Backoff mounting structure and electronic equipment

Abstract

The utility model provides a back-off mounting structure and electronic equipment. The back-off mounting structure comprises a shell, a main board and a pressing piece. An installation space is arranged in the machine shell, a heat dissipation substrate is fixedly installed on the side wall of the installation space, and the heat dissipation substrate is used for providing heat conduction and heat dissipation effects for the MOS tube assembly on the main board. The first board surface of the mainboard is provided with the MOS tube assembly, and the reverse buckling installation of the PCBA is realized by arranging the MOS tube assembly in the installation space of the housing. One end of the pressing piece is fixedly connected to the machine shell, and the other end of the pressing piece is pressed against the surface of the MOS tube assembly, so that the MOS tube assembly is pressed against the heat dissipation substrate. Through the effect of the pressing piece, the MOS tube assembly is directly pressed against the heat dissipation substrate, additional installation steps or complex adjustment operation is not needed, the installation process is simplified, the installation efficiency is remarkably improved, and meanwhile the problem of device interference caused by a visual blind area in traditional back-off installation is solved.

Description

Technical Field

[0001] This application belongs to the field of circuit board mounting technology, and more specifically, relates to an inverted mounting structure and electronic equipment. Background Technology

[0002] Traditionally, printed circuit board assemblies (PCBAs) are mounted face up for ease of installation. However, in certain applications, due to space constraints or design requirements, PCBs must be mounted upside down. During upside-down mounting, the electronic components on the PCBA are located below the circuit board, obstructing the operator's view and preventing direct observation of the relative positions of the components to the device housing. This blind spot complicates the installation process, especially when components are densely packed or compactly arranged. Components on the PCBA are highly susceptible to interference with protrusions, fasteners, or other components on the housing. This interference not only leads to installation difficulties but can also cause physical damage to the components, affecting the normal operation of the equipment. Utility Model Content

[0003] The purpose of this application is to provide an inverted mounting structure and electronic device to solve the technical problem of inconvenient operation when installing PCBA inverted in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] A snap-fit ​​mounting structure is provided, comprising:

[0006] The casing has an installation space, and a heat sink is installed on the side wall of the installation space;

[0007] A motherboard, on the first board surface of which a MOSFET assembly is mounted, the MOSFET assembly being placed in the mounting space;

[0008] A pressing component, one end of which is connected to the housing and the other end of which presses against the MOS transistor assembly, thereby pressing the MOS transistor assembly against the heat sink substrate.

[0009] As a further improvement to the above technical solution:

[0010] Optionally, the pressing member includes a substrate portion, a first elastic pressing foot, and a second elastic pressing foot. The substrate portion is connected to the housing. The first elastic pressing foot and the second elastic pressing foot are both located at the same side edge of the substrate portion and extend to both sides along the thickness direction of the substrate portion. The first elastic pressing foot is used to press against the MOS transistor assembly, and the second elastic pressing foot can slide against the limiting protrusion in the mounting space.

[0011] Optionally, there is at least one first elastic pressure foot, and at least two second elastic pressure feet, with each second elastic pressure foot disposed on both sides of the first elastic pressure foot along the side edge direction of the substrate portion.

[0012] Optionally, the inverted mounting structure also includes fasteners. The base plate is provided with fastening holes and guide holes, and the mounting space is also provided with guide posts. When the base plate is connected to the housing, the guide posts are inserted into the guide holes, and the fasteners pass through the fastening holes and fasten the base plate to the housing.

[0013] Optionally, the motherboard is further provided with a first through hole, and the fastener passes through the first through hole and is fastened to the substrate.

[0014] Optionally, the MOS transistor assembly includes a MOS transistor bracket and at least one MOS transistor. The first side of the MOS transistor bracket has a slot corresponding to the MOS transistor. The MOS transistor is connected to the slot and contacts the heat sink substrate. The first elastic pressure foot presses against the second side of the MOS transistor bracket.

[0015] Optionally, the MOS transistor assembly further includes an adhesive layer disposed in the slot to adhere between the MOS transistor support and the MOS transistor.

