Packaging structure of high-voltage brick type power supply module

Abstract

The utility model relates to the technical field of power supply packaging, in particular to a packaging structure of a high-voltage brick type power supply module, which comprises a bottom plate, a middle frame, a cover plate and a printed board, the bottom plate comprises a stud mechanism which is located on the bottom plate and faces the cover plate. The middle frame is connected to the bottom plate through a stud mechanism and used for enabling the middle frame and the bottom plate to form a cavity with an opening; the cover plate is connected to the bottom plate and the middle frame through a stud mechanism and used for closing the opening, so that the cavity with the opening forms a closed cavity; and the printed board is connected above the bottom plate through a stud mechanism, is arranged in the middle frame and below the cover plate, and is used for enabling the printed board to be positioned in the closed cavity. Through the structure, the packaging technology of the high-voltage brick-type power supply module realizes the purposes of reducing the use of packaging jigs, simplifying the number of packaging procedures, ensuring the packaging accuracy of the high-voltage brick-type power supply module, and improving the packaging efficiency and the packaging speed.

Description

Technical Field

[0001] This utility model relates to the field of power supply packaging technology, and in particular to a packaging structure for a high-voltage brick-type power supply module. Background Technology

[0002] Currently, existing standard brick-type high-voltage DC / DC power modules typically employ two packaging processes. The first process involves encapsulating the aluminum heat sink base, internal printed circuit board, and five-sided plastic casing using a potting fixture. The second process uses automated potting equipment to vacuum-encapsulate the internal cavity formed by the aluminum heat sink base, internal printed circuit board, and five-sided plastic casing.

[0003] The specific process of the first packaging process is as follows: First, place the base plate and internal printed circuit board together into the potting compound fixture slot. Second, pour in a sufficient amount of potting compound. Third, cover with the five-sided plastic shell. Fourth, remove the entire high-voltage power module from the potting fixture and then bake it in an oven to cure the potting compound. Fifth, remove any residual potting compound from the potting fixture and any excess potting compound from the surface of the high-voltage power module. This packaging process relies heavily on tooling fixtures, involves numerous packaging steps, has high process requirements, and results in significant dimensional accuracy deviations in the packaged product, leading to low packaging efficiency.

[0004] The second packaging process involves the following steps: First, preheating the product formed by the aluminum heat sink base, internal printed circuit board, and five-sided plastic casing. Second, degassing and pre-stirring the potting compound. Third, filling the product cavity by vacuuming the product and then injecting the potting compound. Fourth, curing the product after potting. This packaging process requires significant equipment investment, is unsuitable for small-batch, multi-variety product potting, and the type of potting compound cannot be changed frequently. Furthermore, vacuum potting requires sealing and protecting areas inside the product that cannot be potted, increasing the difficulty and potentially causing the potting compound to expand in those areas, leading to product failure. Therefore, existing high-voltage brick-type power modules suffer from low packaging efficiency. Utility Model Content

[0005] This application provides a packaging structure for a high-voltage brick-type power module, which solves the technical problem of low packaging efficiency in existing high-voltage brick-type power modules. It reduces the use of packaging fixtures, simplifies packaging processes, ensures the packaging accuracy of the high-voltage brick-type power module, improves packaging efficiency and speed, avoids resource waste caused by excessive potting compound, and facilitates rework when problems are found during the aging test of the high-voltage brick-type power module.

[0006] In a first aspect, this utility model embodiment provides a packaging structure for a high-voltage brick-type power module, including: a base plate, a middle frame, a cover plate, and a printed circuit board;

[0007] The base plate includes a stud mechanism, which is located on the base plate and faces the cover plate.

[0008] The middle frame is connected to the base plate by the stud mechanism, so that the middle frame and the base plate form a cavity with an opening;

[0009] The cover plate is connected to the base plate and the middle frame by the stud mechanism, and is used to close the opening, so that the cavity with the opening forms a closed cavity;

[0010] The printed circuit board is connected to the base plate via the stud mechanism, and is located in the middle frame and below the cover plate, so that the printed circuit board is located in the closed cavity.

[0011] Optionally, the base plate includes a groove; the groove is disposed within the inner cavity of the base plate.

