Bonding plate, slicing device, cutting machine and grinding equipment

Abstract

The utility model provides a bonding plate, a slicing device, a cutting machine and grinding equipment. The bonding plate comprises a body. The pattern structure is arranged on at least one surface of the body in the thickness direction, so that the surface is provided with a non-pattern area and a pattern area; wherein the roughness of the pattern area is greater than that of the non-pattern area. In the application, the bonding connection between the bonding plate and the silicon rod or the crystal support is realized through the pattern area with relatively large roughness, and the bonding strength between the bonding plate and the silicon rod or the crystal support is improved, so that the problem of bonding failure in a local contact area is avoided, and the connection reliability between the resin plate and the silicon rod or the crystal support is improved; and the problem of rod falling is avoided.

Description

Technical Field

[0001] This application belongs to the field of diamond wire cutting technology, and in particular relates to an adhesive plate, a slicing device, a cutting machine and a grinding equipment. Background Technology

[0002] With the trend towards thinner wafers and larger silicon wafer cutting, the problem of wafer and rod falling off during the material handling process has become increasingly prominent, causing serious losses. The main reason for this problem is that the adhesion between the generally resin-based bonding plate and the silicon rod, or between the bonding plate and the crystal holder, is insufficient to meet the friction during material handling. Therefore, it is particularly urgent to increase the adhesion between the bonding plate and the silicon rod and the crystal holder. Utility Model Content

[0003] This application provides an adhesive board, a slicing device, a cutting machine, and a grinding device to solve the problem of adhesive strength in existing resin boards.

[0004] According to one aspect of this application, an adhesive board is provided, comprising a body; and a patterned structure disposed on at least one surface of the body in the thickness direction such that the surface has a non-patterned area and a patterned area; wherein the roughness of the patterned area is greater than the roughness of the non-patterned area.

[0005] According to another aspect of this application, a slicing apparatus is provided, which includes a crystal rod, a crystal holder, and the bonding plate described above.

[0006] According to another aspect of this application, a cutting machine is provided, which includes the slicing device described above.

[0007] According to another aspect of this application, a polishing device is provided, comprising: a fixing mechanism for fixing the body of an adhesive board; an adjusting mechanism disposed opposite to the fixing mechanism; a polishing mechanism disposed on the adjusting mechanism and rotatable relative to the adjusting mechanism; and a control mechanism connected to the polishing mechanism and the adjusting mechanism for controlling the adjusting mechanism to adjust the position of the polishing mechanism relative to the body and controlling the polishing mechanism to polish a pattern structure on the body.

[0008] The bonding plate, slicing device, cutting machine, and grinding equipment provided in this application have at least the following beneficial effects:

[0009] (1) In this application, the bonding plate includes a body and a pattern structure disposed on the body. The surface of the body with multiple pattern structures has non-patterned areas and patterned areas based on the pattern structure. Thus, the bonding connection between the bonding plate and the silicon rod or crystal holder can be achieved through the patterned area with larger roughness, thereby improving the bonding strength and connection reliability between the bonding plate and the silicon rod or crystal holder.

[0010] (2) In this application, the grinding equipment can replace manual grinding, has a high degree of automation, and can meet the needs of various product sizes of adhesive boards and can grind out pattern structures of various densities and roughnesses. Moreover, the roughness of the ground pattern structure is more uniform in size and spacing, which effectively avoids the problem of bonding failure in local contact areas. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application; those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of an adhesive plate provided in an embodiment of this application;

[0013] Figure 2 This is a schematic diagram of another adhesive plate provided in an embodiment of this application;

[0014] Figure 3 This is a schematic diagram of the structure of another adhesive plate provided in an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of a pattern structure on an adhesive board provided in an embodiment of this application;

[0016] Figure 5 A schematic diagram of another pattern structure on the adhesive board provided in the embodiments of this application;

[0017] Figure 6 A schematic diagram of yet another pattern structure on the adhesive board provided in an embodiment of this application;

[0018] Figure 7 This is an enlarged schematic diagram of the surface structure of an adhesive plate provided in an embodiment of this application;

[0019] Figure 8 A perspective view of the grinding equipment provided in the embodiments of this application;

[0020] Figure 9 for Figure 8 The left view;

[0021] Figure 10 for Figure 8 Top view.

[0022] The reference numerals in the attached figures are as follows:

[0023] 100. Grinding equipment;

[0024] 10. Fixing mechanism; 11. Fixing frame; 111. Main frame; 112. First crossbeam support; 12. Clamping unit; 13. Lifting unit; 20. Adjusting mechanism; 21. Sliding rail; 211. First track plate; 212. Second track plate; 22. Locking unit; 23. Drive unit; 231. Second motor; 30. Grinding mechanism; 31. Third motor; 32. Grinding head; 40. Control mechanism; 41. Display screen; C. Collection cavity;

[0025] 200. Adhesive board;

[0026] 210. Body; 220. Scratches; A. Non-pattern area; B. Pattern area; B1. First sub-pattern area; B2. Second sub-pattern area; B3. Third sub-pattern area;

[0027] L represents the length direction; W represents the width direction. Detailed Implementation

[0028] To make the above and other features and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explanation to those skilled in the art and are exemplary only, not restrictive.

