Pin fin liquid cooling heat dissipation device and system

Abstract

The utility model relates to a pin-fin liquid cooling heat dissipation device and system. The pin-fin liquid cooling heat dissipation device comprises a shell, a plurality of fin liquid inlet pipes, a liquid outlet pipe, a liquid cooling source, a recovery part and a power part. In actual use of the pin-fin liquid cooling heat dissipation device and system, firstly, one side of the shell is attached to the electronic equipment, the density distribution of the fins in different areas of the inner wall of the shell is different, specifically, the fins can be arranged according to the heating conditions of different areas of the electronic equipment, and a coolant of a liquid cooling source is introduced into the shell through the first through hole; the cooling agent is in contact with the shell and the fins, due to the existence of the fins, the contact area of the shell and the cooling agent is increased, the cooling speed is increased, meanwhile, different heating areas of the electronic equipment are cooled in a targeted mode, and the arrangement density of the fins further has the effects of adjusting the flowing path of the cooling agent and reducing flowing resistance. Therefore, the heat dissipation requirement of the high-power-consumption chip is met, the liquid cooling fluid can be in complete contact with the multiple fins, and efficient heat dissipation can be achieved.

Description

Technical Field

[0001] This application relates to the field of refrigeration technology, and in particular to a pin-fin liquid cooling heat dissipation device and system. Background Technology

[0002] Heat dissipation for high-power chips is a significant technical challenge. Traditional solutions involve active cooling using copper / aluminum heat sinks and fans. However, this method cannot meet the cooling requirements of high-power chips and also suffers from problems such as high noise levels and large size.

[0003] Liquid heatsinks are components used for heat dissipation in electronic devices. Compared to traditional cooling fans, liquid heatsinks use water or other non-volatile liquids to transfer heat, resulting in higher heat dissipation efficiency and lower noise levels. Liquid heatsinks consist of high thermal conductivity metal materials and channels, carrying away heat through a liquid cooling circulation system to cool the device. Liquid heatsinks are mainly used in high-load electronic devices such as large computers, servers, and high-performance gaming PCs. Liquid heatsinks are categorized by fin shape into straight fins, staggered fins, curved fins, vortex fins, and fin-channel combinations. Different fin shapes and structures offer different heat dissipation efficiencies and noise characteristics, allowing users to select the appropriate fin type based on their specific needs.

[0004] However, the main problem with existing liquid cooling fins is that the fin distribution does not match the heat source distribution, which cannot meet the heat dissipation requirements of high-power chips, and the liquid cooling fluid cannot fully contact multiple fins, thus failing to achieve more efficient heat dissipation. Utility Model Content

[0005] Based on this, it is necessary to address the main problem of existing liquid cooling fins, namely the mismatch between the pin distribution and the heat source distribution, which fails to meet the heat dissipation requirements of high-power chips and the inability of the liquid cooling fluid to fully contact multiple fins, thus failing to achieve more efficient heat dissipation. Therefore, a pin-fin liquid cooling heat dissipation device and system should be provided.

[0006] A pin-fin liquid cooling heat dissipation device, the pin-fin liquid cooling heat dissipation device comprising:

[0007] shell;

[0008] Multiple fins are disposed on the inner wall of the housing, and the density distribution of the fins is different in different areas of the inner wall of the housing. One side of the housing is attached to the electronic device.

[0009] The outer casing has a first through hole and a second through hole that communicate with the interior of the outer casing. The first through hole and the second through hole are used to allow coolant to enter and exit, respectively.

[0010] In practical use, the aforementioned finned liquid cooling device first attaches one side of the outer shell to the electronic device. The density distribution of the fins varies in different areas of the inner wall of the outer shell, which can be specifically arranged according to the heat generation of different areas of the electronic device. Then, the coolant from the liquid cooling source is introduced into the interior of the outer shell through the first through hole, where the coolant contacts the outer shell and the fins. The coolant exiting through the second through hole is recovered to the recovery unit through the liquid outlet pipe. The power unit is connected to the liquid inlet pipe, the liquid outlet pipe, or any part of the outer shell to provide power for the flow of the coolant. Due to the presence of the fins, the contact area between the outer shell and the coolant is increased, thereby accelerating the cooling speed. At the same time, by arranging fins of different densities in different areas of the inner wall of the outer shell according to the heat generation of different areas of the electronic device, different heat generation areas of the electronic device are cooled in a targeted manner. The fin arrangement density also has the effect of adjusting the flow path of the coolant and reducing flow resistance, thereby meeting the heat dissipation requirements of high-power chips and ensuring that the liquid cooling fluid can fully contact multiple fins, thus achieving efficient heat dissipation.

