PCB structure for reinforcing heavy-duty large-scale SMD device

Abstract

The utility model discloses a PCB structure for reinforcing a heavy-duty large-scale SMD device, comprising a circuit board body, the circuit board body is provided with a bonding pad, the bonding pad comprises a plurality of welding spots, the welding spots comprise primary control welding spots and secondary control welding spots, at least one secondary control welding spot is provided with an accommodating part, and the accommodating part is provided with an opening. And the accommodating part is used for accommodating soldering tin. According to the utility model, the accommodating part is arranged at the secondary control welding spot, so that the connection strength with the heavy large SMD device is improved. According to the utility model, more soldering tin is filled around the accommodating part and the welding spot, the anchoring point is added between the device and the welding spot, and the connection area is not increased, so that the risk of position deviation or falling of the device when a patch is subjected to reflow soldering is effectively reduced, and the welding effect and quality are improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB structure technology, and more specifically, to a PCB structure for reinforcing heavy-duty large SMD devices. Background Technology

[0002] In today's electronics manufacturing industry, with the continuous enhancement of electronic product functions and the increasing integration, the design and production of PCBs (Printed Circuit Boards) face numerous challenges. Among these challenges, the application of heavy-duty, large-scale SMD (Surface Mount Devices) is becoming increasingly widespread. Due to their unique advantages in functional implementation, these devices are widely used in high-end electronic products, such as high-performance servers, industrial control equipment, and aerospace electronic equipment.

[0003] However, the use of heavy-duty, large SMD components in PCB manufacturing presents significant technical challenges. These components are larger than 6cm in size. 3 Weighing over 0.8g, these components require significantly stronger connections to the PCB compared to standard SMD devices. During the critical reflow soldering process, insufficient connection strength can easily lead to component misalignment or even detachment. This not only severely impacts the soldering quality of individual products but can also trigger systemic quality issues in large-scale production, resulting in a substantial increase in product defect rates, increased production costs, delayed production cycles, and ultimately, a detrimental impact on the entire electronics manufacturing supply chain.

[0004] The above shortcomings need to be improved. Summary of the Invention

[0005] To address or mitigate the problem of existing heavy-duty large SMD devices easily shifting when soldered onto circuit boards, this invention provides a PCB structure for reinforcing heavy-duty large SMD devices.

[0006] The technical solution of this utility model is as follows:

[0007] A PCB structure for reinforcing heavy-duty large SMD devices includes a circuit board body with pads on the circuit board body. Each pad includes multiple solder joints, including primary control solder joints and secondary control solder joints. At least one of the secondary control solder joints has a receiving portion for receiving solder.

[0008] Furthermore, the receiving portion is a through hole, and solder joints are provided on both sides of the circuit board body at the receiving portion.

[0009] Furthermore, the through hole is a variable diameter hole, and the inner diameter of the first end of the through hole is not greater than the inner diameter of the other sections.

[0010] Furthermore, the inner diameter of the through hole gradually changes along the axial direction, with the inner diameter of the first end being smaller than that of the second end.

[0011] Furthermore, the through hole is a stepped hole or a tapered hole.

[0012] Furthermore, the accommodating portion is symmetrically distributed about the center of the pad.

[0013] Furthermore, the secondary control solder joints include power pin solder joints, empty pin solder joints, and signal pin solder joints without residual stake requirements.

[0014] Furthermore, a receiving portion is provided on the solder joint, and the receiving portion is located at the center of the area where the solder joint connects to the device pin.

[0015] Furthermore, the solder joint is provided with a plurality of accommodating portions, which are evenly distributed in the area where the solder joint connects to the device pin.

[0016] Furthermore, the area occupied by the receiving portion on the solder joint is no greater than 1 / 2 of the area of ​​the receiving portion.

[0017] According to the above-described solution, the beneficial effect of this utility model is that by setting a receiving portion at the secondary control solder joint, the connection strength with heavy and large SMD devices is improved. More solder fills the receiving portion and around the solder joint, increasing the anchoring point between the device and the solder joint without increasing the connection area. This effectively reduces the risk of device displacement or detachment during reflow soldering, thus improving the soldering effect and quality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a top view of the first embodiment of the solder pad in this utility model;

[0020] Figure 2 This is a top view of the second embodiment of the solder pad in this utility model;

[0021] Figure 3 This is a cross-sectional structural diagram of the first type of accommodating part in this utility model;

[0022] Figure 4 This is a cross-sectional view of the second type of accommodating part in this utility model;

[0023] Figure 5 This is a cross-sectional view of the third type of accommodating part in this utility model;

[0024] Figure 6 This is a cross-sectional structural diagram of the fourth type of accommodating part in this utility model.

