Cleaning jig

Abstract

The utility model belongs to the technical field of cleaning equipment, and particularly relates to a cleaning jig which comprises a lower bottom plate, an upper cover plate and a semiconductor CVD to be cleaned, and the semiconductor CVD is tightly attached to the upper cover plate and the lower bottom plate through a first sealing ring and a second sealing ring to form a sealing structure. The lower bottom plate is provided with a material collecting cavity, a stepped groove, a first vibrator and a second vibrator, the first vibrator is used for enhancing the washing effect of the cleaning liquid, and the second vibrator is used for rapidly concentrating impurities in the material collecting cavity to the discharging opening; a liquid injection cavity and symmetrically arranged handles are arranged at the top of the upper cover plate, the liquid injection cavity is used for uniformly distributing cleaning liquid, and the handles facilitate disassembly and assembly of the operation device; the device is connected through bolts of the first flange ring and the second flange ring, so that the sealing effect and stability are ensured; when the cleaning device is used, the cleaning liquid uniformly covers the semiconductor CVD through the liquid injection cavity, impurities are brought into the material collection cavity through the spraying holes, meanwhile, the cleaning efficiency and the impurity discharging speed are improved through the effect of the vibrator, and efficient cleaning and rapid discharging are achieved.

Description

Technical Field

[0001] This utility model belongs to the field of cleaning equipment technology, and specifically relates to a cleaning fixture. Background Technology

[0002] Semiconductor chemical vapor deposition (CVD) equipment is an indispensable key piece of equipment in the integrated circuit manufacturing process, and one of its core components, the Showerhead (SiC), is widely used in semiconductor etching equipment. As an electrode for applying voltage and a conduit for delivering etching gas into the chamber, the Showerhead plays a crucial role in continuously, stably, and uniformly delivering gas and covering the wafer surface. Its spray orifice diameter can reach as small as 0.2 mm. This extremely high gas delivery precision is vital in semiconductor manufacturing, helping to maintain optimal etching conditions and making it a crucial core component for ensuring yield in wafer etching processes.

[0003] In actual production, the cleanliness of the showerhead directly affects the yield of wafer production and the stability of equipment operation. Whether it's initial testing of new products or cleaning after maintenance (PM) of operating equipment, a high-cleanliness cleaning process is indispensable. However, due to the structural characteristics of the micropores and stepped vias in the showerhead (pore size ranging from 0.4μm to 1μm), incomplete cleaning will result in residues affecting performance, thereby reducing equipment production efficiency and yield.

[0004] Common showerhead cleaning processes include dry ice cleaning, chemical cleaning, ultrasonic cleaning, high-pressure water washing, and ultrasonic cleaning within cleanrooms. However, these methods typically rely on manual operation. Chemical cleaning, in particular, varies in effectiveness depending on the type and ratio of chemicals used. For example, commonly used chemical cleaning combinations include acetone, potassium hydroxide, hydrofluoric acid, nitric acid, and acetic acid, which are applied step-by-step manually. However, the precision and consistency of manual operation are limited, especially when cleaning micropores and stepped openings, making it impossible to guarantee consistent cleanliness. This situation not only increases equipment maintenance costs but may also affect the stability and yield of equipment production. Utility Model Content

[0005] To address the problems existing in the prior art, the purpose of this utility model is to provide a cleaning fixture that can achieve high efficiency, stability, and ensure the cleaning of micropores.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A cleaning fixture includes a lower base plate, an upper cover plate on the top of the lower base plate, a semiconductor CVD to be cleaned disposed between the lower base plate and the upper cover plate, and spray holes are provided through the semiconductor CVD.

[0008] The bottom of the lower base plate is connected to the first pipe joint, and the top of the upper cover plate is connected to the second pipe joint.

[0009] During cleaning, the cleaning fluid enters the space between the lower base plate and the upper cover plate through the second pipe joint and cleans the semiconductor CVD located between the lower base plate and the upper cover plate. The cleaned residue is discharged through the first pipe joint.