[0011] In one embodiment, the housing includes a receiving portion and a cooling portion;

[0012] The receiving part is provided with a cooling groove, the cooling part covers the cooling groove and is connected to the receiving part, and the bottom wall of the cooling groove is provided with a first through hole and a second through hole;

[0013] Multiple fins are disposed on the side wall of the cooling section near the receiving section and partially located within the cooling groove. The side of the cooling section opposite to the receiving section is attached to the electronic device.

[0014] In one embodiment, the pin-fin liquid cooling heat dissipation device further includes a first baffle and a second baffle;

[0015] The first baffle covers the first through hole, and the first baffle has a first strip-shaped hole, which partially covers the first through hole;

[0016] The second baffle covers the second through hole, and the second baffle has a second strip hole, which partially covers the second through hole.

[0017] In one embodiment, the bottom wall of the cooling tank is provided with a first slot and a second slot;

[0018] The first card slot is connected to the first through hole, and the first baffle is located in the first card slot and is adapted to the first card slot;

[0019] The second slot communicates with the second through hole, and the second baffle is located inside the second slot and is adapted to the second slot.

[0020] In one embodiment, a first liquid passage groove is formed on the bottom wall of the first card slot, the first liquid passage groove is connected to the first through hole, the first baffle covers the first liquid passage groove, and the first strip hole is connected to the first liquid passage groove.

[0021] The bottom wall of the second slot is provided with a second liquid passage groove, which is connected to the second through hole. The second baffle covers the second liquid passage groove, and the second strip hole is connected to the second liquid passage groove.

[0022] In one embodiment, the first through hole and the second through hole are arranged along a first direction;

[0023] Both the first and second strip holes extend along a second direction, and the first direction is perpendicular to the second direction.

[0024] In one embodiment, along the first direction, the width of the first baffle along the second direction gradually decreases towards the direction close to the second baffle, and the shape of the cross-section of the first liquid passage is similar to that of the first baffle;

[0025] Along the first direction, the width of the second baffle gradually decreases towards the direction close to the first baffle, and the cross-sectional shape of the second liquid passage is similar to that of the second baffle.

[0026] In one embodiment, the pin-fin liquid cooling heat dissipation device further includes a sealing ring located between the receiving portion and the cooling portion.

[0027] In one embodiment, the pin-fin liquid cooling heat dissipation device further includes a first fastener, and the housing has a first fastening hole, the first fastener passing through the first fastening hole for fixing the housing to the electronic device.

[0028] An embodiment of this application also provides a pin-fin liquid cooling heat dissipation system, which includes: an inlet pipe, an outlet pipe, a liquid cooling source, a recovery unit, a power unit, and the aforementioned pin-fin liquid cooling heat dissipation device;

[0029] One end of the liquid inlet pipe is connected to the liquid cooling source, and the other end is connected to the first through hole;

[0030] One end of the liquid outlet pipe is connected to the recovery section, and the other end is connected to the second through hole;

[0031] The power unit is connected to any one of the liquid inlet pipe, the liquid outlet pipe, or the outer casing, and is used to provide power for the flow of the coolant.

[0032] In practical use, the aforementioned pin-fin liquid cooling system first attaches one side of the housing to the electronic device. The density distribution of the fins varies in different areas of the inner wall of the housing, which can be specifically arranged to address the heat generation in different areas of the electronic device. Then, the coolant from the liquid cooling source is introduced into the interior of the housing through the first through-hole, where the coolant contacts the housing and the fins. The coolant exiting through the second through-hole is recovered to the recovery unit through the liquid outlet pipe. The power unit is connected to the liquid inlet pipe, liquid outlet pipe, or housing at any point to provide power for the flow of the coolant. Due to the presence of the fins, the contact area between the housing and the coolant is increased, thereby accelerating the cooling speed. At the same time, by arranging fins of different densities in different areas of the inner wall of the housing to address the heat generation in different areas of the electronic device, different heat-generating areas of the electronic device can be cooled in a targeted manner. The fin arrangement density also helps to adjust the flow path of the coolant and reduce flow resistance, thereby meeting the heat dissipation requirements of high-power chips and ensuring that the liquid cooling fluid can fully contact multiple fins, thus achieving efficient heat dissipation. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a pin-fin liquid cooling heat dissipation device according to one embodiment.

