Virtual memory circuit structure

Abstract

The utility model provides a virtual memory circuit structure. The virtual memory circuit structure comprises a circuit substrate which is configured to be detachably inserted into a slot of a mainboard; the micro-control unit is arranged on the circuit substrate; the light-emitting diode control chip is arranged on the circuit substrate, and the light-emitting diode control chip is electrically connected to the micro-control unit through the circuit substrate; the at least one light-emitting diode is arranged on the circuit substrate, and the at least one light-emitting diode is electrically connected to the light-emitting diode control chip through the circuit substrate; wherein a central processing unit on the mainboard is configured to directly communicate with the micro-control unit, and the central processing unit does not need to identify module specification information of the micro-control unit. Therefore, the virtual memory circuit structure provided by the utility model can be used for directly starting up subsequent electronic equipment such as a computer and controlling a light-emitting diode.

Description

Technical Field

[0001] This utility model relates to a memory, and more particularly to a virtual memory circuit structure that enables electrical signal communication without needing to identify the module specification information of the virtual memory. Background Technology

[0002] Existing virtual memory architecture 10' can be referenced Figure 1 , Figure 2 as well as Figure 3 As shown. The existing virtual memory structure 10' may include a circuit board 100', a sequence presence detection hub (SPD Hub) 200', a light-emitting diode control chip 300', and at least one light-emitting diode 400'. The circuit board 100' can be inserted into a slot (not shown) on a motherboard (not shown). The circuit board 100' does not contain physical memory integrated circuit (IC) chips; its main advantage, besides cost reduction, is the absence of antenna effect interference. This slot can be, for example, a DIMM (Dual In-line Memory Module) slot. Figure 6 As shown, a signal from a central processing unit of the motherboard (not shown) can be transmitted through the HSCL (Host Bus-Input Clock) / HSDA (Host Bus-Data Input / Output) pins of the slot to the HSCL / HSDA pins of the sequence presence detection hub 200', and then further transmitted from the LSCL (Local Bus-Output Clock) / LSDA (Local Bus-Data Input / Output) pins of the sequence presence detection hub 200' to the SCLK (Serial Clock) / SDAT (Serial Data Input and Output) pins of the LED control chip 300'.

[0003] At this point, since the sequence presence detection hub 200' must conform to JEDEC (Joint Electron Device Engineering Council) specifications, the BIOS (Basic Input / Output System) of different central processing units will identify the module specification information of the sequence presence detection hub 200' in the virtual memory structure 10'. For example, Figure 4As shown, taking a 16GB memory (i.e., non-virtual memory) as an example, the data content contained in the sequence presence detection hub 200' includes JEDEC specification information D1', allowing electronic devices (e.g., computers) to directly perform subsequent power-on and control of the LED 400'; please refer to... Figure 5 If it is virtual memory (e.g., virtual memory structure 10'), the data content of addresses other than 0x200 and 0x201 is 00, while addresses 0x200 and 0x201 store 86 and 6D of data content respectively, which correspond to the manufacturer's identification code.

[0004] As mentioned above, since the BIOS of different central processing units will identify the module specification information D1' of the sequence presence detection hub 200' in the virtual memory structure 10', if the central processing unit is Intel (i.e., on the Intel platform), it will accept the data content of this module specification information D1' and proceed with the subsequent power-on and control of the LED 400'. However, if the central processing unit is AMD (i.e., on the AMD platform), it will consider the data content of this module specification information D1' to be virtual and will not accept the data content of this module specification information D1', resulting in no subsequent power-on operation.

[0005] Therefore, how to ensure that the motherboard, regardless of whether it has different central control units, is not affected by the virtual memory structure and can still perform subsequent operations such as powering on electronic devices like computers and controlling LEDs is a major problem that needs to be solved. Utility Model Content

[0006] In view of the above problems, the main purpose of this utility model is to provide a virtual memory circuit structure that, through the setting of the microcontroller unit and the removal of the sequence presence detection hub, can achieve the operation of subsequent electronic devices such as computers and the control of light-emitting diodes without the need to identify the data content of the virtual memory circuit structure itself, even when used on motherboards with different central processing units.

