Fixed-point splitting device

Abstract

The utility model discloses a fixed-point splitting device, which comprises a sample preparation carrying table, the overturning table is rotatably connected to the side wall of the sample preparation carrying table; the open groove is positioned between the sample preparation carrying table and the overturning table; the cutting structure is located in the open groove and can move in the extending direction of the open groove; and the substrate to be cracked is cracked along the notch in the overturning process of the overturning table. According to the technical scheme provided by the utility model, the sample preparation precision is improved, and the accuracy of sample measurement is ensured.

Description

Technical Field

[0001] This utility model relates to the field of dicing sample preparation technology, and in particular to a fixed-point dicing device. Background Technology

[0002] The application of dicing in semiconductors is multifaceted. It not only helps monitor and optimize chip manufacturing quality, but also plays a crucial role in failure analysis. Therefore, the requirements for the efficiency and success rate of dicing are constantly increasing.

[0003] In related technologies, manual dicing is typically used for sample preparation, followed by observation of the cross-sectional film structure of the diced sample using a scanning electron microscope (SEM). The specific dicing process involves: first, using a cutting wheel to create a cutting line on the substrate to be diced; then, a worker applies bending force to both sides of the cutting line to achieve the dicing operation. However, during manual dicing, the handheld product is prone to instability (uneven force application), causing the edges of the separated parts to easily touch and damage the cutting line, affecting the accuracy of sample measurement. Utility Model Content

[0004] This utility model provides a fixed-point dicing device to improve sample preparation accuracy and ensure the accuracy of sample measurement.

[0005] This utility model embodiment provides a fixed-point dicing device, comprising:

[0006] Sample preparation stage;

[0007] A flipping table is rotatably connected to the side wall of the sample preparation stage; the top surface of the flipping table is flush with the top surface of the sample preparation stage when the flipping table is not flipped.

[0008] An open slot is located between the sample preparation stage and the flipping stage.

[0009] Optionally, the targeted dicing device further includes:

[0010] A cutting structure is located in the open groove and can move along the extension direction of the open groove; the cutting structure is used to slide and cut the position of the substrate to be cracked to form a cut; wherein the substrate to be cracked covers the open groove, and one side of the substrate to be cracked is fixed on the sample preparation stage, and the other side is fixed on the flipping stage.

[0011] A cut support plate is located in the open slot and fixed to the side wall of the cutting structure so as to move synchronously with the cutting structure along the cutting direction of the cutting structure; the cut support plate is used to support the cut formed by the cutting structure on the surface of the substrate to be cracked; the substrate to be cracked cracks along the cut during the flipping process of the flipping table.

[0012] An optical microscope, wherein the detection lens of the optical microscope is located above the open groove, is used to determine the location to be cracked on the substrate to be cracked.

[0013] Optionally, the cutting structure includes a cutting wheel and a support base located at the bottom of the cutting wheel;

[0014] The support base is connected to the cutting wheel by a spring;

[0015] The top surface of the cutting support plate is flush with the top surface of the sample preparation stage; the cutting support plate is fixedly connected to the side wall of the support base, or the cutting support plate and the support base are integrally formed.

[0016] Optionally, the pinpoint dicing device further includes:

[0017] A lead screw is located at the bottom of the sample preparation stage; the surface of the lead screw has threads, and the lead screw is screwed to the cutting support plate, and / or the lead screw is screwed to the support base;

[0018] A first driving structure is located at one end of the transmission screw. The first driving structure is used to drive the transmission screw to rotate, so as to drive the cutting support plate and the cutting blade wheel to move in the axial direction of the transmission screw.

[0019] Optionally, in the extending direction of the open slot, the length of the cut support plate is greater than or equal to the length of the cut in the substrate to be cracked.

[0020] And / or, in a direction perpendicular to the extension direction of the open slot, the thickness of the cutting support plate is greater than the blade thickness of the cutting wheel.

