Electroplating structure of ultrathin small terminal

Abstract

The electroplating structure of the ultrathin small terminal comprises a substrate, a first press-fitting part, a second press-fitting part and an inserting part which are integrally formed are sequentially arranged on the substrate, and the inserting part comprises a first connecting part and a second connecting part which are symmetrical to each other. The first connecting part and the second connecting part are folded towards the same side of the base plate under stamping to form the inserting part, and an overlapping area is formed in the inserting part; wherein the outer surface of the substrate is electroplated before stamping, so that a thin electroplated layer is pre-plated on the whole outer surface of the substrate, then stamping is carried out, and secondary electroplating is carried out after stamping is completed, so that the problem that the substrate cannot be subjected to secondary electroplating even if gaps between the first connecting part and the substrate as well as between the second connecting part and the substrate are very small after stamping is effectively solved. The problem that electroplating is uneven or no electroplating layer exists due to the fact that the second electroplating layer cannot flow into the gap is solved, and the problem that the electroplating cost is high due to the fact that complete electroplating treatment is carried out before stamping in the prior art is solved.

Description

Technical Field

[0001] This utility model belongs to the field of electrical connection technology, specifically relating to an electroplating structure for an ultra-thin small terminal. Background Technology

[0002] Electrical terminals are accessories used to achieve electrical connections. With the development of the electronics industry, the application range of electrical terminals is expanding, and the types are also increasing. To improve the performance of terminals, electroplating is usually performed on the terminal surface. This is a process that uses the principle of electrolysis to plate a thin layer of another metal or alloy onto the surface of certain metals. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics.

[0003] Currently, when electroplating is required for terminal structures that require folding and have small gaps after folding, the electroplating process is usually completed before folding and stamping. However, this approach increases electroplating costs, and because the gaps are small after folding, excessive electroplating layers can easily cause cracks at the folding points, affecting the overall performance of the terminal. Another approach is to perform overall electroplating after stamping, but this results in the electroplating solution not being able to flow between the two sides with small gaps after folding, leading to uneven electroplating and affecting the terminal's corrosion resistance and oxidation resistance. Therefore, this electroplating structure needs to be improved. Utility Model Content

[0004] (1) Technical problems to be solved

[0005] This invention provides an electroplating structure for ultra-thin small terminals, aiming to solve the problems of high electroplating cost and uneven electroplating in the existing technology due to the difficulty in electroplating the overlapping area of ​​terminals.

[0006] (2) Technical solution

[0007] This utility model provides an electroplating structure for an ultra-thin small terminal, including a substrate. The substrate is provided with an integrally formed first pressing part, a second pressing part, and an insertion part. The insertion part includes two mutually symmetrical first connecting parts and second connecting parts. The first connecting parts and the second connecting parts are folded toward the same side of the substrate under stamping to form the insertion part. An overlapping area is formed in the insertion part.

[0008] Before stamping, the substrate is electroplated on its outer surface to form a first electroplated layer. After stamping, the overlapping area of ​​the substrate is covered by the first electroplated layer. Then, the outer surface of the substrate is electroplated a second time to cover the first electroplated layer with a second electroplated layer.

[0009] Furthermore, the first electroplated layer is a nickel plating layer.

[0010] Furthermore, after stamping, the first connecting portion and the second connecting portion are located on the same horizontal plane and a first gap is formed between them, and a second gap is formed between the first connecting portion, the second connecting portion and the substrate, and the distance between the first gap and the second gap is the same.

[0011] Furthermore, the front peripheral wall of the insertion part is provided with a guide slope, which is narrower at the front and wider at the back.

[0012] Furthermore, the rear end of the plug portion is provided with an upward arc-shaped protrusion, and the arc-shaped protrusion and the substrate form a connecting cavity that communicates with the overlapping area.

[0013] Furthermore, both the first pressing part and the second pressing part are provided with two upwardly extending pressing blocks. The two pressing blocks are used to press or fold the cable to fix the wire on the substrate.

