Packaging structure of high-voltage power supply module

Abstract

The utility model relates to the technical field of power supply packaging, in particular to a packaging structure of a high-voltage power supply module, which comprises a printed board, a bottom board, a middle frame and a cover board, an extrusion stud and a boss stud are arranged on the bottom plate; the middle frame is connected to the bottom plate through an extrusion stud, so that the middle frame and the bottom plate form a cavity with an opening; the cover plate is connected to the middle frame through the extrusion studs and used for sealing the cavity with the opening, and then the bottom plate, the middle frame and the cover plate form a whole with the sealed cavity. The printed board is connected to the bottom plate through the boss screw columns and located in the middle frame, so that the printed board is located in the cavity with the opening, and then the printed board is located in the closed cavity. According to the packaging structure, the packaging speed of the high-voltage power supply module is increased, the packaging benefit and the packaging efficiency of the high-voltage power supply module are improved, resource waste caused by excessive pouring sealant of the high-voltage power supply module can be avoided, and meanwhile, the high-voltage power supply module can be repaired when problems are found in the aging test stage.

Description

Technical Field

[0001] This utility model relates to the field of power supply packaging technology, and in particular to a packaging structure for a high-voltage power supply module. Background Technology

[0002] Currently, the packaging process for standard DC / DC brick-type high-voltage power modules typically involves the following steps: First, the base plate and internal printed circuit board are placed together into the potting compound fixture slot. Second, sufficient potting compound is poured in. Third, a five-sided plastic shell is placed on top. Fourth, the high-voltage power module is removed from the potting fixture and then baked in an oven to cure the potting compound. Fifth, any residual potting compound inside the potting fixture and any excess potting compound on the surface of the high-voltage power module are removed. Because the packaging process for high-voltage power modules requires high precision, products assembled using existing packaging methods exhibit significant dimensional accuracy deviations, resulting in reduced packaging speed and efficiency. Utility Model Content

[0003] This application provides a packaging structure for a high-voltage power module, which solves the technical problems of reduced packaging speed and efficiency in existing high-voltage power modules. It improves the packaging speed, efficiency, and effectiveness of high-voltage power modules, avoids resource waste caused by excessive potting compound, and facilitates repair when problems are found during the aging test.

[0004] In a first aspect, this utility model embodiment provides a packaging structure for a high-voltage power supply module, including: a printed circuit board, a base plate, a middle frame, and a cover plate;

[0005] The base plate is provided with extrusion studs and boss studs;

[0006] The middle frame is connected to the base plate by the extrusion stud, so that the middle frame and the base plate form a cavity with an opening;

[0007] The cover plate is connected to the middle frame by the extrusion stud, which is used to close the cavity with the opening, thereby making the bottom plate, the middle frame and the cover plate form a whole with a closed cavity;

[0008] The printed circuit board is connected to the base plate via the boss screw post and is located in the middle frame, so that the printed circuit board is located in the cavity with the opening, and thus the printed circuit board is located in the closed cavity.

[0009] Optionally, the middle frame includes: stud holes and screw holes; the stud holes and screw holes are disposed at the bottom of the middle frame; the stud holes are configured one-to-one with the extrusion studs, and the screw holes are configured one-to-one with the boss screw studs;

[0010] The inner wall of the stud hole and the inner wall of the screw hole are provided with protrusions. The protrusions of the stud hole are interference-fitted with the extrusion stud, and the protrusions of the screw hole are interference-fitted with the boss screw stud, which are used to fix the middle frame to the base plate.

[0011] Optionally, the base plate includes a groove disposed on the base plate.

[0012] Optionally, the middle frame includes a skirt, which is disposed at the bottom of the middle frame and is matched and connected to the groove.

[0013] Optionally, the boss screw post includes: a boss and a boss hole; the boss hole is disposed in the boss and faces the printed circuit board.

[0014] Optionally, the printed circuit board includes: fixing holes and through holes, the through holes being provided one-to-one with the extrusion studs, and the fixing holes being provided one-to-one with the boss screw studs; the through holes are matched and connected to the extrusion studs; the fixing holes are located on the boss and are connected to the boss holes by screws, so that the printed circuit board is fixedly connected to the base plate.