[0021] Optionally, when the cutting wheel is not in contact with the substrate to be cracked, the top surface of the cutting wheel is higher than the top surface of the sample preparation stage;

[0022] When the cutting wheel slides across the substrate to be cracked, the top surface of the cutting wheel, the top surface of the cutting support plate, and the top surface of the sample preparation stage are flush with each other.

[0023] Optionally, the pinpoint dicing device further includes:

[0024] A first conveying component and a second conveying component are arranged side by side on the top surface of the sample preparation stage, and the substrate to be cracked is clamped between the first conveying component and the second conveying component; the first conveying component and the second conveying component are used to clamp and drive the substrate to be cracked.

[0025] The second driving structure is used to drive the first transmission component and the second transmission component;

[0026] The first conveying component and the second conveying component each include a first upper drive belt and a first lower drive belt stacked together; wherein the first lower drive belt is located in a groove on the top surface of the sample preparation platform, and the top surface of the first lower drive belt is flush with the top surface of the sample preparation platform; one side of the substrate to be cracked is clamped between the first upper drive belt and the first lower drive belt of the first conveying component, and the other side of the substrate to be cracked is clamped between the first upper drive belt and the second lower drive belt of the second conveying component.

[0027] Optionally, the pinpoint dicing device further includes:

[0028] The third transmission component includes a second upper transmission belt and a second lower transmission belt stacked on the top surface of the sample preparation stage; the substrate to be cracked is clamped between the second upper transmission belt and the second lower transmission belt; the second upper transmission belt and the second lower transmission belt are used to clamp and transmit the substrate to be cracked.

[0029] The third drive structure is used to drive the second upper drive belt conveyor and the second lower drive belt conveyor.

[0030] The second lower drive belt is located in a groove on the top surface of the sample preparation platform, and the top surface of the second lower drive belt is flush with the top surface of the sample preparation platform.

[0031] Optionally, the pinpoint dicing device further includes:

[0032] A damping plate is located on the top surface of the flipping table. The damping plate is used to clamp and fix the substrate to be cracked when cutting the substrate to be cracked and when the flipping table is flipped.

[0033] And / or, a pedal for driving the tilting platform to tilt is provided below the tilting platform, and the tilting platform and the pedal are connected by a pull rope.

[0034] Optionally, the optical microscope is fixed to the top surface of the sample preparation stage, and the center position of the detection lens of the optical microscope corresponds to the moving path of the cutting structure.

[0035] The technical solution provided by this utility model uses a cutting structure to slide cut the substrate to be cracked, and then uses a flipping table to flip it so that the substrate to be cracked breaks along the scratch cut. Compared with the traditional manual cracking method, it prevents the edges of the two parts of the substrate to be cracked from touching and causing damage at the cut after separation, improves the sample preparation accuracy, and ensures the accuracy of sample measurement.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a top view schematic diagram of a fixed-point dicing device provided in an embodiment of the present invention;

[0039] Figure 2 This is a three-dimensional structural diagram of a cutting structure and a cut support plate provided in an embodiment of this utility model;

[0040] Figure 3 This is a frontal dynamic schematic diagram of a cutting structure provided in an embodiment of this utility model;

[0041] Figure 4 This is a side view of a fixed-point dicing device provided in an embodiment of the present invention;

[0042] Figure 5 This is a side view dynamic schematic diagram of a fixed-point dicing device provided in an embodiment of this utility model. Detailed Implementation

[0043] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0045] This utility model embodiment provides a fixed-point dicing device. Figure 1 This is a top view schematic diagram of a fixed-point dicing device provided in an embodiment of the present invention. Figure 2 This is a three-dimensional structural diagram of a cutting structure and a cut support plate provided in an embodiment of this utility model, for reference. Figure 1 and Figure 2 The targeted fragmentation device includes:

[0046] Sample preparation stage 1;

[0047] The flipping table 11 is rotatably connected to the side wall of the sample preparation stage 1; when the flipping table 11 is not flipped, the top surface of the flipping table 11 is flush with the top surface of the sample preparation stage 1.

