Device for exposing inner layer target of printed circuit board
By combining laser ablation with machine vision positioning, the problem of unstable exposure of inner layer targets on thin and flexible printed circuit boards has been solved, achieving low-cost and high-efficiency inner layer target exposure, which is applicable to printed circuit boards with a thickness of 0.075 to 2.4 mm.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2026-03-06
AI Technical Summary
Existing technologies for processing inner layer targets on thin flexible printed circuit boards include mechanical double-sided milling, which is costly and inefficient, and chemical etching, which is difficult to control and results in unstable exposure of inner layer targets, failing to meet the demand for thinner PCBs.
The method combines laser ablation with machine vision positioning. The vision mechanism grasps the edge of the board or the positioning hole for positioning, and the laser is used to ablate and clean the surface copper skin to achieve rapid and high-precision exposure of the inner target.
It achieves low-cost, consumable-free, fast and high-precision inner target exposure, and is particularly suitable for printed circuit board processing in the thickness range of 0.075 to 2.4 mm, overcoming the shortcomings of traditional methods.
Smart Images
Figure CN223978831U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of printed circuit board manufacturing technology, and in particular relates to a device for revealing inner layer targets of printed circuit boards. Background Technology
[0002] In printed circuit board (PCB) manufacturing, the inner layer target becomes invisible after lamination. To ensure precise alignment between the outer and inner layer patterns, specific methods are needed to expose the inner layer target. Currently, the mainstream methods for exposing the inner layer target include mechanical double-sided milling and chemical etching.
[0003] Mechanical double-sided milling is suitable for PCBs with a certain degree of rigidity and surface copper thickness. However, for thin flexible boards, the target effect after milling may be unstable, and this method is costly, requiring a large number of milling cutters. Chemical etching is limited by the reaction time of the chemical solution, resulting in lower efficiency. It also requires precise control of the chemical solution dosage and local cleaning, making it technically challenging to implement.
[0004] With the trend towards thinner and lighter consumer electronics, PCBs with a thickness of less than 100 micrometers are becoming increasingly common. Traditional mechanical double-sided milling methods face challenges when processing these thin PCBs. Therefore, there is an urgent need to develop a target exposure device for printed circuit boards to overcome the shortcomings in current practical applications. Summary of the Invention
[0005] The purpose of this invention is to provide a device for revealing inner layer targets of printed circuit boards, which aims to solve the problems mentioned in the background art.
[0006] This invention is implemented as follows: a printed circuit board inner layer target exposure device includes a conveying mechanism for conveying the printed circuit board, and a pressure plate mechanism for pressing and fixing the printed circuit board is installed on the conveying mechanism; a positioning and ablation assembly is also provided on the upper and / or lower side of the conveying mechanism, the positioning and ablation assembly includes a vision mechanism, an X-direction module, a Y-direction module and a laser, the X-direction module is installed on the Y-direction module, and the vision mechanism and laser are also installed on the X-direction module. The X-direction module and the Y-direction module cooperate to drive the vision mechanism and laser to move in the X and Y directions, the vision mechanism performs movement and positioning, and the laser performs laser ablation on the printed circuit board.
[0007] A further technical solution is that one of the positioning ablation components includes two pairs of vision mechanisms and a laser.
[0008] In a further technical solution, the laser is one or more of UV, CO2, and infrared lasers.
[0009] In a further technical solution, the vision mechanism is used to grasp the edge or positioning hole of the printed circuit board for machine vision positioning, and the laser is used to perform ablation of the copper foil on the surface of the printed circuit board and laser cleaning according to the positioning parameters.
[0010] The printed circuit board inner layer target exposure device provided by this utility model has the following beneficial effects:
[0011] This invention achieves rapid, high-precision, low-cost, and consumable-free inner target exposure by using laser ablation of the surface copper layer combined with machine vision positioning. It is particularly suitable for the processing of printed circuit boards with a thickness range of 0.075 to 2.4 mm, and has significant technical and economic advantages. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the structure of an embodiment of the single laser device of this utility model;
[0013] Figure 2 for Figure 1 Workflow diagram;
[0014] Figure 3 This is a schematic diagram of the structure of an embodiment of the multi-laser device of this utility model;
[0015] Figure 4 for Figure 3 Workflow diagram;
[0016] In the diagram: 1-Pressure plate mechanism, 2-Printed circuit board, 3-Conveying mechanism, 4-Vision mechanism, 5-X-direction module, 6-Y-direction module, 7-Laser. Detailed Implementation
[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0018] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.
