Electroplating bath body assembly and electroplating equipment

Abstract

The utility model belongs to the technical field of semiconductors, and discloses an electroplating bath body assembly and electroplating equipment. The electroplating bath body assembly comprises an electroplating bath body, a containing cavity is formed in the electroplating bath body, and electroplating liquid is contained in the containing cavity; the electroplating bath body assembly further comprises an air inlet pipe, a diffusion spraying structure and an exhaust pipe, the diffusion spraying structure is arranged at the top of the containing cavity, the air inlet pipe penetrates through the electroplating bath body to be communicated with the diffusion spraying structure, and the diffusion spraying structure can spray evaporation adjusting gas conveyed by the air inlet pipe into the containing cavity and enables the evaporation adjusting gas to be diffused in the containing cavity; the evaporation adjusting gas sprayed into the accommodating cavity can evaporate water on the surface of the electroplating liquid in the accommodating cavity into water vapor so as to change the concentration of the electroplating liquid; the exhaust pipe penetrates through the electroplating bath body and communicates with the top of the containing cavity, and evaporation adjusting gas and water vapor in the containing cavity are exhausted through the exhaust pipe. By adopting the electroplating bath body assembly, the concentration of electroplating liquid can be quickly and efficiently adjusted; and the electroplating bath body assembly is simple in structure and low in production cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to electroplating tank components and electroplating equipment. Background Technology

[0002] A wafer is a silicon chip used to fabricate silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Electroplating a conductive metal layer onto the wafer and then processing this layer to create conductive circuitry is a key process in wafer electroplating. The wafer is placed in an electroplating solution, a negative voltage is applied to the pre-fabricated thin metal layer on the wafer, and a positive voltage is applied to a soluble or insoluble anode. The electric field causes metal ions in the electroplating solution to deposit onto the wafer surface. After electroplating, the wafer and fixture are removed from the electroplating solution, and any remaining electroplating solution on the wafer and fixture surfaces is recovered. The wafer is then washed and dried.

[0003] Currently, in order to save time and space for wafer cleaning, high-end electroplating equipment typically completes both the electroplating and cleaning processes within the electroplating chamber. However, this method causes some of the cleaning solution to fall into the electroplating solution circulation system, resulting in changes in the concentration of the electroplating solution within the circulation system (generally causing passive dilution of the electroplating solution). Changes in the concentration of the electroplating solution affect the electroplating effect on the front side of the wafer, thereby affecting the yield of the entire wafer processing flow. Utility Model Content

[0004] The purpose of this invention is to provide an electroplating tank assembly and electroplating equipment to solve the aforementioned problems existing in the electroplating equipment of the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An electroplating tank assembly includes an electroplating tank body, wherein the electroplating tank body forms a receiving cavity containing an electroplating solution; the electroplating tank assembly further includes:

[0007] An air inlet pipe and a diffusion spray structure are provided. The diffusion spray structure is located at the top of the receiving cavity. The air inlet pipe passes through the electroplating tank and communicates with the diffusion spray structure. The diffusion spray structure can spray the evaporation regulating gas delivered by the air inlet pipe into the receiving cavity and cause the evaporation regulating gas to diffuse within the receiving cavity. The evaporation regulating gas injected into the receiving cavity can cause the water on the surface of the electroplating solution in the receiving cavity to evaporate into water vapor, thereby changing the concentration of the electroplating solution.

[0008] An exhaust pipe passes through the electroplating tank and communicates with the top of the receiving cavity, through which the evaporating regulating gas and water vapor in the receiving cavity are discharged.

[0009] As a preferred embodiment of the above-mentioned electroplating tank assembly, the diffusion spray structure includes a nozzle, the output end of the air inlet pipe is connected to the input port of the nozzle, the nozzle is provided with at least two spray port groups, and the at least two spray port groups spray the evaporation regulating gas in different directions.