[0012] Optionally, the stud mechanism includes: a plurality of stud groups; each stud group includes: an extruded stud and a boss stud, the extruded stud and the boss stud being arranged adjacent to each other on the base plate.

[0013] Optionally, the extrusion stud includes: a stud body and a first slot; the stud body is disposed on the base plate and faces the cover plate; the first slot is located at the top of the stud body;

[0014] The boss stud further includes a boss body and a boss hole, wherein the boss hole is disposed on the top surface of the boss body and faces the printed circuit board.

[0015] Optionally, the middle frame includes: a plurality of stud holes; the stud holes are disposed at the bottom of the middle frame, and the stud holes are configured one-to-one with the stud groups;

[0016] Each of the stud assembly holes includes: a first stud hole and a second stud hole, wherein the first stud hole is provided in a one-to-one correspondence with the extrusion stud, and the second stud hole is provided in a one-to-one correspondence with the boss stud;

[0017] The inner walls of the first stud hole and the second stud hole are provided with protrusions. The protrusions of the first stud hole are interference-fitted with the extrusion stud, and the protrusions of the second stud hole are interference-fitted with the boss stud, which are used to fix the middle frame to the base plate.

[0018] Optionally, the middle frame further includes: a skirt and a second slot, the skirt being disposed at the bottom of the middle frame and matched and connected with the groove; the second slot being disposed on the inner wall of the middle frame and close to the cover plate.

[0019] Optionally, the printed circuit board includes: multiple fixing holes and multiple through holes, the through holes being configured one-to-one with the extrusion studs, and the fixing holes being configured one-to-one with the boss studs; the through holes being matched and connected to the extrusion studs; the fixing holes are located on the boss studs and are connected to the boss holes by screws, so that the printed circuit board is fixedly connected to the base plate.

[0020] Optionally, the cover plate includes: a cover plate hole, a pin hole, and a middle frame buckle disposed on the cover plate;

[0021] The cover plate holes are provided one-to-one with the extrusion studs, and the inner wall of the cover plate holes is provided with cover plate buckles, which are connected to the first slot in a buckle-fitting manner.

[0022] The pin holes are configured to correspond one-to-one with the pins on the printed circuit board;

[0023] The middle frame buckle and the second slot are respectively set one-to-one, and the middle frame buckle and the second slot are connected by a buckle engagement.

[0024] Optionally, it also includes: potting compound, which fills the closed cavity and encapsulates the printed circuit board.

[0025] Optionally, it may also include: a ceramic sheet and a thermally conductive insulating pad, wherein the ceramic sheet and the thermally conductive insulating pad are disposed on the base plate and located below the printed circuit board.

[0026] One or more technical solutions in the embodiments of this utility model have at least the following technical effects or advantages:

[0027] This invention provides a packaging structure for a high-voltage brick-type power module. A middle frame is connected to the base plate via a stud mechanism, forming an open cavity. A printed circuit board (PCB) is connected to the base plate via the stud mechanism, positioned within the middle frame and housed in the open cavity. A cover plate is connected to the middle frame via the stud mechanism, closing the open cavity. This creates a closed cavity formed by the base plate, middle frame, and cover plate, with the PCB positioned within it. This design achieves precise positioning and assembly of the middle frame, cover plate, and PCB on the base plate, avoiding reliance on excessive tooling and simplifying the packaging process. It also ensures the accuracy of the high-voltage brick-type power module packaging, improving packaging efficiency and speed. Furthermore, this embodiment features a simple packaging structure that requires no additional complex environmental conditions (such as a vacuum environment), making it suitable for packaging small batches of various types of high-voltage brick-type power modules.

[0028] Furthermore, the open cavity formed by the mid-frame and base plate allows for precise control of the amount of potting compound used in the packaging structure. Simultaneously, the potting compound does not flow to the outside of the overall structure, eliminating the need for cleaning residual compound from the tooling and the overall structure after potting. This also avoids resource waste caused by excessive potting compound in high-voltage brick-type power modules, reducing material and labor costs. This embodiment assembles the base plate, mid-frame, cover plate, and printed circuit board to form the packaging structure of the high-voltage brick-type power module. Furthermore, problems discovered during the aging test phase of the high-voltage brick-type power module facilitate disassembly and repair. Attached Figure Description

[0029] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference figures denote the same parts throughout the drawings. In the drawings:

[0030] Figure 1 A schematic diagram of the packaging structure of the high-voltage brick-type power module in an embodiment of this utility model is shown.

