Glue filling liquid supply pump

Abstract

The utility model discloses a glue filling liquid supply pump, and belongs to the technical field of liquid supply pumps. The liquid supply pump comprises a shell, a support, a rotor, an impeller, a winding and a circuit board, the shell sleeves the support, the shell and the support define an inner cavity, the rotor is installed on the support, the impeller is installed on the rotor, the rotor and the impeller are arranged in the inner cavity, the winding and the circuit board are installed at the end, away from the inner cavity, of the support, and the circuit board is connected with the winding. The end, away from the inner cavity, of the shell is filled with pouring sealant, the support is arranged between the shell and the second pouring sealant, and the circuit board is arranged in the second pouring sealant. According to the utility model, the positioning step of the bottom cover is canceled, the potting process step is reduced, and the problem of complex process of potting adhesive sealing in the prior art is solved.

Description

Technical Field

[0001] This utility model belongs to the field of liquid supply pump technology, specifically a glue dispensing liquid supply pump. Background Technology

[0002] The Chinese invention patent, published on June 14, 2024, under the publication number CN 118188391 A, describes a high-sealing liquid supply pump. The outer casing is fitted onto a bracket, and the rotor, impeller, and windings are all located in the inner cavity between the outer casing and the bracket. The circuit board is installed on the end of the bracket away from the inner cavity. The end of the bracket away from the inner cavity is sealed by a bottom cover and potting compound. This structure requires positioning the bottom cover and then sealing it with potting compound, which presents a complex manufacturing process. Utility Model Content

[0003] Purpose of the utility model: To provide a dispensing liquid supply pump that reduces the number of steps in the dispensing process.

[0004] The technical solution of this utility model is as follows: a potting liquid supply pump includes: a shell, a bracket, a rotor, an impeller, a winding, a circuit board, a first potting compound, and a second potting compound.

[0005] The outer shell is fitted onto the bracket, and the outer shell and the bracket together enclose an inner cavity.

[0006] The rotor and windings are mounted on the bracket, the impeller is mounted on the rotor, the rotor, impeller and windings are disposed in the inner cavity, and the windings are disposed in the first potting compound.

[0007] The circuit board is mounted on the end of the bracket away from the inner cavity, and the circuit board is connected to the winding.

[0008] The end of the outer shell away from the inner cavity is filled with a second potting compound, so that the bracket is disposed between the outer shell and the second potting compound, and the circuit board is disposed within the second potting compound.

[0009] In a further embodiment, the outer shell is provided with a stepped portion, and the end face of the bracket near the inner cavity is connected to the end face of the stepped portion.

[0010] In a further embodiment, the inner wall of the housing and the outer wall of the bracket are fitted with a clearance, and the sealing between the housing and the bracket is further ensured by the stepped portion and the fit between the inner wall of the housing and the outer wall of the bracket.

[0011] In a further embodiment, the bracket includes a base plate with a through hole. The first potting compound and the second potting compound are connected in the through hole. The through hole allows the first potting compound to flow to the bottom of the winding during the potting process, and also improves the overall structural strength of the components at both ends of the bracket.

[0012] In a further embodiment, the base plate is provided with an annular boss for supporting the first potting compound. The boss surrounds the through hole and can position the first potting compound after it has solidified.

[0013] In a further embodiment, a gap is provided between the outer wall of the end of the bracket away from the inner cavity and the inner wall of the outer shell. The gap is filled with a second potting compound, which increases the contact area between the second potting compound and the bracket and the outer shell, thereby improving the connection strength.

[0014] The beneficial effects of this utility model are: This application directly uses potting compound to set the bracket and circuit board as a whole between the outer shell and the second potting compound, and seals the end of the bracket away from the inner cavity at the same time completing the step of installing the bracket into the outer shell. Based on the prior art, the positioning step of the bottom cover is eliminated, the potting process steps are reduced, and the problem of complex process of potting compound sealing in the prior art is solved. Attached Figure Description

[0015] Figure 1 This is a cross-sectional schematic diagram of the present invention.