[0034] Figure 2 for Figure 1 A schematic diagram from another perspective.

[0035] Figure 3 for Figure 1 Exploded view.

[0036] Figure 4 for Figure 1 A sectional view.

[0037] Figure 5 This is an exploded view of the receiving portion, the first baffle, and the second baffle according to one embodiment.

[0038] Figure 6 This is a schematic diagram of a cooling section, a first baffle, and a second baffle according to one embodiment.

[0039] Figure 7 This is a schematic diagram of a cooling unit according to one embodiment.

[0040] Explanation of icon numbers:

[0041] 100-Pin-fin liquid cooling heat dissipation device;

[0042] 110 - Outer shell; 111 - Fin; 112 - First through hole; 113 - Second through hole;

[0043] 120 - Receiving section; 121 - Cooling tank;

[0044] 130 - Cooling section;

[0045] 140 - First baffle; 141 - First strip hole; 142 - First slot; 143 - First liquid passage groove;

[0046] 150 - Second baffle; 151 - Second strip hole; 152 - Second slot; 153 - Second liquid passage groove;

[0047] 160 - Sealing ring; 161 - Groove;

[0048] 170 - First fastener; 171 - Second fastener; 172 - Protrusion;

[0049] 180 - First fastening hole; 181 - Second fastening hole; 182 - Third fastening hole;

[0050] OX - First direction; OY - Second direction. Detailed Implementation

[0051] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0052] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0057] See Figure 1 , Figure 1 The diagram shows a schematic of the structure of a pin-fin liquid cooling heat dissipation device 100 according to an embodiment of the present application. The pin-fin liquid cooling heat dissipation device 100 provided in an embodiment of the present application includes a housing 110 and a plurality of fins 111.

[0058] See Figure 1-3 In the aforementioned pin-fin liquid cooling heat dissipation device 100, multiple fins 111 are disposed on the inner wall of the outer shell 110. The density distribution of the fins 111 in different regions of the inner wall of the outer shell 110 is different. One side of the outer shell 110 is attached to the electronic device. The outer side wall of the outer shell 110 is provided with a first through hole 112 and a second through hole 113 that communicate with the interior of the outer shell 110. The first through hole 112 and the second through hole 113 are used to introduce and exit coolant, respectively.

[0059] In actual use, the aforementioned finned liquid cooling heat dissipation device 100 first attaches one side of the outer shell 110 to the electronic device. The density distribution of the fins 111 in different areas of the inner wall of the outer shell 110 is different, which can be arranged according to the heat dissipation of different areas of the electronic device. Then, coolant is introduced into the interior of the outer shell 110 through the first through hole 112, and the coolant contacts the outer shell 110 and the fins 111. The coolant exits through the second through hole 113. Due to the presence of the fins 111, the contact area between the outer shell 110 and the coolant is increased, thereby accelerating the cooling speed. At the same time, since the fins 111 of different densities are arranged in different areas of the inner wall of the outer shell 110 according to the heat dissipation of different areas of the electronic device, the different heat dissipation areas of the electronic device are cooled in a targeted manner. The arrangement density of the fins 111 also has the function of adjusting the flow path of the coolant and reducing the flow resistance, thereby meeting the heat dissipation requirements of high-power chips and enabling the liquid cooling fluid to fully contact multiple fins, thereby achieving efficient heat dissipation.

[0060] Specifically, the position of the first through hole 112 is lower than the position of the second through hole 113, and the height of the second through hole 113 is higher than the height of all fins 111. As the amount of coolant introduced into the first through hole 112 increases, the liquid level of the coolant continuously rises until it comes into contact with all fins 111 and is discharged into the interior of the outer shell 110 through the second through hole 113. This ensures that all fins 111 can come into contact with the coolant, thereby improving heat dissipation efficiency.