[0007] To achieve the aforementioned objectives, this utility model provides a virtual memory circuit structure, including a circuit board configured to be detachably inserted into a slot on a motherboard; a microcontroller unit disposed on the circuit board; a light-emitting diode (LED) control chip disposed on the circuit board, the LED control chip being electrically connected to the microcontroller unit through the circuit board; and at least one LED disposed on the circuit board, the at least one LED being electrically connected to the LED control chip through the circuit board; wherein a central processing unit (CPU) on the motherboard is configured to communicate directly with the microcontroller unit, and the CPU does not need to identify a module specification information of the microcontroller unit.

[0008] In some embodiments, the virtual memory circuit structure further includes a first voltage conversion circuit module disposed on the circuit board, the first voltage conversion circuit module being electrically connected to the motherboard and the microcontroller unit.

[0009] In some embodiments, the virtual memory circuit structure further includes a second voltage conversion circuit module disposed on the circuit substrate, the second voltage conversion circuit module being electrically connected to the motherboard, the LED control chip, and the at least one LED.

[0010] In some embodiments, the first voltage conversion circuit module converts the 5V voltage provided by the motherboard to a 1V voltage and supplies power to the microcontroller unit, and the second voltage conversion circuit module converts the 5V voltage provided by the motherboard to a 3.3V to 5V voltage and supplies power to the LED control chip and the at least one LED.

[0011] In some embodiments, the microcontroller unit and the light-emitting diode control chip are integrated into a single chip. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of one side of the existing virtual memory structure;

[0013] Figure 2 This is a schematic diagram of another aspect of the existing virtual memory structure;

[0014] Figure 3 This is a schematic diagram of the circuit block of an existing virtual memory structure;

[0015] Figure 4 This is a schematic diagram of the specifications of an existing non-virtual memory architecture with available capacity;

[0016] Figure 5 This is a schematic diagram of the specifications of the existing virtual memory architecture;

[0017] Figure 6This is a circuit connection diagram of an existing virtual memory structure;

[0018] Figure 7 This is a schematic diagram of one side of the virtual memory circuit structure of this utility model;

[0019] Figure 8 This is a schematic diagram of another aspect of the virtual memory circuit structure of this utility model;

[0020] Figure 9 This is a circuit block diagram of the virtual memory circuit structure of this utility model;

[0021] Figure 10 This is a circuit connection diagram of the virtual memory circuit structure of this utility model;

[0022] Figure 11 This is a flowchart illustrating the operation method of the virtual memory circuit structure of this utility model.

[0023] Explanation of reference numerals in the attached figures

[0024] 10: Virtual Memory Circuit Structure

[0025] 100: Circuit board

[0026] 110: First Surface

[0027] 120: Second Surface

[0028] 200: Microcontroller Unit

[0029] 300: Light Emitting Diode Control Chip

[0030] 400: Light Emitting Diode

[0031] 500: First voltage conversion circuit module

[0032] 600: Second voltage conversion circuit module

[0033] 10': Virtual Memory Structure

[0034] 100': Circuit board

[0035] 200': Sequence Presence Detection Hub

[0036] 300': LED control chip

[0037] 400': Light Emitting Diode

[0038] C1: First control signal

[0039] D1': Module Specification Information

[0040] S100: Operation method of virtual memory circuit structure

[0041] S110: Steps

[0042] S120: Steps

[0043] S130: Steps Detailed Implementation

[0044] Figure 7 This is a schematic diagram of one side of the virtual memory circuit structure of this utility model. Figure 8 This is a schematic diagram of another aspect of the virtual memory circuit structure of this utility model. Figure 9 This is a circuit block diagram of the virtual memory circuit structure of this utility model.

[0045] Please refer to Figures 7 to 9 The virtual memory circuit structure 10 of this invention includes a circuit board 100, a microcontroller unit 200, a light-emitting diode control chip 300, and at least one light-emitting diode 400. Communication between the components of this invention can be achieved through a serial communication bus, which can be, for example, I2C (Inter-Integrated Circuit) and / or I3C (Improved Inter-Integrated Circuit), but is not limited thereto.

