Quick heating type ceramic semiconductor heating device

Abstract

The utility model relates to the technical field of heating devices, in particular to a quick-heating type ceramic semiconductor heating device, which improves the heating effect on a heat conduction pipe, does not damage a heat conduction piece and the heat conduction pipe even if the heating is dry burning, and improves the use safety and reliability. Comprising a heat conduction piece and a groove arranged on the outer side wall of the heat conduction piece. The ceramic heating assembly is arranged in the heat conduction piece, the heat conduction pipe is embedded in the groove, the heat conduction pipe is wound outside the heat conduction piece in a snakelike mode, the cold water opening is communicated with the input end of the heat conduction pipe, the hot water opening is communicated with the output end of the heat conduction pipe, and the ceramic heating assembly is arranged in the heat conduction piece. The ceramic heating assembly is used for heating the heat conduction piece.

Description

Technical Field

[0001] This utility model relates to the technical field of heating devices, and in particular to a rapid-heating ceramic semiconductor heating device. Background Technology

[0002] Rapid heating ceramic semiconductor heating devices are high-efficiency heating devices that utilize the resistive properties of semiconductor materials. By passing an electric current through the ceramic material, the device generates heat. This type of device can heat objects quickly and evenly, and can precisely control the temperature, thus having broad application prospects in various fields.

[0003] Currently, among existing heating equipment, such as the patent with authorization announcement number CN201443795U, this utility model discloses a resistance wire heating furnace. It has the advantages of simple structure, convenient use, high heating efficiency, and multiple uses. Its structure is as follows: it includes a furnace body, in which a resistance wire heating device is installed. The device is surrounded by a water jacket, on which inlet pipe and outlet pipe are provided. The resistance wire heating device is connected to the power distribution device at the bottom of the furnace body.

[0004] However, it was found during the use of the equipment that it was prone to burning out when dry, which reduced its reliability and safety. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a rapid-heating ceramic semiconductor heating device that improves the heating effect of the heat-conducting pipe, prevents damage to the heat-conducting components and heat-conducting pipe during dry heating, and improves the safety and reliability of use.

[0006] This utility model discloses a rapid-heating ceramic semiconductor heating device, comprising a heat-conducting element and a groove, the groove being disposed on the outer wall of the heat-conducting element; it also includes a ceramic heating assembly, a heat-conducting pipe, a cold water inlet, and a hot water inlet. The heat-conducting pipe is embedded inside the groove and is serpentinely wound around the outside of the heat-conducting element. The cold water inlet is connected to the input end of the heat-conducting pipe, and the hot water inlet is connected to the output end of the heat-conducting pipe. The ceramic heating assembly is disposed inside the heat-conducting element and is used to heat the heat-conducting element; cold water is supplied to the inside of the heat-conducting pipe through the cold water inlet, and the ceramic heating assembly heats the heat-conducting element. The device heats the heat-conducting component, which in turn heats the heat-conducting pipe through heat conduction. This, in turn, heats the cold water flowing inside the heat-conducting pipe through heat conduction. The heated water is then discharged through the hot water outlet. By incorporating grooves, the contact area between the heat-conducting component and the heat-conducting pipe is increased, improving the heating effect on the heat-conducting pipe. Since the maximum heating temperature of the ceramic heating component is 300°C, while the heat-conducting component and heat-conducting pipe can withstand high temperatures of 500°C, dry heating will not damage the heat-conducting component and heat-conducting pipe even when there is no water inside, thus improving the safety and reliability of the device.

[0007] Preferably, the ceramic heating assembly includes a cover plate, a mounting groove, a PTC heating element, and a terminal block. The cover plate is installed on the top of the heat-conducting component, the mounting groove is located inside the heat-conducting component, the PTC heating element is installed inside the mounting groove, and the terminal block is connected to the top of the PTC heating element. By providing the mounting groove, the ease of installation and positioning of the PTC heating element is improved. By energizing the PTC heating element through the terminal block, the PTC heating element heats the heat-conducting component, thereby improving the processing convenience of the device.

[0008] Preferably, the heat-conducting component includes a first heat-conducting half and a second heat-conducting half, which are assembled into a whole facing each other. Grooves are respectively provided on the outer walls of the first and second heat-conducting half, and heat-conducting tubes are wound around the outer walls of the first and second heat-conducting half. The bottom end of the cover plate is connected to the top end of the first and second heat-conducting half, and the mounting groove is provided inside the first and second heat-conducting half. By assembling the first and second heat-conducting half into a whole to enclose the PTC heating core, the convenience of maintenance and replacement of the PTC heating core is improved.