[0016] Optionally, the card slot is provided with a positioning protrusion corresponding to the positioning hole on the MOS tube.

[0017] Optionally, the MOSFET bracket further includes a snap-fit ​​post for snapping the MOSFET bracket onto the motherboard.

[0018] This application also provides an electronic device including the above-described inverted mounting structure.

[0019] The beneficial effects of the inverted mounting structure and electronic device provided in this application are as follows:

[0020] The inverted mounting structure provided in this application includes a chassis, a motherboard, and a retaining component. The chassis has an internal mounting space, and a heatsink is fixedly mounted on the side wall of the mounting space. The heatsink provides heat conduction and dissipation for the MOSFET assemblies on the motherboard. MOSFET assemblies are mounted on the first surface of the motherboard. By placing the MOSFET assemblies within the mounting space of the chassis, the PCBA is inverted. One end of the retaining component is fixedly connected to the chassis, and the other end presses against the surface of the MOSFET assembly, thereby pressing the MOSFET assembly against the heatsink and ensuring good contact between the two to optimize heat conduction.

[0021] During installation, the retaining element is first installed onto the chassis, followed by the motherboard being installed upside down into the chassis's mounting space. The retaining element directly presses the MOSFET components against the heatsink, eliminating the need for additional installation steps or complex adjustments. This simplifies the installation process, significantly improves efficiency, and avoids interference issues caused by blind spots in traditional upside-down installations. Furthermore, the thermal conductivity of the heatsink combined with the pressing action of the retaining element effectively enhances the heat dissipation of the MOSFET components, ensuring stable operation of the electronic equipment in high-temperature environments.

[0022] The electronic device provided in this application includes the above-described inverted mounting structure, and therefore also has the advantages of the above-described inverted mounting structure. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A three-dimensional structural diagram of the inverted installation structure provided in this application;

[0025] Figure 2 for Figure 1 A magnified schematic diagram of the local structure;

[0026] Figure 3 A schematic diagram of the disassembled structure of the inverted installation structure provided in this application. Figure 1 ;

[0027] Figure 4 A partially enlarged structural diagram of the inverted mounting structure provided in this application;

[0028] Figure 5 for Figure 4 A magnified schematic diagram of the local structure;

[0029] Figure 6 A schematic diagram of the disassembled structure of the inverted installation structure provided in this application. Figure 2 ;

[0030] Figure 7 A three-dimensional structural diagram of the MOSFET assembly with an inverted mounting structure provided in this application;

[0031] Figure 8 This is a schematic diagram showing the disassembled structure of the MOSFET assembly with the inverted mounting structure provided in this application.

[0032] The following are the labeling elements in the figure:

[0033] 1. Housing; 11. Limiting protrusion; 12. Guide post;

[0034] 2. Heat sink substrate;

[0035] 3. Mainboard; 31. First through hole;

[0036] 4. MOSFET assembly; 41. MOSFET bracket; 411. Slot; 412. Positioning protrusion; 413. Connecting post; 42. MOSFET; 43. Adhesive layer;

[0037] 5. Pressing member; 51. Substrate portion; 511. Fastening hole; 512. Guide hole; 52. First elastic presser foot; 53. Second elastic presser foot;

[0038] 6. Fasteners. Detailed Implementation

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0040] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of this utility model.

[0045] In the following description, suffixes such as "circuit," "component," "assembly," or "unit" are used only for the purpose of describing this utility model and have no specific meaning in themselves. Therefore, they can be used in combination.

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0047] like Figure 1 and Figure 6As shown, this application provides an inverted mounting structure, including a housing 1, a motherboard 3, and a retaining member 5. The housing 1 has an internal mounting space, and a heat sink 2 is fixedly mounted on the side wall of the mounting space. The heat sink 2 provides heat conduction and dissipation for the MOSFET assembly 4 on the motherboard 3. The heat sink 2 can be a ceramic substrate, a metal substrate, or a heat sink substrate made of other materials. The MOSFET assembly 4 is disposed on the first surface of the motherboard 3 (i.e., the front side, the side where multiple electronic devices are mounted). By placing the MOSFET assembly 4 within the mounting space of the housing 1, the PCBA is inverted. One end of the retaining member 5 is fixedly connected to the housing 1, and the other end presses against the surface of the MOSFET assembly 4, thereby pressing the MOSFET assembly 4 against the heat sink 2, ensuring good contact between the two to optimize heat conduction.