[0010] As a preferred embodiment of the above-mentioned electroplating tank assembly, the number of the spray nozzle groups is three, including a first spray nozzle group, a second spray nozzle group, and a third spray nozzle group. The first spray nozzle group sprays the evaporation regulating gas in a direction toward the bottom wall of the receiving cavity. The spray directions of the second spray nozzle group and the third spray nozzle group are symmetrical about the spray direction of the first spray nozzle group and are both distributed at an acute angle to the spray direction of the first spray nozzle group.

[0011] As a preferred embodiment of the above-mentioned electroplating tank assembly, the nozzle is formed with an elongated connecting cavity, which connects the input port and the spray ports in each of the spray port groups, and the length direction of the elongated connecting cavity is the same as the arrangement direction of the spray ports in each of the spray port groups.

[0012] As a preferred embodiment of the above-mentioned electroplating tank assembly, the diameter of the nozzle in each of the nozzle groups is smaller than the diameter of the input port.

[0013] As a preferred embodiment of the above-mentioned electroplating tank assembly, the electroplating tank assembly further includes a temperature regulating structure, which is used to regulate the temperature of the evaporating regulating gas delivered from the air inlet pipe to the diffusion spray structure, so that the temperature of the evaporating regulating gas injected into the receiving cavity is greater than the temperature of the electroplating solution in the receiving cavity.

[0014] As a preferred embodiment of the above-mentioned electroplating tank assembly, the temperature regulation structure includes a heater disposed on the air inlet pipe, the heater being used to heat the evaporation regulating gas delivered from the air inlet pipe to the diffusion jet structure.

[0015] As a preferred embodiment of the above-mentioned electroplating tank assembly, the temperature regulation structure further includes a temperature monitoring element disposed on the air inlet pipe, and the temperature monitoring element is disposed at least downstream of the heater.

[0016] As a preferred embodiment of the above-mentioned electroplating tank assembly, the electroplating tank assembly further includes a flow regulating structure disposed on the air inlet pipe, the flow regulating structure being used to regulate the flow rate of the evaporation regulating gas supplied to the diffusion jet structure.

[0017] As a preferred embodiment of the above-mentioned electroplating tank assembly, the air inlet pipe includes a main air inlet pipe and two sub-air inlet pipes connected to the output end of the main air inlet pipe. The number of nozzles is two, and the number of receiving cavities is two. The two sub-air inlet pipes, the two nozzles, and the two receiving cavities are all arranged in a one-to-one correspondence. The output end of the sub-air inlet pipe is connected to the input port of the nozzle.

[0018] The flow rate and temperature of the evaporative regulating gas in the two intake sub-pipes can be controlled independently.

[0019] Electroplating equipment, including the aforementioned electroplating tank assembly.

[0020] The beneficial effects of this utility model are:

[0021] This utility model provides an electroplating tank assembly and electroplating equipment. The electroplating tank assembly includes an electroplating tank body with a cavity containing an electroplating solution. The assembly also includes an air inlet pipe, a diffusion spray structure, and an exhaust pipe. The diffusion spray structure is located at the top of the cavity. The air inlet pipe passes through the electroplating tank body and connects to the diffusion spray structure. The diffusion spray structure injects evaporation regulating gas supplied by the air inlet pipe into the cavity, causing the evaporation regulating gas to diffuse within the cavity. The evaporation regulating gas injected into the cavity evaporates water on the surface of the electroplating solution, thus changing the concentration of the electroplating solution. The exhaust pipe passes through the electroplating tank body and connects to the top of the cavity, allowing the evaporation regulating gas and water vapor in the cavity to be discharged.