[0014] Furthermore, a connecting portion is provided between the insertion portion and the second pressing portion. The connecting portion is provided with two side plates, which together with the bottom wall of the substrate to form a connecting groove. The connecting groove is connected to the rear end of the insertion portion.

[0015] Furthermore, each of the two side plates has a grooved block bent towards the center at the end away from the insertion part.

[0016] Furthermore, both sides of the first pressing part and the connecting part are provided with recessed surfaces that narrow towards the second pressing part.

[0017] Furthermore, the present invention also includes a connecting plate, wherein at least two substrates with identical structures are provided on the connecting plate.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] Before stamping, the substrate is electroplated to pre-plat a thin electroplating layer on the entire outer surface of the substrate before stamping. After stamping, a second electroplating process is performed. This effectively solves the problem that even if the gap between the first connecting part, the second connecting part and the substrate is very small after stamping, the second electroplating layer cannot flow into the gap, resulting in uneven electroplating or no electroplating layer. It also improves the problem of high electroplating cost caused by the traditional technology of performing a complete electroplating process before stamping. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 .

[0021] Figure 2 This is a cross-sectional view of the insertion part of this utility model.

[0022] Figure 3 This is a schematic diagram illustrating the electroplating process before and after stamping in this utility model.

[0023] Figure 4 This is a schematic diagram of the front end of the plug-in part of this utility model.

[0024] Figure 5 This is a schematic diagram of the rear end of the plug-in part of this utility model.

[0025] Figure 6 This is a schematic diagram of the overall structure of the present invention. Figure 2 .

[0026] Figure 7 This is a partial schematic diagram of the overall structure of this utility model.

[0027] Figure 8 This is a schematic diagram of the connecting plate and multiple substrates of this utility model.

[0028] Reference numerals: 1-substrate, 11-first electroplating layer, 12-second electroplating layer, 2-first pressing part, 21-pressing block, 22-recessed surface, 3-second pressing part, 4-insertion part, 41-first connecting part, 42-second connecting part, 43-overlapping area, 44-first gap, 45-second gap, 46-guide slope, 47-arc protrusion, 48-connecting cavity, 5-connecting part, 51-side plate, 52-connecting groove, 53-groove block, 6-connecting plate. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0030] like Figure 1-3As shown, this utility model provides an electroplating structure for an ultra-thin small terminal, including a substrate 1. The substrate 1 has a first pressing part 2, a second pressing part 3, and a plug-in part 4 sequentially formed. The plug-in part 4 includes two symmetrical first connecting parts 41 and second connecting parts 42. The first connecting parts 41 and second connecting parts 42 are folded towards the same side of the substrate 1 under stamping to form the plug-in part 4. The plug-in part 4 has a flat structure and is used to plug into a female terminal to achieve electrical connection. An overlapping area 43 is formed on the inner wall of the plug-in part 4. The gap within the overlapping area 43 is extremely small, so that the electroplating solution cannot flow smoothly inside during electroplating after folding. Therefore, if electroplating is performed after stamping, the electroplating on the inner wall of the overlapping area 43 will be uneven, or even no electroplating layer will be applied. This makes it easy for a conductive layer to form between the first connecting part 41, the second connecting part 42, and the substrate 1, thus affecting the normal operation of the terminal. To solve this problem, the substrate 1 of this invention is electroplated on its outer surface before stamping, forming a first electroplating layer 11 on the surface of the substrate 1. The first electroplating layer 11 can be a low-cost corrosion-resistant plating layer to reduce the cost of electroplating. In this embodiment, the first electroplating layer 11 is a nickel plating layer. Then, the first connecting part 41 and the second connecting part 42 are stamped, thereby covering the inner wall of the overlapping area 43 after stamping with the first electroplating layer 11. Then, the outer surface of the stamped substrate 1 is electroplated again, so that the first electroplating layer 11 is covered with a second electroplating layer 12. It should be noted that the second electroplating layer 12 is not limited to one type of plating layer. Here, all plating layers other than the first electroplating layer 11 are collectively referred to as the second electroplating layer 12. The electroplating technology has been disclosed in the prior art and is not within the main technical scope of this invention, so this description will not elaborate further.

