Crystal oscillator IC automatic binding machine

Abstract

The utility model discloses an automatic binding machine for a crystal oscillator IC. The automatic binding machine comprises a rack; the adsorption mechanism is slidably connected to the rack, and a first visual camera is arranged on one side of the adsorption mechanism; the welding mechanism is slidably connected to the rack, and a second visual camera is arranged on one side of the welding mechanism; the feeding mechanism comprises a first storage unit and a first positioning unit, and the first storage unit is used for storing IC chip trays; and the receiving mechanism comprises a second storage unit and a second positioning unit. Compared with the prior art, the utility model solves the problems that the connection efficiency of the chip and the packaging substrate is low and the connection quality is not monitored in the crystal oscillator production process.

Description

Technical Field

[0001] This utility model relates to the field of crystal oscillator processing technology, and in particular to an automatic crystal oscillator IC bonding machine. Background Technology

[0002] A quartz crystal resonator is an electronic component that utilizes the piezoelectric effect of a quartz crystal to generate a high-precision oscillation frequency. This component mainly consists of a quartz crystal wafer, a substrate, a housing, silver paste, and silver. IC bonding machines are primarily used to achieve high-precision electrical connections between chips and packaging substrates or other electronic components, ensuring the performance and reliability of the crystal oscillator.

[0003] The existing bonding machines used in crystal oscillator production have low production efficiency and lack monitoring of the connection quality between the chip and the packaging substrate, which affects the production efficiency and quality of crystal oscillators. Utility Model Content

[0004] The purpose of this invention is to provide an automatic bonding machine for crystal oscillator ICs to solve the problems of low connection efficiency and lack of monitoring of connection quality between chips and packaging substrates during the crystal oscillator production process.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: an automatic crystal oscillator IC bonding machine, comprising:

[0006] frame;

[0007] The adsorption mechanism is slidably connected to the frame, and a first vision camera is set on one side of the adsorption mechanism.

[0008] A welding mechanism is slidably connected to the frame, and a second vision camera is installed on one side of the welding mechanism;

[0009] The feeding mechanism includes a first storage unit and a first positioning unit, wherein the first storage unit is used to store IC chip trays;

[0010] The receiving mechanism includes a second storage unit and a second positioning unit. The second storage unit includes a second lead screw driver and a second hopper. The second hopper is fixedly installed on the sliding seat of the second lead screw driver. A pallet support groove is provided on one opposite side wall of the second hopper. The pallet support groove is used to place a substrate pallet.

[0011] The second positioning unit includes a second Y-axis mover, a second moving seat, a second material support plate, and a second material lifting cylinder. The second moving seat is mounted on the second Y-axis mover, the second material lifting cylinder is mounted on the second moving seat, and the second material support plate is mounted on the cylinder rod of the second material lifting cylinder. The position of the second material support plate corresponds to the second hopper.

[0012] As a further description of the above technical solution:

[0013] A guide frame is provided between the second storage unit and the second positioning unit. A photoelectric sensor is provided on one side of the guide frame. A clearance hole is provided on one side wall of the second hopper. Several clearance holes are arranged at equal intervals along the height direction of the second hopper. One clearance hole position corresponds to one pallet support groove.

[0014] As a further description of the above technical solution:

[0015] The second material support plate has symmetrically arranged side plates on both sides, and the side plates are slidably connected to the second movable seat.

[0016] As a further description of the above technical solution:

[0017] The second movable seat is equipped with an upper baffle.

[0018] As a further description of the above technical solution:

[0019] An adsorption cylinder is installed below the second material support plate. The cylinder rod of the adsorption cylinder is connected to a transmission rod, and the end of the transmission rod is connected to a mounting plate. A suction cup is installed on the mounting plate, which is used to adsorb the end face of the substrate tray.

[0020] As a further description of the above technical solution:

[0021] The mounting plate has two suction cups.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0023] 1. In this utility model, when the IC automatic bonding machine is working, the feeding mechanism automatically feeds IC chips and collects empty IC chip trays, and the receiving mechanism automatically feeds the packaging substrate and collects the substrate tray after bonding, effectively improving the crystal oscillator processing efficiency.

[0024] 2. In this utility model, during the operation of the IC automatic bonding machine, the adsorption mechanism adsorbs the IC chip and the packaging substrate for preliminary assembly. The first vision camera monitors whether the IC chip and the packaging substrate are placed in place. The welding mechanism monitors the welding quality of the IC chip and the packaging substrate through the second vision camera, effectively ensuring the processing quality of the crystal oscillator. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1This is a schematic diagram of an automatic crystal oscillator IC bonding machine.

[0027] Figure 2 This is a schematic diagram of the structure of the second material storage unit in an automatic crystal oscillator IC bonding machine.

[0028] Figure 3 This is a schematic diagram of the guide frame in an automatic crystal oscillator IC bonding machine.

