 and Figure 4 Below the base 10 is the test stage 200, on which the subject to be tested, such as a wafer 300, can be placed. In this embodiment, the subject to be tested is a wafer 300.

[0058] Optional, please refer to Figure 3 and Figure 4The structure below the base 10 can enclose and form a detection chamber 200a. The detection chamber 200a is equipped with a worktable 200 to be tested. The control console can control the temperature inside the detection chamber 200a, such as performing high-temperature testing.

[0059] The camera assembly 20 is disposed within the receiving cavity 10a. The camera assembly 20 is fixedly mounted on the base 10. Optionally, the bottom plate 11 of the base 10 is provided with a light-transmitting hole and a lens or light-transmitting cover plate disposed within the light-transmitting hole, so that the camera assembly 20 can acquire an image of the subject to be detected through the light-transmitting hole.

[0060] Please see Figure 3 and Figure 4 The cover plate 30 covers the base 10. Optionally, the cover plate 30 covers the first side plate 12, the second side plate 13, the third side plate 14, and the fourth side plate 15.

[0061] The fan assembly 40 is disposed on at least one side of the base 10. In this embodiment, the fan assembly 40 is disposed on the first side plate 12. In other embodiments, the fan assembly 40 may also be disposed on other side plates.

[0062] Optional, please refer to Figure 3 The fan assembly 40 includes a plurality of fans 41.

[0063] Specifically, the first side plate 12 has multiple fan mounting holes, and each fan 41 is installed in one fan mounting hole.

[0064] This application does not specify the size of the fan 41.

[0065] If the size of fan 41 is too large, it will occupy too much space, which is not conducive to the miniaturization of heat dissipation mechanism 100. If the size of fan 41 is too small, the air volume will be too small, the area of ​​heat dissipation airflow driven by fan assembly 40 will be small, and the heat dissipation efficiency will be too low.

[0066] For example, the dimensions of each fan 41 include, but are not limited to, 30×(30-60)mm×60mm. Further, the dimensions of fan 41 are 30×40×60mm.

[0067] This application does not specify the number of fans 41.

[0068] If there are too many fans 41, the air volume will be greater, but the vibration will be greater.

[0069] For example, the number of fans 41 is 3-8. Alternatively, the number of fans 41 is 6.

[0070] This application does not specify the rotational speed of fan 41.

[0071] For example, the fan 41 rotates at a speed of 1000-6000 revolutions per minute. As a further example, the fan 41 rotates at a speed of 2000 revolutions per minute. Optionally, the speed of the fan 41 is adjustable.

[0072] Furthermore, the heat dissipation mechanism 100 also includes a controller (not shown), which is electrically connected to the fan assembly 40 and is used at least to control the fan assembly 40 to turn on or off.

[0073] The air inlet of the fan assembly 40 is connected to the receiving cavity 10a.

[0074] The plurality of heat dissipation fins 50 are disposed outside the receiving cavity 10a and at the air outlet of the fan assembly 40.

[0075] This embodiment does not impose specific limitations on the size, shape, or number of heat dissipation fins 50.

[0076] Furthermore, when the fan assembly 40 is operating, it can carry the heat out of the receiving cavity 10a, thereby reducing the heat in the receiving cavity 10a and minimizing its impact on the camera assembly 20. Furthermore, heat dissipation fins 50 are located at the air outlet of the fan assembly 40 to facilitate faster heat exchange, improve heat dissipation efficiency, and reduce the impact of high temperatures on the camera assembly 20.

[0077] In this configuration, the extension direction of each heat sink fin 50 is consistent with the airflow direction of the fan assembly 40. For example, the first side plate 12 and the second side plate 13 are arranged opposite each other along a first direction. The fan 41 of the fan assembly 40 has its rotation axis arranged approximately along or along the first direction. Each heat sink fin 50 is arranged approximately along or along the first direction so that the fan 41 can generate airflow during rotation to remove heat from the heat sink fin 50.

[0078] Alternatively, the heat sink fins 50 may be made of materials including but not limited to aluminum alloy, copper, and plastics (such as PVC or ABS).

