Conductive member
By designing cavity and recessed structures in conductive components, the problem of uneven stress during extrusion installation is solved, thereby improving the service life of conductive components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-06
AI Technical Summary
Existing conductive components are prone to uneven stress during extrusion installation, which can lead to outer layer cracking and reduced service life.
Design a conductive component comprising an outer sheath, a support layer, and a filler layer. The filler layer has a cavity structure and a recessed structure on one side, which can fit with a circuit board. The recessed structure releases stress and improves service life.
It effectively relieves stress, prevents damage to conductive components, and extends service life.
Smart Images
Figure CN223978126U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of this disclosure relate to the field of circuit board conductivity, and more specifically to conductive components. Background Technology
[0002] As electronic devices become increasingly miniaturized and highly integrated, surface mount technology (SMT) has become mainstream. Extrusion soldering processes are compatible with SMT workflows, enabling precise connections between conductive components (such as pads and connectors) and the PCB, meeting the assembly requirements of miniaturized components. Currently, most surface mount conductive components are typically extruded onto the PCB by external force and then mounted and secured by soldering.
[0003] However, when using the above-mentioned extrusion-welded conductive components, the following technical problems often arise:
[0004] Most surface-mount conductive components are regular in shape (such as rectangular or cylindrical). When subjected to pressure during installation, uneven stress can easily occur, causing the outer layer of the conductive component to crack and reducing its service life.
[0005] The information disclosed in this background section is only intended to enhance the understanding of the background of the present disclosure concept, and therefore may contain information that does not form prior art known to those skilled in the art. Utility Model Content
[0006] The summary portion of this disclosure is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description portion. This summary portion is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.
[0007] Some embodiments of this disclosure provide conductive components to address one or more of the technical problems mentioned in the background section above.
[0008] Some embodiments of this disclosure provide a conductive component, characterized in that the outer cladding layer, support layer, and filler layer are provided, wherein the outer cladding layer covers the support layer; the support layer wraps around the filler layer; the filler layer has a cavity structure; one side of the conductive component has a recessed structure; the conductive component is configured to be disposed on a circuit board; and in the installed state, the side of the conductive component with the recessed structure is in contact with the circuit board.
[0009] Optionally, the conductive component described above has a rounded corner structure.
[0010] Optionally, the conductive component is configured to be deformable under stress.
[0011] Optionally, the shape of the cavity structure is the same as the shape of the conductive component, and the central axis of the cavity structure and the central axis of the conductive component are on the same straight line.
[0012] Optionally, the aforementioned recessed structure is triangular.
[0013] Optionally, the thickness of the outer cladding layer is between 0.01 and 0.04 mm, the outer cladding layer is configured to not completely enclose the support layer, the thickness of the support layer is between 0.1 mm and 0.3 mm, and an inner support layer is provided inside the cavity structure, the thickness of the inner support layer is between 0.1 mm and 0.3 mm.
[0014] Some embodiments of this disclosure provide a conductive component with a recessed structure on one side, which can better release stress during extrusion mounting and improve the service life of the conductive component. Specifically, the reason for the low service life of most conductive components is that most surface-mount conductive components are regular in shape (such as rectangular or cylindrical), which easily leads to uneven stress during extrusion mounting, causing the outer layer of the conductive component to crack easily and reducing its service life. Based on this, some embodiments of this disclosure provide a conductive component characterized by the aforementioned outer sheath, support layer, and filler layer, wherein the outer sheath covers the support layer; the support layer wraps around the filler layer; the filler layer has a cavity structure; one side of the conductive component has a recessed structure; the conductive component is configured to be mounted on a circuit board; and in the mounted state, the side of the conductive component with the recessed structure is in contact with the circuit board. When extruded mounting on the circuit board, the recessed structure can release some of the stress generated by the extrusion force, thus avoiding damage to the conductive component to a certain extent. Therefore, a conductive component that can release stress through the recessed structure on one side can be provided, improving the service life of the conductive component. Attached Figure Description
[0015] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and elements are not necessarily drawn to scale.
[0016] Figure 1 These are schematic diagrams of the structure of conductive components according to some embodiments of this disclosure;
[0017] Figure 2 This is a cross-sectional view of a conductive component according to some embodiments of this disclosure;
[0018] Figure 3 This is a bottom view of a conductive component according to some embodiments of this disclosure;
[0019] Figure 4 This is a schematic diagram of conductive components mounted on a circuit board according to some embodiments of this disclosure. Detailed Implementation
[0020] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.