[0010] The bottom plate has a material collection chamber and a stepped groove at the top, with the stepped groove located at the top of the material collection chamber;

[0011] An injection chamber is provided at the bottom of the top cover plate;

[0012] Semiconductor CVD is placed between the injection chamber and the stepped groove.

[0013] Furthermore, a first positioning groove is provided on the stepped groove, and a first sealing ring is placed in the first positioning groove;

[0014] A second positioning groove is provided inside the injection chamber, and a second vibrator is placed inside the second positioning groove;

[0015] Both the second sealing ring and the first sealing ring are in close contact with the semiconductor CVD.

[0016] Furthermore, a second oscillator is symmetrically arranged at the bottom of the lower base plate;

[0017] The top of the cover plate is symmetrically equipped with the first oscillator.

[0018] Furthermore, a first flange ring is fixedly connected to the outer side of the lower base plate;

[0019] A second flange ring is fixedly connected to the outer side of the top cover plate;

[0020] The first flange and the second flange are connected by bolts.

[0021] Furthermore, handles are symmetrically arranged on the top of the cover plate.

[0022] Furthermore, the bottom of the lower base plate is symmetrically provided with support legs.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] The cleaning fixture provided by this utility model has high cleaning efficiency and good sealing performance. By setting a first sealing ring and a second sealing ring between the upper cover plate and the lower base plate, it fits tightly against both sides of the semiconductor CVD, ensuring the sealing of the cleaning fluid during the rinsing process and avoiding the problem of cleaning fluid leakage. At the same time, the cooperation of the injection chamber and the stepped groove achieves uniform distribution of the cleaning fluid, improves the removal effect of impurities inside the spray holes, and solves the problem of incomplete cleaning in the prior art.

[0025] This invention further improves cleaning efficiency through the combined use of a first oscillator and a second oscillator. The first oscillator causes the lower base plate, upper cover plate, and semiconductor CVD to vibrate during the cleaning process, enhancing the cleaning fluid's ability to flush away stubborn impurities. The second oscillator acts on the lower base plate, which can quickly concentrate impurities in the collection chamber to the position of the first pipe joint, accelerating the discharge of impurities and solving the problems of impurity retention and long cleaning time in the prior art.

[0026] This invention provides a reliable assembly method through the bolted connection structure of the first and second flange rings. During the cleaning process, the tightening effect of the bolts further enhances the sealing effect of the sealing ring, ensuring the sealing of the cleaning fluid and the stability of the cleaning fixture, while avoiding leakage problems caused by improper manual operation, significantly improving the safety and consistency of cleaning.

[0027] The structural design of this utility model simplifies the operation process of the cleaning fixture. By setting symmetrical handles on the top of the upper cover plate, the installation and disassembly of the device are facilitated, improving the ease of operation; at the same time, the support leg design of the lower base plate enhances the stability of the device during the cleaning process, preventing the device from shifting due to vibration or the action of the rinsing liquid, thereby improving the reliability of the equipment operation. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of this utility model;

[0029] Figure 2 This is a perspective view of the present utility model;

[0030] Figure 3 This is the front view of the present invention;

[0031] Figure 4 for Figure 3 Cross-sectional view along the BB direction;

[0032] Figure 5 for Figure 3 Enlarged schematic diagram of point A in the middle.

[0033] The attached diagram lists the components represented by each number as follows:

[0034] 1. Bottom plate; 11. First flange ring; 12. First pipe joint; 13. Support leg; 14. Stepped groove;

[0035] 15. Collection chamber; 16. First positioning groove; 17. First sealing ring;

[0036] 2. Top cover plate; 21. Second flange ring; 22. Second pipe joint; 23. Injection chamber; 24. Second positioning groove; 25. Second sealing ring;

[0037] 3. Handle;

[0038] 4. First oscillator;

[0039] 5. The second oscillator;

[0040] 6. Semiconductor CVD; 61. Spray nozzle. Detailed Implementation

[0041] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.