[0048] The open slot 12 is located between the sample preparation stage 1 and the tilting stage 11;

[0049] The cutting structure 200 is located in the open groove 12 and can move along the extension direction of the open groove 12; the cutting structure 200 is used to slide and cut the position of the substrate to be cracked to form a cut; wherein, the substrate to be cracked covers the open groove 12, and one side of the substrate to be cracked is fixed on the sample preparation stage 1, and the other side is fixed on the flipping stage 11.

[0050] The fixed-point dicing device provided by this utility model uses a cutting structure to slide and cut the substrate to be diced, and then uses a flipping table to flip the substrate to be diced so that the substrate to be diced breaks along the scratch cut. Compared with the traditional manual dicing method, it can prevent the edges of the two parts of the substrate to be diced from touching and causing damage at the cut after separation, thus improving the sample preparation efficiency and accuracy and ensuring the accuracy of sample measurement.

[0051] Based on the above embodiments, optionally, the pinpoint dicing device further includes:

[0052] The cut support plate 21 is located in the open slot 12 and fixed to the side wall of the cutting structure 200 so as to move synchronously with the cutting structure 200 along the cutting direction of the cutting structure 200; the cut support plate 21 is used to support the cut formed by the cutting structure 200 on the surface of the substrate to be cracked; the substrate to be cracked cracks along the cut during the flipping process of the flipping table 11.

[0053] An optical microscope, with its inspection lens located above the open slot 12, is used to determine the location to be cracked on the substrate to be cracked.

[0054] Specifically, the sample preparation stage 1 has a rotating platform 11 rotatably connected to its sidewall via a torsion spring for bending and splitting the substrate to be cracked. When not rotated, the top surface of the rotating platform 11 is flush with the top surface of the sample preparation stage 1. During rotation, the rotating platform 11 can rotate downwards around a fixed axis, which is parallel to the sidewall of the sample preparation stage 1 adjacent to the rotating platform 11. An open slot 12 is provided between the sample preparation stage 1 and the rotating platform 11. The open slot 12 includes two opposing sidewalls, one of which is at least a portion of the sidewall of the sample preparation stage 1 near the rotating platform 11, and the other sidewall is at least a portion of the sidewall of the rotating platform 11 near the sample preparation stage 1. The open slot 12 may also include a bottom surface, which may be entirely the surface of the rotating platform 11, entirely the surface of the sample preparation stage 1, or partially the surface of the rotating platform 11 and partially the surface of the sample preparation stage 1.

[0055] An optical microscope is provided above the open slot 12 for observing the internal circuitry of the substrate to be cracked. The microscope allows confirmation of the location to be cracked on the substrate. A cutting structure 200 and a cut support plate 21 are provided within the open slot 12, arranged side-by-side along the extending direction of the open slot 12. The cutting structure 200 can move along the extending direction of the open slot 12 to slide and cut the substrate at the location to be cracked, forming a slit. The cut support plate 21 is fixed to the side wall of the cutting structure 200, moving synchronously with it along its cutting direction. The height difference between the top surface of the cut support plate 21 and the top surface of the sample preparation stage 1 is close to zero, or even equal to zero, and the cut support plate and the cutting wheel 2 in the cutting structure 200 are on the same horizontal line, allowing the cut support plate 21 to support the slit. The support for the cut can be understood as providing support to the area on both sides of the cut and directly above the open groove 12 on the bottom surface of the substrate to be cracked. Therefore, the thickness of the cut support plate 21 needs to be greater than the width of the cut so that the cut support plate 21 can cover the cut and the area on both sides of the cut on the bottom surface of the substrate to be cracked.

