Semiconductor processing cooling device

Abstract

The utility model discloses a semiconductor processing cooling device which comprises a workbench, three groups of open grooves are arranged on the upper side of the workbench in parallel, an inverted L-shaped plate is fixed on the workbench, a driven structure penetrating through the L-shaped plate is arranged in the L-shaped plate in a sliding mode, a driving structure is arranged on the upper side of the L-shaped plate, and the driving structure is arranged on the lower side of the L-shaped plate. The driven structure and the driving structure are meshed with each other, the lower side of the driven structure is provided with a soaking structure, and the soaking structure is fixedly provided with a charging box of which the side surface and the lower side are opened, and the utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor processing cooling device. The semiconductor processing cooling device effectively solves the problem that a traditional semiconductor cooling device is low in cooling efficiency, and is a novel modern semiconductor processing cooling device.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically referring to a semiconductor processing cooling device. Background Technology

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their conductivity is easily controlled, and they can be used as components for information processing. Semiconductors have a wide range of applications, so efficiency is a critical factor in their production. Therefore, cooling devices are needed to cool semiconductors quickly.

[0003] Existing semiconductor cooling devices achieve the effect of facilitating semiconductor handling by first fixing the column, rack, worm gear, sliding frame, motor, worm, storage basket, placement plate, insertion rod, screen, and handle. However, the above devices cool a small number of semiconductors at a time by placing them on the placement plate, resulting in low efficiency. Utility Model Content

[0004] The problem to be solved by this invention is the low cooling efficiency of traditional semiconductor cooling devices.

[0005] To solve the above-mentioned technical problems, this utility model proposes a semiconductor processing cooling device, including a worktable with three sets of slots parallel to each other on the upper side of the worktable. An inverted L-shaped plate is fixed on the worktable, and a driven structure that slides through the L-shaped plate is provided inside the L-shaped plate. A driving structure is provided on the upper side of the L-shaped plate, and the driven structure and the driving structure mesh with each other. An immersion structure is provided on the lower side of the driven structure, and a loading box with side and bottom openings is fixed on the immersion structure.

[0006] Furthermore, the driven structure includes a groove formed on the L-shaped plate, and a rack is slidably disposed inside the groove.

[0007] Furthermore, the driving structure includes a first vertical plate fixed to the upper side of the L-shaped plate, a drive motor fixed to one side of the vertical plate, a second vertical plate fixed to the L-shaped plate, a rotating rod fixed to the output shaft of the drive motor, the other end of the rotating rod rotatably mounted on the second vertical plate, and a gear meshing with a rack fixed to the outside of the rotating rod.

[0008] Furthermore, the driven structure and the driving structure are symmetrically arranged in two sets.

[0009] Furthermore, the soaking structure includes an electric telescopic rod fixed to the lower side of the rack, and a material box is fixed to the lower side of the electric telescopic rod.

[0010] Furthermore, the loading box is provided with an array of slots, in which a detachable placement net is inserted, and the loading box is provided with drainage holes on all four sides to allow water to pass through.

[0011] Furthermore, the loading box is provided with two sets and is located at both ends of the two sets of racks respectively, and the side opening direction of the loading box is in the same direction as the end position of the rack.

[0012] Furthermore, the two outer slots are equipped with a series of fans, the middle slot is equipped with cooling water, and the outer side of the workbench is equipped with a drain outlet that communicates with the slot.

[0013] The beneficial effects of this utility model by adopting the above structure are as follows:

[0014] By setting multiple slots and placement meshes inside the loading box to hold more semiconductors, and by setting two sets of driving and driven devices to alternately cool them, the problem of low cooling efficiency of traditional semiconductor cooling devices is solved. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 1 ;

[0016] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 2 ;

[0017] Figure 3 A cross-sectional view of an embodiment of this utility model. Figure 1 ;

[0018] Figure 4 A cross-sectional view of an embodiment of this utility model. Figure 2 .

[0019] Among them, 1. workbench, 2. slotted, 3. L-shaped plate, 4. driven structure, 5. driving structure, 6. soaking structure, 7. loading box, 8. chute, 9. rack, 10. vertical plate one, 11. drive motor, 12. vertical plate two, 13. rotating rod, 14. gear, 15. electric telescopic rod one, 16. slot, 17. placement net, 18. fan, 19. drain outlet.

[0020] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] like Figure 1-4 As shown, the present invention proposes a semiconductor processing cooling device, including a worktable 1. Three sets of slots 2 are parallelly opened on the upper side of the worktable 1. An inverted L-shaped plate 3 is fixed on the worktable 1. A driven structure 4 that slides through the L-shaped plate 3 is slidably arranged inside the L-shaped plate 3. A driving structure 5 is provided on the upper side of the L-shaped plate 3. The driven structure 4 and the driving structure 5 mesh with each other. An immersion structure 6 is provided on the lower side of the driven structure 4. A loading box 7 with side and bottom openings is fixed on the immersion structure 6. A set of fans 18 are provided in the two outer slots 2. Cooling water is provided in the middle slot 2. A drain outlet 19 communicating with the slots 2 is provided on the outer side of the worktable 1.

