Die assembly oil cylinder of semiconductor sealing and testing equipment

Abstract

The utility model discloses a mold closing oil cylinder of semiconductor sealing and testing equipment, which comprises an adapter tube communicated with a mold closing oil cylinder body, a lifting sleeve is arranged in the adapter tube, the inner wall of the lifting sleeve is fixedly connected with a filter screen I and a connecting frame, and one side of the filter screen I is fixedly connected with a connecting rod. When hydraulic oil flows to the adapter from the inside of the mold closing oil cylinder, the hydraulic oil bursts open the filter screen II, so that the filter screen II turns over towards one side close to the filter screen I around the axis of the rotating shaft, and scraps mixed in the hydraulic oil can enter the middle of the filter screen I and the connecting frame and are intercepted by the filter screen I; when the hydraulic oil flows in the reverse direction, the hydraulic oil flushes the second filter screens to the original positions, the multiple second filter screens can be completely closed through cooperation of the baffles, chippings located between the first filter screens and the connecting frame are prevented from flowing into the mold closing oil cylinder again, and therefore abrasion is reduced, and the service life is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of die closing cylinders, and particularly relates to a die closing cylinder for semiconductor packaging and testing equipment. Background Art

[0002] Packaging and testing is the back-end process of semiconductor manufacturing, ensuring the connection between the chip and the external circuit and protecting the chip from physical and chemical damage. During the packaging process, the mold needs to be precisely closed to inject packaging materials such as epoxy resin. The role of the die closing cylinder is to provide sufficient pressure to ensure that the mold is tightly closed under high temperature and high pressure, avoid material leakage, and ensure the integrity and accuracy of the packaging.

[0003] During the long-term use of the die closing cylinder, the piston will be worn. The debris generated by the wear will accelerate the wear of the piston in the hydraulic oil, resulting in a low service life of the die closing cylinder. For this reason, we propose a die closing cylinder for semiconductor packaging and testing equipment that can timely handle the debris of piston wear. Content of the Utility Model

[0004] In view of the problems in the prior art, the utility model proposes the following technical solutions:

[0005] A die closing cylinder for semiconductor packaging and testing equipment includes a transfer pipe connected to the cylinder body of the die closing cylinder. A lifting sleeve is arranged inside the transfer pipe. A first filter screen and a connecting frame are fixedly connected to the inner wall of the lifting sleeve. A connecting rod is fixedly connected to one side of the first filter screen. The end of the connecting rod far from the first filter screen is fixedly connected to a baffle. The connecting frame is fixedly connected to a rotating shaft. A second filter screen is rotatably connected to the rotating shaft. The side of the second filter screen far from the first filter screen abuts against the side of the baffle close to the connecting rod.

[0006] Preferably, an elastic member is fixedly connected to the side wall of the second filter screen, and the end of the elastic member far from the second filter screen is fixed on the side wall of the connecting frame.

[0007] Preferably, a hook is fixedly connected to the side wall of the lifting sleeve. A slot is opened on the side of the transfer pipe far from the die closing cylinder. The hook is inserted into the slot.

[0008] Preferably, the end of the hook far from the lifting sleeve is in a "middle" shape, and the convex part thereof fits with the side wall of the slot.

[0009] Preferably, the cylinder body of the die closing cylinder includes an outer layer, an intermediate layer, and an inner layer. The material of the outer layer is titanium alloy, the material of the intermediate layer is beryllium copper alloy, and the material of the inner layer is silicon nitride ceramic.

[0010] The beneficial effects of the utility model are as follows:

[0011] 1. When hydraulic oil flows from the inside of the mold closing cylinder to the transfer pipe, the hydraulic oil will push the second filter screen open, causing it to flip around the axis of the rotating shaft towards the side closer to the first filter screen. At this time, the debris mixed in the hydraulic oil will come to the middle of the first filter screen and the connecting frame, and be intercepted by the first filter screen, preventing it from entering the hydraulic station. When the hydraulic oil flows in the reverse direction, the hydraulic oil will push the second filter screen back to its original position. Through the cooperation of the baffle, multiple second filters will be completely closed, preventing the debris located between the first filter screen and the connecting frame from flowing back into the mold closing cylinder, thereby reducing wear and improving service life. Attached Figure Description

[0012] Figure 1 The diagram shown is a structural schematic of the mold-closing cylinder of the semiconductor packaging and testing equipment in the embodiment;

[0013] Figure 2 The diagram shown is a schematic representation of the transfer pipe in the embodiment.