[0046] The circuit board 100 is configured to be removably inserted into a slot (not shown) of a motherboard (not shown). In some embodiments, for example, the slot (not shown) may be a DIMM (Dual In-line Memory Module) slot, but is not limited thereto. In some embodiments, the circuit board 100 may include a first surface 110 (e.g., Figure 7 (as shown) and a second surface 120 (as shown) Figure 8 (As shown).

[0047] The microcontroller unit 200, also known as an MCU, can be mounted on the circuit board 100. In some embodiments, such as Figure 7 As shown, the microcontroller unit 200 can be disposed on the first surface 110 of the circuit board 100.

[0048] The light-emitting diode control chip 300 can be disposed on the circuit board 100. In some embodiments, such as Figure 7As shown, the light-emitting diode control chip 300 can be disposed on the first surface 110 of the circuit board 100. In some embodiments, the light-emitting diode control chip 300 can be electrically connected to the microcontroller unit 200 through the circuit board 100.

[0049] At least one light-emitting diode 400 may be disposed on the circuit board 100. In some embodiments, the light-emitting diode 400 may be disposed on a first surface 110, a second surface 120, and / or simultaneously on the first surface 110 and the second surface 120 of the circuit board 100 (e.g., ...). Figure 7 and Figure 8 (As shown). In some embodiments, the light-emitting diode 400 can be electrically connected to the light-emitting diode control chip 300 via the circuit board 100. In some embodiments, the number of light-emitting diodes 400 can be increased or decreased as needed. In some embodiments, the microcontroller unit 200 and the light-emitting diode control chip 300 can be integrated into a single chip.

[0050] In some embodiments, the virtual memory circuit structure 10 of this utility model further includes a first voltage conversion circuit module 500. The first voltage conversion circuit module 500 may be disposed on the circuit board 100. In some embodiments, such as Figure 8 As shown, the first voltage conversion circuit module 500 may be disposed on the second surface 120 of the circuit board 100. In some embodiments, the first voltage conversion circuit module 500 may be electrically connected to the motherboard (not shown) and the microcontroller unit 200. In some embodiments, the first voltage conversion circuit module 500 may convert the 5V voltage (i.e., a supply voltage) provided by the motherboard (not shown) into a 1V voltage (i.e., a first voltage) and supply power to the microcontroller unit 200.

[0051] In some embodiments, the virtual memory circuit structure 10 of this utility model further includes a second voltage conversion circuit module 600. The second voltage conversion circuit module 600 may be disposed on the circuit board 100. In some embodiments, such as Figure 8 As shown, the second voltage conversion circuit module 600 can be disposed on the second surface 120 of the circuit board 100. In some embodiments, the second voltage conversion circuit module 600 can be electrically connected to the motherboard (not shown) and the LED control chip 300 and each LED 400. In some embodiments, the second voltage conversion circuit module 600 can convert the 5V voltage (i.e., the supply voltage) provided by the motherboard (not shown) to a voltage of 3.3V to 5V (i.e., a second voltage) and supply power to the LED control chip 300 and each LED 400.

[0052] Compared to the above Figures 1 to 6In the existing virtual memory structure 10', different central processing units (not shown) on the motherboard (not shown) can be configured to communicate directly with the microcontroller unit 200 in the virtual memory circuit structure 10 of this utility model. That is, any central processing unit (not shown) does not need to identify the module specification information of the microcontroller unit 200. Thus, an electronic device (not shown) (e.g., a computer) corresponding to the motherboard (not shown) can be directly powered on and perform subsequent operation to control the light-emitting diode 400.

[0053] Figure 10 This is a circuit connection diagram of the virtual memory circuit structure of this utility model. Figure 11 This is a flowchart illustrating the operation method of the virtual memory circuit structure of this utility model.

[0054] Please refer to Figure 10 and Figure 11 The operation method S100 of the virtual memory circuit structure of this utility model may include steps S110, S120, and S130. The components used correspond to the components and component numbers of the aforementioned virtual memory circuit structure 10.

[0055] Step S110 is an addressing step. In step S110, a virtual memory circuit structure 10 is inserted into a slot (not shown) of a motherboard (not shown) to address the virtual memory circuit structure 10.