[0023] As per the instruction manual Figure 3-4 As shown, in order to move the loading box 7, the driven structure 4 includes a groove 8 opened on the L-shaped plate 3, and a rack 9 is slidably provided inside the groove 8. The driving structure 5 includes a vertical plate 10 fixed on the upper side of the L-shaped plate 3, a drive motor 11 fixed on the side of the vertical plate 10, a vertical plate 2 12 fixed on the L-shaped plate 3, a rotating rod 13 fixed on the output shaft of the drive motor 11, and the other end of the rotating rod 13 rotatably mounted on the vertical plate 2 12. A gear 14 that meshes with the rack 9 is fixed on the outer side of the rotating rod 13. The driven structure 4 and the driving structure 5 are symmetrically arranged in two sets.

[0024] In order to immerse the loading box 7 in the cold water tank, the immersion structure 6 includes an electric telescopic rod 15 fixed to the lower side of the rack 9, and the loading box 7 is fixed to the lower side of the electric telescopic rod 15.

[0025] As per the instruction manual Figure 2-3 As shown, in order to cool more semiconductors at one time, the charging box 7 is provided with an array of slots 16, and a detachable placement net 17 is inserted into the slots 16. The charging box 7 is provided with drainage holes on all four sides to allow water to pass through. The charging box 7 is provided with two sets and is located at both ends of the two sets of racks 9 respectively. The side opening direction of the charging box 7 is in the same direction as the end position of the rack 9.

[0026] In practical use, the two sets of racks 9 are located at both ends of the slide 8, and the operator is positioned on both sides of the workbench 1. The placement net 17 with semiconductors placed on the upper side is inserted into the loading box 7. First, one set of drive motors 11 is run to make the racks 9 drive the electric telescopic rod 15 to move above the central slot 2. The electric telescopic rod 15 is run to immerse the loading box 7 in the water pool for cooling. After cooling, the device is raised, and the drive motor 11 is run in the opposite direction to return the device to its original position. The electric telescopic rod 15 is then extended, and the fan 18 is turned on to blow the water stains off the semiconductors. At the same time, the other loading box 7 is immersed and cooled. This cycle is repeated. The above is the entire usage process of the semiconductor processing cooling device.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0029] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A semiconductor processing cooling apparatus, characterized by: Including workbench (1), three groups of slot (2) are opened on the workbench (1) upside parallel, the L-shaped plate (3) is fixed on the workbench (1) upside and sets up reversely, the driven structure (4) is slidably arranged in the L-shaped plate (3) and penetrates the L-shaped plate (3), the driving structure (5) is arranged on the L-shaped plate (3) upside, the driven structure (4) and driving structure (5) are mutually engaged, the soaking structure (6) is arranged on the driven structure (4) downside, the loading box (7) with open side and downside is fixed on the soaking structure (6).

2. The semiconductor processing cooling device of claim 1, wherein: The driven structure (4) includes the sliding groove (8) opened on the L-shaped plate (3), the rack (9) is slidably arranged in the sliding groove (8).

3. The semiconductor processing cooling apparatus of claim 2, wherein: The driving structure (5) includes the vertical plate one (10) fixed on the L-shaped plate (3) upside, the driving motor (11) is fixed on the vertical plate one (10) side, the vertical plate two (12) is fixed on the L-shaped plate (3), the rotating rod (13) is fixed on the output shaft of driving motor (11), the rotating rod (13) other end is rotatably arranged on the vertical plate two (12), the gear (14) is fixed on the rotating rod (13) outside and is mutually engaged with the rack (9).

4. The semiconductor processing cooling apparatus of claim 3, wherein: The driven structure (4) and driving structure (5) are symmetrically provided with two groups.

5. The semiconductor processing cooling apparatus of claim 2, wherein: The soaking structure (6) includes the electric telescopic rod one (15) fixed on the rack (9) downside, the loading box (7) is fixed on the electric telescopic rod one (15) downside.

6. The semiconductor processing cooling device of claim 1, wherein: A plurality of insertion slots (16) are arranged in the loading box (7), the detachable placing net (17) is inserted into the insertion slot (16), and water holes are arranged on the four sides of the loading box (7) to allow water to pass through.

7. The semiconductor processing cooling apparatus of claim 5, wherein: The loading box (7) is provided with two groups and is located at the two ends of the two groups of racks (9), and the opening direction of the side edge of the loading box (7) is in the same direction as the position of the end of the rack (9).

8. The semiconductor processing cooling device of claim 1, wherein: A plurality of fans (18) are arranged in the outer slot (2) of the two groups, cooling water is arranged in the middle slot (2), and a water outlet (19) is arranged on the outside of the workbench (1) and is communicated with the slot (2).

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