[0056] After the incision is formed, the flipping limit of the flipping stage 11 is released, allowing the flipping stage 11 to be flipped. Since one side of the substrate to be cracked is fixed on the sample preparation stage 1 and the other side is fixed on the flipping stage 11, the flipping stage 11 is used to bend the substrate to be cracked, causing the substrate to be cracked into two parts from the incision. The incision support plate 21 provides force support during the folding process of the substrate to be cracked, which can prevent the incision from failing to break along the scratch (incision) formed on the surface of the substrate to be cracked by the cutting structure 200 due to the lack of force support at the open groove 12.

[0057] Furthermore, the substrate to be cracked may include a substrate and a TFT circuit layer located on one side of the substrate. By facing the cutting wheel 2 towards the substrate side away from the TFT circuit layer, a cut is formed by sliding cut on the surface of the substrate away from the TFT circuit layer. This can avoid the cutting wheel 2 from damaging the TFT circuit layer, thereby ensuring the integrity of the TFT circuit layer pattern in the substrate to be cracked and avoiding affecting the observation of the film structure at the fracture.

[0058] The targeted dicing device provided by this invention uses an optical microscope to confirm the location of the substrate to be diced. Then, a cutting structure is used to slide and cut the substrate, creating a slit at the desired dicing location. A support plate supports the slit, providing force support during the flipping process of the substrate. This ensures that the substrate breaks along the scratches created by the cutting structure when the flipping table is turned. Compared to traditional blind cutting and manual dicing methods, this increases the accuracy of sample preparation and improves work efficiency. Therefore, it achieves targeted dicing of the substrate, avoiding the randomness and uncertainty of blind cutting, and improving sample preparation efficiency and accuracy.

[0059] Based on the above embodiments, refer to Figure 1 and Figure 2 Optionally, the cutting structure 200 includes a cutting blade wheel 2 and a support base 23 located at the bottom of the cutting blade wheel 2;

[0060] The support base 23 is connected to the cutting wheel 2 by a spring; the cutting support plate 21 is fixedly connected to the side wall of the support base 23, or the cutting support plate 21 is integrally set with the support base 23; the top surface of the cutting support plate 21 is flush with the top surface of the sample preparation platform 1.

[0061] Specifically, the bottom of the cutting wheel 2 is provided with a support base 23 for supporting the glass cutting wheel 2. The support base 23 and the cutting wheel 2 are connected by a spring. The support base 23 and the cutting wheel 2 are connected by a spring, and when the cutting wheel 2 is not in contact with the substrate to be cracked, the top surface of the cutting wheel 2 is higher than the top surface of the sample preparation stage 1. This allows the cutting wheel 2 to make downward clearance when it contacts the bottom surface of the substrate to be cracked, increasing the spring deformation and thus increasing the upward elastic force of the spring on the cutting wheel 2. This makes it easier for the cutting wheel 2 to increase the pressure applied to the bottom surface of the substrate when it slides and cuts, so that the cutting wheel 2 slides closely to the bottom surface of the substrate to be cracked, deepening the cut depth. This makes it easier for the substrate to crack along the cut during the flipping of the flipping table 11.

[0062] When the cutting wheel 2 slides and cuts the substrate to be cracked, the cutting support plate 21 moves synchronously with the cutting structure 200 along the cutting direction of the cutting structure 200. This allows the cutting support plate 21 to promptly support the cut after the sliding cutting action of the cutting wheel 2 is completed, which is beneficial to the flatness of the cut. When the cutting wheel 2 slides and cuts the substrate to be cracked, due to the downward pressure of the substrate to be cracked, the cutting wheel 2 moves downward to make room. Therefore, at this time, the top surface of the cutting wheel 2, the top surface of the cutting support plate 21, and the top surface of the sample preparation stage 1 are flush with each other. When the top surface of the cutting wheel 2 is no longer compressed, it returns to its original position under the action of the spring.

[0063] Based on the above embodiments, refer to Figure 1 Optionally, in the extending direction X of the open groove 12, the length of the cutting support plate 21 is greater than or equal to the length of the cut of the substrate to be cracked; and / or, in the direction Y perpendicular to the extending direction of the open groove 12, the thickness of the cutting support plate 21 is greater than or equal to the blade thickness of the cutting wheel 2.