[0014] Explanation of reference numerals in the attached figures:

[0015] 10. Adapter pipe; 20. Lifting sleeve; 21. Filter screen one; 22. Connecting frame; 23. Rotary shaft; 24. Filter screen two; 25. Elastic element; 26. Connecting rod; 27. Baffle; 28. Hook. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0017] Example

[0018] like Figure 1 and Figure 2 As shown, the mold closing cylinder of the semiconductor packaging and testing equipment includes a transfer pipe 10 connected to the cylinder body of the mold closing cylinder. The transfer pipe 10 is provided with a lifting sleeve 20. The inner wall of the lifting sleeve 20 is fixedly connected to a filter screen 21 and a connecting frame 22. The connecting frame 22 is shaped as an outer circle and an inner square. A connecting rod 26 is fixedly connected to one side of the filter screen 21. A baffle 27 is fixedly connected to the end of the connecting rod 26 away from the filter screen 21. A rotating shaft 23 is fixedly connected to the connecting frame 22. A second filter screen 24 is rotatably connected to the rotating shaft 23. The side of the second filter screen 24 away from the filter screen 21 abuts against the side of the baffle 27 near the connecting rod 26.

[0019] Specifically, when the mold clamping oil cylinder is working, hydraulic oil will flow inside the adapter pipe 10. When the hydraulic oil flows from the inside of the mold clamping oil cylinder to the adapter pipe 10, the hydraulic oil will flush open the second filter screen 24, causing it to flip to the side closer to the first filter screen 21 around the axis of the rotating shaft 23. At this time, the debris mixed in the hydraulic oil will come between the first filter screen 21 and the connecting frame 22, and will be intercepted by the first filter screen 21, preventing it from entering the hydraulic station. When the hydraulic oil flows in the reverse direction, the hydraulic oil will flush the second filter screen 24 back to its original position, and through the cooperation of the baffle 27, multiple second filter screens 24 will be completely closed, preventing the debris located between the first filter screen 21 and the connecting frame 22 from flowing into the mold clamping oil cylinder again, thereby reducing wear and increasing the service life.

[0020] As Figure 2 shown, an elastic member 25 is fixedly connected to the side wall of the second filter screen 24, and the end of the elastic member 25 away from the second filter screen 24 is fixed on the side wall of the connecting frame 22.

[0021] Specifically, the elastic member 25 is preferably but not limited to a torsion spring. By setting the elastic member 25, when the hydraulic oil stops flowing, it will push the second filter screen 24 to immediately flip to the side closer to the baffle 27, preventing the debris located between the first filter screen 21 and the connecting frame 22 from flowing into the mold clamping oil cylinder again.

[0022] As Figure 2 shown, a lifting hook 28 is fixedly connected to the side wall of the lifting sleeve 20, and a slot is opened on the side of the adapter pipe 10 away from the mold clamping oil cylinder, and the lifting hook 28 is inserted into the slot.

[0023] Specifically, both the lifting sleeve 20 and the lifting hook 28 are located inside the adapter pipe 10, so as not to affect the connection between the adapter pipe 10 and the pipeline. Through the lifting hook 28, the lifting sleeve 20 can be prevented from falling into the connection part between the adapter pipe 10 and the cylinder body of the mold clamping oil cylinder, and at the same time, it is convenient to take out the lifting sleeve 20 from it.

[0024] As Figure 2 shown, the end of the lifting hook 28 away from the lifting sleeve 20 is in the shape of a "middle" character, and its protruding part fits against the side wall of the slot.