[0025] In the figure, the following labels are used: 1. Circuit board body; 2. Pad; 201. Solder joint; 202. Primary control solder joint; 203. Secondary control solder joint; 204. Receptacle; 205. Area where solder joint connects to device pin. Detailed Implementation

[0026] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0027] It should be noted that when a component is referred to as "fixed," "set," or "connected" to another component, it may be located directly or indirectly on that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first," "second," etc., are used for ease of description only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "Many" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0028] like Figure 1 and Figure 2 As shown in one embodiment of the present invention, a PCB structure for reinforcing heavy-duty large SMD devices includes a circuit board body 1. The circuit board body 1 is provided with solder pads 2. The solder pads 2 include multiple solder joints 201. The solder joints 201 include primary control solder joints 202 and secondary control solder joints 203. At least one secondary control solder joint 203 is provided with a receiving portion 204 for receiving solder.

[0029] Based on the impedance requirements of solder joint 201, solder joint 201 is divided into primary control solder joint 202 and secondary control solder joint 203. Primary control solder joint 202 has higher impedance requirements, while secondary control solder joint 203 has lower impedance requirements. Secondary control solder joint 203 includes power pin solder joints, empty pin solder joints, and signal pin solder joints without residual posts.

[0030] During production, a receiving portion 204 is formed on the secondary control solder joint 203 through specific etching or machining processes. During the surface mount operation, heavy-duty large SMD devices are placed on the solder pads 2, and an automated placement machine ensures accurate device positioning. Then, a reflow soldering process is performed. In a high-temperature environment, the solder melts, and the receiving portion 204 can hold more solder. Excess solder is evenly distributed around the solder joint 201 and device leads under the action of surface tension, thereby completing the connection between the device and the circuit board body 1.

[0031] This PCB structure improves the connection strength with heavy, large SMD components by incorporating a receiving portion 204 at the secondary control solder joint 203. More solder fills the area around the receiving portion 204 and the solder joint 201, adding anchoring points between the component and the solder joint 201 without increasing the connection area. This effectively reduces the risk of component displacement or detachment during reflow soldering, improving the soldering effect and quality.

[0032] like Figure 3 As shown, in a preferred embodiment, the receiving portion 204 is a through hole, and solder joints 201 are provided on both sides of the circuit board body 1 at the receiving portion 204.

[0033] It facilitates soldering and increases the amount of solder applied, ensuring connection strength.

[0034] During manufacturing, for the secondary control solder joints 203 where the accommodating portion 204 needs to be located, drilling equipment such as lasers and drill bits are used to create through-holes penetrating both sides of the circuit board body 1, which serve as the accommodating portion 204. After drilling, copper plating can be performed to ensure good conductivity of the through-hole walls and to provide a better adhesion base for subsequent soldering. Solder joints 201 are provided on both sides of the circuit board corresponding to the locations of the accommodating portion 204. In the surface mount and reflow soldering stages, the top surface (device mounting surface) is tinned first, and after reflow soldering, the bottom surface is tinned again to ensure sufficient solder is accommodated in the accommodating portion 204 before reflow soldering.

[0035] In this embodiment, the receiving portion 204 is configured as a through hole, and solder joints 201 are provided on both sides of the circuit board body 1 to facilitate soldering. During reflow soldering, solder can flow into the through hole from either side of the circuit board, forming a bidirectional filling effect and greatly increasing the amount of solder applied. Sufficient solder forms a strong connection around the through hole and solder joints 201, tightly connecting heavy-duty large SMD components to the circuit board body 1, thereby significantly improving the connection strength between the two and effectively reducing the probability of component displacement or detachment due to weak connection during reflow soldering. This strongly ensures the quality and stability of PCB soldering and lays the foundation for the high-performance operation of electronic products.

[0036] like Figures 4 to 6As shown, in a preferred embodiment, the through hole is a variable diameter hole, and the inner diameter of the first end of the through hole is not greater than the inner diameter of the other segments. The first end of the through hole is the side where the device is mounted.

[0037] Preferably, the inner diameter of the through hole gradually changes along the axial direction, with the inner diameter of the first end being smaller than that of the second end.

[0038] Specifically, the through hole is a stepped hole or a tapered hole.