[0064] Specifically, in the extension direction X of the open groove 12, the length of the cutting support plate 21 is set to be greater than or equal to the length of the cut on the substrate to be cracked. This allows the cutting support plate 21 to support the entire length of the cut, further improving the support effect. Since the blade thickness of the cutting wheel 2 is almost equal to the width of the cut, in the direction Y perpendicular to the extension direction of the open groove 12, the thickness of the cutting support plate 21 is set to be greater than the blade thickness of the cutting wheel 2. This ensures the effectiveness of the cutting support plate 21 in supporting the cut.

[0065] Based on the above embodiments, Figure 3 This is a frontal dynamic schematic diagram of a cutting structure provided in an embodiment of this utility model, for reference. Figure 3 and combined Figures 1-2 Optionally, the targeted dicing device also includes:

[0066] The transmission screw 22 is located at the bottom of the sample preparation stage 1; the surface of the transmission screw 22 has threads, and the transmission screw 22 is screwed to the cutting support plate 21, and / or the transmission screw 22 is screwed to the support base 23.

[0067] The first drive structure 24 is located at one end of the transmission screw 22. The first drive structure 24 is used to drive the transmission screw 22 to rotate, so as to drive the cutting support plate 21 and the cutting wheel 2 to move in the axial direction of the transmission screw 22.

[0068] Specifically, the bottom of the sample preparation stage 1 is rotatably connected to a transmission screw 22 for driving the cutting blade wheel 2 and the cutting support plate 21 to slide within the open groove 12 along the extending direction of the open groove 12. The transmission screw 22 can be screwed to the cutting support plate 21 or to the support base 23. The end of the transmission screw 22 is provided with a first drive structure 24 for driving the transmission screw 22 to rotate; the first drive structure 24 can be a hand-cranked actuator. During use, rotating the hand-cranked actuator drives the transmission screw 22 to rotate, and during the rotation of the transmission screw 22, it causes the glass cutting blade wheel 2 and the cutting support plate 21 to slide within the open groove 12.

[0069] Based on the above embodiments, Figure 4 This is a side view of a fixed-point dicing device provided in an embodiment of the present invention, with reference to... Figure 4 , Figure 1 and Figure 3 In one embodiment of this utility model, the fixed-point dicing device further includes: a first conveying component 301, a second conveying component 302, and a second driving structure 31. The first conveying component 301 and the second conveying component 302 are arranged side by side on the top surface of the sample preparation stage 1, and the substrate 01 to be diced is clamped between the first conveying component 301 and the second conveying component 302; the first conveying component 301 and the second conveying component 302 are used to clamp and drive the substrate 01 to be diced; the second driving structure 31 is used to drive the first conveying component 301 and the second conveying component 302.

[0070] The first conveying assembly 301 and the second conveying assembly 302 both include a first upper drive belt conveyor 311 and a first lower drive belt conveyor 321 stacked together. One side of the substrate 01 to be cracked is sandwiched between the first upper drive belt conveyor 311 and the first lower drive belt conveyor 321 of the first conveying assembly 301, and the other side of the substrate 01 to be cracked is sandwiched between the first upper drive belt conveyor 311 and the second lower drive belt conveyor 321 of the second conveying assembly 302. The first lower drive belt conveyor 321 is located in a groove on the top surface of the sample preparation stage 1, and the top surface of the first lower drive belt conveyor 321 is flush with the top surface of the sample preparation stage 1, so that the surface of the substrate 01 to be cracked near the sample preparation stage 1 is in contact with the top surface of the sample preparation stage 1. Both the first upper drive belt conveyor 311 and the first lower drive belt conveyor 321 include a drive belt and a pulley. The second drive structure 31 may include a gear differential drive for synchronously driving the first conveying assembly 301 and the second conveying assembly 302. Under the action of the gear differential drive, the sliding of the substrate to be cracked can be avoided too fast, which would affect the observation of the circuit and abnormal area inside the substrate through the optical microscope 4, and can improve the accurate positioning of the cracking position of the substrate to be cracked.