[0015] Optionally, the extrusion stud includes a slot disposed on the top of the extrusion stud.

[0016] Optionally, the cover plate includes: a cover plate hole and a pin hole disposed on the cover plate;

[0017] The cover plate holes are provided one-to-one with the extrusion studs, and the inner wall of the cover plate holes is provided with buckles, which are connected to the buckle grooves in a buckle-fitting manner;

[0018] The pin holes are configured to correspond one-to-one with the pins on the printed circuit board.

[0019] Optionally, it may also include: a ceramic sheet and a thermally conductive insulating pad, wherein the ceramic sheet and the thermally conductive insulating pad are disposed on the base plate and located below the printed circuit board.

[0020] Optionally, it also includes: potting compound, which fills the closed cavity and encapsulates the printed circuit board.

[0021] One or more technical solutions in the embodiments of this utility model have at least the following technical effects or advantages:

[0022] In this embodiment of the invention, the middle frame is tightly fixed to the base plate via extrusion studs. The cover plate is fixedly connected to the base plate via extrusion studs, and is also tightly fitted to the middle frame. This forms a whole with a closed cavity, consisting of the base plate, middle frame, and cover plate. Furthermore, the printed circuit board (PCB) is connected to the base plate via boss screws and is located within the middle frame. This places the PCB within an open cavity, and ultimately within a closed cavity. This packaging structure for the high-voltage power module facilitates installation and disassembly, improves packaging efficiency, effectiveness, and speed, and avoids excessive tooling, packaging steps, and waste of potting compound during the packaging process. Moreover, this packaging structure facilitates repair of any problems discovered during the aging test phase of the high-voltage power module. Attached Figure Description

[0023] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference figures denote the same parts throughout the drawings. In the drawings:

[0024] Figure 1 A schematic diagram of the packaging structure of the high-voltage power supply module in an embodiment of this utility model is shown;

[0025] Figure 2 A schematic diagram of the base plate in an embodiment of this utility model is shown;

[0026] Figure 3 A schematic diagram of the middle frame in an embodiment of this utility model is shown;

[0027] Figure 4 This diagram illustrates the positional structure of the ceramic sheet and the thermally conductive insulating pad in an embodiment of the present invention.

[0028] Figure 5 A schematic diagram of the printed circuit board in an embodiment of this utility model is shown;

[0029] Figure 6 A schematic diagram of the cover plate in an embodiment of this utility model is shown;

[0030] In the attached diagram, 100 is the base plate; 200 is the middle frame; 300 is the cover plate; and 400 is the printed circuit board.

[0031] 110. Extruded stud; 120. Bossed stud; 130. Groove; 140. Ceramic plate; 150. Thermally conductive insulating pad;

[0032] 111. Slot; 121. Boss; 122. Boss hole;

[0033] 210. Stud hole; 220. Screw hole; 230. Skirt;

[0034] 310. Cover hole; 320. Pin hole;

[0035] 410. Perforation; 420. Fixing hole. Detailed Implementation

[0036] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] Example 1

[0038] The first embodiment of this utility model provides a packaging structure for a high-voltage power supply module, such as... Figure 1 As shown, the system includes: a printed circuit board 400, a base plate 100, a middle frame 200, and a cover plate 300. The base plate 100 is provided with extrusion studs 110 and boss studs 120. The middle frame 200 is connected to the base plate 100 via the extrusion studs 110, forming an open cavity between the middle frame 200 and the base plate 100. The cover plate 300 is connected to the middle frame 200 via the extrusion studs 110, closing the open cavity, thus forming a closed cavity from the base plate 100, the middle frame 200, and the cover plate 300. The printed circuit board 400 is connected to the base plate 100 via the boss studs 120 and is located within the middle frame 200, positioning the printed circuit board 400 within the open cavity, thus placing the printed circuit board 400 within the closed cavity.

[0039] It should be noted that the base plate 100 is a heat dissipation base plate, which can be an aluminum heat dissipation base plate. The packaging structure of this embodiment is suitable for various brick-type high-voltage power supply modules, especially for high-voltage semi-brick-type power supply modules.