[0031] Figure 2 A schematic diagram of the base plate in an embodiment of this utility model is shown;

[0032] Figure 3 A schematic diagram of the middle frame in an embodiment of this utility model is shown;

[0033] Figure 4 A schematic diagram of the structure of the ceramic sheet and the thermally conductive insulating pad in an embodiment of this utility model is shown;

[0034] Figure 5 A schematic diagram of the printed circuit board in an embodiment of this utility model is shown;

[0035] Figure 6 A schematic diagram of the cover plate in an embodiment of this utility model is shown.

[0036] In the attached diagram, 100 is the base plate; 200 is the middle frame; 300 is the cover plate; 400 is the printed circuit board; 500 is the ceramic sheet; and 600 is the thermally conductive and insulating pad.

[0037] 110. Stud assembly; 120. Groove;

[0038] 111. Extruded stud; 112. Boss stud; 1111. Stud body; 1112. First slot; 1121. Boss body; 1122. Boss hole;

[0039] 210, Stud hole; 220, Skirt; 230, Second slot; 211, First stud hole; 212, Second stud hole;

[0040] 310. Cover plate hole; 320. Pin hole; 330. Middle frame clip; 311. Cover plate clip;

[0041] 410. Fixing hole; 420. Through hole. Detailed Implementation

[0042] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0043] Example 1

[0044] The first embodiment of this utility model provides a packaging structure for a high-voltage brick-type power supply module, such as... Figure 1 As shown, the system includes: a base plate 100, a middle frame 200, a cover plate 300, and a printed circuit board 400. The base plate 100 includes a stud mechanism located on the base plate 100 and facing the cover plate 300. The middle frame 200 is connected to the base plate 100 via the stud mechanism, forming an open cavity with the base plate 100. The cover plate 300 is connected to the base plate 100 and the middle frame 200 via the stud mechanism, closing the opening and forming a closed cavity. The printed circuit board 400 is connected to the base plate 100 via the stud mechanism, located within the middle frame 200 and below the cover plate 300, positioning the printed circuit board 400 within the closed cavity.

[0045] It should be noted that the base plate 100 is a heat dissipation base plate, which can be an aluminum heat dissipation base plate. The packaging structure of this embodiment is suitable for various brick-type high-voltage power supply modules, especially for high-voltage full-brick power supply modules.

[0046] In this embodiment, the middle frame 200 is connected to the base plate 100 via a stud mechanism located on the base plate 100, forming an open cavity with the base plate 100. The printed circuit board 400 is connected to the base plate 100 via the stud mechanism and is positioned within the middle frame 200, thus placing the printed circuit board 400 within the open cavity. The cover plate 300 is connected to the middle frame 200 via the stud mechanism, closing the open cavity. This allows the base plate 100, middle frame 200, and cover plate 300 to form a whole with a closed cavity, within which the printed circuit board 400 is positioned. This achieves the limited assembly of the middle frame 200, cover plate 300, and printed circuit board 400 on the base plate 100, avoiding reliance on excessive tooling and fixtures, simplifying the packaging process, ensuring the packaging accuracy of the high-voltage brick-type power module, and improving packaging efficiency and speed. Furthermore, the packaging structure of this embodiment is simple and does not require additional complex environmental conditions (such as a vacuum environment), making it suitable for packaging applications of small batches and various types of high-voltage brick-type power modules.

[0047] Furthermore, the cavity with openings formed by the middle frame 200 and the base plate 100 allows for precise control of the amount of potting compound used in the encapsulation structure. Simultaneously, the potting compound does not flow to the outside of the overall structure, eliminating the need for cleaning residual compound from the tooling and the overall structure after potting. This also avoids resource waste caused by excessive potting compound in the high-voltage brick-type power module, reducing material and labor costs. In this embodiment, the encapsulation structure of the high-voltage brick-type power module is formed by assembling the base plate 100, middle frame 200, cover plate 300, and printed circuit board 400. Furthermore, problems discovered during the aging test phase of the high-voltage brick-type power module facilitate disassembly and repair.