[0029] In the description of this application, features specified with "first" or "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified with "first" or "second" may explicitly or implicitly include at least one of the specified features. The use of the term "multiple" generally means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] In the description of this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0032] Figure 1 This is a schematic diagram of the structure of an adhesive plate provided in an embodiment of this application. Figure 2 This is a schematic diagram of another adhesive plate provided in an embodiment of this application; Figure 3 This is a schematic diagram of another adhesive plate provided in an embodiment of this application.

[0033] Reference Figures 1 to 3 The adhesive plate 200 provided in this embodiment includes a body 210 and a patterned structure disposed on the body 210. The body 210 has a first surface and a second surface disposed opposite to each other in the thickness direction.

[0034] The pattern structure is formed manually or by grinding on the surface of the body 210. Before grinding, the body 210 is a plastic sheet structure, which can be purchased directly or made with epoxy resin as the base material, filled with aluminum powder, calcium powder or glass fiber, and manufactured by high temperature and high pressure process. This application does not make specific limitations. Then, based on the body 210, the pattern structure is ground on the surface of the body 210 to obtain the adhesive board 200 of this application.

[0035] The pattern structure is disposed on at least one surface in the thickness direction of the body 210. Based on the arrangement of the pattern structure, the surface has a non-patterned area A and a patterned area B. That is, the area on the surface with the pattern structure is called the patterned area B, while the area without the pattern structure is called the non-patterned area A.

[0036] The roughness of patterned area B is greater than that of unpatterned area A. It should be noted that in this application, the roughness is measured using a commercially available roughness tester, and the roughness referred to in this application is the arithmetic mean roughness Ra.

[0037] In this embodiment, the bonding plate 200 includes a body 210 and a patterned structure disposed on the body 210. The surface of the body 210 with the patterned structure has a non-patterned area A and a patterned area B based on the patterned structure. Thus, the bonding connection between the bonding plate 200 and the silicon rod or crystal holder can be achieved through the patterned area B with a larger roughness, thereby improving the bonding strength and connection reliability between the bonding plate 200 and the silicon rod or crystal holder, and thus avoiding the problem of rod falling off.

[0038] In some embodiments, the roughness of the patterned region B is 2 to 5 times that of the unpatterned region A. In this application, the roughness difference between the patterned region B and the unpatterned region A can be controlled by controlling the shape, spacing, and size of the pattern structure. Here, setting the roughness of the patterned region B to 2 to 5 times that of the unpatterned region A ensures both the bonding strength between the patterned region B and the silicon rod or crystal holder, and the overall structural strength of the bonding board 200.

[0039] In some embodiments, the roughness of the unpatterned region A is 2~8 μm. For example, the roughness of the unpatterned region A can be 2 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 7 μm, 7.5 μm, 8 μm, etc.

[0040] In some embodiments, the roughness of the pattern region B is 5~20μm. For example, the roughness of the pattern region B can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 12μm, 15μm, 18μm, 20μm, etc.

[0041] In this application, setting the roughness of the pattern area B within the above-mentioned range can avoid damage to the body 210 during the polishing process due to excessive roughness of the pattern area B, and can also avoid bonding failure caused by insufficient bonding strength due to insufficient roughness of the pattern area B.

[0042] In some embodiments, refer to Figure 1 and Figure 2 Pattern area B has a continuous structure, meaning that the various parts of pattern area B are connected as a whole. Specifically, pattern area B includes at least one first sub-pattern area B1 and at least one second sub-pattern area B2.

[0043] Each first sub-pattern area B1 extends along the length direction L of the body 210, and each second sub-pattern area B2 is connected to the adjacent first sub-pattern area B1 and extends along the width direction W of the body 210. The first sub-pattern areas B1 and second sub-pattern areas B2 are alternately arranged and connected along the width direction W to form pattern areas B, such as... Figure 1As shown. Alternatively, the first sub-pattern area B1 and the second sub-pattern area B2 are alternately arranged and connected along the length direction L to form pattern area B, as shown. Figure 2 As shown.

[0044] Here, "alternating arrangement" means that the first sub-pattern area B1, the second sub-pattern area B2, the first sub-pattern area B1, the second sub-pattern area B2, and so on are arranged in sequence, and all the first sub-pattern areas B1 and all the second sub-pattern areas B2 are connected together by connecting the beginning and the end; or, the second sub-pattern area B2, the first sub-pattern area B1, the second sub-pattern area B2, the first sub-pattern area B1, and so on are arranged in sequence, and all the first sub-pattern areas B1 and all the second sub-pattern areas B2 are connected together by connecting the beginning and the end.

[0045] Understandably, the length of each first sub-pattern area B1 can be greater than or less than the length of the second sub-pattern area B2. This application does not make a specific limitation, but it can be determined based on the specific positions of the first sub-pattern area B1 and the second sub-pattern area B2 on the body 210.