[0029] Figure 4 This is a schematic diagram of the structure of the second positioning unit in an automatic crystal oscillator IC bonding machine.

[0030] Figure 5 This is a schematic diagram of the state changes of the second positioning unit in an automatic crystal oscillator IC bonding machine. Figure 1 .

[0031] Figure 6 This is a schematic diagram of the state changes of the second positioning unit in an automatic crystal oscillator IC bonding machine. Figure 2 .

[0032] Legend:

[0033] 1. Frame; 2. Adsorption mechanism; 21. First vision camera; 3. Welding mechanism; 31. Second vision camera; 4. Feeding mechanism; 41. First storage unit; 42. First positioning unit; 5. Receiving mechanism; 51. Second storage unit; 511. Second lead screw driver; 512. Second hopper; 5121. Pallet support groove; 5122. Clearance hole; 52. Second positioning unit; 521. Second Y-axis mover; 522. Second moving seat; 5221. Upper baffle; 523. Second material support plate; 5231. Side plate; 524. Second top material cylinder; 525. Adsorption cylinder; 526. Transmission rod; 527. Mounting plate; 528. Suction cup; 53. Guide frame; 531. Photoelectric sensor; 9. Substrate tray. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0035] Example 1

[0036] Please see Figure 1-6 This utility model provides a technical solution: an automatic crystal oscillator IC bonding machine, comprising:

[0037] Rack 1;

[0038] Adsorption mechanism 2 is slidably connected to frame 1, and a first vision camera 21 is provided on one side of adsorption mechanism 2;

[0039] The welding mechanism 3 is slidably connected to the frame 1, and a second vision camera 31 is provided on one side of the welding mechanism 3;

[0040] The feeding mechanism 4 includes a first storage unit 41 and a first positioning unit 42. The first storage unit 41 is used to store IC chip trays.

[0041] The receiving mechanism 5 includes a second storage unit 51 and a second positioning unit 52. The second storage unit 51 includes a second lead screw driver 511 and a second hopper 512. The second hopper 512 is fixedly installed on the sliding seat of the second lead screw driver 511. A tray support groove 5121 is provided on one opposite side wall of the second hopper 512. The tray support groove 5121 is used to place the substrate tray 9.

[0042] The second positioning unit 52 includes a second Y-axis mover 521, a second moving seat 522, a second material support plate 523, and a second material lifting cylinder 524. The second moving seat 522 is mounted on the second Y-axis mover 521, the second material lifting cylinder 524 is disposed on the second moving seat 522, and the second material support plate 523 is disposed on the cylinder rod of the second material lifting cylinder 524. The position of the second material support plate 523 corresponds to the second hopper 512.

[0043] The feeding mechanism 4 and the receiving mechanism 5 have the same structure and operation mode, differing only in their purpose. In the feeding mechanism 4, the first storage unit 41 stores IC chip trays, and the first positioning unit 42 is used to pick up and place IC chip trays from the first storage unit 41. In the receiving mechanism 5, the second storage unit 51 stores substrate trays 9, and the second positioning unit 52 is used to pick up and place substrate trays 9 from the second storage unit 51.

[0044] When the IC automatic bonding machine is working, the feeding mechanism 4 automatically feeds IC chips and collects empty IC chip trays, and the receiving mechanism 5 automatically feeds the packaging substrate and collects the substrate tray 9 after bonding, effectively improving the crystal oscillator processing efficiency.

[0045] During the operation of the IC automatic bonding machine, the adsorption mechanism 2 adsorbs the IC chip and the packaging substrate for preliminary assembly. The first vision camera 21 monitors whether the IC chip is placed in place. The welding mechanism 3 monitors the welding quality of the IC chip and the packaging substrate through the second vision camera 31, effectively ensuring the processing quality of the crystal oscillator.

[0046] The second material support plate 523 has symmetrically arranged side plates 5231 on both sides. The side plates 5231 are slidably connected to the second movable seat 522 to ensure that the second material support plate 523 moves up and down smoothly.

[0047] The second movable seat 522 is provided with an upper baffle 5221, which restricts the substrate tray 9 from disengaging from the upper side of the second material support plate 523.

[0048] Working principle: When the IC automatic bonding machine is working, the IC chip tray in the first storage unit 41 is removed by the first positioning unit 42 and moved along the Y-axis to the bottom of the frame 1. The adsorption mechanism 2 moves along the x-axis to the IC chip tray, adsorbs the IC chip on it, and then moves along the x-axis to the second positioning unit 52 to place the IC chip on the packaging substrate of the substrate tray 9. The first vision camera 21 detects whether the IC chip is placed in place. Then, the welding mechanism 3 moves along the x-axis to the second positioning unit 52 to weld the IC chip to the packaging substrate. After the welding is completed, the welding quality is detected by the second vision camera 31.