[0040] In this embodiment, the middle frame 200 is tightly fixed to the base plate 100 via extrusion studs 110. The cover plate 300 is fixedly connected to the base plate 100 via extrusion studs 110, and is also tightly fitted to the middle frame 200. This forms a whole with a closed cavity, consisting of the base plate 100, the middle frame 200, and the cover plate 300. Furthermore, the printed circuit board 400 is connected to the base plate 100 via boss screws 120 and is located within the middle frame 200. This places the printed circuit board 400 within an open cavity, thus placing it within a closed cavity. This achieves a high-voltage power module packaging structure that facilitates the installation and disassembly of the high-voltage power module, improves the packaging efficiency, effectiveness, and speed, and avoids excessive tooling, packaging processes, and waste of potting compound during the high-voltage power module packaging process. Furthermore, this packaging structure facilitates repairs when problems are found during the aging test of the high-voltage power module.

[0041] Below, in conjunction with Figure 1 The packaging structure of the high-voltage power supply module in this embodiment is described in detail:

[0042] like Figure 2 As shown, the base plate 100 is provided with extrusion studs 110 and boss studs 120. The manner in which the extrusion studs 110 and boss studs 120 are provided on the base plate 100, as well as the number of extrusion studs 110 and boss studs 120, can be set according to actual needs. Figure 2 In this configuration, a compression stud 110 is riveted to each of the four corners of the base plate 100, and a boss stud 120 is provided at each of the four corners of the base plate 100. The compression stud 110 and the boss stud 120 at each corner of the base plate 100 are arranged adjacent to each other, and one compression stud 110 and one boss stud 120 can also be regarded as a set of stud mechanisms.

[0043] like Figure 2 As shown, the extrusion stud 110 includes a slot 111, which is disposed on the top of the extrusion stud 110. The slot 111 is used to fix the cover plate 300 to the bottom and to match the middle frame 200, so that the bottom plate 100, the middle frame 200 and the cover plate 300 form an integral structure with a closed cavity. The boss stud 120 includes a boss 121 and a boss hole 122. The boss hole 122 is disposed in the boss 121 and faces the printed circuit board 400. The boss 121 is used to place the printed circuit board 400. The boss hole 122 is used to lock the printed circuit board 400, so that the printed circuit board 400 is stably connected to the floor and located in the middle frame 200. The height of the boss 121 can be set according to actual needs.

[0044] like Figure 2 As shown, the base plate 100 includes a groove 130, which is disposed on the base plate 100. The specific shape and position of the groove 130 can be set according to actual needs. For example, in... Figure 2 In the middle frame 200, a groove 130 is provided around the inner perimeter of the side of the base plate facing the middle frame 200. The groove 130 is used to match the skirt 230 at the bottom of the middle frame 200, so that the middle frame 200 can be quickly positioned during the assembly process of the middle frame 200 and the base plate 100, so that the middle frame 200 and the base plate 100 are fixedly connected; at the same time, the groove 130 can make the middle frame 200 and the base plate 100 form a firm cavity with an opening, preventing the potting compound inside the cavity from leaking out.

[0045] like Figure 3 As shown, the middle frame 200 includes stud holes 210 and screw holes 220. The stud holes 210 and screw holes 220 are located at the bottom of the middle frame 200. The stud holes 210 correspond one-to-one with the extrusion studs 110, and the screw holes 220 correspond one-to-one with the boss screw studs 120. Protrusions are provided on the inner walls of the stud holes 210 and 220. The protrusions of the stud holes 210 and 220 are interference-fitted with the extrusion studs 110, and the protrusions of the screw holes 220 and 220 are interference-fitted with the boss screw studs 120, for fixing the middle frame 200 to the base plate 100. The middle frame 200 also includes a skirt 230. The skirt 230 is located at the bottom of the middle frame 200 and is matched with the groove 130.

[0046] Specifically, Figure 3 This is a top-down view starting from the bottom of the mid-frame 200. Figure 3 In this configuration, if a pressing stud 110 and a boss stud 120 are considered as a set of stud mechanisms, then the stud holes 210 and screw holes 220 of the middle frame 200 are combined to form a stud hole group. One stud hole group corresponds to one set of stud mechanisms, and the shape of the stud hole group can be set according to the stud mechanism. Figure 3 In this design, since the stud mechanism consists of an adjacent extrusion stud 110 and a boss stud 120, the shape of the stud hole group can be a gourd shape with two overlapping circular holes, corresponding to the extrusion stud 110 and the boss stud 120 respectively. Alternatively, the stud hole 210 and the screw hole 220 can be two independent circular holes. The positions of the stud hole 210 and the screw hole 220 correspond to the positions of the extrusion stud 110 and the boss stud 120, respectively.