[0048] During installation, the retaining element 5 is first installed onto the housing 1, and then the motherboard 3 is installed upside down into the mounting space of the housing 1. Through the action of the retaining element 5, the MOSFET assembly 4 is directly pressed against the heat sink 2, eliminating the need for additional installation steps or complex adjustments. This simplifies the installation process, significantly improves installation efficiency, and avoids device interference problems caused by blind spots in traditional upside-down installations. Furthermore, the thermal conductivity of the heat sink 2 combined with the pressing action of the retaining element 5 effectively enhances the heat dissipation of the MOSFET assembly 4, thereby ensuring stable operation of the electronic equipment in high-temperature environments.

[0049] like Figure 2 , Figure 4 and Figure 5 As shown, in one specific embodiment of this application, the pressing member 5 includes a substrate portion 51, a first elastic pressing foot 52, and a second elastic pressing foot 53. The substrate portion 51 is fixed to the housing 1 by fasteners or other connection methods. The first elastic pressing foot 52 and the second elastic pressing foot 53 are both disposed at the same side edge of the substrate portion 51 and extend along both sides of the thickness direction of the substrate portion 51, forming a structure with a V-shaped opening. The first elastic pressing foot 52 is used to directly press against the surface of the MOSFET assembly 4 to ensure close contact between the MOSFET assembly 4 and the heat sink 2, thereby achieving efficient heat conduction. The second elastic pressing foot 53 can slide against the limiting protrusion 11 in the mounting space. The limiting protrusion 11 serves as a fixing structure in the mounting space, providing support and guidance for the second elastic pressing foot 53.

[0050] During installation, as the substrate 51 is gradually fixed to the housing 1 using fasteners or other means, the second elastic pressure foot 53 moves along the surface of the limiting protrusion 11 toward the base of the limiting protrusion 11. Because the V-shaped opening structure formed between the first elastic pressure foot 52 and the second elastic pressure foot 53 has elastic deformation capability, the movement of the second elastic pressure foot 53 causes the V-shaped opening to gradually widen, thereby causing the first elastic pressure foot 52 to apply a gradually increasing clamping force to the MOS transistor assembly 4. Thus, through the adaptive deformation capability of the elastic pressure foot, the MOS transistor assembly 4 is gradually clamped without interfering with the initial installation and docking of the MOS transistor assembly 4.

[0051] like Figure 2 and Figure 5 As shown, in one specific embodiment of this application, the number of first elastic pressure feet 52 is at least one, and the specific number corresponds to the number of MOS transistors 42 included in the MOS transistor assembly 4. This ensures that each MOS transistor 42 can obtain a stable clamping force through the corresponding first elastic pressure foot 52, thereby effectively avoiding local stress concentration caused by uneven clamping force distribution and further improving the contact reliability between the MOS transistor assembly 4 and the heat sink 2, thus optimizing heat dissipation performance. The number of second elastic pressure feet 53 is at least two, and each second elastic pressure foot 53 is respectively disposed on both sides of the first elastic pressure foot 52 along the side edge direction of the substrate portion 51 to form a symmetrical force distribution structure. This layout ensures that during installation, the clamping force applied by the first elastic pressure foot 52 is evenly transmitted to the limiting protrusion 11 through the second elastic pressure foot 53, thereby avoiding deformation or displacement of the substrate portion 51 caused by unilateral force.