[0061] See Figure 1 and Figure 3 In one embodiment, the housing 110 includes a receiving portion 120 and a cooling portion 130. The receiving portion 120 has a cooling groove 121, and the cooling portion 130 covers the cooling groove 121 and is connected to the receiving portion 120. The bottom wall of the cooling groove 121 has a first through hole 112 and a second through hole 113. Multiple fins 111 are disposed on the side wall of the cooling portion 130 near the receiving portion 120 and are partially located within the cooling groove 121. Coolant enters the cooling groove 121 through the first through hole 112, contacts the cooling portion 130 and the fins 111, and then exits the cooling groove 121 through the second through hole 113. The side of the cooling portion 130 facing away from the receiving portion 120 is attached to the electronic device, thereby increasing the contact area between the cooling portion 130 and the coolant by adjusting the density of the fins 111, thus improving heat dissipation efficiency.

[0062] See Figure 3 and Figure 5In one embodiment, the pin-fin liquid cooling heat dissipation device 100 further includes a first baffle 140 and a second baffle 150. The first baffle 140 covers the first through hole 112 and has a first strip-shaped hole 141, which partially covers the first through hole 112. The second baffle 150 covers the second through hole 113 and has a second strip-shaped hole 151, which partially covers the second through hole 113.

[0063] In this embodiment, after the coolant passes through the first through hole 112, it first needs to flow through the first strip hole 141, and then enter the cooling tank 121. After the coolant flows through the second strip hole 151, it can flow out of the strip groove 161 through the first through hole 112. This makes the width through which the coolant flows equal to the length of the first strip hole 141 and the second strip hole 151, thereby increasing the area through which the coolant flows and improving the heat dissipation efficiency.

[0064] See Figure 3 and Figure 5 In one embodiment, the bottom wall of the cooling tank 121 is provided with a first slot 142 and a second slot 152. The first slot 142 communicates with the first through hole 112, and a first baffle 140 is located in the first slot 142 and adapted to the first slot 142. The second slot 152 communicates with the second through hole 113, and a second baffle 150 is located in the second slot 152 and adapted to the second slot 152, thereby enabling the first baffle 140 to be confined in the first slot 142 and the second baffle 150 to be confined in the second slot 152.

[0065] See Figure 3 and Figure 5 In one embodiment, the bottom wall of the first slot 142 is provided with a first liquid passage groove 143, which communicates with the first through hole 112. A first baffle 140 covers the first liquid passage groove 143, and a first strip hole 141 communicates with the first liquid passage groove 143. The bottom wall of the second slot 152 is provided with a second liquid passage groove 153, which communicates with the second through hole 113. A second baffle 150 covers the second liquid passage groove 153, and a second strip hole 151 communicates with the second liquid passage groove 153.

[0066] In this embodiment, after passing through the first through hole 112, the coolant first enters the first liquid channel 143. Since the first strip hole 141 is connected to the first liquid channel 143, the coolant in the first liquid channel 143 is blocked by the first baffle 140 and must pass through the first strip hole 141 to enter the cooling tank 121. During the process of flowing out of the cooling tank 121, the coolant is blocked by the second baffle 150 and must flow through the second strip hole 151 before entering the second liquid channel 153. Finally, it flows out of the strip channel 161 through the first through hole 112, so that the width through which the coolant flows is the length of the first strip hole 141 and the second strip hole 151, thereby increasing the area through which the coolant flows and improving the heat dissipation efficiency.

[0067] See Figure 3 and Figure 5 In one embodiment, the axes of the first through hole 112 and the second through hole 113 are arranged along the first direction OX. The first strip hole 141 and the second strip hole 151 both extend along the second direction OY, and the first strip hole 141 and the second strip hole 151 are arranged along the first direction OX, which is perpendicular to the second direction OY.

[0068] In this embodiment, assuming the first direction OX is vertical and the second direction OY is horizontal, the first through hole 112 is lower than the second through hole 113. After passing through the first through hole 112, the coolant first enters the first liquid channel 143. Since the first strip hole 141 is connected to the first liquid channel 143, the coolant in the first liquid channel 143 is blocked by the first baffle 140 and must pass through the first strip hole 141 along the second direction OY to enter the cooling tank 121, thereby accelerating the formation of the horizontal liquid surface. The horizontal liquid surface steadily rises until it reaches the second baffle 150. During the process of the coolant flowing out of the cooling tank 121, it is blocked by the second baffle 150 and must flow through the second strip hole 151 along the second direction OY before entering the second liquid channel 153. Finally, it flows out of the second liquid channel 153 through the first through hole 112, so that the width through which the coolant flows is the length of the first strip hole 141 and the second strip hole 151, thereby increasing the area through which the coolant flows and improving the heat dissipation efficiency.