[0079] This application provides a heat dissipation mechanism 100 for a probe station 1000. The heat dissipation mechanism 100 includes a base 10, a camera assembly 20, a cover plate 30, a fan assembly 40, and a plurality of heat dissipation fins 50. The base 10 has a receiving cavity 10a, in which the camera assembly 20 is disposed. The cover plate 30 covers the base 10. The fan assembly 40 is disposed on at least one side of the base 10, and the air inlet of the fan assembly 40 is connected to the receiving cavity 10a. The plurality of heat dissipation fins 50 are disposed outside the receiving cavity 10a and at the air outlet of the fan assembly 40. When the fan assembly 40 is turned on, it can directly dissipate heat from the receiving cavity 10a where the heat source of the camera assembly 20 is located. The plurality of heat dissipation fins 50 can further improve the heat dissipation efficiency and reduce the impact of high temperature on the camera assembly 20.

[0080] Optional, please refer to Figure 3 The cover plate 30 is provided with a plurality of ventilation holes 31. The ventilation holes 31 are directly opposite the camera assembly 20. The ventilation holes 31 are connected to the receiving cavity 10a. Further optionally, the ventilation holes 31 are connected to the receiving cavity 10a and the external space, so that when the fan assembly 40 is working, it drives a cooling airflow from the plurality of ventilation holes 31 - receiving cavity 10a - air inlet of fan assembly 40 - air outlet of fan assembly 40. As the heat in the receiving cavity 10a is continuously carried away by the cooling airflow, the temperature in the receiving cavity 10a where the camera assembly 20 is located is reduced, thereby avoiding the influence of height on the structural components of adjacent components, which could lead to problems such as inaccurate position detection on the wafer 300.

[0081] In this embodiment, a number of ventilation holes 31 are provided facing the camera assembly 20, while the part of the cover plate 30 facing away from the camera assembly 20 is not provided with ventilation holes 31. This is to increase the airflow in the area where the camera assembly 20 is located, and also to ensure that the cover plate 30 has relatively strong structural strength.

[0082] This embodiment does not specifically limit the size, shape, or number of ventilation holes 31. For example, the shape and size of the area where a plurality of ventilation holes 31 are provided correspond to the shape and size of the orthographic projection of the camera assembly 20 on the base plate 11.

[0083] Of course, in other embodiments, more ventilation holes 31 can be provided on the cover plate 30. The area of ​​the ventilation holes 31 is larger than the area of ​​the orthographic projection of the camera assembly 20 on the base plate 11.

[0084] Optional, please refer to Figure 5The heat dissipation mechanism 100 further includes a heat-conducting plate 60. The heat-conducting plate 60 includes a first heat-conducting sub-plate 61 and a second heat-conducting sub-plate 62. The first heat-conducting sub-plate 61 and the second heat-conducting sub-plate 62 are two parts of the heat-conducting plate 60. The heat-conducting plate 60 is disposed on the bottom surface of the base 10. Specifically, the first heat-conducting sub-plate 61 is disposed on the bottom surface of the base 10. Further, the first heat-conducting sub-plate 61 is located between the aforementioned detection chamber 200a and the bottom plate 11 of the base 10. The second heat-conducting sub-plate 62 extends out of the base 10. The plurality of heat dissipation fins 50 are disposed on the second heat-conducting sub-plate 62.

[0085] In this embodiment, by setting the first heat-conducting sub-plate 61 of the heat-conducting plate 60 between the aforementioned detection chamber 200a and the bottom plate 11 of the base 10, when the detection chamber 200a is a high-temperature chamber, the first heat-conducting sub-plate 61 of the heat-conducting plate 60 can, on the one hand, prevent heat from being conducted to the bottom of the base 10 and thus affecting the camera assembly 20 inside the base 10. On the other hand, the first heat-conducting sub-plate 61 of the heat-conducting plate 60 conducts the heat in the detection chamber 200a to the heat dissipation fins 50 through the second heat-conducting sub-plate 62. Furthermore, the heat on the heat dissipation fins 50 is carried away by the airflow formed by the fan assembly 40, thereby reducing the temperature on the heat-conducting plate 60 and preventing the temperature inside the detection chamber 200a from affecting the camera assembly 20 inside the base 10.

[0086] Several heat dissipation fins 50 are disposed on the heat-conducting plate 60. During heat conduction, heat is more easily conducted to the heat dissipation fins 50 than to the base 10. When the detection chamber 200a is a high-temperature chamber, heat is more easily conducted through the heat-conducting plate 60 to the heat dissipation fins 50 outside the base 10. The heat on the heat dissipation fins 50 is carried away by the airflow generated by the fan assembly 40, thereby preventing heat in the detection chamber 200a from being conducted to the base 10. As mentioned above, the heat-conducting plate 60 is disposed between the detection chamber 200a and the base 10, forming a heat insulation barrier.