[0047] Protrusions are provided on the inner walls of the stud hole 210 and the screw hole 220. The protrusions of the stud hole 210 are interference-fitted with the extrusion stud 110, and the protrusions of the screw hole 220 are interference-fitted with the boss screw stud 120. This allows the stud hole 210 to fit onto the bottom of the extrusion stud 110, and the screw hole 220 to fit onto the bottom of the boss screw stud 120, thereby fixing the middle frame 200 to the base plate 100. The number of protrusions can be set according to actual needs. The interference fit can be set according to actual needs, for example, 0.13mm or 0.11mm-0.14mm. Figure 3 In this design, after the stud holes 210 and screw holes 220 of the middle frame 200 are combined to form a stud hole group, a protrusion is provided on the inner wall of the stud hole group, and the stud hole group is interference-fitted with the stud mechanism. In this way, through the interference fit between the stud holes 210 and screw holes 220 of the middle frame 200 and the pressing studs 110 and boss studs 120 of the base plate 100, the middle frame 200 and the base plate 100 are stably and securely connected.

[0048] The bottom perimeter of the middle frame 200 is also provided with a skirt 230. The width of the skirt 230 can be set according to actual needs, for example, the width of the skirt 230 is 1.65mm. The skirt 230 is matched and connected with the groove 130. On the one hand, during the assembly of the middle frame 200 and the base plate 100, the middle frame 200 can be quickly positioned, so that the middle frame 200 and the base plate 100 are stably connected; on the other hand, through the matching connection of the groove 130 and the skirt 230, the middle frame 200 and the base plate 100 can form a firm cavity with an opening, preventing the potting compound inside the cavity from leaking out.

[0049] In this embodiment, the middle frame 200 wraps around the extrusion studs 110 and boss screw studs 120 on the base plate 100 and is provided with a skirt 230. This not only securely connects the middle frame 200 to the base plate 100, but also increases the creepage distance between the components on the printed circuit board 400 and the extrusion studs 110 and boss screw studs 120, as well as the creepage distance between the components near the edge of the printed circuit board 400 and the base plate 100. Since the components on the printed circuit board 400 of the high-voltage power module have very strict requirements regarding the safe distance between them and the metal housing, this improves the potential for poor insulation withstand voltage caused by insufficient safe distance, and also improves the space utilization of the printed circuit board 400. Furthermore, the base plate 100 and the middle frame 200, after assembly, form a closed cavity with an opening. This allows for more precise application of potting compound, and prevents the potting compound from flowing outside the product, eliminating the need for cleaning residual compound from the tooling and the product after potting, thus reducing assembly material and labor costs.

[0050] like Figure 4As shown, the packaging structure of this embodiment also includes a ceramic sheet 140 and a thermally conductive insulating pad 150. The ceramic sheet 140 and the thermally conductive insulating pad 150 are disposed on the base plate 100 and located below the printed circuit board 400. Specifically, the ceramic sheet 140 and the thermally conductive insulating pad 150 can be adhered to the base plate 100, surrounded by the middle frame 200, and located below the printed circuit board 400. The number and placement of the ceramic sheet 140 and the thermally conductive insulating pad 150 can be set according to actual needs. By setting the ceramic sheet 140 and the thermally conductive insulating pad 150, it is ensured that the creepage distance between the primary components on the printed circuit board 400 and the base plate 100 meets the withstand voltage requirements, and the heat from the heat-generating components on the printed circuit board 400 can be effectively conducted to the base plate 100 components, ensuring heat dissipation requirements.

[0051] like Figure 5 As shown, the printed circuit board 400 includes through holes 410 and fixing holes 420. Through holes 410 are correspondingly provided with compression studs 110, and fixing holes 420 are correspondingly provided with boss screw studs 120. Through holes 410 and compression studs 110 are mated and connected so that the compression studs 110 pass through the through holes 410. Fixing holes 420 are located on bosses 121 and are connected to boss holes 122 by screws, thereby fixing the printed circuit board 400 to the base plate 100.