[0019] like Figure 1-4As shown, an embodiment of the present invention provides a printed circuit board inner layer target exposure device, including a conveying mechanism 3 for conveying a printed circuit board 2, and a pressure plate mechanism 1 for pressing and fixing the printed circuit board 2 on the conveying mechanism 3; the upper and / or lower sides of the conveying mechanism 3 are also provided with a positioning ablation assembly, the positioning ablation assembly including a vision mechanism 4, an X-direction module 5, a Y-direction module 6 and a laser 7, the X-direction module 5 is mounted on the Y-direction module 6, and the vision mechanism 4 and the laser 7 are also mounted on the X-direction module 5. The X-direction module 5 and the Y-direction module 6 cooperate to drive the vision mechanism 4 and the laser 7 to move in the X and Y directions, the vision mechanism 4 performs movement and positioning, and the laser 7 performs laser ablation on the printed circuit board 2.
[0020] One of the positioning ablation components includes two pairs of vision mechanisms 4 and a laser 7.
[0021] The laser 7 is one or more of UV, CO2, and infrared lasers.
[0022] The vision mechanism 4 is used to grasp the edge or positioning hole of the printed circuit board 2 for machine vision positioning, and the laser 7 is used to perform ablation of the copper foil on the surface of the printed circuit board 2 and laser cleaning according to the positioning parameters. Example
[0023] Please refer to Figure 1 and 2 The operation of the single laser 7 to ablate and expose the target includes the following steps:
[0024] Step 1: The sheet metal is transported to the designated location.
[0025] Step 2: Press plate mechanism 1 presses the plate.
[0026] Step 3: The vision mechanism 4 grasps the edge of the board or the positioning hole for machine vision positioning.
[0027] Step 4: Laser 7 ablates the copper layer on the board surface according to the positioning parameters.
[0028] Step 5: Laser 7 performs laser cleaning. Example
[0029] Please refer to Figure 3 and 4 The operation of the double-sided four-target ablation and exposure device using two pairs of lasers includes the following steps:
[0030] Step 1: The sheet metal is transported to the designated location.
[0031] Step 2: Press plate mechanism 1 presses the plate.
[0032] Step 3: The dual vision mechanism 4 on the upper panel simultaneously grasps the edge of the panel or the positioning hole for machine vision positioning.
[0033] Step 4: Four lasers 7 simultaneously ablate the copper foil on the upper and lower surfaces of the board according to the positioning parameters.
[0034] Step 5: Laser 7 performs laser cleaning.
[0035] The present invention provides a device for revealing inner layers of printed circuit boards in the above embodiments, which uses laser ablation of the surface copper layer to achieve the effect of revealing inner layers. Using a laser 7 as the core, it performs simultaneous and rapid inner layer target revealing on both the top and bottom surfaces, employing machine vision for positioning, resulting in high repeatability and stability, and completely avoiding defects such as positioning difficulties and the difficulty in processing thin boards. The method is simple in principle, stable and efficient, low in cost, and requires no consumables or easily damaged parts. It is particularly suitable for supporting the inner layer target revealing processing of printed circuit boards 2 with a thickness of 0.075~2.4mm, and has profound significance for the printed circuit board 2 manufacturing industry.
[0036] The control of each component can be achieved using a PLC controller disclosed in the prior art. The specific model and circuit connections of each component are not limited and can be flexibly configured in practical applications. All circuits, electronic components, and modules involved are existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. Furthermore, the scope of protection of this utility model does not involve improvements to the software or methods.
[0037] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0038] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A printed circuit board inner layer target exposing device, comprising a conveying mechanism (3) for conveying a printed circuit board (2); The conveying mechanism (3) is provided with a pressing plate mechanism (1) for pressing and fixing the printed circuit board (2), characterized in that, The upper side and / or the lower side of the conveying mechanism (3) is further provided with a positioning and ablation assembly, which comprises a vision mechanism (4), an X-direction module (5), a Y-direction module (6) and a laser (7); The X-direction module (5) is installed on the Y-direction module (6), and the X-direction module (5) is further installed with the vision mechanism (4) and the laser (7); The X-direction module (5) and the Y-direction module (6) are used for driving the vision mechanism (4) and the laser (7) to move in the X and Y directions, the vision mechanism (4) is used for positioning, and the laser (7) is used for laser ablation of the printed circuit board (2).
2. The printed circuit board inner layer target reveal apparatus of claim 1, wherein, One of the positioning and ablation assemblies comprises two pairs of vision mechanisms (4) and lasers (7).
3. The printed circuit board inner layer target reveal apparatus of claim 1, wherein, The laser (7) adopts one or more of UV, CO2 and infrared lasers.
4. The printed circuit board inner layer target reveal apparatus of any of claims 1-3, wherein, The vision mechanism (4) is used for machine vision positioning of the board edge or positioning hole of the printed circuit board (2), and the laser (7) is used for ablation of the surface copper of the printed circuit board (2) according to the positioning parameters and laser cleaning.