[0042] See Figure 1-5 A cleaning fixture includes a lower base plate 1, an upper cover plate 2 on top of the lower base plate 1, and a semiconductor CVD 6 to be cleaned disposed between the lower base plate 1 and the upper cover plate 2. The semiconductor CVD 6 has multiple spray holes 61 penetrating through it, which allow cleaning fluid to pass through during the cleaning process to remove internal residues. A first pipe connector 12 is connected to the bottom of the lower base plate 1, and a second pipe connector 22 is connected to the top of the upper cover plate 2. During cleaning, a cleaning pump injects cleaning fluid into the second pipe connector 22, allowing the cleaning fluid to enter the space between the lower base plate 1 and the upper cover plate 2, and rinsing the surface of the semiconductor CVD 6 and the spray holes 61 located between the lower base plate 1 and the upper cover plate 2. Residue carried by the cleaning fluid is discharged through the spray holes 61 into the collection chamber 15 within the lower base plate 1 and discharged through the first pipe connector 12, achieving efficient removal of impurities.

[0043] See Figure 3-5 The bottom plate 1 has a material collection chamber 15 and a stepped groove 14 at its top. The stepped groove 14 is located at the top of the material collection chamber 15. The design of the stepped groove 14 allows the semiconductor CVD6 to be stably placed in the cleaning device. The bottom of the top cover plate 2 has a liquid injection chamber 23. The liquid injection chamber 23 is used to guide the cleaning liquid to evenly cover the surface of the semiconductor CVD6. The semiconductor CVD6 is placed between the liquid injection chamber 23 and the stepped groove 14 to ensure that the cleaning liquid can cover the semiconductor CVD6 from multiple angles.

[0044] The stepped groove 14 has a first positioning groove 16 inside, and a first sealing ring 17 is placed in the first positioning groove 16. The first sealing ring 17 is in close contact with the lower surface of the semiconductor CVD6. The liquid injection chamber 23 has a second positioning groove 24 inside, and a second sealing ring 25 is placed in the second positioning groove 24. The second sealing ring 25 is in close contact with the upper surface of the semiconductor CVD6. The cooperation of the first sealing ring 17 and the second sealing ring 25 ensures the sealing performance during the cleaning process and prevents the cleaning fluid from leaking.

[0045] See Figure 1 Two second vibrators 5 are symmetrically arranged at the bottom of the bottom plate 1. The second vibrators 5 use vibration to gather the residue in the collection chamber 15 toward the first pipe joint 12, thereby accelerating the discharge speed of impurities. Two first vibrators 4 are symmetrically arranged at the top of the top cover plate 2. The first vibrators 4 drive the semiconductor CVD6 to vibrate during the cleaning process, thereby further improving the rinsing efficiency of the cleaning fluid and enabling the separation of stubborn impurities.

[0046] See Figure 2 The outer side of the lower base plate 1 is fixedly connected to a first flange ring 11, and the outer side of the upper cover plate 2 is fixedly connected to a second flange ring 21. The first flange ring 11 and the second flange ring 21 are connected by bolts. By tightening the bolts, the first sealing ring 17 and the second sealing ring 25 can fit more tightly on the semiconductor CVD6, ensuring the sealing effect during the cleaning process, while improving cleaning efficiency and stability.

[0047] See Figure 1 The top of the upper cover plate 2 is symmetrically provided with two handles 3, which make it easy for operators to grab and move the upper cover plate 2 when installing or removing it; the bottom of the lower base plate 1 is symmetrically provided with support legs 13, which ensure the stability of the cleaning fixture during use and prevent the device from tilting or shifting during vibration.