[0087] On the other hand, a number of ventilation holes 31 are provided on the cover plate 30 of the base 10, and a number of fan assemblies 40 are provided on one side of the base 10 to remove the heat of the camera assembly 20 inside the base 10 by airflow, so as to avoid the temperature inside the containment cavity 10a from affecting the camera assembly 20.

[0088] This application does not specify the material of the heat-conducting plate 60. Optionally, the material of the heat-conducting plate 60 may include, but is not limited to, aluminum alloy or copper.

[0089] In the first alternative implementation, please refer to Figure 6The heat-conducting plate 60 is a heat reflector. The heat-conducting plate 60 can also reflect thermal radiation from the detection chamber 200a to prevent heat from the detection chamber 200a from being conducted to the camera assembly 20 within the base 10. For example, the material of the heat-conducting plate 60 includes, but is not limited to, aluminum, stainless steel, and titanium.

[0090] In the second alternative implementation, please refer to Figure 7 The heat dissipation mechanism 100 further includes a heat reflector 63. The heat reflector 63 is disposed on the side of the heat-conducting plate 60 facing away from the base 10. That is, the heat reflector 63 can reflect thermal radiation from the detection chamber 200a to prevent heat from the detection chamber 200a from being conducted to the camera assembly 20 inside the base 10. The heat reflector 63 acts as a heat-insulating barrier between the detection chamber 200a and the base 10. For example, the material of the heat reflector 63 includes, but is not limited to, aluminum, stainless steel, and titanium.

[0091] In the third alternative implementation, please refer to Figure 8 The heat dissipation mechanism 100 further includes a heat reflector 63. The heat reflector 63 is disposed on the side of the heat-conducting plate 60 facing the base 10. That is, the heat reflector 63 can reflect thermal radiation from the detection chamber 200a to prevent heat from the detection chamber 200a from being conducted to the camera assembly 20 inside the base 10. The heat reflector 63 acts as a heat insulation barrier between the heat-conducting plate 60 and the base 10 to prevent heat on the heat-conducting plate 60 from affecting the camera assembly 20 inside the base 10. For example, the material of the heat reflector 63 includes, but is not limited to, aluminum, stainless steel, and titanium.

[0092] In the above embodiments, the heat reflector 63 is an independent plate. In other embodiments, the heat reflector layer can also be formed by coating the heat-conducting plate 60 or the bottom of the base 10 to reduce the installation steps of the heat reflector 63.

[0093] Further optional information can be found in [link to relevant documentation]. Figure 9 The heat dissipation mechanism 100 further includes a heat insulation pad 64. The heat insulation pad 64 is located between the heat-conducting plate 60 and the base 10. The heat insulation pad 64 can further prevent heat from the heat-conducting plate 60 from being conducted to the camera assembly 20 inside the base 10.

[0094] The material of the thermal insulation layer 64 includes, but is not limited to, any one or more of the following: foam board, polystyrene board, extruded polystyrene board, graphite polystyrene board, rock wool board, glass wool, polyurethane insulation material, silicate insulation material, HD-STP insulation material, ceramic insulation material, rigid polyurethane foam, granulated polystyrene, and elastic foam.

[0095] Optional, please refer to Figure 3 and Figure 5The heat dissipation mechanism 100 further includes at least one reinforcing bracket 65. The at least one reinforcing bracket 65 is connected to the outer side of the base 10 and the second heat-conducting sub-plate 62 to increase the connection strength between the heat-conducting plate 60 and the outer side of the base 10, so that the second heat-conducting sub-plate 62 can support the weight of several heat dissipation fins 50 and increase structural stability.

[0096] Optional, please refer to Figure 10 and Figure 11 The heat dissipation mechanism 100 also includes a dust cover 66.

[0097] The dust cover 66 is located within the receiving cavity 10a and is mounted on the base 10. The dust cover 66 covers the lens of the camera assembly 20 to prevent dust from accumulating on the lens when the airflow driven by the fan assembly 40 passes through the lens of the camera assembly 20, thereby preventing the image acquired by the camera assembly 20 from becoming blurry.