[0048] Below, in conjunction with Figure 1 The packaging structure of the high-voltage brick-type power module in this embodiment is described in detail below:

[0049] like Figure 2 As shown, the base plate 100 includes a stud mechanism located on the base plate 100 and facing the cover plate 300. The stud mechanism includes a plurality of stud groups 110. Each stud group 110 includes a press-fit stud 111 and a boss stud 112, which are arranged adjacent to each other on the base plate 100.

[0050] Specifically, in Figure 2 In the base plate 100, stud assemblies 110, namely extrusion studs 111 and boss studs 112, are riveted to the four corners. The stud assemblies 110 are used to stably fix the middle frame 200, cover plate 300 and printed circuit board 400 to the base plate 100. In the stud assembly 110, the height of the extrusion stud 111 is greater than the height of the boss stud 112. The boss stud 112 is mainly used to fix the printed circuit board 400 to the base plate 100 and within the middle frame 200, as well as below the cover plate 300.

[0051] exist Figure 2 In each stud assembly 110, the extrusion stud 111 includes a stud body 1111 and a first retaining groove 1112. The stud body 1111 is disposed on the base plate 100 and faces the cover plate 300. The first retaining groove 1112 is located at the top of the stud body 1111. The first retaining groove 1112 is used to connect with the cover plate snap-fit ​​311, so that the cover plate 300 closes the opening of the cavity formed by the middle frame 200 and the base plate 100.

[0052] The boss stud 112 also includes a boss body 1121 and a boss hole 1122. The boss hole 1122 is located on the top surface of the boss body 1121 and faces the printed circuit board 400. The boss body 1121 is used to position the printed circuit board 400 on the boss body 1121, that is, the boss body 1121 supports the printed circuit board 400, so that there is a preset distance between the printed circuit board 400 and the base plate 100. This ensures that no component on the printed circuit board 400 directly contacts the base plate 100. The preset distance depends on the height of the boss body 1121 and can be set according to actual needs. The boss hole 1122 is used to lock the printed circuit board 400 on the boss body 1121, so that the printed circuit board 400 is fixedly connected to the base plate 100, preventing the printed circuit board 400 from moving. The boss hole 1122 may be provided with a thread. The printed circuit board 400 is fixed on the base plate 100 by connecting the screw to the thread in the boss hole 1122.

[0053] exist Figure 2 In the middle, the base plate 100 includes a groove 120. The groove 120 is disposed within the inner cavity of the base plate 100. Optionally, the groove 120 is disposed around the perimeter of the inner cavity of the base plate 100. The groove 120 is used to mate and connect with the skirt 220 at the bottom of the middle frame 200. When the middle frame 200 and the base plate 100 are assembled, the groove 120 positions the middle frame 200 and simultaneously forms an open cavity to prevent the potting compound inside the power module from flowing out.

[0054] like Figure 3 As shown, the middle frame 200 includes multiple stud holes 210. The stud holes 210 are located at the bottom of the middle frame 200, and each stud hole 210 corresponds to a stud group 110. Each stud hole 210 includes a first stud hole 211 and a second stud hole 212. The first stud hole 211 corresponds to an extrusion stud 111, and the second stud hole 212 corresponds to a boss stud 112.

[0055] It should be noted that the size of the first stud hole 211 depends on the size of the extrusion stud 111, and the size of the second stud hole 212 depends on the size of the boss stud 112. Figure 3This is a top view from the bottom of the middle frame 200. In each stud hole 210, the first stud hole 211 and the second stud hole 212 can be two independent holes, or they can be... Figure 3 The two overlapping circular holes shown make the stud assembly hole 210 appear as a gourd shape with two overlapping circular holes. The shape of the stud assembly hole 210 can also be set according to actual needs.

[0056] In each stud hole 210, the inner walls of the first stud hole 211 and the second stud hole 212 are provided with protrusions. The protrusions of the first stud hole 211 are interference-fitted with the extrusion stud 111, so that the first stud hole 211 is fitted onto the extrusion stud 111. The protrusions of the second stud hole 212 are interference-fitted with the boss stud 112, so that the second stud hole 212 is fitted onto the boss stud 112. This is used to fix the middle frame 200 to the base plate 100. The number of protrusions can be set according to actual needs, such as four protrusions on the inner walls of the first stud hole 211 and the second stud hole 212. The interference fit can be set according to actual needs, for example, 0.13mm or 0.11mm-0.14mm.