[0048] The working principle of this utility model is as follows:

[0049] In use, the semiconductor CVD6 is placed between the injection chamber 23 and the stepped groove 14, and the two sides of the semiconductor CVD6 are respectively attached to the second sealing ring 25 and the first sealing ring 17.

[0050] Then, bolts are used to connect the first flange ring 11 and the first pipe joint 12 together. As the torque of the connecting bolts increases, the second sealing ring 25 and the first sealing ring 17 will fit tightly against the semiconductor CVD6.

[0051] The cleaning solution is injected into the injection chamber 23 on the upper cover plate 2 through the second pipe joint 22 using a water pump. The cleaning solution washes the semiconductor CVD6 and passes through the spray holes 61 on the semiconductor CVD6, thereby cleaning the spray holes 61. The washed-off residue will fall into the collection chamber 15 on the lower base plate 1 along with the cleaning solution and be discharged through the first pipe joint 12 located at the bottom of the lower base plate 1.

[0052] During the cleaning process;

[0053] During cleaning, the first oscillator 4 can be turned on to make the lower base plate 1, the upper cover plate 2 and the semiconductor CVD6 vibrate, which makes it easier for the impurities of the semiconductor CVD6 to fall off.

[0054] When it is necessary to discharge the impurities that have fallen into the collection chamber 15, the second vibrator 5 can be turned on. Under the vibration of the second vibrator 5, the impurities in the collection chamber 15 will quickly gather at the location of the first pipe joint 12, thereby accelerating the discharge speed of the impurities. In turn, with the cooperation of the first vibrator 4 and the second vibrator 5, the cleaning rate can be accelerated.

[0055] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the field.

Claims

1. A cleaning tool, characterized by: The utility model relates to a semiconductor CVD cleaning device, including lower bottom plate (1), the top of lower bottom plate (1) is provided with upper cover plate (2), be provided with the semiconductor CVD (6) to be cleaned between lower bottom plate (1) and upper cover plate (2), and the spray hole (61) is set up on the semiconductor CVD (6) and penetrates, The bottom of the lower bottom plate (1) is connected with a first pipe joint (12), and the top of the upper cover plate (2) is connected with a second pipe joint (22). During cleaning, the cleaning liquid enters the space between the lower bottom plate (1) and the upper cover plate (2) through the second pipe joint (22) and cleans the semiconductor CVD (6) located between the lower bottom plate (1) and the upper cover plate (2), and the residues cleaned are discharged through the first pipe joint (12). The top of the lower bottom plate (1) is provided with a material collecting cavity (15) and a stepped groove (14), and the stepped groove (14) is located at the top of the material collecting cavity (15). The bottom of the upper cover plate (2) is provided with a liquid injection cavity (23). The semiconductor CVD (6) is placed between the liquid injection cavity (23) and the stepped groove (14).

2. The cleaning tool of claim 1, wherein: The first positioning groove (16) is provided on the stepped groove (14), and the first sealing ring (17) is placed in the first positioning groove (16). The second positioning groove (24) is provided in the liquid injection cavity (23), and the second vibrator (5) is placed in the second positioning groove (24). The second sealing ring (25) and the first sealing ring (17) are in close contact with the semiconductor CVD (6).

3. The cleaning tool of claim 1, wherein: The bottom of the lower bottom plate (1) is symmetrically provided with the second vibrator (5). The top of the upper cover plate (2) is symmetrically provided with the first vibrator (4).

4. The cleaning tool of claim 1, wherein: The outer side of the lower bottom plate (1) is fixedly connected with the first flange ring (11). The outer side of the upper cover plate (2) is fixedly connected with the second flange ring (21). The first flange ring (11) and the second flange ring (21) are connected through bolts.

5. The cleaning tool of claim 1, wherein: The top of the upper cover plate (2) is symmetrically provided with the handle (3).

6. The cleaning tool of claim 1, wherein: The bottom of the lower bottom plate (1) is symmetrically provided with the supporting leg (13).

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