[0046] In this embodiment, since the patterned region B is formed as a continuous structure, each region of the patterned region B can be used to bond with the silicon rod or crystal holder along its overall extension direction. This creates a continuous contact and bonding surface between the patterned region B and the silicon rod or crystal holder, significantly improving the bonding strength between them. Furthermore, since the first sub-patterned region B1 and the second sub-patterned region B2 extend along different directions, the patterned region B can form adhesive forces with the silicon rod or crystal holder in both the width direction W and the length direction L, further enhancing the bonding strength and thus improving the connection reliability between the bonding plate 200 and the silicon rod or crystal holder.

[0047] In some embodiments, since the dimension of the body 210 in the length direction L (i.e., the length of the body 210) is usually greater than the dimension in the width direction W (i.e., the width of the body 210), the adhesion force between the body 210 and the silicon rod or crystal holder in the length direction L usually needs to be greater than the adhesion force in the width direction W. Therefore, the roughness of the first sub-pattern area B1 can be set to be greater than the roughness of the second sub-pattern area B2.

[0048] In some embodiments, further reference is made to Figure 1There are multiple first sub-pattern areas B1, which are spaced apart along the width direction W. A second sub-pattern area B2 is disposed between the ends of two adjacent first sub-pattern areas B1, forming a U-shaped structure together. For example, there are 4 first sub-pattern areas B1 and 3 second sub-pattern areas B2, which are alternately connected and form an overall "bow" shaped structure.

[0049] In this embodiment, each first sub-pattern area B1 forms an independent bonding area with the silicon rod or crystal holder. By setting multiple spaced first sub-pattern areas B1 in the width direction W, multiple bonding areas extending in the length direction L can be formed between the pattern area B and the silicon rod or crystal holder. Each bonding area can be regarded as providing an independent adhesive force. Therefore, based on the effect of multiple adhesive forces, the bonding effect of the pattern area B in the length direction L can be significantly improved.

[0050] In some embodiments, further reference is made to Figure 2 There are multiple second sub-pattern areas B2, which are spaced apart along the length direction L. A first sub-pattern area B1 is located between the ends of two adjacent second sub-pattern areas B2, forming a U-shaped structure together. Furthermore, the multiple first sub-pattern areas B1 are arranged in at least two rows, with the multiple first sub-pattern areas B1 in each row spaced apart along the length direction L, and adjacent first sub-pattern areas B1 in adjacent rows staggered along the width direction W. For example, the multiple first sub-pattern areas B1 are arranged in two rows, and the multiple second sub-pattern areas B2 together with the multiple first sub-pattern areas B1 form multiple continuous "bow"-shaped structures.

[0051] In this embodiment, since the multiple first sub-pattern areas B1 in each row are spaced apart in the length direction L, and the adjacent first sub-pattern areas B1 in adjacent rows are staggered in the width direction W, the pattern area B and the silicon rod or crystal holder have multiple staggered bonding areas in the length direction L. The multiple staggered bonding areas can improve the bonding effect of the pattern area B in the length direction L.

[0052] In some embodiments, the pattern area B has a discontinuous structure and includes a plurality of spaced third sub-pattern areas B3, which are spaced apart along the length direction L or width direction W of the body 210. For example, as shown... Figure 3 As shown, multiple third sub-pattern areas B3 are spaced apart along the length direction L of the body 210.

[0053] In this embodiment, since the pattern area B has a discontinuous structure, and the multiple third sub-pattern areas B3 of the pattern area B are spaced apart along the length direction L or width direction W of the body 210, during the bonding process, each bonding area of ​​the bonding plate 200 can be bonded to the silicon rod or crystal holder in the same direction, thereby ensuring the bonding reliability between the bonding plate 200 and the silicon rod or crystal holder. Furthermore, this bonding method is simple and can guarantee bonding efficiency.

[0054] It should be noted that, in the above embodiments, in order to further improve the overall roughness of the pattern area B, the overall surface of the pattern area B can also be roughened.

[0055] Figure 4 This is a schematic diagram of a grooved structure on an adhesive plate provided in an embodiment of this application. Figure 5 This is a schematic diagram of another scoring structure on the adhesive plate provided in an embodiment of this application. Figure 6 This is a schematic diagram of another scoring structure on the adhesive plate provided in an embodiment of this application. It should be noted that... Figure 4 , Figure 5 and Figure 6 This is a magnified view of a portion of pattern area B, which shows the specific structural shape of each notch 220.

[0056] Reference Figures 4 to 6 The pattern structure includes multiple spaced grooves 220, meaning that each first sub-pattern area B1, each second sub-pattern area B2, and each third sub-pattern area B3 in the above embodiment has spaced grooves 220 distributed in each region. Each groove 220 can be formed by being recessed inwards along the thickness direction or protruding outwards along the thickness direction.