[0098] Furthermore, a portion of the dust cover 66 may be connected to the base plate and / or side plate of the base 10. Optionally, another portion of the dust cover 66 may also be connected to the outer peripheral surface of the lens housing of the camera assembly 20, wherein the dust cover 66 forms a sealed chamber surrounding the lens, lens elements, etc., of the camera assembly 20.

[0099] For example, there are 6 fans 41, which are divided into 2 groups of 3 fans 41 each. The two groups of fans 41 are located on both sides of the dust cover 66.

[0100] The dust cover 66 may be spaced apart from or abut against the cover plate 30.

[0101] The area where the ventilation holes 31 on the cover plate 30 are located is divided into two areas, which are located on both sides of the dust cover 66, that is, the camera assembly 20 structure located outside the dust cover 66.

[0102] The heat dissipation fins 50 are divided into two groups, and each group of heat dissipation fins 50 corresponds to a group of fans 41.

[0103] Alternatively, the number of reinforcing brackets 65 is three, with the three reinforcing brackets 65 located on both sides and between the two sets of heat dissipation fins 50.

[0104] As mentioned above, the heat dissipation mechanism 100 also includes a controller.

[0105] The controller is electrically connected to the fan assembly 40. The controller is used to drive the fan assembly 40 to rotate, so as to form a cooling airflow from the ventilation hole 31 to the receiving cavity 10a to the air inlet of the fan assembly 40 and the air outlet of the fan assembly 40, so as to dissipate heat from the camera assembly 20.

[0106] Optionally, the heat dissipation mechanism 100 further includes a controller and a temperature sensor (not shown) as described above. The controller is electrically connected to the fan assembly 40. The temperature sensor is disposed within the base 10 and is used to detect the temperature of the area where the camera assembly 20 is located. The temperature sensor is electrically connected to the controller. The controller is used to turn on the fan assembly 40 or control the speed of the fan assembly 40 based on the temperature detected by the temperature sensor.

[0107] For example, when the temperature sensor detects that the temperature inside the base 10 is higher than a first preset temperature, the controller controls the fan assembly 40 to turn on. When the temperature sensor detects that the temperature inside the base 10 is higher than a second preset temperature, the controller controls the fan assembly 40 to increase its airflow speed to a preset speed. Specifically, the fan assembly 40 has multiple airflow speeds. When the temperature sensor detects that the temperature inside the base 10 is high, the controller can control the fan assembly 40 to increase its airflow speed to a high speed, thereby increasing the heat dissipation efficiency for the camera assembly 20.

[0108] Optional, please refer to Figure 12 and Figure 13 The base plate 11 of the base 10 is also provided with a light-transmitting hole 10b.

[0109] In one alternative implementation, please refer to Figure 12 and Figure 13 The camera assembly 20 includes a light source 21, a light source reflector 27, a reflector 22, a first beam splitter 23, and a first microscope 24. The reflecting surface of the reflector 22 is positioned opposite to the light-transmitting aperture 10b.

[0110] The light emitted by the light source 21 passes sequentially through the light source reflector 27, the first beam splitter 23, the reflector 22, and the light-transmitting aperture 10b to illuminate the wafer 300. The light reflected from the wafer 300 passes through the light-transmitting aperture 10b and is directed to the reflector 22. The reflector 22 is used to receive the reflected light from the wafer 300.

[0111] The first beam splitter 23 is used to receive the reflected light transmitted by the reflector 22 and split the reflected light reflected by the reflector 22 into a first sub-reflected light and a first sub-transmitted light. The first microscope 24 is used to receive one of the first sub-reflected light and the first sub-transmitted light. The light source 21 is used to receive the other of the first sub-reflected light and the first sub-transmitted light.

[0112] In this embodiment, the dust cover 66 can be installed on the light-emitting end of the light source 21, the first beam splitter 23, the reflector 22, the light-transmitting hole 10b, and the lens portion of the first microscope 24.

[0113] In this embodiment, the light source 21 directs light onto the wafer 300 to be inspected via a first beam splitter 23 and a reflector 22, providing illumination for the wafer 300. The first microscope 24 receives the image of the wafer 300 via the reflector 22 and the beam splitter. Furthermore, the first beam splitter 23 also directs a portion of the light towards the light source 21 via the light source reflector 27, forming a closed light loop and improving the utilization rate of the light source 21. In addition, the reflector 22 allows the light emitted from the light source 21 to rotate by 90°, thus allowing the light source 21 to be positioned along the base plate 11 and forming light emitted through the light-transmitting hole 10b.