[0025] Specifically, the lifting hook 28 is made of an elastic material, preferably ABS plastic, to increase the friction with the slot and ensure the stability of the lifting sleeve 20.

[0026] As Figure 1 and Figure 2 shown, the cylinder body of the mold clamping oil cylinder includes an outer layer, a middle layer and an inner layer. The material of the outer layer is titanium alloy, the material of the middle layer is beryllium copper alloy, and the material of the inner layer is silicon nitride ceramic.

[0027] Specifically, titanium alloys have a tensile strength ≥1000MPa, a yield strength ≥830MPa, and can withstand high-frequency impact loads of >1 million times. Their fatigue life is 5 times longer than that of traditional 45# steel.

[0028] Beryllium copper alloy has high thermal conductivity, reaching 210 W / m·K. Combined with a honeycomb microchannel design, the axial thermal resistance is reduced to 0.05 K·m / W.

[0029] The surface of silicon nitride ceramic is polished to Ra≤0.01μm (mirror finish), with a friction coefficient as low as 0.05, which can reduce piston rod friction power consumption by >60%.

[0030] The composite cylinder block, composed of titanium alloy, beryllium copper alloy, and silicon nitride ceramic, has a strength of 380 MPa·cm. 3 / g, thermal conductivity uniformity is axial ΔT 1.2℃ / m, wear resistance life is 50,000 hours, and accuracy retention is drift <0.1μm per year.

[0031] Working principle: When the mold clamping cylinder is working, hydraulic oil flows inside the transfer pipe 10. When the hydraulic oil flows from the inside of the mold clamping cylinder to the transfer pipe 10, it pushes open the filter screen 24, causing it to flip around the axis of the rotating shaft 23 towards the side closer to the filter screen 21. At this time, the debris mixed in the hydraulic oil will come to the middle of the filter screen 21 and the connecting frame 22, and be intercepted by the filter screen 21, preventing it from entering the hydraulic station. By setting the elastic element 25, when the hydraulic oil stops flowing, it will push the filter screen 24 to immediately flip towards the side closer to the baffle 27. The baffle 27 will make multiple filter screens 24 completely close, preventing debris located between the filter screen 21 and the connecting frame 22 from flowing back into the mold clamping cylinder, reducing wear, and increasing service life.

[0032] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A clamp cylinder for a semiconductor bonder, comprising an adapter tube (10) in communication with a clamp cylinder body, characterized by: The inside of the adapter pipe (10) is provided with a pull-out sleeve (20), the inner wall of the pull-out sleeve (20) is fixedly connected with a filter screen one (21) and a connecting frame (22), one side of the filter screen one (21) is fixedly connected with a connecting rod (26), the end of the connecting rod (26) away from the filter screen one (21) is fixedly connected with a baffle (27), the connecting frame (22) is fixedly connected with a rotating shaft (23), the rotating shaft (23) is rotatably connected with a filter screen two (24), the side of the filter screen two (24) away from the filter screen one (21) is abutted with the side of the baffle (27) close to the connecting rod (26).

2. The clamp cylinder of the semiconductor encapsulation apparatus according to claim 1, wherein The side wall of the filter screen two (24) is fixedly connected with an elastic member (25), the end of the elastic member (25) away from the filter screen two (24) is fixed on the side wall of the connecting frame (22).

3. The clamp cylinder of claim 1, wherein, The side wall of the pull-out sleeve (20) is fixedly connected with a hook (28), the side of the adapter pipe (10) away from the mold oil cylinder is provided with a slot, the hook (28) is inserted into the slot.

4. The clamp cylinder of claim 3, wherein, The end of the hook (28) away from the pull-out sleeve (20) is in the shape of "middle", the convex part of which is attached to the side wall of the slot.

5. The clamp cylinder of claim 1, wherein, The mold oil cylinder body comprises an outer layer, an intermediate layer and an inner layer, the material of the outer layer is titanium alloy, the material of the intermediate layer is beryllium copper alloy, and the material of the inner layer is silicon nitride ceramic.

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