[0057] In this embodiment, whether the notation 220 is protruding or recessed, the surfaces between adjacent notches 220 and the surface of each notch 220 constitute the bonding surface of the adhesive plate 200. This increases the bonding area between the adhesive plate 200 and the silicon rod or crystal holder, thereby improving the bonding strength between the patterned area B and the silicon rod or crystal holder, and thus enhancing the connection reliability between the adhesive plate 200 and the silicon rod or crystal holder. By controlling the protrusion height or recess depth of the notch 220, the roughness difference between the patterned area B and the non-patterned area A can be controlled. Preferably, the notch 220 is formed by recess, which not only provides stronger adhesion but also prevents glue overflow during the bonding process.

[0058] To ensure consistent bonding strength across different parts of pattern area B, preferably, multiple serrations 220 in the pattern structure are evenly spaced, meaning the serrations 220 are uniformly distributed across pattern area B.

[0059] Therefore, based on the equal spacing of multiple scribes 220 on the pattern area B, each contact area of ​​the pattern area B includes the same number of scribes 220, which can completely eliminate the roughness difference between the contact areas of the pattern area B, thereby ensuring the consistency of the bonding strength between each contact area of ​​the pattern area B and the silicon rod or crystal holder. This avoids the problem of bonding failure in local contact areas and further improves the bonding reliability between the bonding plate 200 and the silicon rod or crystal holder.

[0060] Reference Figures 4 to 6 Each notch 220 in the pattern area B can be formed as a straight notch and / or a curved notch. Straight notches are simple to form and facilitate the formation of notches 220 on the body 210, thus improving the polishing efficiency of the notches 220. Curved notches increase the bonding area between the pattern area B and the silicon rod or substrate at each notch 220, thereby improving the bonding strength between the pattern area B and the silicon rod or substrate, and consequently enhancing the connection reliability between the bonding plate 200 and the silicon rod or substrate. Therefore, multiple notches 220 in the pattern area B can be formed as straight notches, curved notches, or a combination of straight and curved notches; this application does not impose specific limitations.

[0061] Specifically, such as Figure 4 As shown, each notch 220 in pattern area B is formed as a straight notch. Adjacent notches 220 can be parallel or perpendicular to each other in the width direction W of the body 210, for example, in... Figure 1 The etch marks 220 on two adjacent first sub-pattern areas B1 can be parallel or perpendicular to each other. Figure 3 The engravings 220 on two adjacent third sub-pattern areas B3 can be parallel or perpendicular to each other.

[0062] like Figure 5 and Figure 6 As shown, each notch 220 in pattern area B is formed as a curved notch, and Figure 5 and Figure 6 The bends 220 shown are in opposite directions. Specifically, in the width direction W of the body 210, adjacent bends 220 have the same or opposite bend directions; for example, in... Figure 1 The curvature directions of the scribe lines 220 on two adjacent first sub-pattern areas B1 can be the same or opposite. Figure 3 The curvature direction of the engravings 220 on two adjacent third sub-pattern areas B3 can also be the same or opposite.

[0063] In some embodiments, the dimension of each notch 220 in the thickness direction can be 5μm-15μm. Specifically, when the notch 220 is formed by recess, its dimension in the thickness direction is the depth of its inward recess; when the notch 220 is formed by protrusion, its dimension in the thickness direction is the height of its outward protrusion. Exemplarily, the dimension of each notch 220 in the thickness direction can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, etc.

[0064] In this embodiment, by setting the size of each notch 220 in the thickness direction within the above-mentioned range, it is possible to avoid the notch 220 being too large and affecting the structural strength of the adhesive board 200, and the notch 220 being too small and resulting in an insignificant improvement in the bonding effect.

[0065] In some embodiments, the spacing between two adjacent scribe lines 220 along the length direction L of the body 210 is 1 to 10 μm. For example, the spacing between two adjacent scribe lines 220 along the length direction L of the body 210 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc.

[0066] In some embodiments, the spacing between two adjacent scribe lines 220 in the width direction W of the body 210 is 0.5mm to 5mm. For example, the spacing between two adjacent scribe lines 220 in the width direction W of the body 210 can be 0.5μm, 1μm, 1.5μm, 2μm, 2.5μm, 3μm, 3.5μm, 4μm, 4.5μm, 5μm, etc.

[0067] In some embodiments, the pattern structure may be disposed only on the first surface of the body 210 in the thickness direction that contacts the silicon rod, or the pattern structure may be disposed only on the second surface of the body 210 in the thickness direction that contacts the crystal holder.

[0068] Of course, the pattern structure can also be set on the first surface in contact with the silicon rod and the second surface in contact with the crystal holder in the thickness direction of the body 210, and the roughness of the pattern area B on the first surface is greater than the roughness of the pattern area B on the second surface.

[0069] In order to make the roughness of the pattern area B on the first surface greater than the roughness of the pattern area B on the second surface, the size of the scribing 220 in the thickness direction of the pattern structure on the first surface is smaller than the size of the scribing 220 in the thickness direction of the pattern structure on the second surface, and / or the spacing between adjacent scribing 220 in the pattern structure on the first surface is smaller than the spacing between adjacent scribing 220 in the pattern structure on the second surface.