[0071] In this embodiment of the utility model, reference is made to Figure 3 By clamping the two opposite sides of the substrate 01 to be cracked by the first conveying component 301 and the second conveying component 302, wear and damage to the front side of the substrate 01 to be cracked during the transmission process can be avoided, which would affect the accuracy of the sample measurement.

[0072] Based on the above embodiments, in another embodiment of this utility model, the clamping and transfer of the substrate 01 to be cracked can be completed by a transfer component, as shown in the reference. Figure 4 The fixed-point dicing device also includes a third transmission component and a third driving structure: the third transmission component includes a second upper transmission belt 312 and a second lower transmission belt 322 stacked on the top surface of the sample preparation stage 1; the substrate to be diced is clamped between the second upper transmission belt 312 and the second lower transmission belt 322, and the second upper transmission belt 312 and the second lower transmission belt 322 are used to clamp and transmit the substrate to be diced; the third driving structure is used to drive the second upper transmission belt 312 and the second lower transmission belt 322.

[0073] The second lower drive belt conveyor 322 is located in a groove on the top surface of the sample preparation stage 1, and its top surface is flush with the top surface of the sample preparation stage 1, so that the surface of the substrate to be cracked near the sample preparation stage 1 is in contact with the top surface of the sample preparation stage 1. Both the second upper drive belt conveyor 312 and the second lower drive belt conveyor 322 include a drive belt and a pulley. The third drive structure may include a gear differential drive for driving the second upper drive belt conveyor 312 and the second lower drive belt conveyor 322.

[0074] The technical solution provided by this utility model embodiment only requires two transmission belts, upper and lower, to clamp and transport the substrate to be cracked, which can reduce the cost of the fixed-point cracking device. In addition, by clamping and fixing the substrate to be cracked between the second upper transmission belt 312 and the second lower transmission belt 322, the entire side of the substrate to be cracked can be fixed on one side of the sample preparation stage, increasing the fixing area of ​​the substrate to be cracked. This prevents the substrate from easily breaking in the fixing area when the thickness of the substrate to be cracked is too thin, because the transmission component needs to apply downward force to the fixing area of ​​the substrate to be cracked during the slicing process and the flipping process of the flipping table 11.

[0075] Based on the above embodiments, refer to Figure 1 and Figure 4 Optionally, the pinpoint dicing device further includes:

[0076] Damping plate 13 is located on the top surface of the flipping table 11. Damping plate 13 is used to clamp and fix the substrate to be cracked when cutting the substrate and when flipping the table.

[0077] Specifically, before cutting the substrate to be cracked, the substrate to be cracked is clamped and driven to the open slot 12 by the first conveying component 301 and the second conveying component 302, or the third conveying component, and the position of the substrate to be cracked is directly above the open slot 12. Therefore, during the cutting process of the cutting structure 200, the substrate to be cracked extends from the top surface of the sample preparation stage 1 to the top surface of the flipping stage 11; the side of the substrate to be cracked located on the top surface of the sample preparation stage 1 can be clamped and fixed by the first conveying component 301 and the second conveying component 302, or by the third conveying component, and the side of the substrate to be cracked located on the top surface of the flipping stage 11 is clamped and fixed by the damping pressure plate 13, so as to prevent the substrate to be cracked from being warped by force during the sliding cutting process and the flipping stage 11 flipping process, thereby ensuring the normal cutting and bending of the substrate to be cracked.

[0078] Based on the above embodiments, refer to Figure 4 and Figure 5 Optionally, a pedal 132 for driving the flipping table 11 to flip is provided below the flipping table 11, and the flipping table 11 and the pedal 132 are connected by a pull rope 131. After the flipping table 11 is released from the flipping limit, the flipping table 11 is pulled by the pull rope 131 to flip when the pedal 132 is stepped on, thereby breaking the substrate to be cracked.