[0057] like Figure 3 As shown, the middle frame 200 also includes a skirt 220 and a second slot 230. The skirt 220 is disposed at the bottom of the middle frame 200 and is matched and connected with the groove 120. The second slot 230 is disposed on the inner wall of the middle frame 200 and is close to the cover plate 300.

[0058] Specifically, the width of the skirt 220 can be set according to actual needs, for example, the width of the skirt 220 can be 1.9mm. The skirt 220 matches and connects with the groove 120. On the one hand, during the assembly of the middle frame 200 and the base plate 100, the middle frame 200 can be quickly positioned, so that the middle frame 200 and the base plate 100 are stably connected; on the other hand, through the matching connection of the groove 120 and the skirt 220, the middle frame 200 and the base plate 100 can form a firm cavity with an opening, preventing the potting compound inside the cavity from leaking out. The position of the second slot 230 can be set according to actual needs. The second slot 230 is used to fix the cover plate 300 and the middle frame 200 to close the opening of the cavity formed by the middle frame 200 and the base plate 100, to prevent the potting compound from leaking out, and also to ensure that the high-voltage brick-type power module is easy to disassemble and repair. Figure 3 In the middle frame 200, a second slot 230 is provided on the inner wall of each long side, that is, there are two second slots 230. The second slots 230 are close to the cover plate 300 to facilitate connection with the cover plate buckle 311.

[0059] In this embodiment, since there are strict requirements for the safety distance between the components on the printed circuit board 400 of the high-voltage power module and the metal housing, each stud hole 210 of the middle frame 200 is fitted onto the stud group 110, and a skirt 220 is added to the bottom of the middle frame 200. This increases the creepage distance between the components on the internal printed circuit board 400 and the studs, and between the components on the edge of the internal printed circuit board 400 and the metal base plate 100. This improves the potential for poor insulation withstand voltage caused by insufficient safety distance, and also improves the space utilization of the internal printed circuit board 400.

[0060] like Figure 4 As shown, the high-voltage brick-type power module of this embodiment also includes a ceramic sheet 500 and a thermally conductive insulating pad 600. The ceramic sheet 500 and the thermally conductive insulating pad 600 are disposed on the base plate 100 and located below the printed circuit board 400. The position, shape, and size of the ceramic sheet 500 and the thermally conductive insulating pad 600 can be set according to actual needs. Bonding the ceramic sheet 500 and the thermally conductive insulating pad 600 to the base plate 100 ensures that the creepage distance between the primary components on the internal printed circuit board 400 and the base plate 100 meets the withstand voltage requirements, and also effectively conducts the heat from the heat-generating components on the printed circuit board 400 to the base plate 100, thereby achieving heat dissipation.

[0061] like Figure 5 As shown, the printed circuit board 400 includes multiple fixing holes 410 and multiple through holes 420. Each through hole 420 corresponds to a crimping stud 111, and each fixing hole 410 corresponds to a boss stud 112. The through holes 420 and crimping studs 111 are matched and connected so that the crimping studs 111 pass through the through holes 420, facilitating connection with the cover plate 300. The fixing holes 410 are located on the boss studs 112 (i.e., boss bodies 1121) and are connected to the boss holes 1122 by screws, locking the printed circuit board 400 onto the boss studs 112, thus fixing the printed circuit board 400 to the base plate 100.

[0062] Since a stud assembly 110 is provided at each of the four corners of the base plate 100, then in Figure 5In this circuit board 400, there are four fixing holes 410 and four through holes 420. The through holes 420 correspond one-to-one with the forming studs 111, and are matched and connected. The fixing holes 410 correspond one-to-one with the boss studs 112, and are located on the boss studs 112 (i.e., boss bodies 1121). Thus, by connecting screws to the boss holes 1122, the printed circuit board 400 is locked onto the boss studs 112. The printed circuit board 400 is supported by the four boss studs 112 at the four corners of the base plate 100, ensuring that no component on the printed circuit board 400 directly contacts the base plate 100. This ensures that the printed circuit board 400 is securely fixed to the base plate 100 and maintains a fixed position on the base plate 100. The screws can be configured according to actual needs; for example, the screws can be selected as M1.6 three-in-one stainless steel screws.