[0022] When the concentration of the electroplating solution in the containment chamber needs to be increased, the air inlet pipe is controlled to deliver evaporation regulating gas. The evaporation regulating gas is injected into the containment chamber through the air inlet pipe and the diffusion jet structure. The evaporation regulating gas directly contacts the water on the surface of the electroplating solution to exchange heat and evaporate the water in the electroplating solution to form water vapor. Compared with the existing technology, this can effectively improve the efficiency of evaporating water in the electroplating solution, and the structure is simple. Secondly, by setting a diffusion jet structure in the containment chamber, the diffusion jet structure can inject the evaporation regulating gas into the containment chamber and allow the evaporation regulating gas to diffuse within the containment chamber. This allows the evaporation regulating gas to be roughly evenly distributed in the containment chamber and to contact the water on the surface of the electroplating solution to exchange heat and evaporate the water in the electroplating solution to form water vapor, thereby further improving the efficiency of evaporating water in the electroplating solution. Finally, the evaporated water vapor is discharged from the exhaust pipe along with the evaporation regulating gas to achieve the purpose of quickly and efficiently adjusting the concentration of the electroplating solution.

[0023] Therefore, the electroplating tank assembly can quickly and efficiently adjust the concentration of the electroplating solution; moreover, the electroplating tank assembly has a simple structure and low production cost. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the electroplating tank assembly provided in a specific embodiment of this utility model;

[0025] Figure 2 This is a partial structural diagram of the electroplating tank assembly provided in a specific embodiment of this utility model. Figure 1 ;

[0026] Figure 3 This is a partial structural diagram of the electroplating tank assembly provided in a specific embodiment of this utility model. Figure 2 ;

[0027] Figure 4 This is a partial structural diagram of the electroplating tank assembly provided in a specific embodiment of this utility model. Figure 3 ;

[0028] Figure 5 This is a schematic diagram of the nozzle structure from a first viewing angle, provided in a specific embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the nozzle structure from a second perspective, provided in a specific embodiment of this utility model.

[0030] In the picture:

[0031] 1. Electroplating tank; 11. Receiving cavity;

[0032] 2. Intake pipe; 21. Main intake pipe; 22. Intake sub-pipe; 23. Pipe connector;

[0033] 3. Exhaust pipe;

[0034] 4. Nozzle; 41. Inlet; 42. Spray nozzle; 43. Connecting cavity;

[0035] 5. Seal the lid. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0037] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0040] After electroplating, to save time and space for wafer cleaning, electroplating and cleaning processes are typically completed within the electroplating chamber of the equipment. The cleaning process, including cleaning the fixture assemblies and / or the wafer itself, can cause some cleaning solution to fall into the electroplating solution within the electroplating chamber.

[0041] In electroplating equipment, the electroplating solution in the electroplating chamber is circulated from the electroplating tank. After electroplating, the metal ion concentration in the electroplating solution in the electroplating chamber decreases. However, through circulation between the electroplating tank and the electroplating chamber, the metal ion concentration in the electroplating chamber remains stable, ensuring the stability of the electroplating process, including the uniformity of the plated metal layer and the electroplating efficiency.

[0042] However, when the cleaning solution falls into the electroplating solution in the electroplating chamber, it dilutes the electroplating solution. The electroplating solution in the chamber mixes with the electroplating solution in the electroplating tank, passively diluting the electroplating solution in the tank and reducing the concentration of metal ions. This affects the yield of the electroplating process, including the uniformity and efficiency of the electroplating. Therefore, to quickly and efficiently stabilize the concentration of the electroplating solution in the electroplating tank to the expected concentration, this invention provides an electroplating tank assembly.

[0043] like Figure 1-4 As shown, the electroplating tank assembly includes an electroplating tank 1, which forms a receiving cavity 11 containing an electroplating solution. The electroplating tank assembly also includes an air inlet pipe 2, a diffusion spray structure, and an exhaust pipe 3. The diffusion spray structure is located at the top of the receiving cavity 11. The air inlet pipe 2 passes through the electroplating tank 1 and communicates with the diffusion spray structure. The diffusion spray structure can spray the evaporation regulating gas delivered by the air inlet pipe 2 into the receiving cavity 11 and cause the evaporation regulating gas to diffuse within the receiving cavity 11. The evaporation regulating gas injected into the receiving cavity 11 can cause the water on the surface of the electroplating solution in the receiving cavity 11 to evaporate into water vapor, thereby changing the concentration of the electroplating solution. The exhaust pipe 3 passes through the electroplating tank 1 and communicates with the top of the receiving cavity 11. The evaporation regulating gas and water vapor in the receiving cavity 11 are discharged through the exhaust pipe 3.