[0079] Based on the above embodiments, refer to Figure 1 and Figure 4Optionally, the optical microscope 4 is fixed on the top surface of the sample preparation stage 1, and the center position of the detection lens of the optical microscope 4 corresponds to the moving path of the cutting structure 200.

[0080] Specifically, since the center position of the detection lens of the optical microscope 4 corresponds to the moving path of the cutting structure 200, the cracking position of the substrate to be cracked can be moved to the center position of the display screen of the optical microscope 4 so that the cutting wheel 2 can slide and cut the cracking position of the substrate to be cracked. In addition, by setting the center position of the detection lens of the optical microscope 4 to correspond to the moving path of the cutting structure 200, the cracking position of the substrate to be cracked can be placed in the center position of the display screen, which is convenient for observing the cut.

[0081] In summary, the specific steps for targeted dicing of the substrate to be diced include:

[0082] The substrate to be cracked is placed on the top surface of the sample preparation stage 1, and then pushed into the gap between the two sets of transmission belts (or between the two sets of transmission components) to engage. The differential drive is rotated to drive the transmission belt to move the substrate to be cracked to the open slot 12. The internal circuitry and abnormal areas of the substrate to be cracked are observed through the optical microscope 4 to determine the area where the substrate is to be cracked (the position to be cracked). The position to be cracked of the substrate is driven to the top of the open slot 12 by the differential drive, corresponding to the movement trajectory of the drive cutting wheel 2. The differential drive prevents the transmission belt from driving the substrate to be cracked too fast, which would affect the observation of the internal circuitry and abnormal areas of the substrate by the personnel through the optical microscope 4. Then, the damping plate 13 is used to press and clamp the substrate to prevent it from warping upwards during the sliding cutting process, which would affect the cutting.

[0083] After fixing, the transmission screw 22 is driven to rotate by a hand-cranked driver, so that the cutting wheel 2 and the cutting support plate 21 slide in the open slot 12. The cutting wheel 2 slides through the opening of the open slot 12 to form a cut on the back of the substrate to be cracked. After the cut is formed, the flipping table 11 is released from its flipping limit, and the flipping table 11 is driven to flip by stepping on the pedal 132. The substrate to be cracked is fixed by the damping pressure plate 13. During the flipping process, the substrate to be cracked is subjected to force and thus breaks, completing the cracking sample preparation. During the flipping process of the flipping table 11, since the top of the cutting support plate 21 is on the same horizontal line as the top of the cutting wheel 2, the cutting support plate 21 can support the position on the bottom surface of the substrate to be cracked that is slid by the cutting wheel 2. This prevents the substrate to be cracked from failing to break along the scratch (cut) of the cutting wheel 2 due to the lack of a force point support at the bottom during the flipping cracking process.

[0084] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A spot-splitting device, characterized by The device comprises: a sample preparation platform; a turnover platform, which is rotatably connected to the side wall of the sample preparation platform; the top surface of the turnover platform is flush with the top surface of the sample preparation platform when the turnover platform is not turned over; an open slot between the sample preparation platform and the turnover platform; a cutting structure in the open slot and movable along the extension direction of the open slot; the cutting structure is used to slide cut the to-be-cracked position of the to-be-cracked substrate to form a cut; wherein the to-be-cracked substrate covers the open slot, one side of the to-be-cracked substrate is fixed on the sample preparation platform, and the other side is fixed on the turnover platform.

2. The site-directed cleavage device of claim 1, wherein, Further comprising: a cut support plate in the open slot and fixed on the side wall of the cutting structure to move synchronously with the cutting structure along the cutting direction of the cutting structure; the cut support plate is used to support the cut formed by the cutting structure on the surface of the to-be-cracked substrate; the to-be-cracked substrate is cracked along the cut during the turnover of the turnover platform; an optical microscope, the detection lens of which is above the open slot, and the optical microscope is used to determine the to-be-cracked position of the to-be-cracked substrate.