[0069] See Figure 4-6 Specifically, the end of the first baffle 140 away from the first through hole 112 abuts against the end of the fin 111 away from the cooling section 130, and the end of the second baffle 150 away from the second through hole 113 abuts against the end of the fin 111 away from the cooling section 130, thereby ensuring that the first baffle 140 is stably located in the first slot 142 and the second baffle 150 is stably located in the second slot 152.

[0070] See Figure 3 and Figure 5In one embodiment, along the first direction OX, the width of the first baffle 140 gradually decreases along the second direction OY towards the direction close to the second baffle 150, and the cross-sectional shape of the first liquid channel 143 is similar to that of the first baffle 140. Similarly, along the first direction OX, the width of the second baffle 150 gradually decreases along the second direction OY towards the direction close to the first baffle 140, and the cross-sectional shape of the second liquid channel 153 is similar to that of the second baffle 150.

[0071] In this embodiment, since the width of the first baffle 140 along the second direction OY gradually decreases towards the direction close to the second baffle 150, and the cross-sectional shape of the first liquid channel 143 is similar to that of the first baffle 140, the width of the first liquid channel 143 along the second direction OY gradually decreases towards the direction close to the second liquid channel 153. This causes the coolant to accumulate in the first liquid channel 143 if the flow rate is too fast after entering the first liquid channel 143 through the first through hole 112. The side of the first liquid channel 143 inclined towards the first direction OX... The collision between the wall and the coolant cancels out the flow velocity, and the flow is stabilized by the side wall of the first liquid channel 143, making the flow velocity of the liquid entering the first strip-shaped hole 141 more stable. Similarly, when too much coolant enters the second liquid channel 153 through the second strip-shaped hole 151, it accumulates in the second liquid channel 153. The collision between the coolant and the side wall of the second liquid channel 153, which is inclined in the first direction OX, cancels out the flow velocity. The coolant is stabilized by the side wall of the second liquid channel 153, making the flow velocity of the liquid flowing out of the second through hole 113 more stable.

[0072] Specifically, the first through hole 112 is connected to the end of the first liquid channel 143 along the first direction OX near the second liquid channel 153, the first strip hole 141 is connected to the end of the first liquid channel along the first direction OX away from the second liquid channel 153, the second through hole 113 is connected to the end of the second liquid channel 153 along the first direction OX near the first liquid channel 143, and the second strip hole 151 is connected to the end of the second liquid channel along the first direction OX away from the first liquid channel 143. If the first direction OX is vertical and the second direction OY is horizontal, and the first through hole 112 is lower than the second through hole 113, then the coolant first enters the first liquid channel 143 after passing through the first through hole 112. Since the first strip hole 141 is connected to the first liquid channel 143, the coolant in the first liquid channel 143 is blocked by the first baffle 140. The side wall of the first liquid channel 143, which is inclined to the first direction OX, diffuses the coolant along the second direction OY. The coolant must pass through the first strip hole 141 along the second direction OY to enter the cooling tank 121, thus accelerating the formation of a horizontal liquid surface. The horizontal liquid level rises steadily until it reaches the second baffle 150. As the coolant flows out of the cooling tank 121, it is blocked by the second baffle 150 and must flow through the second strip hole 151 along the second direction OY before entering the second liquid channel 153. It is then affected by the liquid-gathering effect of the side wall of the first liquid channel 143, which is inclined to the first direction OX, and the outflowing coolant is gathered at the second through hole 113 and flows out of the second through hole 113. This makes the width through which the coolant flows equal to the length of the first strip hole 141 and the second strip hole 151, so that the coolant can fully contact the fins 111 and improve the heat dissipation efficiency.

[0073] Specifically, the first through hole and the second through hole are circular, and the side wall connections of the first liquid channel, the second liquid channel, the first slot, and the second slot are all chamfered to make the liquid flow more smoothly and prevent the liquid from generating unstable turbulence at sharp corners.