[0021] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.
[0022] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.
[0023] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".
[0024] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.
[0025] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.
[0026] Figure 1 This is a schematic diagram of the structure of a conductive component according to some embodiments of this disclosure. Figure 1 It includes an outer cladding layer 1, a support layer 2, a filling layer 3, and a cavity structure 4.
[0027] Figure 2 This is a cross-sectional view of a conductive component according to some embodiments of this disclosure. Figure 2 It includes an outer cladding layer 1, a notch 11, a cavity structure 4, an inner support layer 5, and a recessed structure 6.
[0028] Figure 3 This is a bottom view of a conductive component according to some embodiments of this disclosure. Figure 3 It includes the outer cladding layer 1 and the notch 11.
[0029] Figure 4 This is a schematic diagram of conductive components mounted on a circuit board according to some embodiments of this disclosure. Figure 4 It includes filler layer 3, circuit board 7, and notch 11.
[0030] In some embodiments, the conductive component may include an outer cladding layer 1, a support layer 2, and a filler layer 3. The outer cladding layer 1 may be a PI (polyimide) film with a gold-plated layer adhered to its surface. The outer cladding layer 1 can be used for conduction. The outer cladding layer 1 can be bonded to the support layer 2 by its own adhesiveness. The support layer 2 may be silicone rubber. The functions of the support layer 2 may include, but are not limited to, cushioning, sealing, and support. The filler layer 3 may be foamed silicone. The functions of the filler layer 3 may include, but are not limited to, insulation, stress relief, and sealing.
[0031] In some embodiments, the outer cladding layer 1 may cover the support layer 2 to ensure the conductivity of the conductive component to a certain extent.
[0032] In some embodiments, the support layer 2 may be wrapped around the filler layer 3 to ensure the support effect on the conductive component.
[0033] In some embodiments, the filling layer 3 is provided with a cavity structure 4. The cavity structure 4 can be achieved by hollowing out a portion of the filling layer 3. The cavity structure 4 can be used to increase the upper limit of the elastic deformation of the conductive component.
[0034] In some embodiments, one side of the conductive component may be provided with a recessed structure 6. The recessed structure 6 can be used to relieve stress when the conductive component is installed.
[0035] In some embodiments, the conductive component is configured to be disposed on a circuit board 7. The circuit board 7 may be a PCB board. The conductive component can be soldered onto the circuit board 7 by applying solder paste to one side, pressing it against the target circuit board 7, and then heat-sealing it.
[0036] In some embodiments, in the installed state, the side of the conductive component with the recessed structure 6 is attached to the circuit board 7.
[0037] Optionally, such as Figure 1 As shown, the conductive component may have a rounded corner structure. This rounded corner structure allows for better shaping and a more aesthetically pleasing appearance of the conductive component.
[0038] Optionally, the conductive component can be configured to deform under stress, allowing it to better adapt to the welding environment and absorb more extrusion pressure without damage. For example, Figure 4An example diagram is shown of the conductive component being deformed by extrusion and mounted on the circuit board 7.
[0039] Optionally, such as Figure 1-2 As shown, the shape of the cavity structure 4 can be the same as the shape of the conductive component. The central axis of the cavity structure 4 and the central axis of the conductive component can be on the same straight line to make the machining of the cavity structure 4 easier and to make the conductive component more uniformly stressed.
[0040] Optionally, such as Figure 2 As shown, the recessed structure 6 can be triangular. The triangular recessed structure 6 can release more stress on the conductive component during extrusion installation.
[0041] Optionally, the thickness of the outer cladding layer 1 can be between 0.01 and 0.04 mm. A thickness within the range of 0.01 to 0.04 mm is sufficient to ensure the conductivity of the outer cladding layer 1 while also preventing damage. The outer cladding layer 1 is configured to not completely enclose the support layer 2, such as... Figure 1-2 A notch 11 can be provided on the bottom surface of the conductive component to prevent short circuits to some extent. The thickness of the support layer 2 is between 0.1mm and 0.3mm. A thickness within the range of 0.1mm to 0.3mm is sufficient to ensure the support layer 2's support function while preventing damage. An inner support layer 5 can be provided inside the cavity structure 4. The thickness of the inner support layer 5 can be between 0.1mm and 0.3mm. For example, the thickness of the inner support layer 5 can be 0.2mm. A thickness within the range of 0.1mm to 0.3mm is sufficient to ensure the inner support layer 5's support function while preventing damage. The inner support layer 5 can be used to further support the conductive component when it is pressed and installed.