[0031] Specifically, the terminals of this invention are relatively thin and small, resulting in a small gap in the overlapping area 43 after stamping. During re-plating, the plating solution often has difficulty penetrating into the overlapping area 43, causing a certain amount of plating solution to accumulate at the port of the overlapping area 43, forming a closed space. If electroplating is not performed before stamping, corrosion and oxidation are likely to occur in the area of ​​the overlapping area 43, affecting the normal operation of the product and reducing its service life. The electroplating structure of this invention effectively solves this problem. At the same time, the electroplating structure of this invention avoids the traditional technique of completing all electroplating layers before stamping, resulting in the same specifications of plating on the surface of the substrate 1. This not only increases the cost of electroplating but also easily causes cracks at the bending points after stamping. Especially in the overlapping area 43, due to the large curvature of the bend, excessive plating can easily cause wrinkles in the plating layer, leading to cracking and damage to the terminal, affecting its normal operation. Therefore, the improvement of the electroplating structure of this invention is of great significance.

[0032] Furthermore, such as Figure 4 As shown, after stamping, the first connecting part 41 and the second connecting part 42 are located on the same horizontal plane and a first gap 44 is formed between them. A second gap 45 is formed between the first connecting part 41, the second connecting part 42 and the substrate 1. The distance between the first gap 44 and the second gap 45 is the same. The distance between the first gap 44 and the second gap 45 is extremely small, which can ensure the overall flatness of the surface of the plug-in part 4, which is convenient for processing and can also ensure the stability of clamping when plugged into the female terminal.

[0033] Furthermore, the front peripheral wall of the insertion part 4 is provided with a guide slope 46. The guide slope 46 is narrow at the front and wide at the back. When it is inserted with the female terminal, the guide slope 46 has a guiding function, which can make the terminal of this utility model be inserted faster and more accurately, thereby improving the assembly efficiency.

[0034] Furthermore, such as Figure 5 As shown, the rear end of the plug-in part 4 is provided with an upward arc-shaped protrusion 47. The arc-shaped protrusion 47 and the substrate 1 form a connecting cavity 48 that communicates with the overlapping area 43. Since the actual length of the plug-in part 4 is the length of the straight section of the plug-in part 4, the arc-shaped protrusion 47 can prevent the user from using excessive force during plug-in, which could damage the terminal.

[0035] Furthermore, such as Figure 6-7As shown, both the first pressing part 2 and the second pressing part 3 are provided with two upwardly extending pressing blocks 21. The two pressing blocks 21 are used to press or fold the cable to fix the wire on the base plate 1. A connecting part 5 is also provided between the plug-in part 4 and the second pressing part 3. The connecting part 5 is provided with two side plates 51. The two side plates 51 and the bottom wall of the base plate 1 form a connecting groove 52. The connecting groove 52 is connected to the rear end of the plug-in part 4, that is, the connecting groove 52 communicates with the connecting cavity 48. The user can set a corresponding elastic element (not shown in the figure) in the connecting groove 52 as needed, so that when the male terminal is connected to the female terminal, the elastic force of the elastic element makes the connection between the male terminal and the female terminal more stable.

[0036] Furthermore, each of the two side plates 51 has a groove 53 bent toward the center at the end away from the plug-in part 4. The groove 53 is arranged side by side above the connecting groove 52 for use with the female terminal. This is disclosed in the prior art and will not be described in detail here.

[0037] It should be noted that when the wire is installed with this terminal, the wire end is placed on the second pressing part 3, and the insulation layer of the wire is placed on the first pressing part 2. At this time, the pressing blocks 21 on the first pressing part 2 and the second pressing part 3 are bent and pressed towards the wire to complete the fixed installation of the wire and the terminal. Since the wire end is not covered with insulation, the space occupied by the wire end is small. In order to make the pressing more secure and improve the processing efficiency, both sides of the first pressing part 2 and the connecting part 5 are provided with recessed surfaces 22 that narrow towards the second pressing part 3, so that the space formed by the second pressing part 3 is smaller than the space of the first pressing part 2, thereby better matching the structure of the wire.