[0074] See Figure 7 Specifically, the fin 111 in this application is a pin fin, i.e., a long strip-shaped cooling structure. The length of the fin 111 extends along the depth direction of the cooling groove 121. The cross-section of the fin 111 can be circular, elliptical, polygonal, etc., as long as it can increase the contact area of ​​the coolant. There is no limitation here. The density distribution of the fin 111 on the cooling part is arranged according to the heating situation of different heat-generating areas of the electronic device, thereby increasing the contact area between the coolant and the fin, enabling targeted cooling of the electronic device, thereby improving the cooling efficiency. At the same time, the increased fin density can increase the resistance to the flow of coolant, reduce the flow rate of coolant, and further improve the cooling effect.

[0075] See Figure 3 and Figure 5In one embodiment, the pin-fin liquid cooling heat dissipation device 100 further includes a sealing ring 160. A strip groove 161 is provided on the plane where the receiving part 120 contacts the cooling part 130. The sealing ring 160 is partially located in the strip groove 161 and is located between the bottom wall of the strip groove 161 and the cooling part 130, thereby achieving the sealing of the cooling groove 121 and preventing liquid leakage. At the same time, the sealing ring 160 is also limited.

[0076] See Figure 3 and Figure 5 In one embodiment, the pin-fin liquid cooling heat dissipation device 100 further includes a first fastener 170, and the outer casing has a first fastening hole 180. The first fastener 170 passes through the first fastening hole 180 to fix the outer casing to the electronic device.

[0077] Preferably, the receiving portion 120 has protrusions 172 around its perimeter, and the protrusions 172 have first fastening holes 180. First fasteners 170 are inserted through the first fastening holes 180 to fix the housing to the electronic device. The cooling portion 130 is located between the receiving portion 120 and the electronic device. There are multiple first fasteners 170 and multiple first fastening holes 180. The multiple first fastening holes 180 are evenly arranged around the circumference of the cooling groove 121, and the multiple first fasteners 170 are inserted through the multiple first fastening holes 180 one by one.

[0078] See Figure 3 and Figure 5 Specifically, the pin-fin liquid cooling heat dissipation device 100 also includes a plurality of second fasteners 171. The receiving part 120 has a plurality of second fastening holes 181 on the side near the cooling part 130, and the cooling part 130 has a plurality of third fastening holes 182 on the side near the receiving part 120. The plurality of second fastening holes 181 are evenly arranged around the circumference of the cooling groove 121. The plurality of second fasteners 171, the plurality of second fastening holes 181, and the plurality of third fastening holes 182 correspond one-to-one. The second fasteners 171 pass through the second fastening holes 181 and the third fastening holes 182 to connect the cooling part 130 with the receiving part 120.

[0079] One embodiment of this application also provides a pin-fin liquid cooling system, which includes: an inlet pipe (not shown), an outlet pipe (not shown), a liquid cooling source (not shown), a recovery unit (not shown), a power unit (not shown), and a pin-fin liquid cooling device 100. One end of the inlet pipe is connected to the liquid cooling source, and the other end is connected to a first through hole 112. One end of the outlet pipe is connected to the recovery unit, and the other end is connected to a second through hole 113. The power unit is connected to any one of the inlet pipe, the outlet pipe, and the outer casing 110, and is used to provide power for the flow of coolant.

[0080] In practical use, the aforementioned pin-fin liquid cooling system first attaches one side of the housing 110 to the electronic device. The density distribution of the fins 111 varies in different areas of the inner wall of the housing 110, allowing for specific arrangement based on the heat generation conditions of different areas of the electronic device. Then, the coolant from the liquid cooling source is introduced into the interior of the housing 110 through the first through-hole 112, where it contacts both the housing 110 and the fins 111. The coolant exiting through the second through-hole 113 is recovered to the recovery unit via the liquid outlet pipe. The power unit is connected to any of the liquid inlet pipe, liquid outlet pipe, or housing 110, and is used to power the coolant... The flow provides the power, and the presence of fins 111 increases the contact area between the outer shell 110 and the coolant, thereby accelerating the cooling speed. At the same time, due to the different heat generation conditions in different areas of the electronic device, fins 111 of different densities are arranged on different areas of the inner wall of the outer shell 110 to cool different heat generation areas of the electronic device in a targeted manner. In addition, the arrangement density of fins 111 also has the function of adjusting the flow path of the coolant and reducing flow resistance, thereby meeting the heat dissipation requirements of high-power chips and enabling the liquid cooling fluid to fully contact multiple fins, thereby achieving efficient heat dissipation.