[0063] like Figure 6 As shown, the cover plate 300 includes: cover plate holes 310, pin holes 320, and middle frame clips 330. The cover plate holes 310 correspond one-to-one with the extrusion studs 111, and the inner wall of the cover plate holes 310 is provided with cover plate clips 311, which are engaged with the first slot 1112. The pin holes 320 correspond one-to-one with the pins on the printed circuit board 400, exposing the pins on the printed circuit board 400 for easy connection to external devices. The middle frame clips 330 correspond one-to-one with the second slot 230, and are engaged with the second slot 230 to fix the cover plate 300 to the middle frame 200.

[0064] Specifically, Figure 6 This is a top view from the bottom of the cover plate 300. The cover plate 300 has cover plate holes 310, which are matched and connected one-to-one with the extrusion studs 111. Since there are extrusion studs 111 at each of the four corners of the base plate 100, the cover plate 300 has cover plate holes 310 at each of the four corners. Each cover plate hole 310 has a cover plate latch 311 on its inner wall, which is engaged with the first latching groove 1112 at the top of the extrusion stud 111. Since there is a second latching groove 230 on the inner wall of each long side of the middle frame 200, a middle frame latch 330 is provided on the side of the cover plate 300 corresponding to the long side of the middle frame 200. The interference fit of the latching fit can be set according to actual needs; for example, the interference fit range is 0.1-0.2 mm. This ensures a secure connection between the cover plate 300, the middle frame 200, and the base plate 100, forming a closed cavity for the entire encapsulation structure, while also facilitating the repair and disassembly of the high-voltage power module.

[0065] The encapsulation structure of the high-voltage brick-type power module in this embodiment also includes potting compound. The potting compound fills the sealed cavity and encapsulates the printed circuit board 400. The potting compound essentially fills the entire sealed cavity after encapsulation, completely encapsulating the printed circuit board 400. The potting compound serves two purposes: firstly, it dissipates heat generated by the heat-generating components during operation of the high-voltage power module; secondly, it provides a sealing and anti-oxidation function, isolating important components from air and preventing oxidation, thereby increasing the overall lifespan of the high-voltage power module.

[0066] Typically, after installing extrusion studs 111, boss studs 112, ceramic sheets 500, and thermally conductive insulating pads 600 on the base plate 100, the middle frame 200 and the base plate 100 are assembled, forming an open cavity. After assembling the middle frame 200 and the base plate 100, a small amount of thermally conductive potting compound is poured into the open cavity formed by the middle frame 200 and the base plate 100. This thermally conductive potting compound increases the creepage distance between the components and the base plate 100 and also provides good heat conduction, reducing heat accumulation inside the power supply. Furthermore, after the potting compound cures, it increases the bonding strength between the base plate 100 and the middle frame 200, allowing them to be connected more stably.

[0067] After pouring a small amount of thermally conductive potting compound into the cavity formed by the middle frame 200 and the base plate 100, which has an opening, the printed circuit board 400 is assembled into the cavity. Next, potting compound is poured in and the board is shaken left and right to ensure it fully fills the internal space formed by the middle frame 200 and the base plate 100, especially filling the top and bottom of the printed circuit board 400 and the gaps between the components. This ensures that the high-voltage power module can conduct the heat generated by the power devices out when operating under full load, ensuring normal product operation. Finally, the cover plate 300 is snapped into place with the base plate 100 and the middle frame 200, ensuring a relatively sealed overall structure.

[0068] One or more technical solutions in the embodiments of this utility model have at least the following technical effects or advantages:

[0069] First, it simplifies or eliminates the need for special tooling and fixtures for dispensing, saving on the cost of manufacturing tooling and fixtures, improving production efficiency, and at the same time greatly reducing the amount of dispensing adhesive used.

[0070] Secondly, the encapsulating material needs to be baked to cure after potting, which can save the tooling and process of clamping product modules. At the same time, the baking oven can hold more products, saving space and improving efficiency.