[0042] Optionally, such as Figure 1-3 As shown, one side of the outer layer 1 may have a notch 11. The notch 11 may be rectangular in shape. Figure 2 and 3As shown, the notch 11 can be a rectangular strip-shaped notch penetrating the bottom surface of the outer sheath 1. The notch 11 can be located on the side of the conductive component where the recessed structure 6 is located. The side with the recessed structure 6 is the side that contacts the circuit board 7 during installation, which can better prevent short circuits. The length of the notch 11 can be the same as the length of the conductive component to ensure the short-circuit protection function of the conductive component at various locations. The width of the notch 11 can be smaller than the width of the conductive component. For example, the width of the notch 11 can be between 0.4mm and 0.6mm, and can be flexibly adjusted according to conductivity requirements and the current circuit board 7, without specific limitations. The central axis of the notch 11 is on the same straight line as the central axis of the recessed structure 6 to make the force on both ends of the notch 11 more even. The notch can be configured to penetrate the outer sheath 1. The size of the notch can be configured to change under force to better fit the conductive component. In the installed state of the conductive component, both sides of the notch can contact the circuit portion of the circuit board to ensure conductivity.
[0043] The above-described optional embodiments, as an inventive point of this disclosure, solve the technical problem that "most extruded conductive components lack short-circuit protection structures." The specific factors causing most extruded conductive components to lack short-circuit protection structures are as follows: the conductive layer of most extruded conductive components completely encloses the inner layer structure, which may lead to short circuits after installation, affecting user experience. Solving these factors can improve user experience. To achieve this effect, this disclosure also provides a conductive component with a short-circuit protection notch on the mounting surface. By leaving a rectangular notch penetrating the bottom surface of the outer layer, short circuits are prevented to a certain extent after installation. Thus, the notch structure on the outer layer provides short-circuit protection, improving user experience.
[0044] Some embodiments of this disclosure provide a conductive component with a recessed structure on one side, which can better release stress during extrusion mounting and improve the service life of the conductive component. Specifically, the reason for the low service life of most conductive components is that most surface-mount conductive components are regular in shape (such as rectangular or cylindrical), which easily leads to uneven stress during extrusion mounting, causing the outer layer of the conductive component to crack easily and reducing its service life. Based on this, some embodiments of this disclosure provide a conductive component characterized by the aforementioned outer sheath, support layer, and filler layer, wherein the outer sheath covers the support layer; the support layer wraps around the filler layer; the filler layer has a cavity structure; one side of the conductive component has a recessed structure; the conductive component is configured to be mounted on a circuit board; and in the mounted state, the side of the conductive component with the recessed structure is in contact with the circuit board. When extruded mounting on the circuit board, the recessed structure can release some of the stress generated by the extrusion force, thus avoiding damage to the conductive component to a certain extent. Therefore, a conductive component that can release stress through the recessed structure on one side can be provided, improving the service life of the conductive component.
[0045] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.
Claims
1. An electrically conductive component, characterized by The conductive component comprises an outer layer, a support layer and a filling layer, wherein, The outer layer covers the support layer; The support layer covers the filling layer; The filling layer is provided with a cavity structure; One side of the conductive component is provided with a recess structure; The conductive component is configured to be arranged on a circuit board; In the installed state, the side of the conductive component provided with the recess structure is attached to the circuit board.
2. The electrically conductive component of claim 1, wherein, The conductive component is provided with a rounded corner structure.
3. The electrically conductive component of claim 1, wherein, The conductive component is configured to be deformed under force.
4. The conductive member according to claim 1, characterized by The shape of the cavity structure is the same as that of the conductive component, and the central axis of the cavity structure is on the same line as the central axis of the conductive component.
5. The conductive member according to claim 1, wherein The recess structure is triangular.
6. The conductive member according to claim 1, wherein The thickness of the outer layer is between 0.01 and 0.04 mm, the outer layer is configured to not completely cover the support layer, the thickness of the support layer is between 0.1 mm and 0.3 mm, the inside of the cavity structure is provided with an inner support layer, and the thickness of the inner support layer is between 0.1 mm and 0.3 mm.