[0009] Preferably, it also includes multiple sets of screws, all of which are fitted together on the first and second heat-conducting halves; by setting multiple sets of screws, the assembly convenience between the first and second heat-conducting halves is improved.

[0010] Preferably, it also includes a connector, which is installed on the outer wall of the first and second heat-conducting halves; improving the convenience of fixed installation of the device.

[0011] Preferably, both the heat-conducting component and the heat-conducting pipe are made of high-temperature resistant metal.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: cold water is transported to the inside of the heat-conducting pipe through the cold water inlet, and the heat-conducting component is heated by the ceramic heating component. The heat-conducting component heats the heat-conducting pipe through heat conduction, thereby heating the cold water flowing inside the heat-conducting pipe through heat conduction. The heated water is discharged through the hot water inlet. By setting grooves, the contact area between the heat-conducting component and the heat-conducting pipe is increased, improving the heating effect on the heat-conducting pipe. Since the maximum heating temperature of the ceramic heating component is 300°, when there is no water in the heat-conducting pipe, dry burning at the heating temperature will not damage the heat-conducting component and the heat-conducting pipe, thus improving the safety and reliability of the device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the isometric structure of this utility model;

[0014] Figure 2 This is an isometric structural diagram of the heat-conducting component and the groove;

[0015] Figure 3 This is a partial isometric structural diagram of the first heat-conducting half-plate and the screw;

[0016] Figure 4 This is an isometric structural diagram of the first and second heat-conducting halves;

[0017] Figure 5 This is a partial isometric structural diagram of the PTC heating element and the wiring terminals.

[0018] The following are labels in the attached diagram: 1. Heat-conducting component; 2. Groove; 3. Heat-conducting pipe; 4. Cold water inlet; 5. Hot water inlet; 6. Cover plate; 7. Mounting groove; 8. PTC heating element; 9. Wiring terminal; 10. First heat-conducting half plate; 11. Second heat-conducting half plate; 12. Screw; 13. Connector. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete. Example 1

[0020] like Figures 1 to 5 As shown, this utility model discloses a rapid-heating ceramic semiconductor heating device, including a heat-conducting element 1 and a groove 2, the groove 2 being disposed on the outer wall of the heat-conducting element 1; it also includes a ceramic heating assembly, a heat-conducting pipe 3, a cold water inlet 4, and a hot water inlet 5, the heat-conducting pipe 3 being embedded inside the groove 2 and serpentinely wound around the outside of the heat-conducting element 1, the cold water inlet 4 being connected to the input end of the heat-conducting pipe 3, the hot water inlet 5 being connected to the output end of the heat-conducting pipe 3, and the ceramic heating assembly being disposed inside the heat-conducting element 1, the ceramic heating assembly being used to heat the heat-conducting element 1;

[0021] like Figure 3 As shown, the ceramic heating assembly includes a cover plate 6, a mounting groove 7, a PTC heating core 8, and a wiring terminal 9. The cover plate 6 is installed on the top of the heat-conducting component 1, the mounting groove 7 is located inside the heat-conducting component 1, the PTC heating core 8 is installed inside the mounting groove 7, and the wiring terminal 9 is connected to the top of the PTC heating core 8.

[0022] In this embodiment, cold water is supplied to the heat pipe 3 through the cold water inlet 4. The heat-conducting element 1 is heated by the ceramic heating assembly, which in turn heats the heat pipe 3 through heat conduction. This heat conduction heats the cold water flowing inside the heat pipe 3. The heated water is discharged through the hot water inlet 5. By setting the groove 2, the contact area between the heat-conducting element 1 and the heat pipe 3 is increased, thereby improving the heating effect on the heat pipe 3. Since the maximum heating temperature of the ceramic heating assembly is 300°C, while the heat-conducting element 1 and the heat pipe 3 can withstand high temperatures of 500°C, dry heating will not damage the heat-conducting element 1 and the heat pipe 3 when there is no water inside the heat pipe 3, thus improving the safety and reliability of the device. Example 2

[0023] Based on Example 1, such as Figure 3 As shown, this utility model discloses a rapid-heating ceramic semiconductor heating device. The heat-conducting component 1 includes a first heat-conducting half plate 10 and a second heat-conducting half plate 11. The first heat-conducting half plate 10 and the second heat-conducting half plate 11 are assembled into a whole with front and rear facing each other. Grooves 2 are respectively provided on the outer walls of the first heat-conducting half plate 10 and the second heat-conducting half plate 11. Heat-conducting pipes 3 are wound around the outer walls of the first heat-conducting half plate 10 and the second heat-conducting half plate 11. The bottom end of the cover plate 6 is connected to the top end of the first heat-conducting half plate 10 and the second heat-conducting half plate 11. The mounting groove 7 is provided inside the first heat-conducting half plate 10 and the second heat-conducting half plate 11.