[0071] Third, the process of removing residual potting compound from the product module after potting is eliminated, reducing operating time and lowering labor costs.

[0072] Fourth, regarding safety distance regulations, the bottom of the stud is wrapped in plastic in the middle frame and a skirt is added, which increases the creepage distance between the components on the internal printed circuit board and the stud, and between the components near the edge of the internal printed circuit board and the bottom plate. This improves the potential for poor insulation withstand voltage caused by insufficient safety distance, and also improves the space utilization of the internal printed circuit board.

[0073] Fifth, no additional equipment costs are required.

[0074] Those skilled in the art will understand that although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0075] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A packaging structure of a high-voltage brick power module, characterized by, The utility model relates to a printed circuit board (PCB) structure, comprising: a bottom plate, a middle frame, a cover plate and a printed circuit board (PCB); the bottom plate comprises stud mechanisms on the bottom plate and towards the cover plate; the middle frame is connected to the bottom plate by the stud mechanisms, forming a cavity with an opening with the bottom plate; the cover plate is connected to the bottom plate and the middle frame by the stud mechanisms, closing the opening and forming a closed cavity with the cavity with an opening; the printed circuit board (PCB) is connected to the bottom plate by the stud mechanisms, in the middle frame and under the cover plate, located in the closed cavity.

2. The packaging structure of a high voltage brick power module according to claim 1, wherein the bottom plate comprises a groove in the inner cavity of the bottom plate.

3. The packaging structure of the high voltage brick power module according to claim 2, wherein the stud mechanisms comprise a plurality of stud groups; 4. The packaging structure of the high voltage brick power module according to claim 3, wherein each stud group comprises an extrusion stud and a boss stud, arranged adjacently on the bottom plate. the extrusion stud comprises a stud body and a first clamping slot; 5. The packaging structure of the high voltage brick power module according to claim 4, wherein the stud body is arranged on the bottom plate and towards the cover plate; the first clamping slot is located on the top of the stud body; the boss stud further comprises a boss body and a boss hole; 6. The packaging structure of a high voltage brick power module according to claim 5, wherein the boss hole is arranged on the top surface of the boss body and towards the printed circuit board (PCB).

7. The packaging structure of a high voltage brick power module according to claim 4, wherein the middle frame comprises a plurality of stud group holes; 8. The packaging structure of a high voltage brick power module according to claim 6, wherein the stud group holes are arranged on the bottom of the middle frame, corresponding to the stud groups one by one; each stud group hole comprises a first stud hole and a second stud hole; the first stud hole corresponds to the extrusion stud one by one, and the second stud hole corresponds to the boss stud one by one; the inner walls of the first stud hole and the second stud hole are provided with protrusions; 9. The packaging structure of a high voltage brick power module according to claim 1, wherein the protrusions of the first stud hole are in interference fit with the extrusion stud, and the protrusions of the second stud hole are in interference fit with the boss stud, for fixed connection of the middle frame and the bottom plate. the middle frame further comprises a skirt and a second clamping slot; 10. The packaging structure of a high voltage brick power module according to claim 1, wherein the skirt is arranged on the bottom of the middle frame and matches the groove for connection; the second clamping slot is arranged on the inner wall of the middle frame and close to the cover plate. the printed circuit board (PCB) comprises a plurality of fixing holes and a plurality of through holes; the through holes correspond to the extrusion studs one by one, and the fixing holes correspond to the boss studs one by one; the through holes match the extrusion studs for connection; the fixing holes are located on the boss studs to connect with the boss holes by screws, for fixed connection of the printed circuit board (PCB) and the bottom plate. the cover plate comprises cover plate holes, pin holes and middle frame buckles arranged on the cover plate; the cover plate holes correspond to the extrusion studs one by one, and the inner walls of the cover plate holes are provided with cover plate buckles in buckle fit connection with the first clamping slots; the pin holes correspond to the pins on the printed circuit board (PCB) one by one; the middle frame buckles correspond to the second clamping slots one by one and are in buckle fit connection with the second clamping slots. the utility model further comprises: potting glue filled in the closed cavity and wrapping the printed circuit board (PCB). the utility model further comprises: ceramic sheets and heat-conducting insulation gaskets arranged on the bottom plate and under the printed circuit board (PCB).

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