[0114] Please see Figure 12 and Figure 13 The camera assembly 20 includes a light source 21, a light source reflector 27, a reflector 22, a first beam splitter 23, a second beam splitter 25, a first microscope 24, and a second microscope 26. The reflecting surface of the reflector 22 is positioned opposite to the light-transmitting aperture 10b.

[0115] The light emitted by the light source 21 is sequentially irradiated onto the wafer 300 by the first beam splitter 23, the second beam splitter 25, the reflector 22, and the light-transmitting hole 10b.

[0116] The reflector 22 is used to receive reflected light reflected by the wafer 300.

[0117] The first beam splitter 23 receives the reflected light transmitted by the reflector 22 and splits it into a first sub-reflected light and a first sub-transmitted light. The first microscope 24 receives the first sub-reflected light. The second beam splitter 25 receives the first sub-transmitted light and splits it into a second sub-reflected light and a second sub-transmitted light. The second microscope 26 receives one of the second sub-reflected light and the second sub-transmitted light. The light source 21 receives the other of the second sub-reflected light and the second sub-transmitted light.

[0118] The first microscope 24 and the second microscope 26 are microscopes with different magnifications, so that the camera assembly 20 can provide images with different magnifications.

[0119] In this embodiment, the dust cover 66 can be installed on the light-emitting end of the light source 21, the first beam splitter 23, the second beam splitter 25, the reflector 22, the light-transmitting hole 10b, the lens portion of the first microscope 24, and the lens portion of the second microscope 26.

[0120] In this embodiment, the light source 21 directs light onto the wafer 300 to be inspected via two beam splitters and a reflector 22, providing illumination for the wafer 300. The first microscope 24 receives the image of the wafer 300 via the reflector 22 and the first beam splitter 23. Furthermore, the first beam splitter 23 also directs a portion of the light towards the second microscope 26 and the light source 21, forming a closed-loop light path and improving the utilization rate of the light source 21. Additionally, the reflector 22 allows the light emitted from the light source 21 to rotate 90°, enabling the light source 21 to be positioned along the base plate 11 and forming light emitted through the aperture 10b. Furthermore, magnified images at different magnifications can be acquired.

[0121] This application provides a heat dissipation mechanism 100 for a probe station 1000. A fan mounting hole is provided on the side plate of the base 10, and a fan assembly 40 is installed in the fan mounting hole. The fan assembly 40 is used to draw out the airflow in the receiving cavity 10a and blow it outward. A heat-conducting plate 60 is installed on the bottom surface of the base 10 of the camera assembly 20. The heat-conducting plate 60 extends out of the bottom surface of the base 10 and forms a mounting position for heat dissipation fins 50. The heat dissipation fins 50 are installed on the part of the heat-conducting plate 60 that extends out of the bottom surface of the base 10, and the heat dissipation fins 50 are located at the air outlet of the fan assembly 40 to receive the airflow brought out by the fan assembly 40. The cover plate 30 on the top of the camera assembly 20 is provided with a plurality of ventilation holes 31. The positions of the plurality of ventilation holes 31 correspond to the heat source of the camera assembly 20, so that the cooling airflow can pass through the camera assembly 20 during the downward process from above, thereby directly cooling the camera assembly 20. The camera assembly 20 also includes a dust cover 66, mounted on the base 10, to cover the lens of the camera assembly 20 and prevent airflow from passing over the lens and accumulating dust. A reinforcing bracket 65 is provided on the side of the heat-conducting plate 60 and the base 10, connecting the heat-conducting plate 60 and the base 10 to increase structural stability. A gasket is also provided between the heat-conducting plate 60 and the base 10 to reduce heat transfer from the device to the base 10. The heat dissipation mechanism 100 provided in this embodiment can directly dissipate heat from the camera assembly 20. Compared to transferring heat from the camera assembly 20 to the heat dissipation fins 50 via the heat-conducting plate 60 structure, which drives airflow over the heat dissipation fins 50 for cooling, this reduces the heat transfer path and improves heat dissipation efficiency.