3. The spot-splitting device of claim 2, wherein, The cutting structure comprises a cutting knife wheel and a support base at the bottom of the cutting knife wheel; The support base is connected to the cutting knife wheel through a spring; The top surface of the cut support plate is flush with the top surface of the sample preparation platform; the cut support plate is fixedly connected with the side wall of the support base, or the cut support plate is integrally arranged with the support base.

4. The spot-splitting device of claim 3, wherein Further comprising: a transmission screw rod at the bottom of the sample preparation platform; the surface of the transmission screw rod has a thread, and the transmission screw rod is screwed with the cut support plate and / or the support base; a first driving structure at one end of the transmission screw rod, which is used to drive the transmission screw rod to rotate, so as to drive the cut support plate and the cutting knife wheel to move in the axial direction of the transmission screw rod.

5. The device according to claim 3, wherein in the extension direction of the open slot, the length of the cut support plate is greater than or equal to the length of the cut of the to-be-cracked substrate; and / or, in the direction perpendicular to the extension direction of the open slot, the thickness of the cut support plate is greater than the thickness of the cutting edge of the cutting knife wheel.

6. The spot-splitting device of claim 3, wherein When the cutting knife wheel is not in contact with the to-be-cracked substrate, the top surface of the cutting knife wheel is higher than the top surface of the sample preparation platform; When the cutting knife wheel slides and cuts the to-be-cracked substrate, the top surfaces of the cutting knife wheel, the cut support plate and the sample preparation platform are flush with each other.

7. The spot-splitting device of claim 1, wherein Further comprising: a first conveying assembly and a second conveying assembly, which are arranged side by side on the top surface of the sample preparation platform, and the to-be-cracked substrate is clamped between the first conveying assembly and the second conveying assembly; the first conveying assembly and the second conveying assembly are used to clamp and drive the to-be-cracked substrate; a second driving structure for driving the first conveying assembly and the second conveying assembly. The first conveying assembly and the second conveying assembly each include a first upper driving belt conveyor and a first lower driving belt conveyor arranged in a stack; the first lower driving belt conveyor is located in a groove on the top surface of the sample preparation platform, and the top surface of the first lower driving belt conveyor is flush with the top surface of the sample preparation platform; one side edge of the substrate to be split is clamped between the first upper driving belt conveyor and the first lower driving belt conveyor of the first conveying assembly, and the other side edge of the substrate to be split is clamped between the first upper driving belt conveyor and the second lower driving belt conveyor of the second conveying assembly.

8. The spot-splitting device of claim 1, wherein, Further comprising: A third conveying assembly including a second upper driving belt conveyor and a second lower driving belt conveyor arranged in a stack on the top surface of the sample preparation platform; The substrate to be split is clamped between the second upper driving belt conveyor and the second lower driving belt conveyor; the second upper driving belt conveyor and the second lower driving belt conveyor are used for clamping and driving the substrate to be split; A third driving structure is used for driving the second upper driving belt conveyor and the second lower driving belt conveyor; The second lower driving belt conveyor is located in a groove on the top surface of the sample preparation platform, and the top surface of the second lower driving belt conveyor is flush with the top surface of the sample preparation platform.

9. The spot-splitting device of claim 1, wherein, Further comprising: A damping pressing plate is located on the top surface of the turnover platform, and the damping pressing plate is used for clamping and fixing the substrate to be split when the substrate to be split is cut and when the turnover platform is turned over; And / or, a pedal is arranged below the turnover platform and is used for driving the turnover platform to turn over; the turnover platform and the pedal are connected through a pull rope.

10. The spot-splitting device of claim 2, wherein, The optical microscope is fixed on the top surface of the sample preparation platform, and the center position of the detection lens of the optical microscope corresponds to the movement path of the cutting structure.

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