[0038] Preferably, such as Figure 8 As shown, the present invention also includes a connecting plate 6, on which at least two substrates 1 with the same structure are provided. Since the substrates 1 are small in size and occupy little space, multiple substrates 1 can be connected together by the connecting plate 6, so that multiple substrates 1 can be produced in one stamping, thereby improving production efficiency.

[0039] The working principle of this utility model is explained in detail below:

[0040] The first pressing part 2, the second pressing part 3, the first connecting part 41, and the second connecting part 42 on the substrate 1 are integrally formed and stamped to form a product. Before stamping, the substrate 1 is first electroplated to pre-plat a thin layer on the entire substrate 1 before stamping. After stamping, the first connecting part 41 and the second connecting part 42 form the insertion part 4. The stamped substrate 1 is then electroplated a second time to cover the first plating layer with a second plating layer. Since the gap inside the insertion part 4 is small, it is difficult for the second plating layer to enter the insertion part 4 for electroplating. Therefore, electroplating before stamping can effectively solve this problem.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

[0042] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An electroplating structure of an ultrathin small terminal, characterized in that, The utility model relates to a kind of connector, including substrate (1), the substrate (1) is equipped with integrally formed first press fitting (2), second press fitting (3) and plug-in portion (4) in turn, the plug-in portion (4) includes two mutually symmetrical first connecting portion (41) and second connecting portion (42), the first connecting portion (41) and the second connecting portion (42) are folded in the same side of the substrate (1) under stamping and form the plug-in portion (4), and overlap area (43) is formed in the plug-in portion (4); Wherein, the substrate (1) is first electroplated to outer surface before stamping, to form first electroplated layer (11) on the surface of the substrate (1), so that the overlap area (43) is wrapped with the first electroplated layer (11) inside after the substrate (1) is stamped;Then the outer surface of the substrate (1) is electroplated again, so that the second electroplated layer (12) is wrapped on the first electroplated layer (11); After stamping, the first connecting portion (41) and the second connecting portion (42) are located on the same horizontal plane and form a first gap (44) between them, and a second gap (45) is formed between the first connecting portion (41), the second connecting portion (42) and the substrate (1), and the distance between the first gap (44) and the second gap (45) is the same. The front end of the plug-in portion (4) is provided with a guide slope (46), and the guide slope (46) is narrow in front and wide in back. The rear end of the plug-in portion (4) is provided with an upward arc-shaped protrusion (47), and the arc-shaped protrusion (47) and the substrate (1) form a connecting cavity (48) in communication with the overlap area (43).

2. The electroplating structure of an ultrathin small terminal according to claim 1, wherein, The first electroplated layer (11) is a nickel plating layer.

3. The electroplating structure of an ultrathin small terminal according to claim 1, characterized in that, The first press fitting (2) and the second press fitting (3) are each provided with two upwardly extending pressing blocks (21), and the two pressing blocks (21) are used for pressing or folding the wires to fix the wires on the substrate (1).

4. The electroplating structure of an ultrathin small terminal according to claim 3, characterized in that, The plug-in portion (4) and the second press fitting (3) are further provided with a connecting portion (5), and the connecting portion (5) is provided with two side plates (51), and the two side plates (51) and the bottom wall of the substrate (1) form a connecting groove (52), and the connecting groove (52) is connected with the rear end of the plug-in portion (4).

5. The electroplating structure of an ultrathin small terminal according to claim 4, characterized in that, The ends of the two side plates (51) away from the plug-in portion (4) are respectively provided with a groove block (53) bent towards the center.

6. The electroplating structure of an ultrathin small terminal according to claim 5, characterized in that, The first press fitting (2) and the connecting portion (5) are each provided with a recessed surface (22) narrowing towards the second press fitting (3).

7. The electroplating structure of an ultra-thin small terminal according to claim 1, wherein, Further comprising a connecting plate (6), the connecting plate (6) is provided with at least two identical substrates (1).

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