[0044] When the concentration of the electroplating solution in the containment chamber 11 needs to be increased, the air inlet pipe 2 is controlled to deliver evaporation regulating gas. The evaporation regulating gas is injected into the containment chamber 11 through the air inlet pipe 2 and the diffusion jet structure. The evaporation regulating gas directly contacts the water on the surface of the electroplating solution to exchange heat and evaporate the water in the electroplating solution to form water vapor. Compared with the existing technology, this can effectively improve the efficiency of evaporating water in the electroplating solution, and the structure is simple. Secondly, by setting a diffusion jet structure in the containment chamber 11, the diffusion jet structure can inject the evaporation regulating gas into the containment chamber 11 and make the evaporation regulating gas diffuse in the containment chamber 11, so that the evaporation regulating gas is roughly evenly distributed in the containment chamber 11 and contacts the water on the surface of the electroplating solution to exchange heat and evaporate the water in the electroplating solution to form water vapor, thereby further improving the efficiency of evaporating water in the electroplating solution. Finally, the water vapor formed by evaporation is discharged from the exhaust pipe 3 along with the evaporation regulating gas to achieve the purpose of quickly and efficiently adjusting the concentration of the electroplating solution.

[0045] Therefore, the electroplating tank assembly can quickly and efficiently adjust the concentration of the electroplating solution; moreover, the electroplating tank assembly has a simple structure and low production cost.

[0046] Specifically, in this embodiment, nitrogen gas is used as an example for heating, which is evaporated as a regulating gas.

[0047] Among them, such as Figure 2-6As shown, the diffusion injection structure includes a nozzle 4, with the output end of the air inlet pipe 2 connected to the inlet 41 of the nozzle 4. The nozzle 4 is provided with at least two injection port groups, and the injection directions of the at least two injection port groups for injecting the evaporating conditioning gas are different. This arrangement allows the evaporating conditioning gas injected into the receiving cavity 11 to diffuse approximately uniformly within the receiving cavity 11. It is understood that each injection port group includes at least one injection port 42. In this embodiment, each injection port group is exemplaryly configured to include multiple spaced injection ports 42.

[0048] Preferably, in this embodiment, such as Figure 6 As shown, there are three groups of injection nozzles: a first group, a second group, and a third group. The first group injects the evaporative regulating gas towards the bottom wall of the receiving cavity 11. The injection directions of the second and third groups are symmetrical about the injection direction of the first group and are both distributed at an acute angle to it. This arrangement further enhances the effect of relatively uniform diffusion of the evaporative regulating gas injected into the receiving cavity 11.

[0049] In other embodiments, the number of injection port groups can be adjusted to two, four, or five, etc., according to actual operating conditions, and the injection direction of the evaporative regulating gas injected into each injection port group can be adjusted. The goal is to achieve a substantially uniform diffusion of the evaporative regulating gas injected into the receiving cavity 11.

[0050] Preferably, such as Figure 5 and Figure 6 As shown, the nozzle 4 has an elongated connecting cavity 43, which connects the inlet 41 and the nozzles 42 in each nozzle group. The length direction of the elongated connecting cavity 43 is the same as the arrangement direction of the nozzles 42 in each nozzle group. This arrangement can improve the efficiency of the evaporation regulating gas flowing from the inlet 41 to the nozzles 42 in each nozzle group, thereby enabling faster and more efficient adjustment of the concentration of the electroplating solution in the containment cavity 11.