[0070] Figure 7 This is an enlarged schematic diagram of the surface structure of an adhesive plate provided in an embodiment of this application.

[0071] Reference Figure 7 Pattern area B has a discontinuous structure and includes multiple spaced third sub-pattern areas B3. These multiple third sub-pattern areas B3 are spaced along the length direction L of the body 210. Each pattern 220 in pattern area B is a curved scribe, such as an arc-shaped structure, and the curvature directions of the scribes 220 in adjacent third sub-pattern areas B3 are opposite. For example, the scribes 220 are formed by recesses, with each scribe 220 having a recess depth of 10 μm. The distance between two adjacent scribes 220 in the length direction L is 5 μm, while the distance between two adjacent scribes 220 in the width direction W is 2 mm.

[0072] In this embodiment, since the scribe lines 220 in each third sub-pattern area B3 are curved, the curved scribe lines can increase the bonding area between each third sub-pattern area B3 and the silicon rod or crystal holder at each scribe line 220, thereby improving the bonding strength between the pattern area B and the silicon rod or crystal holder, and thus improving the connection reliability between the bonding plate 200 and the silicon rod or crystal holder. Furthermore, setting the curvature directions of the scribe lines 220 in two adjacent third sub-pattern areas B3 to opposite directions allows the two adjacent third sub-pattern areas B3 to mutually cancel out some of the forces that damage the bonding surface, thereby reducing the probability of bonding failure.

[0073] This application embodiment also provides a slicing apparatus, which includes a crystal rod, a crystal support device, and the aforementioned bonding plate 200.

[0074] In order to ensure the bonding strength between the bonding plate 200 and the crystal rod, the two end faces of the crystal rod in the length direction are bonded to the pattern structure of the bonding plate 200, that is, the dimension of the pattern structure on the bonding plate 200 in the length direction of the crystal rod is not less than the length of the crystal rod; and / or, the two end faces of the crystal rod in the width direction are bonded to the pattern structure of the bonding plate 200, that is, the dimension of the pattern structure on the bonding plate 200 in the width direction of the crystal rod is not less than the width of the crystal rod.

[0075] Figure 8 This is a perspective view of the grinding equipment provided in the embodiments of this application. Figure 9 for Figure 8 Left view, Figure 10 for Figure 8 Top view.

[0076] Reference Figure 8The polishing equipment 100 provided in this application embodiment is used to polish a patterned structure on the body 210. Specifically, the polishing equipment 100 includes a fixing mechanism 10, an adjusting mechanism 20, a polishing mechanism 30, and a control mechanism 40.

[0077] The fixing mechanism 10 serves as a support mechanism, which can be used to fix the body 210 and support the adjustment mechanism 20 and the grinding mechanism 30.

[0078] The adjustment mechanism 20 is arranged opposite to the fixing mechanism 10 and connected to the polishing mechanism 30. The adjustment mechanism 20 is used to adjust the position of the polishing mechanism 30 relative to the body 210 so as to polish the pattern structure at different positions of the body 210.

[0079] The polishing mechanism 30 is mounted on the adjusting mechanism 20 and can rotate relative to the adjusting mechanism 20. Different angles of rotation of the polishing mechanism 30 relative to the adjusting mechanism 20 can produce different shaped patterns.

[0080] The control mechanism 40, as an intelligent control mechanism, is connected to the polishing mechanism 30 and the adjustment mechanism 20. It is used to control the adjustment mechanism 20 to adjust the position of the polishing mechanism 30 relative to the body 210 and to control the polishing mechanism 30 to polish the pattern structure on the body 210 to obtain the aforementioned adhesive plate 200. Specifically, an automatic control program can be set in the control mechanism 40. Through automatic control by the program, a pattern structure of a preset shape and size can be polished on the surface of the body 210 according to a predetermined trajectory, thereby forming patterned areas B and non-patterned areas A with different roughnesses on the surface of the body 210.

[0081] In the polishing equipment 100 of this application, based on the cooperation between the fixing mechanism 10, the adjusting mechanism 20, the polishing mechanism 30, and the control mechanism 40, a pattern structure can be automatically polished on the corresponding surface of the body 210, thereby forming a patterned area B and a non-patterned area A with different roughness on the corresponding surface of the body 210. The polishing equipment 100 of this application has a high degree of automation and can completely replace manual polishing. It has high polishing precision, and the size and spacing of the polished pattern structure are more uniform. During use, it can avoid the problem of bonding failure of the adhesive plate 200 in local contact areas. Furthermore, the adjusting mechanism 20 and the polishing mechanism 30 can be adjusted by the control mechanism 40 to achieve polishing adjustment for different product requirements, so as to polish the adhesive plate 200 to meet different usage needs.

[0082] In other words, the polishing equipment 100 of this application can obtain pattern structures of different densities, shapes and sizes to obtain an adhesive plate 200 with pattern areas B of different roughness.