[0049] After all the packaged substrates on the substrate tray 9 have been connected to the IC chips, the second support plate 523 moves on the second Y-axis mover 521 via the second moving seat 522. The second support plate 523 extends into the second hopper 512, and the cylinder rod of the second top-loading cylinder 524 retracts, driving the second support plate 523 downward to place the substrate tray 9 on the tray support groove 5121 of the second hopper 512. The second support plate 523 then retracts and detaches from the second hopper 512. Afterward, the second lead screw driver 511 drives the second hopper 512 upward, moving the substrate tray 9 without connected IC chips above the second support plate 523. The second support plate 523 then extends back into the second hopper 512, and the second top-loading cylinder 524 lifts and supports the substrate tray 9 without connected IC chips before removing it. The cooperation between the first storage unit 41 and the first positioning unit 42 in the feeding mechanism 4 is similar.

[0050] Example 2

[0051] Based on the above embodiments, this embodiment further improves upon the following technical solutions: a guide frame 53 is provided between the second storage unit 51 and the second positioning unit 52, a photoelectric sensor 531 is provided on one opposite side of the guide frame 53, and a clearance hole 5122 is provided on one opposite side wall of the second hopper 512. Several clearance holes 5122 are arranged equidistantly along the height direction of the second hopper 512, and one clearance hole 5122 corresponds to one pallet support groove 5121.

[0052] The photoelectric sensor 531 can pass through the clearance hole 5122 to identify whether there is a substrate tray 9 in the tray support groove 5121, so that the IC automatic bonding machine control system can determine the substrate tray 9 currently being processed, and adjust the height of the second hopper 512 to receive and feed the substrate tray 9.

[0053] Example 3

[0054] This embodiment further improves upon the above embodiment by providing the following technical solution: A suction cylinder 525 is installed below the second material support plate 523. The cylinder rod of the suction cylinder 525 is connected to a transmission rod 526, and the end of the transmission rod 526 is connected to a mounting plate 527. A suction cup 528 is installed on the mounting plate 527, and the suction cup 528 is used to adsorb the end face of the substrate tray 9. The end of the second material support plate 523 extends into the second material bin 512. The suction cup 528 adsorbs the substrate tray 9. After the second material support plate 523 moves upward and lifts the substrate tray 9, the suction cup 528, driven by the suction cylinder 525, simultaneously moves the substrate tray 9 to below the upper baffle 5221 on the surface of the second material support plate 523, fully positioning the substrate tray 9 and ensuring the quality of the IC chip and the packaging substrate soldering.

[0055] Specifically, the mounting plate 527 is equipped with two suction cups 528, which effectively ensures the firm adhesion of the substrate tray 9.

[0056] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A crystal IC automatic bonding machine characterized by comprising: Include: Frame; Suction mechanism, slidingly connected to the frame, one side of the suction mechanism is provided with a first visual camera; Welding mechanism, slidingly connected to the frame, one side of the welding mechanism is provided with a second visual camera; Feeding mechanism, including a first storage unit and a first positioning unit, the first storage unit is used for storing IC chip tray; Material receiving mechanism, including a second storage unit and a second positioning unit, the second storage unit includes a second lead screw driver and a second material bin, the second material bin is fixedly installed on the sliding seat of the second lead screw driver, a relative side wall of the second material bin is provided with a tray supporting groove, the tray supporting groove is used for placing a substrate tray; The second positioning unit includes a second Y-axis mover, a second moving seat, a second material supporting plate and a second material lifting cylinder, the second moving seat is installed on the second Y-axis mover, the second material lifting cylinder is arranged on the second moving seat, the second material supporting plate is arranged on the cylinder rod of the second material lifting cylinder, and the position of the second material supporting plate corresponds to the second material bin.

2. The crystal IC automatic bonding machine according to claim 1, wherein A guide frame is arranged between the second storage unit and the second positioning unit, one relative side of the guide frame is provided with a photoelectric sensor, a relative side wall of the second material bin is provided with an avoidance hole, a plurality of avoidance holes are equidistantly arranged along the height direction of the second material bin, and one avoidance hole corresponds to one tray supporting groove.

3. The crystal IC automatic bonding machine according to claim 1, wherein The second material supporting plate is provided with symmetrically arranged side plates on both sides, and the side plates are slidingly connected to the second moving seat.

4. The crystal IC automatic bonding machine according to claim 1, wherein The second moving seat is provided with an upper baffle.

5. The crystal IC automatic bonding machine according to claim 1, wherein A suction cylinder is arranged below the second material supporting plate, the cylinder rod of the suction cylinder is connected with a transmission rod, the end of the transmission rod is connected with a mounting plate, the mounting plate is provided with a suction cup, and the suction cup is used for sucking the end face of the substrate tray.

6. The crystal IC automatic bonding machine according to claim 5, wherein Two suction cups are arranged on the mounting plate.

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