[0081] Specifically, the power unit can be a pump or a rotating blade or other structure that enables liquid flow, as long as it can provide power for the flow of coolant, there are no restrictions.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A pin-fin liquid cooling heat dissipation device, characterized in that, The pin-fin liquid cooling heat dissipation device comprises: a shell; a plurality of fins arranged on the inner wall of the shell, the density of the fins in different areas of the inner wall of the shell being different, one side of the shell being attached to an electronic device; the shell is provided with a first through hole and a second through hole which are in communication with the inside of the shell, the first through hole and the second through hole being used for the inlet and outlet of coolant respectively.

2. The pin-fin liquid cooling heat sink device of claim 1, wherein, The shell comprises a containing part and a cooling part; the containing part is provided with a cooling groove, the cooling part covering the cooling groove and being connected with the containing part, the bottom wall of the cooling groove being provided with the first through hole and the second through hole; a plurality of fins are arranged on the side wall of the cooling part close to the containing part, and part of the fins are located in the cooling groove, the side of the cooling part away from the containing part being attached to the electronic device.

3. The pin-fin liquid cooling heat sink of claim 2, wherein, The pin-fin liquid cooling heat dissipation device further comprises a first baffle and a second baffle; the first baffle covers the first through hole, the first baffle being provided with a first strip-shaped hole, the first strip-shaped hole partially covering the first through hole; the second baffle covers the second through hole, the second baffle being provided with a second strip-shaped hole, the second strip-shaped hole partially covering the second through hole.

4. The pin-fin liquid cooling heat sink of claim 3, wherein, The bottom wall of the cooling groove is provided with a first clamping groove and a second clamping groove; the first clamping groove is in communication with the first through hole, the first baffle being located in the first clamping groove and being adapted to the first clamping groove; the second clamping groove is in communication with the second through hole, the second baffle being located in the second clamping groove and being adapted to the second clamping groove.

5. The pin-fin liquid cooling heat sink of claim 4, wherein, The bottom wall of the first clamping groove is provided with a first liquid passage, the first liquid passage being in communication with the first through hole, the first baffle covering the first liquid passage, the first strip-shaped hole being in communication with the first liquid passage; the bottom wall of the second clamping groove is provided with a second liquid passage, the second liquid passage being in communication with the second through hole, the second baffle covering the second liquid passage, the second strip-shaped hole being in communication with the second liquid passage.

6. The pin-fin liquid cooling heat sink of claim 3, wherein, The first through hole and the second through hole are arranged along a first direction; the first strip-shaped hole and the second strip-shaped hole both extend along a second direction, the first direction being perpendicular to the second direction.

7. The pin-fin liquid cooling heat sink of claim 5, wherein, Along the first direction, the width of the first baffle along the second direction gradually decreases in the direction close to the second baffle, the cross section of the first liquid passage being similar to the first baffle; along the first direction, the width of the second baffle along the second direction gradually decreases in the direction close to the first baffle, the cross section of the first liquid passage being similar to the first baffle, the first direction being perpendicular to the second direction.

8. The pin-fin liquid cooling heat sink of claim 2, wherein, The pin-fin liquid cooling heat dissipation device further comprises a sealing ring, the sealing ring being located between the containing part and the cooling part.

9. The pin-fin liquid cooling heat sink of claim 1, wherein, The pin-fin liquid cooling heat dissipation device further comprises a first fastener, the shell being provided with a first fastening hole, the first fastener being arranged in the first fastening hole for fixing the shell to the electronic device.

10. A pin-fin liquid cooling heat dissipation system, characterized in that, The pin-fin liquid cooling heat dissipation system comprises an inlet pipe, an outlet pipe, a liquid cooling source, a recovery part, a power part and the pin-fin liquid cooling heat dissipation device of any one of claims 1-9. One end of the liquid inlet pipe is communicated with the liquid cooling source and the other end is communicated with the first through hole; One end of the liquid outlet pipe is communicated with the recovery part and the other end is communicated with the second through hole; The power part is connected to any one of the liquid inlet pipe, the liquid outlet pipe and the shell, and is used for providing power for the flow of the coolant.

Images