[0122] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, and such improvements and refinements are also considered to be within the protection scope of this application.

Claims

1. A heat dissipation mechanism, characterized in that, Applications in probe stations, including: The base has a receiving cavity; The camera assembly is disposed within the receiving cavity; A cover plate that covers the base; A fan assembly, the fan assembly being disposed on at least one side of the base, the air inlet of the fan assembly communicating with the receiving cavity; and A plurality of heat dissipation fins are disposed outside the receiving cavity and at the air outlet of the fan assembly.

2. The heat dissipation mechanism as described in claim 1, characterized in that, The cover plate is provided with a number of ventilation holes, which are directly opposite the camera assembly and are connected to the receiving cavity.

3. The heat dissipation mechanism as described in claim 1, characterized in that, The heat dissipation mechanism further includes a heat-conducting plate, which includes a first heat-conducting sub-plate and a second heat-conducting sub-plate. The first heat-conducting sub-plate is disposed on the bottom surface of the base, and the second heat-conducting sub-plate extends out of the base. The plurality of heat dissipation fins are disposed on the second heat-conducting sub-plate.

4. The heat dissipation mechanism as described in claim 3, characterized in that, The heat dissipation mechanism also includes a heat reflector plate, which is disposed on the side of the heat-conducting plate away from the base.

5. The heat dissipation mechanism as described in claim 3, characterized in that, The heat dissipation mechanism also includes a heat insulation pad layer, which is located between the heat-conducting plate and the base.

6. The heat dissipation mechanism as described in claim 3, characterized in that, The heat dissipation mechanism further includes at least one reinforcing bracket, which is connected to the outer side of the base and the second heat-conducting subplate.

7. The heat dissipation mechanism as described in claim 1, characterized in that, The heat dissipation mechanism also includes a dust cover, which is located inside the receiving cavity and mounted on the base, and covers the lens of the camera assembly.

8. The heat dissipation mechanism as described in any one of claims 1 to 7, characterized in that, The heat dissipation mechanism further includes a controller electrically connected to the fan assembly, the controller being used to drive the fan assembly to rotate in order to dissipate heat from the camera assembly; and / or, The heat dissipation mechanism also includes a controller and a temperature sensor. The controller is electrically connected to the fan assembly, and the temperature sensor is located inside the base and is used to detect the temperature of the area where the camera assembly is located. The temperature sensor is electrically connected to the controller, and the controller is used to turn on the fan assembly or control the speed of the fan assembly according to the temperature of the temperature sensor.

9. The heat dissipation mechanism as described in any one of claims 1 to 7, characterized in that, The base plate is also provided with light-transmitting holes; The camera assembly includes a light source, a reflector, a first beam splitter, and a first microscope, wherein the reflecting surface of the reflector is positioned opposite to the light-transmitting aperture. The light emitted by the light source sequentially passes through the first beam splitter, the reflector, and the light-transmitting hole to illuminate the wafer; The reflector is used to receive reflected light reflected by the wafer; The first beam splitter is used to receive the reflected light transmitted by the mirror and split the reflected light reflected by the mirror into a first sub-reflected light and a first sub-transmitted light. The first microscope is used to receive one of the first sub-reflected light and the first sub-transmitted light. The light source is used to receive the other of the first sub-reflected light and the first sub-transmitted light. Alternatively, the camera assembly includes a light source, a reflector, a first beam splitter, a second beam splitter, a first microscope, and a second microscope, wherein the reflecting surface of the reflector is positioned opposite to the light-transmitting aperture. The light emitted by the light source sequentially passes through the first beam splitter, the second beam splitter, the reflector, and the light-transmitting hole to illuminate the wafer; The reflector is used to receive reflected light reflected by the wafer; The first beam splitter is used to receive the reflected light transmitted by the mirror and divide the reflected light reflected by the mirror into a first sub-reflected light and a first sub-transmitted light. The first microscope is used to receive the first sub-reflected light. The second beam splitter is used to receive the first sub-transmitted light and divide the first sub-transmitted light into a second sub-reflected light and a second sub-transmitted light. The second microscope is used to receive one of the second sub-reflected light and the second sub-transmitted light. The light source is used to receive the other of the second sub-reflected light and the second sub-transmitted light.

10. A probe station, characterized in that, It includes the probe station body and the heat dissipation mechanism as described in any one of claims 1 to 9.

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