[0051] As an alternative, the nozzle 4 has at least two sub-cavities, with each of the at least two sub-cavities corresponding to at least two injection port groups. Each sub-cavity connects the inlet 41 to the injection port 42 of the corresponding injection port group. This also allows the evaporative regulating gas to be injected from the inlet 41 into the receiving cavity 11. It is understood that the specific structure of the nozzle 4 is not limited, as long as it improves the efficiency of the evaporative regulating gas flowing from the inlet 41 to the injection port 42 of each injection port group.

[0052] Specifically, in this embodiment, such as Figure 5 and Figure 6As shown, an exemplary example is a nozzle 4 having an elongated connecting cavity 43 and an inlet 41 that is circular. In other embodiments, the inlet 41 may also be square, rectangular, or other shapes.

[0053] Preferably, such as Figure 5 and Figure 6 As shown, the diameter of each nozzle 42 in each nozzle group is smaller than the diameter of the inlet 41. This arrangement ensures that the evaporation regulating gas ejected from each nozzle 42 has a certain jetting force, thereby enabling faster and more efficient adjustment of the electroplating solution concentration.

[0054] The electroplating tank assembly also includes a temperature regulation structure. This structure regulates the temperature of the evaporating regulating gas supplied from the air inlet pipe 2 to the diffusion spray structure, ensuring that the temperature of the evaporating regulating gas injected into the receiving cavity 11 is higher than the temperature of the electroplating solution in the receiving cavity 11. This allows the evaporating regulating gas to quickly and efficiently exchange heat with the water on the surface of the electroplating solution, evaporating it to form water vapor, thereby achieving the purpose of regulating the concentration of the electroplating solution in the receiving cavity 11.

[0055] Specifically, the temperature regulating structure includes a heater disposed on the intake pipe 2, which heats the evaporative regulating gas supplied from the intake pipe 2 to the diffusion jet structure. This allows for the regulation of the temperature of the evaporative regulating gas supplied from the intake pipe 2 to the diffusion jet structure. More specifically, the heater is an electric heater or a heat exchanger. Specifically, in this embodiment, the temperature of the evaporative regulating gas is exemplarily stabilized between 40°C and 60°C.

[0056] Preferably, the temperature regulation structure further includes a temperature monitoring device disposed on the air inlet pipe 2, with at least one temperature monitoring device disposed downstream of the heater. This enables accurate control of the temperature of the evaporating regulating gas supplied to the receiving cavity 11, thereby further improving the efficiency and precision of regulating the concentration of the electroplating solution.

[0057] In this embodiment, temperature monitoring devices are preferably installed upstream and downstream of the heater. If the heater is an electric heater, the power of the electric heater is adjusted according to the temperature of the evaporating regulating gas upstream and downstream of the heater, enabling accurate and efficient control of the temperature of the evaporating regulating gas supplied to the receiving cavity 11, thereby further improving the efficiency of regulating the concentration of the electroplating solution. If the heater is a heat exchanger, the temperature of the heat exchange liquid in the heat exchanger is adjusted according to the temperature of the evaporating regulating gas upstream and downstream of the electric heater, also enabling accurate control of the temperature of the evaporating regulating gas supplied to the receiving cavity 11, thereby further improving the efficiency of regulating the concentration of the electroplating solution in the receiving cavity 11. Specifically, the temperature monitoring devices are temperature sensors or thermometers, etc.

[0058] Optionally, the electroplating tank assembly also includes a flow regulating structure disposed on the air inlet pipe 2, the flow regulating structure being used to regulate the flow rate of the evaporation regulating gas supplied to the diffusion jet structure. Specifically, the flow regulating structure includes a flow valve; and / or, the flow regulating structure includes a switching valve.

[0059] Preferably, such as Figure 1-4 As shown, the diameter of exhaust pipe 3 is larger than the maximum diameter of intake pipe 2 to improve the exhaust efficiency of exhaust pipe 3. Alternatively, the diameter of exhaust pipe 3 may be equal to or smaller than the maximum diameter of intake pipe 2.