[0024] like Figure 2 As shown, it also includes multiple sets of screws 12, which are all fitted onto the first heat-conducting half plate 10 and the second heat-conducting half plate 11.

[0025] like Figure 2 As shown, it also includes a connector 13, which is installed on the outer wall of the first heat-conducting half plate 10 and the second heat-conducting half plate 11;

[0026] like Figure 1 As shown, both the heat-conducting component 1 and the heat-conducting pipe 3 are made of high-temperature resistant metal.

[0027] In this embodiment, by setting the mounting slot 7, the ease of installation and positioning of the PTC heating element 8 is improved. The PTC heating element 8 is energized through the wiring terminal 9, thereby heating the heat-conducting element 1, which improves the processing convenience of the device. By assembling the first heat-conducting half piece 10 and the second heat-conducting half piece 11 into a whole to wrap the PTC heating element 8, the convenience of maintenance and replacement of the PTC heating element 8 is improved.

[0028] This utility model discloses a rapid heating ceramic semiconductor heating device. When in operation, cold water is delivered to the interior of the heat-conducting pipe 3 through the cold water inlet 4. The heat-conducting component 1 is heated by the ceramic heating assembly, so that the heat-conducting component 1 heats the heat-conducting pipe 3 through heat conduction. Thus, the heat-conducting pipe 3 heats the cold water flowing inside through heat conduction. The heated water is discharged through the hot water inlet 5.

[0029] The PTC heating element 8 and wiring terminal 9 of the rapid heating ceramic semiconductor heating device of this utility model are commercially available. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A rapid heating ceramic semiconductor heating device comprising a heat conducting member (1) and a groove (2) provided on the outer side wall of the heat conducting member (1); characterized in that, It also includes a ceramic heating assembly, a heat conducting pipe (3), a cold water outlet (4) and a hot water outlet (5), the heat conducting pipe (3) is embedded in the groove (2) inside, and the heat conducting pipe (3) is coiled outside the heat conducting part (1), the cold water outlet (4) is communicated on the input end of the heat conducting pipe (3), the hot water outlet (5) is communicated on the output end of the heat conducting pipe (3), the ceramic heating assembly is arranged inside the heat conducting part (1), and the ceramic heating assembly is used for heating the heat conducting part (1).

2. A rapid heating type ceramic semiconductor heating device as set forth in claim 1, wherein The ceramic heating assembly includes a cover plate (6), a mounting groove (7), a PTC heating core (8) and a wiring terminal (9), the cover plate (6) is installed at the top end of the heat conducting part (1), the mounting groove (7) is arranged inside the heat conducting part (1), the PTC heating core (8) is installed inside the mounting groove (7), and the wiring terminal (9) is communicated at the top end of the PTC heating core (8).

3. A rapid heating ceramic semiconductor heating device as claimed in claim 1, characterized in that, The heat conducting part (1) includes a first heat conducting half piece (10) and a second heat conducting half piece (11), the first heat conducting half piece (10) and the second heat conducting half piece (11) are assembled into a whole in front and back, the groove (2) is arranged on the outer side wall of the first heat conducting half piece (10) and the second heat conducting half piece (11), the heat conducting pipe (3) is coiled on the outer side wall of the first heat conducting half piece (10) and the second heat conducting half piece (11), the bottom end of the cover plate (6) is connected with the top end of the first heat conducting half piece (10) and the second heat conducting half piece (11), and the mounting groove (7) is arranged inside the first heat conducting half piece (10) and the second heat conducting half piece (11).

4. A rapid heating ceramic semiconductor heating device as claimed in claim 3, characterized in that, It also includes a plurality of groups of screws (12), and the plurality of groups of screws (12) are all installed on the first heat conducting half piece (10) and the second heat conducting half piece (11) in cooperation.

5. A rapid heating ceramic semiconductor heating device as claimed in claim 3, wherein, It also includes a connecting piece (13), and the connecting piece (13) is installed on the outer side wall of the first heat conducting half piece (10) and the second heat conducting half piece (11).

6. A rapid heating ceramic semiconductor heating device as claimed in claim 1, characterized in that, The heat conducting part (1) and the heat conducting pipe (3) are both made of high-temperature resistant metal material.

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