[0052] Because the boss 121 has a set height, the printed circuit board 400 is supported by the boss screw post 120 on the base plate 100, especially by the boss 121 of the boss screw post 120, ensuring that no component on the printed circuit board 400 directly contacts the base plate 100. The printed circuit board 400 is then locked onto the base plate 100 by screws connected to the boss hole 122 of the boss screw post 120 or by other matching connection methods. This ensures that the printed circuit board 400 is securely fixed to the base plate 100 and maintains a fixed position on the base plate 100, preventing the printed circuit board 400 from moving. The screws can be selected according to actual needs; for example, three-in-one screws can be used.

[0053] like Figure 6 As shown, the cover plate 300 includes a cover plate hole 310 and a pin hole 320. The cover plate hole 310 corresponds one-to-one with the extrusion stud 110, and a snap-fit ​​is provided on the inner wall of the cover plate hole 310, which engages with the snap-fit ​​groove 111. The pin hole 320 corresponds one-to-one with the pins on the printed circuit board 400.

[0054] Specifically, Figure 6This is a top view from the bottom of the cover plate 300. The cover plate 300 has cover plate holes 310, which are matched and connected one-to-one with the extrusion studs 110. Since there are extrusion studs 110 at each of the four corners of the base plate 100, there are cover plate holes 310 at the four corners of the cover plate 300. Each cover plate hole 310 has a snap-fit ​​on its inner wall, which engages with the snap-fit ​​groove 111 on the top of the extrusion stud 110. The snap-fit ​​interference fit can be set according to actual needs, for example, the snap-fit ​​interference fit is 0.1mm. This ensures a secure connection between the cover plate 300, the middle frame 200, and the base plate 100, forming a closed cavity for the entire encapsulation structure, and also facilitates the repair and disassembly of the high-voltage power module.

[0055] like Figure 5 The printed circuit board 400 shown has pins that need to be connected to external components or devices. Therefore, the cover plate 300 is also provided with pin holes 320, which are set one-to-one with the pins on the printed circuit board 400 so that the pins can pass through the pin holes 320.

[0056] The encapsulation structure in this embodiment also includes potting compound, which fills the closed cavity formed by the base plate 100, the middle frame 200, and the cover plate 300, encapsulating the printed circuit board 400. The potting compound essentially fills the entire internal cavity of the assembled structure, completely encapsulating the printed circuit board 400. The potting compound serves two purposes: firstly, it dissipates heat generated by the heat-generating components during high-voltage power module operation; secondly, it provides a sealing and anti-oxidation function, isolating important components from air and preventing oxidation, thereby increasing the overall lifespan of the high-voltage power module.

[0057] Typically, after installing extrusion studs 110, boss studs 120, ceramic plates 140, and thermally conductive insulating pads 150 on the base plate 100, the middle frame 200 and the base plate 100 are assembled, forming an open cavity. After assembling the middle frame 200 and the base plate 100, a small amount of thermally conductive potting compound is poured into the open cavity formed by the middle frame 200 and the base plate 100. In this way, the thermally conductive potting compound can both increase the creepage distance between the components and the base plate 100 and have good heat conduction, reducing heat accumulation inside the power supply.

[0058] After pouring a small amount of thermally conductive potting compound into the cavity formed by the middle frame 200 and the base plate 100, which has an opening, the printed circuit board 400 is assembled into the cavity. Next, potting compound is poured in and the board is shaken left and right to ensure it fully fills the internal space formed by the middle frame 200 and the base plate 100, especially filling the top and bottom of the printed circuit board 400 and the gaps between the components. This ensures that the high-voltage power module can conduct the heat generated by the power devices out when operating under full load, ensuring normal product operation. Finally, the cover plate 300 and the base plate 100 are fastened together using compression studs 110, ensuring a relatively closed overall structure.

[0059] One or more technical solutions in the embodiments of this utility model have at least the following technical effects or advantages:

[0060] 1. The packaging structure of this embodiment simplifies or eliminates the need for special potting fixtures, saves on the cost of manufacturing potting fixtures, improves the packaging production efficiency of high voltage power modules, and also greatly reduces the amount of potting compound used.