[0083] Reference Figure 9The fixing mechanism 10 includes a fixing frame 11, a clamping unit 12, and a lifting unit 13.

[0084] The fixed frame 11 is used to install and support the clamping unit 12, the lifting unit 13 and the adjusting mechanism 20. The clamping unit 12 is disposed on the fixed frame 11 and is disposed at both ends of the body 210 along the length direction L. The lifting unit 13 is disposed on the fixed frame 11 and is located between the two clamping units 12 in the length direction L.

[0085] Each clamping unit 12 and lifting unit 13 is connected to the control mechanism 40 and operates under the control of the control mechanism 40. The clamping unit 12 is used to clamp the body 210 during grinding and to release the body 210 after grinding. When the clamping unit 12 clamps the body 210, the lifting unit 13 is configured to clamp the middle part of the body 210 in the length direction L to assist the clamping unit 12 in clamping; and when the clamping unit 12 releases the body 210, the lifting unit 13 is configured to act on the body 210 along the width direction W to disengage the body 210 from the clamping unit 12.

[0086] In this embodiment, before grinding, the body 210 can be positioned and installed based on the positions of the two clamping units 12 and the lifting unit 13. During grinding, the clamping units 12 and the lifting unit 13 provide clamping force at different positions, which can improve the stability of the body 210 during the grinding process. After grinding, the lifting unit 13 releases the adhesive plate 200 and acts on the body 210 along the width direction W to complete automatic unloading. Therefore, based on the cooperation of the clamping unit 12, the lifting unit 13 and the control mechanism 40, the stable automatic unloading of the adhesive plate 200 can be achieved, ensuring the stability of the continuous grinding process of the adhesive plate 200.

[0087] Reference Figure 8 and Figure 10 The adjustment mechanism 20 includes a sliding rail 21, a locking unit 22, and a drive unit 23.

[0088] The sliding rail 21 is mounted on the fixed frame 11 and is positioned opposite to the clamping unit 12. The locking unit 22 connects the grinding mechanism 30 to the sliding rail 21. The driving unit 23 is connected to the control mechanism 40 and is configured to drive the grinding mechanism 30 to reciprocate relative to the sliding rail 21 along the length direction L and / or along the width direction W under the action of the control mechanism 40.

[0089] In this embodiment, the grinding mechanism 30 and the sliding track 21 are fixedly connected by the locking unit 22, and the driving unit 23 is controlled by the control mechanism 40 so that the grinding mechanism 30 can reciprocate relative to the sliding track 21 along the length direction L and / or along the width direction W, thereby forming pattern areas B of different shapes on the body 210.

[0090] Specifically, the sliding track 21 includes a first track plate 211 and a second track plate 212. The first track plate 211 is disposed on the fixed frame 11, and the second track plate 212 is slidably connected to the first track plate 211. The locking unit 22 is slidably connected to the second track plate 212. The driving unit 23 includes a first motor (not shown) and a second motor 231. The first motor is connected to the second track plate 212 and is used to drive the second track plate 212 to reciprocate relative to the first track plate 211 along the length direction L. The second motor 231 is connected to the locking unit 22 to drive the locking unit 22 to reciprocate relative to the second track plate 212 along the width direction W.

[0091] For example, when it is necessary to polish the pattern area B with a continuous structure, the control mechanism 40 can first control the first motor and the polishing mechanism 30 to operate simultaneously to form the first sub-pattern area B1 on the surface of the body 210; then, the control mechanism 40 can control the second motor 231 and the polishing mechanism 30 to operate simultaneously to form the second sub-pattern area B2 on the surface of the body 210; and so on. By alternately controlling the first motor and the second motor 231 while the polishing mechanism 30 is operating, a pattern area B1 can be formed on the surface of the body 210. Figure 1 The adhesive board 200 shown.

[0092] When it is necessary to polish the pattern area B with a continuous structure, the control mechanism 40 can first control the second motor 231 and the polishing mechanism 30 to operate simultaneously to form the second sub-pattern area B2 on the surface of the body 210; then, the control mechanism 40 can control the first motor and the polishing mechanism 30 to operate simultaneously to form the first sub-pattern area B1 on the surface of the body 210; and so on. By alternately controlling the first motor and the second motor 231 while the polishing mechanism 30 is operating, a pattern area B1 can be formed on the surface of the body 210. Figure 2 The adhesive board 200 shown.

[0093] When it is necessary to polish the pattern area B with a discontinuous structure, the control mechanism 40 can control the first motor and the polishing mechanism 30 to form a third sub-pattern area B3 on the surface of the body 210; then, the control mechanism 40 can control only the second motor 231 to move, and after the polishing mechanism 30 moves to a new position, the control mechanism 40 can control the first motor and the polishing mechanism 30 to move again to form another third sub-pattern area B3 on the surface of the body 210; and so on, to form on the surface of the body 210. Figure 3 The adhesive board 200 shown.