[0016] The attached figures are labeled as follows: 1. Housing; 2. Support; 3. Rotor; 4. Impeller; 5. Winding; 6. Circuit board; 7. First potting compound; 8. Second potting compound. Detailed Implementation

[0017] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0018] This utility model discloses a glue-supply pump, which reduces the number of steps in the potting process.

[0019] like Figure 1 The liquid supply pump shown includes: housing 1, bracket 2, rotor 3, impeller 4, winding 5, circuit board 6, first potting compound 7, and second potting compound 8.

[0020] The outer shell 1 is fitted onto the bracket 2, and the outer shell 1 and the bracket 2 together form an inner cavity.

[0021] The rotor 3 and winding 5 are mounted on the bracket 2, and the impeller 4 is mounted on the rotor 3. The rotor 3, impeller 4 and winding 5 are arranged in the inner cavity. The winding 5 is arranged in the first potting compound 7. The first potting compound 7 is provided with a receiving cavity. The rotor 3 is arranged in the receiving cavity. The rotor 3 and winding 5 are positioned correspondingly, so that the rotor 3 can drive the impeller 4 to rotate.

[0022] Circuit board 6 is mounted on the end of bracket 2 away from the inner cavity, and circuit board 6 is connected to winding 5.

[0023] The end of the outer shell 1 away from the inner cavity is filled with a second potting compound 8, so that the bracket 2 is disposed between the outer shell 1 and the second potting compound 8, and the circuit board 6 is disposed within the second potting compound 8.

[0024] like Figure 1 The outer casing 1 shown has a stepped portion, and the end face of the bracket 2 near the inner cavity is connected to the end face of the stepped portion.

[0025] The inner wall of the outer casing 1 and the outer wall of the bracket 2 near the inner cavity are fitted with a clearance.

[0026] like Figure 1 The bracket 2 shown includes: a base plate with a through hole, and a first potting compound 7 and a second potting compound 8 connected within the through hole.

[0027] The base plate is provided with an annular boss for supporting the first potting compound 7, and the boss surrounds the through hole.

[0028] like Figure 1 There is a gap between the outer wall of the bracket 2 away from the inner cavity and the inner wall of the outer shell 1, and the gap is filled with a second potting compound 8.

[0029] In the above embodiments, the installation of conductive lines on circuit board 6, the positions of through holes and bosses, the installation method of winding 5 and the potting method of first potting compound 7, the connection method between circuit board 6 and winding 5, and the filling of gaps with second potting compound 8 are existing technologies and will not be limited here.

[0030] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and detail may be made to the present invention without departing from the spirit and scope of the appended claims.

Claims

1. A dispensing liquid supply pump, characterized in that, The utility model relates to a motor, including: A housing, a bracket, a rotor, an impeller, a winding, a circuit board, a first potting adhesive and a second potting adhesive; The housing is sleeved on the bracket, and the housing and the bracket enclose an inner cavity; The rotor and the winding are installed on the bracket, the impeller is installed on the rotor, the rotor, the impeller and the winding are arranged in the inner cavity, and the winding is arranged in the first potting adhesive; The circuit board is installed on the end of the bracket away from the inner cavity, and the circuit board is connected with the winding; The end of the housing away from the inner cavity is filled with the second potting adhesive, the bracket is arranged between the housing and the second potting adhesive, and the circuit board is arranged in the second potting adhesive.

2. The pump of claim 1, wherein, The housing is provided with a stepped portion, and the end face of the bracket close to the inner cavity is connected with the end face of the stepped portion.

3. The pump of claim 2, wherein, The inner wall of the housing and the outer wall of the bracket are gap-fitted.

4. The pump of claim 1, wherein, The bracket includes a bottom plate provided with a through hole, and the first potting adhesive and the second potting adhesive are connected in the through hole.

5. The pump of claim 4, wherein the pump is a pump for dispensing a liquid adhesive. An annular boss for supporting the first potting adhesive is arranged on the bottom plate and surrounds the through hole.

6. The pump of claim 1, wherein, The outer wall of the end of the bracket away from the inner cavity is spaced apart from the inner wall of the housing by a gap, and the gap is filled with the second potting adhesive.

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