[0052] like Figure 3 and Figure 6 As shown, in a specific embodiment of this application, the inverted mounting structure further includes a fastener 6 for securing the substrate portion 51 to the housing 1. The substrate portion 51 is provided with a fastening hole 511 and a guide hole 512. The fastening hole 511 allows the fastener 6 to pass through, securing the substrate portion 51 to the housing 1. The guide hole 512 engages with a guide post 12 within the mounting space, providing initial positioning of the substrate portion 51 before the fastener 6 is installed. The engagement of the guide post 12 and the guide hole 512 ensures the substrate portion 51 maintains the correct position and orientation during installation, thus avoiding installation difficulties or device interference caused by positional deviations. During installation, the guide hole 512 is first aligned with the guide post 12, and the substrate portion 51 is inserted into the guide post 12, completing the initial positioning. Subsequently, the fastener 6 passes through the fastening hole 511 and is fixed to the housing 1, thereby securing the substrate portion 51. Figure 3 and Figure 6As shown in a specific embodiment of this application, to avoid obstruction of vision or inconvenience of operation due to the motherboard 3 blocking the fastener 6 during installation, a first through hole 31 is also provided on the motherboard 3. The position of the first through hole 31 corresponds to the fastening hole 511 on the substrate 51, so that the fastener 6 can pass through the first through hole 31 and be directly fastened to the substrate 51. During the installation process, the guide hole 512 of the substrate 51 is first aligned and inserted into the guide post 12 in the installation space, thereby completing the initial positioning of the substrate 51 and ensuring the accuracy of its position and orientation. Subsequently, the motherboard 3 is installed onto the housing 1 in an upside-down manner. At this time, the fastener 6 extends into the fastening hole 511 of the substrate 51 through the first through hole 31 on the motherboard 3, and finally fastens the substrate 51 to the housing 1.

[0053] Furthermore, during subsequent disassembly, a disassembly tool can be inserted through the first through hole 31 on the motherboard 3 and the fastener 6 can be loosened, thereby reducing the clamping force applied to the MOSFET assembly 4 by the first elastic pressure foot 52 of the pressure member 5, allowing the MOSFET assembly 4 to be separated smoothly and meeting the requirements for non-destructive disassembly and assembly.

[0054] like Figure 7 and Figure 8 As shown, in one specific embodiment of this application, the MOSFET assembly 4 includes a MOSFET bracket 41 and at least one MOSFET 42. The first side of the MOSFET bracket 41 is provided with slots 411 corresponding to the number and size of the MOSFETs 42. Each MOSFET 42 is fixedly connected to the MOSFET bracket 41 through the slots 411, thereby achieving stable installation of the MOSFET 42. After installation, the MOSFET 42 is in direct contact with the heat sink 2 to ensure efficient heat conduction to the heat sink 2, thus achieving effective heat dissipation. A first elastic pressure foot 52 presses against the second side of the MOSFET bracket 41, applying a uniform clamping force to ensure tight contact between the MOSFETs 42 on the MOSFET bracket 41 and the heat sink 2, avoiding a decrease in heat dissipation efficiency due to poor contact.

[0055] like Figure 7 and Figure 8As shown in one specific embodiment of this application, the MOSFET assembly 4 further includes an adhesive layer 43, which is disposed within the slot 411 of the MOSFET support 41 to form a strong bond between the MOSFET support 41 and the MOSFET 42. During installation, the adhesive layer 43 not only fills the small gap between the MOSFET 42 and the slot 411, but also further enhances the fixation of the MOSFET 42 through its adhesive effect, preventing loosening or displacement due to long-term use or external stress. Furthermore, the adhesive layer 43 can absorb mechanical stress generated during installation to a certain extent, reducing the risk of damage to the MOSFET 42 due to uneven stress, thereby improving the reliability and durability of the structure.

[0056] like Figure 7 and Figure 8 As shown in a specific embodiment of this application, a positioning protrusion 412 is provided in the slot 411, and the position of the positioning protrusion 412 corresponds to the positioning hole on the MOS transistor 42. By providing the positioning protrusion 412 in the slot 411, the MOS transistor 42 can be quickly positioned during the installation process. The positioning protrusion 412 can not only effectively prevent the MOS transistor 42 from shifting or rotating during the installation process, but also ensure the relative positional accuracy between the MOS transistor 42 and the slot 411, thereby improving installation efficiency and reliability.