[0094] In some embodiments, the position of at least a portion of the locking unit 22 can be adjusted relative to the body 210, such as by providing a position-adjustable sheet metal connector, through which the distance between the grinding head 32 and the body 210 is adjusted.

[0095] In some embodiments, refer to Figure 8 and Figure 10 The grinding mechanism 30 includes a third motor 31 and a grinding head 32. The grinding mechanism 30 can be equipped with different types of grinding heads 32 to grind out straight and / or curved marks 220.

[0096] Understandably, the width of a single scribe 220 can be controlled by the diameter of the grinding wheel of the grinding head 32, and the size (such as the depth) of a single scribe 220 can be affected by the angle of the grinding head 32 and the distance between the grinding head 32 and the body 210, which can be adjusted by the locking unit 22; the spacing between adjacent scribes 220 in the length direction L can be determined by the transverse speed of the grinding head 32 on the sliding rail 21, and the spacing in the width direction W can be determined by the lifting speed of the grinding head 5 on the sliding rail 21. All of the above can be adjusted according to requirements.

[0097] Furthermore, for a certain type of grinding head 32, the third motor 31 can be controlled to rotate forward and backward via the control mechanism 40 to grind out different shaped grooves 220. For example, by controlling the forward rotation of the third motor 31, grooves 220 can be formed on the surface of the body 210. Figure 5 The notch 220 shown can be formed on the surface of the body 210 by controlling the reverse rotation of the third motor 31. Figure 6 The notch 220 is shown.

[0098] In some embodiments, refer to Figure 9 The control mechanism 40 may include a display screen 41 and a controller. The controller contains an automatic control program to achieve automatic polishing. The display screen 41 has an operation interface. Through the operation interface, the polishing trajectory, polishing shape, and size can be selected and determined to polish out the pattern area B that meets the usage requirements.

[0099] In some embodiments, refer to Figure 10 The fixed frame 11 includes a main frame 111, a first crossbeam support 112, and a second crossbeam support (not shown).

[0100] The main frame 111 is used to support the first crossbeam support 112 and the second crossbeam support. The first crossbeam support 112 is located at one end of the main frame 111 along the length direction L and is provided with a clamping unit 12 and a lifting unit 13. The second crossbeam support is located at the other end of the main frame 111 along the length direction L and is provided with a sliding rail 21.

[0101] In order to collect the adhesive plate 200 with the patterned structure after polishing, the main frame 111 is formed with a collection cavity C corresponding to the body 210. The collection cavity C can automatically collect the polished adhesive plate 200 after polishing.

[0102] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. An adhesive sheet characterized by comprising: The adhesive plate comprises: a body (210); and a pattern structure arranged on at least one surface of the body (210) in a thickness direction of the body (210) to make the surface have a non-pattern area (A) and a pattern area (B); wherein the roughness of the pattern area (B) is greater than the roughness of the non-pattern area (A).

2. The adhesive plate according to claim 1, wherein the pattern structure comprises a plurality of spaced grooves (220) which are recessed inwardly along the thickness direction or protrude outwardly along the thickness direction; and / or the roughness of the pattern area (B) is 2-5 times the roughness of the non-pattern area (A); and / or the roughness of the non-pattern area (A) is 2-8 μm; and / or the roughness of the pattern area (B) is 5-20 μm.

3. The bonding plate according to claim 1, characterized by the pattern area (B) is a continuous structure and comprises: at least one first sub-pattern area (B1) extending along a length direction (L) of the body (210); and at least one second sub-pattern area (B2) connected with the first sub-pattern area (B1) and extending along a width direction (W) of the body (210); wherein the first sub-pattern area (B1) and the second sub-pattern area (B2) are alternately arranged and connected along the width direction (W) or the length direction (L) to form the pattern area (B).

4. The bonding plate according to claim 3, characterized by the roughness of the first sub-pattern area (B1) is greater than the roughness of the second sub-pattern area (B2).

5. The adhesive plate according to claim 3, wherein the first sub-pattern area (B1) is in a plurality in number, and a plurality of the first sub-pattern areas (B1) are spaced along the width direction (W), and one second sub-pattern area (B2) is arranged between the end portions of two adjacent first sub-pattern areas (B1) to together enclose a U-shaped structure; or the second sub-pattern area (B2) is in a plurality in number, and a plurality of the second sub-pattern areas (B2) are spaced along the length direction (L), and one first sub-pattern area (B1) is arranged between the end portions of two adjacent second sub-pattern areas (B2) to together enclose a U-shaped structure.

6. The bonding plate according to claim 1, wherein the pattern area (B) is a discontinuous structure and comprises a plurality of spaced third sub-pattern areas (B3) which are spaced along the length direction (L) or the width direction (W) of the body (210).

7. The bonding sheet according to any one of claims 1 to 6, wherein the pattern structure comprises a plurality of spaced grooves (220) which are formed as straight grooves and / or curved grooves.