[0056] Step S120 is a first-stage communication step. Please also refer to... Figure 10 and Figure 11 In step S120, a central processing unit (not shown) of the motherboard (not shown) sends a first control signal C1, which is transmitted through the HSCL (Host Bus-Input Clock) / HSDA (Host Bus-Data Input / Output) pins of the slot (not shown) to the SCLK (Serial Clock) / SDAT (Serial Data Input and Output) pins of a microcontroller unit 200 included in the virtual memory circuit structure 10.

[0057] Step S130 is a second-stage communication step. Please also refer to... Figure 10 and Figure 11In step S130, after the first control signal C1 is processed by the microcontroller 200, a second control signal C2 is output through the SCLK / SDAT pin of the microcontroller 200. The second control signal C2 is transmitted to the SCLK / SDAT pin of a light-emitting diode chip 300 included in the virtual memory circuit structure 10, thereby controlling at least one light-emitting diode 400 included in the virtual memory circuit structure 10 to operate.

[0058] In steps S110, S120, and S130 above, the central processing unit (not shown) on the motherboard (not shown) is configured to communicate directly with the microcontroller unit 200, compared to the aforementioned... Figures 1 to 6 In the existing virtual memory structure 10', the central processing unit (not shown) does not need to recognize the module specification information of the microcontroller 200 in the virtual memory circuit structure 10 of this utility model.

[0059] In some embodiments, the first-stage communication step (i.e., step S120) may further include: converting a power supply voltage provided by the motherboard (not shown) into a first voltage and providing it to the microcontroller unit 200 via a first voltage conversion circuit module 500 included in the virtual memory circuit structure 10. In some embodiments, the power supply voltage may be greater than the first voltage. For example, the power supply voltage is 5V and the first voltage is 1V.

[0060] In some embodiments, the second-stage communication step (i.e., step S130) may further include: converting the power supply voltage provided by the motherboard (not shown) into a second voltage via a second voltage conversion circuit module 600 included in the virtual memory circuit structure 10, and providing it to the LED control chip 300 and at least one LED 400. In some embodiments, the power supply voltage may be greater than or equal to the second voltage, and the second voltage may be greater than the first voltage. For example, the second voltage may be 3.3V to 5V.

[0061] In summary, the virtual memory circuit structure 10 and its operation method S100 of this utility model can be configured by setting and removing the sequence presence detection hub (see reference) through the microcontroller 200. Figure 3 The sequence presence detection hub 200' enables the operation of subsequent electronic devices such as computers and the control of LEDs 400 without the need to identify the data content of the virtual memory circuit structure 10 (or microcontroller 200) itself, even when used on motherboards (not shown) with different central processing units (not shown).

Claims

1. A virtual memory circuit structure, characterized by, Comprising: a circuit board configured to be detachably inserted into a slot of a host board; a micro control unit disposed on the circuit board; a light emitting diode control chip disposed on the circuit board, the light emitting diode control chip being electrically connected to the micro control unit through the circuit board; and at least one light emitting diode disposed on the circuit board, the at least one light emitting diode being electrically connected to the light emitting diode control chip through the circuit board; wherein a central processing unit on the host board is configured to directly communicate with the micro control unit without identifying module specification information of the micro control unit. Further comprising a first voltage conversion circuit module disposed on the circuit board, the first voltage conversion circuit module electrically connecting the host board and the micro control unit.

2. The virtual memory circuit architecture of claim 1, wherein, Further comprising a second voltage conversion circuit module disposed on the circuit board, the second voltage conversion circuit module electrically connecting the host board and the light emitting diode control chip and the at least one light emitting diode.

3. The virtual memory circuit architecture of claim 2, wherein, The first voltage conversion circuit module converts 5V voltage provided by the host board into 1V voltage and supplies the micro control unit, and the second voltage conversion circuit module converts 5V voltage provided by the host board into 3.3V to 5V voltage and supplies the light emitting diode control chip and the at least one light emitting diode.

4. The virtual memory circuit architecture of claim 3, wherein, The micro control unit and the light emitting diode control chip are integrated in a single chip.

5. The virtual memory circuit architecture of claim 1, wherein, ​

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