[0060] Specifically, such as Figure 1-3 As shown, the top of the electroplating tank 1 has an opening that communicates with the receiving cavity 11. The electroplating tank assembly also includes a cover 5, which can cover the top of the electroplating tank 1 and close the opening.

[0061] Optionally, the air inlet pipe 2 includes a main air inlet pipe 21 and two sub-air inlet pipes 22 connected to the output end of the main air inlet pipe 21; there are two nozzles 4 and two receiving cavities 11. The two sub-air inlet pipes 22, the two nozzles 4, and the two receiving cavities 11 are all arranged in a one-to-one correspondence. The output end of the sub-air inlet pipe 22 is connected to the input port 41 of the nozzle 4; the flow rate and temperature of the evaporation regulating gas in the two sub-air inlet pipes 22 can be controlled independently. Specifically, each of the two sub-air inlet pipes 22 is equipped with a set of heaters, temperature monitoring devices, and flow regulation structures. This arrangement allows for the synchronous adjustment of the concentration of the electroplating solution in the two receiving cavities 11, and allows for precise adjustment of the concentration of the electroplating solution in each receiving cavity 11.

[0062] In this embodiment, as Figure 1-6 As shown, an exemplary configuration is provided with two electroplating tanks 1, each with a corresponding receiving cavity 11. In other embodiments, two receiving cavities 11 may also be provided on one electroplating tank 1.

[0063] In this embodiment, each of the two intake sub-pipes 22 is equipped with a set of heaters, temperature monitoring devices, and flow regulation structures. In other embodiments, the heaters, temperature monitoring devices, and flow regulation structures are all located in the intake manifold 21.

[0064] Furthermore, in this embodiment, as Figure 1-4 As shown, the intake pipe 2 also includes a pipe connector 23, and the two intake sub-pipes 22 are connected to the output end of the intake main pipe 21 through the pipe connector 23. Compared with using two intake pipes 2 connected to two nozzles 4 respectively, the pipe layout cost can be reduced. Using two exhaust pipes 3 connected to two receiving cavities 11 respectively can further improve the exhaust efficiency of the exhaust pipes 3.

[0065] Furthermore, in this embodiment, as Figure 1-4As shown, the maximum diameter of the main intake pipe 21 is greater than the diameter of the intake sub-pipe 22, and the maximum diameter of the main intake pipe 21 is smaller than the diameter of the exhaust pipe 3. This ensures that the evaporative regulating gas ejected from each injection port 42 has a certain injection force and high exhaust efficiency, which can improve the efficiency of regulating the concentration of the electroplating solution in the regulating cavity 11.

[0066] Understandably, the number of electroplating tanks 1, the number of cavities 11 on each electroplating tank 1, the number of exhaust pipes 3, the number of nozzles 4, the number of caps 5, the number of sub-inlet pipes 22, the number of heaters, the number of temperature monitoring components, and the number of flow regulation structures can be increased according to actual working conditions.

[0067] This invention also provides electroplating equipment, including the aforementioned electroplating tank assembly. By employing the aforementioned electroplating tank assembly, the concentration of the electroplating solution can be adjusted quickly and efficiently, thereby improving the working efficiency and performance of the electroplating equipment.

[0068] In this embodiment, the exemplary electroplating equipment includes one of the aforementioned electroplating tank components. It is understood that the number of electroplating tank components in the electroplating equipment can be adaptively increased according to actual working conditions.