[0061] 2. After potting, the potting compound needs to be baked to cure. The encapsulation structure in this embodiment can eliminate the need for product clamping fixtures and processes. At the same time, the baking oven can hold more products, saving space and improving efficiency.

[0062] 3. Eliminate the step of cleaning residual potting compound around the product after potting, reducing operating time and lowering labor costs.

[0063] 4. Regarding safety distance specifications, the traditional five-sided plastic housing is divided into a cover plate and a middle frame in this embodiment. The middle frame covers the extruded studs and boss screws on the bottom plate and is equipped with a skirt, thereby increasing the creepage distance between components on the printed circuit board and the extruded studs and boss screws, as well as the creepage distance between components near the edge of the printed circuit board and the bottom plate. Since there are very strict requirements for the safety distance between components on the printed circuit board of the high-voltage power module and the metal housing, this improves the potential for poor insulation withstand voltage caused by insufficient safety distance, while also increasing the space utilization rate of the printed circuit board.

[0064] 5. The packaging structure of this embodiment improves the packaging speed of the high-voltage power module, enhances the packaging efficiency and effectiveness of the high-voltage power module, avoids the waste of resources caused by excessive potting compound in the high-voltage power module, and facilitates repair when problems are found during the aging test of the high-voltage power module.

[0065] Those skilled in the art will understand that although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0066] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A packaging structure of a high voltage power supply module, characterized by, The utility model relates to a printed board, a bottom plate, a middle frame and a cover plate. An extrusion stud and a boss screw post are arranged on the bottom plate. The middle frame is connected to the bottom plate through the extrusion stud, so that the middle frame and the bottom plate form a cavity with an opening. The cover plate is connected to the middle frame through the extrusion stud, so that the cover plate closes the cavity with an opening, and the bottom plate, the middle frame and the cover plate form an integrated whole with a closed cavity. The printed board is connected to the bottom plate through the boss screw post and is located in the middle frame, so that the printed board is located in the cavity with an opening and is located in the closed cavity. The middle frame comprises stud holes and screw holes, which are arranged at the bottom of the middle frame.

2. The packaging structure of a high voltage power supply module according to claim 1, wherein The inner walls of the stud holes and the screw holes are provided with protrusions, which are in interference fit with the extrusion stud and the boss screw post, respectively. The bottom plate comprises a groove arranged on the bottom plate.

3. The packaging structure of a high voltage power supply module according to claim 2, wherein The middle frame comprises a skirt arranged at the bottom of the middle frame, which is matched with the groove.

4. The packaging structure of a high voltage power supply module according to claim 3, wherein The boss screw post comprises a boss and a boss hole arranged in the boss, which faces the printed board.

5. The packaging structure of a high voltage power supply module according to claim 1, wherein The printed board comprises fixing holes and through holes, which are arranged in one-to-one correspondence with the extrusion stud and the boss screw post, respectively.

6. The packaging structure of a high voltage power supply module according to claim 5, wherein The through holes are matched with the extrusion stud, and the fixing holes are located on the boss to be connected with the boss hole through a screw, so that the printed board is fixedly connected with the bottom plate.

7. The packaging structure of a high voltage power supply module according to claim 1, wherein The extrusion stud comprises a clamping groove arranged at the top of the extrusion stud.

8. The packaging structure of a high voltage power supply module according to claim 7, wherein The cover plate comprises cover plate holes and pin holes arranged on the cover plate. The cover plate holes are arranged in one-to-one correspondence with the extrusion stud, and the inner walls of the cover plate holes are provided with buckles in buckle fit connection with the clamping grooves. The pin holes are arranged in one-to-one correspondence with the pins on the printed board.

9. The packaging structure of a high voltage power supply module according to claim 1, wherein Furthermore, the utility model relates to ceramic sheets and heat-conducting insulating gaskets arranged on the bottom plate and below the printed board. Furthermore, the utility model relates to potting glue filled in the closed cavity and wrapping the printed board.

10. The packaging structure of a high voltage power supply module according to claim 1, wherein ​ ​

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