8. The adhesive plate according to claim 7, wherein when the groove (220) is a curved groove, the bending directions of adjacent grooves (220) are the same or opposite in the width direction (W) of the body (210); or when the groove (220) is a straight groove, adjacent grooves (220) are parallel or perpendicular to each other in the width direction (W) of the body (210).

9. The adhesive plate according to claim 7, wherein The size of the notch (220) in the thickness direction is 5-15 μm; and / or, The distance between two adjacent notches (220) in the length direction (L) of the body (210) is 1-10 μm; and / or, The distance between two adjacent notches (220) in the width direction (W) of the body (210) is 0.5 mm-5 mm.

10. The bonding plate according to claim 1, wherein The body (210) has a first surface and a second surface arranged oppositely in the thickness direction; The pattern structure is arranged on the first surface of the body (210); or, the pattern structure is arranged on the first surface and the second surface of the body (210), and the roughness of the pattern area (B) on the first surface is greater than the roughness of the pattern area (B) on the second surface.

11. A slicing apparatus characterized by comprising: The bonding plate according to any one of claims 1-10, the body (210) has a first surface and a second surface arranged oppositely in the thickness direction, the first surface is matched with the crystal bar, and the second surface is matched with the crystal holder, and the pattern structure is arranged at least on the first surface of the body (210).

12. The slicing device according to claim 11, wherein The pattern structure is arranged on the first surface in contact with the silicon bar and the second surface in contact with the crystal holder in the thickness direction of the body (210), and the roughness of the pattern area (B) on the first surface is greater than the roughness of the pattern area (B) on the second surface; The size of the notch (220) in the thickness direction of the pattern structure arranged on the first surface is smaller than the size of the notch (220) in the thickness direction of the pattern structure arranged on the second surface; and / or, the distance between two adjacent notches (220) in the pattern structure arranged on the first surface is smaller than the distance between two adjacent notches (220) in the pattern structure arranged on the second surface.

13. The slicing device according to claim 12, wherein Two end surfaces in the length direction of the crystal bar are arranged at the pattern structure of the bonding plate; and / or, Two end surfaces in the width direction of the crystal bar are arranged at the pattern structure of the bonding plate.

14. A cutting machine characterized by, The slicing device according to any one of claims 11-13.

15. A sharpening apparatus characterized by, It comprises: A fixing mechanism (10) for fixing the body (210) of the bonding plate; An adjusting mechanism (20) arranged oppositely to the fixing mechanism (10); A polishing mechanism (30) arranged on the adjusting mechanism (20) and rotatable relative to the adjusting mechanism (20); And A control mechanism (40) connected with the polishing mechanism (30) and the adjusting mechanism (20), for controlling the adjusting mechanism (20) to adjust the position of the polishing mechanism (30) relative to the body (210) and controlling the polishing mechanism (30) to polish the pattern structure on the body (210).

16. The sharpening apparatus of claim 15, wherein, The fixing mechanism (10) comprises: A fixing frame (11); A clamping unit (12) is arranged on the fixed frame (11) and at both ends of the body (210) along the length direction (L) of the body (210), and is used for clamping or releasing the body (210); and A jacking unit (13) is arranged on the fixed frame (11) and between the two clamping units (12) along the length direction (L); Wherein, the jacking unit (13) is arranged to act on the body (210) along the width direction (W) of the body (210) when the clamping unit (12) releases the body (210), so as to make the body (210) separate from the clamping unit (12).

17. The sharpening apparatus of claim 16, wherein, The adjusting mechanism (20) comprises: A sliding rail (21) is arranged on the fixed frame (11) and opposite to the clamping unit (12); A locking unit (22) connects the polishing mechanism (30) and the sliding rail (21); and A driving unit (23) is connected with the control mechanism (40) and arranged to be able to drive the polishing mechanism (30) to reciprocate along the length direction (L) and / or along the width direction (W) relative to the sliding rail (21) under the action of the control mechanism (40).

18. The polishing device according to claim 17, wherein The sliding rail (21) comprises: a first rail plate (211) arranged on the fixed frame (11); and a second rail plate (212) in sliding connection with the first rail plate (211), and the locking unit (22) is in sliding connection with the second rail plate (212); The driving unit (23) comprises: a first motor connected with the second rail plate (212) and used for driving the second rail plate (212) to reciprocate along the length direction (L) relative to the first rail plate (211); and a second motor (231) connected with the locking unit (22) to drive the locking unit (22) to reciprocate along the width direction (W) relative to the second rail plate (212).

19. The sharpening apparatus of claim 17, wherein, The fixed frame (11) comprises: A main frame (111); A first cross beam support (112) is arranged at one end of the main frame (111) along the length direction (L) and arranged with the clamping unit (12) and the jacking unit (13); and A second cross beam support is arranged at the other end of the main frame (11) along the length direction (L) and arranged with the sliding rail (21).

20. The sharpening apparatus of claim 19, wherein, The main frame (111) is formed with a collection cavity (C) corresponding to the body (210) for collecting the adhesive plate (200) polished with the pattern structure.

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