[0039] The solder forms a bottom-to-top, wide-to-narrow mating structure within the through-hole, creating a stable solder joint base. This enhances the connection strength between the component and the PCB, reducing the likelihood of component misalignment or detachment during reflow soldering and subsequent use. Furthermore, the smaller inner diameter of the first end of the through-hole limits the amount of solder applied during the initial soldering, reducing the amount of solder in the receiving portion 204 and preventing unnecessary waste by solder falling before melting. It also prevents solder from contaminating other circuit boards. The larger inner diameter of the second end of the through-hole facilitates the filling of solder into the through-hole, ensuring connection strength.

[0040] like Figure 2 As shown, in a preferred embodiment, the accommodating portion 204 is symmetrically distributed about the center of the pad 2.

[0041] During the reflow soldering process, due to the symmetrical distribution, the solder is filled into the accommodating part 204 with uniform force in all directions, so that the connection force on the device in all directions is kept balanced, preventing the risk of device position displacement caused by uneven force.

[0042] like Figure 1 As shown, in a preferred embodiment, a receiving portion 204 is provided on the solder joint 201, and the receiving portion 204 is located at the center of the solder joint and the device pin connection area 205.

[0043] During reflow soldering, the containment portion 204 precisely guides the solder to converge in the central area of ​​the solder joint and device pin connection area 205. Due to its central location, the central area has a full solder layer, and the solder spreads more evenly outwards, comprehensively covering the solder joint and device pin connection area 205. This enhances the connection strength between the solder joint 201 and the device pin, effectively dispersing stress caused by thermal expansion and contraction, mechanical vibration, etc., reducing the possibility of device displacement, loosening, or even detachment during reflow soldering and subsequent use, thus improving the quality and reliability of PCB soldering.

[0044] Or, such as Figure 2 As shown, the solder joint 201 is provided with a plurality of accommodating portions 204, which are evenly distributed in the solder joint and device pin connection area 205.

[0045] During reflow soldering, multiple receiving portions 204 can simultaneously attract and store solder, resulting in a wider and more uniform distribution of solder in the connection area. Multiple evenly distributed solder anchors increase the number of connection points and contact area between the solder joint 201 and the device pins, enhancing the overall connection strength and effectively reducing the risk of device displacement or detachment due to external forces, thermal stress, or other factors. The uniform distribution also reduces localized stress concentration, ensuring a stable and reliable connection between heavy-duty, large SMD devices and the PCB.

[0046] like Figure 1 and Figure 2 As shown, in a preferred embodiment, the area occupied by the accommodating portion 204 on the solder joint 201 is no more than 1 / 2 of the area of ​​the accommodating portion 204.

[0047] In this embodiment, by controlling the area ratio of the accommodating portion 204 on the solder joint 201, on the one hand, it ensures that the solder joint 201 still has sufficient unoccupied area for direct conventional soldering with the device pins, guaranteeing the basic soldering connection surface and maintaining the stability of the solder joint 201. On the other hand, without affecting the overall structural strength of the solder joint 201, the accommodating portion 204 can effectively fill an appropriate amount of solder to improve the connection strength. During reflow soldering, the accommodating portion 204 can be used to reinforce the connection without weakening the soldering performance of other parts of the solder joint 201 due to an excessively large accommodating portion 204.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A PCB structure for reinforcing a heavy large SMD component, characterized by, The circuit board body is provided with a solder pad, the solder pad comprises a plurality of solder points, the solder points comprise primary control solder points and secondary control solder points, at least one of the secondary control solder points is provided with a receiving part for receiving solder.

2. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein The receiving part is a through hole, and the circuit board body is provided with a solder point at both sides of the receiving part.

3. The PCB structure for reinforcing a heavy and large SMD component according to claim 2, wherein The through hole is a variable-diameter hole, and the inner diameter of the first end of the through hole is not greater than the inner diameters of other sections.

4. The PCB structure for reinforcing a heavy and large SMD component according to claim 3, wherein The inner diameter of the through hole gradually changes along the axial direction, and the inner diameter of the first end is smaller than the inner diameter of the second end.

5. The PCB structure for reinforcing a heavy and large SMD component according to claim 4, wherein The through hole is a stepped hole or a tapered hole.

6. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein The receiving parts are symmetrically distributed about the center of the solder pad.

7. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein The secondary control solder points comprise power pin solder points, empty pin solder points, and signal pin solder points without residual stub requirements.

8. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein One receiving part is provided on the solder point, and the receiving part is located at the center of the connection area between the solder point and the device pin.

9. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein A plurality of receiving parts are provided on the solder point, and the plurality of receiving parts are uniformly distributed in the connection area between the solder point and the device pin.

10. The PCB structure for reinforcing a heavy and large SMD component according to claim 1, wherein The area occupied by the receiving part on the solder point is not greater than 1 / 2 of the area of the receiving part.

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