[0069] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An electroplating bath assembly comprising an electroplating bath body (1) formed with a containing cavity (11) in which an electroplating solution is contained; characterized in that, The electroplating tank body assembly further comprises: an air inlet pipe (2) and a diffusion spraying structure arranged at the top of the accommodating cavity (11), the air inlet pipe (2) communicates with the diffusion spraying structure through the electroplating tank body (1), the diffusion spraying structure can spray the evaporative conditioning air delivered by the air inlet pipe (2) into the accommodating cavity (11) and diffuse the evaporative conditioning air in the accommodating cavity (11); the evaporative conditioning air sprayed into the accommodating cavity (11) can evaporate water on the surface of the electroplating solution in the accommodating cavity (11) into water vapor to change the concentration of the electroplating solution; an air outlet pipe (3) passing through the electroplating tank body (1) and communicating with the top of the accommodating cavity (11), the evaporative conditioning air and water vapor in the accommodating cavity (11) are discharged through the air outlet pipe (3).

2. The electroplating cell body assembly of claim 1, wherein, The diffusion spraying structure comprises a spray head (4), the output end of the air inlet pipe (2) communicates with the input port (41) of the spray head (4), the spray head (4) is provided with at least two groups of spraying ports, and the spraying directions of the evaporative conditioning air sprayed by the at least two groups of spraying ports are different.

3. The electroplating cell body assembly of claim 2, wherein, The number of the groups of spraying ports is three, the three groups of spraying ports comprise a first group of spraying ports, a second group of spraying ports and a third group of spraying ports, the spraying direction of the evaporative conditioning air sprayed by the first group of spraying ports is towards the bottom wall of the accommodating cavity (11), the spraying direction of the evaporative conditioning air sprayed by the second group of spraying ports and the spraying direction of the evaporative conditioning air sprayed by the third group of spraying ports are symmetrical about the spraying direction of the evaporative conditioning air sprayed by the first group of spraying ports and are both distributed at an acute angle with the spraying direction of the evaporative conditioning air sprayed by the first group of spraying ports.

4. The electroplating cell body assembly of claim 2, wherein, The spray head (4) is formed with an elongated communication cavity (43) which communicates the input port (41) and the spraying port (42) in each group of spraying ports, and the length direction of the elongated communication cavity (43) is the same as the arrangement direction of the spraying port (42) in each group of spraying ports.

5. The electroplating cell body assembly of claim 2, wherein, The caliber of the spraying port (42) in each group of spraying ports is smaller than the caliber of the input port (41).

6. The electroplating cell assembly of any one of claims 1-5, wherein, The electroplating tank body assembly further comprises a temperature adjusting structure for adjusting the temperature of the evaporative conditioning air delivered by the air inlet pipe (2) to the diffusion spraying structure, so that the temperature of the evaporative conditioning air sprayed into the accommodating cavity (11) is higher than the temperature of the electroplating solution in the accommodating cavity (11).

7. The electroplating cell body assembly of claim 6, wherein, The temperature adjusting structure comprises a heater arranged on the air inlet pipe (2), the heater is used for heating the evaporative conditioning air delivered by the air inlet pipe (2) to the diffusion spraying structure.

8. The electroplating cell body assembly of claim 7, wherein, The temperature adjusting structure further comprises a temperature monitoring member arranged on the air inlet pipe (2), and the temperature monitoring member is arranged downstream of at least the heater.

9. The electroplating cell assembly of any one of claims 1-5, wherein, The electroplating tank body assembly further comprises a flow adjusting structure arranged on the air inlet pipe (2), the flow adjusting structure is used for adjusting the flow of the evaporative conditioning air delivered to the diffusion spraying structure.

10. The electroplating cell assembly of any one of claims 2-5, wherein, The intake pipe (2) comprises an intake manifold (21) and two intake sub-pipes (22) communicated with the output end of the intake manifold (21), the number of the spray heads (4) is two, the number of the accommodating cavities (11) is two, two intake sub-pipes (22), two spray heads (4) and two accommodating cavities (11) are arranged in one-to-one correspondence, the output end of the intake sub-pipe (22) is communicated with the input port (41) of the spray head (4); The flow and temperature of the evaporation regulating gas in the two intake sub-pipes (22) can be controlled respectively and individually.

11. A plating apparatus characterized by comprising: An electroplating cell assembly comprising the cell body assembly of any one of claims 1-10.

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