[0057] In one specific embodiment of this application, the MOSFET support 41 further includes a snap-fit ​​post 413 for securely snapping the MOSFET support 41 onto the motherboard 3. The motherboard 3 has a second through-hole corresponding to the snap-fit ​​post 413, and the snap-fit ​​post 413 connects the MOSFET support 41 to the motherboard 3 by inserting into the second through-hole. The front end of the snap-fit ​​post 413 is designed with a tapered head structure. This tapered head can guide the insertion into the second through-hole, thereby simplifying the installation process and improving installation accuracy. The middle part of the snap-fit ​​post 413 has a neck, which forms a snap-fit ​​engagement with the second through-hole of the motherboard 3, ensuring that the MOSFET support 41 is firmly fixed to the motherboard 3 after installation, preventing loosening or displacement due to vibration or impact. This snap-fit ​​post 413 design not only enables quick installation and removal of the MOSFET support 41, but also provides a reliable mechanical connection through the engagement of the neck with the second through-hole, thereby enhancing the stability and durability of the overall structure.

[0058] This application also provides an electronic device including the inverted mounting structure in the above embodiments. Since the electronic device has the inverted mounting structure in the above embodiments, it also has the advantages of the inverted mounting structure in the above embodiments.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An inverted mounting structure characterized by comprising: The application relates to a MOS tube assembly pressing structure. The MOS tube assembly pressing structure comprises a casing (1) with a mounting space, a heat dissipation substrate (2) mounted on the side wall of the mounting space, a main plate (3) with a MOS tube assembly (4) mounted on the first plate surface of the main plate (3) and arranged in the mounting space, and a pressing member (5) connected to one end of the casing (1) and pressed against the MOS tube assembly (4) to press the MOS tube assembly (4) against the heat dissipation substrate (2). The pressing member (5) comprises a base plate part (51) connected to the casing (1), a first elastic pressing foot (52) and a second elastic pressing foot (53) arranged at the same side edge of the base plate part (51) and respectively extending along the two sides of the thickness direction of the base plate part (51), the first elastic pressing foot (52) is used for pressing against the MOS tube assembly (4), and the second elastic pressing foot (53) is slidably pressed against a limiting protrusion (11) in the mounting space. The first elastic pressing foot (52) is at least one, and the number of the second elastic pressing foot (53) is at least two, and each second elastic pressing foot (53) is arranged on the two sides of the first elastic pressing foot (52) along the side edge direction of the base plate part (51).

2. The reverse-mounting structure according to claim 1, wherein The base plate part (51) is provided with a fastening hole (511) and a guide hole (512), and the mounting space is further provided with a guide column (12); when the base plate part (51) is connected to the casing (1), the guide column (12) is inserted into the guide hole (512), the fastening member (6) is penetrated into the fastening hole (511), and the base plate part (51) is fastened to the casing (1).

3. The reverse-mounting structure according to claim 2, wherein The main plate (3) is further provided with a first through hole (31), and the fastening member (6) is fastened and connected to the base plate part (51) after penetrating through the first through hole (31).

4. The reverse-mounting structure according to claim 2, wherein The MOS tube assembly (4) comprises a MOS tube support (41) and at least one MOS tube (42), the first side surface of the MOS tube support (41) is provided with a clamping groove (411) corresponding to the MOS tube (42), the MOS tube (42) is connected to the clamping groove (411), the MOS tube (42) is in contact with the heat dissipation substrate (2), and the first elastic pressing foot (52) is pressed against the second side surface of the MOS tube support (41).

5. The reverse-mounting structure according to claim 4, wherein The MOS tube assembly (4) further comprises an adhesive layer (43) arranged in the clamping groove (411) to be bonded between the MOS tube support (41) and the MOS tube (42).

6. The reverse-mounting structure according to any one of claims 2 to 5, wherein The clamping groove (411) is provided with a positioning protrusion (412) corresponding to a positioning hole on the MOS tube (42).

7. The reverse-mounting structure according to claim 6, wherein The MOS tube support (41) further comprises a clamping column (413) used for clamping the MOS tube support (41) to the main plate (3).

8. The reverse-mounting structure according to claim 6, wherein The application further relates to a reverse buckling mounting structure.

9. The reverse-mounting structure according to claim 6, wherein ​ 10. An electronic device, comprising: ​

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