High-density chip packaging solder ball positioning automatic supply equipment

Abstract

The utility model relates to the technical field of solder ball supply equipment, and discloses high-density chip packaging solder ball positioning automatic supply equipment, which comprises a bottom plate and a ball supply box, the upper side of the bottom plate is provided with a limiting strip, the upper side of the bottom plate is provided with a groove, the bottom side wall of the groove is provided with a positioning hole, the groove is internally provided with a solder ball template, and the solder ball template is provided with a positioning hole. And the solder ball template is provided with a ball inlet hole. When a chip is subjected to ball mounting, the solder ball template is replaced according to the position where the chip needs to be subjected to ball mounting, the solder ball template is positioned through the screw rod after the solder ball template is replaced, then the ball supply box is pulled in a reciprocating mode, the ball supply box slides along with the track of the limiting strip, and after a ball discharging opening in the bottom of the ball supply box passes through a ball inlet hole in the solder ball template, the ball supply box is driven to move back and forth. The solder balls fall into the ball inlet holes and the positioning holes in the grooves, the top ends of the solder balls and the openings in the upper portions of the ball inlet holes are located on the same horizontal plane, and in the process that the ball supply box continues to move, redundant solder balls are shoveled back into the ball supply box by the inclined blocks on the two sides of the ball discharging opening.

Description

Technical Field

[0001] This utility model relates to the technical field of solder ball supply equipment, specifically to an automatic supply equipment for positioning solder balls in high-density chip packaging. Background Technology

[0002] Solder ball positioning and feeding equipment is primarily used to precisely place tiny solder balls (usually tin balls or other metal alloy balls) onto the pads on a chip. This process requires extremely high precision and consistency to ensure that the chip can form a good electrical and mechanical connection during subsequent packaging and bonding processes.

[0003] Traditional solder ball feeding methods typically involve placing an orifice-shaped frame on a solder ball template, pouring a large number of solder balls into the frame, and then shaking the template to allow the solder balls to fall into the solder ball holes. Excess solder balls are then removed by tilting the template. However, in these methods, solder balls may still not enter the solder ball holes during the shaking process, and tilting the template may cause solder balls to detach from the holes. Therefore, those skilled in the art have provided an automated solder ball positioning and feeding device for high-density chip packaging to solve the problems mentioned in the background section. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an automatic feeding device for positioning solder balls in high-density chip packaging, which solves the problems of solder balls not entering the solder ball holes during the shaking process of the solder ball template and solder balls detaching from the solder ball holes due to the tilting of the solder ball template.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an automatic feeding device for positioning solder balls in high-density chip packaging, comprising a base plate and a ball supply box, the ball supply box being disposed above the base plate, a limit strip being installed on the upper side of the base plate, a groove being formed on the upper side of the base plate, a positioning hole being formed on the bottom side wall of the groove, a solder ball template being disposed in the groove, a ball inlet being formed on the solder ball template, a screw being rotatably engaged at one end of the solder ball template, a lower ball outlet being formed at the bottom of the ball supply box, and inclined blocks being disposed on the front and rear sides of the lower ball outlet.

[0008] Preferably, the solder ball template is slidably inserted into the base plate through a groove, and the end of the limiting strip is provided with a screw hole. The screw is threadedly connected to the screw hole. When placing solder balls on the chip, the solder ball template is changed according to the required placement position of the solder balls on the chip. After changing the solder ball template, the solder ball template is positioned by the screw.

[0009] Preferably, a handle is installed on the top of the ball supply box, and sliding grooves are provided on the left and right sides of the bottom of the ball supply box. The sliding grooves are slidably engaged with the limiting strip. When in use, the ball supply box is pulled, and the ball supply box slides along the track of the limiting strip. When the lower ball inlet at the bottom of the ball supply box passes through the ball inlet hole on the welding ball template, the welding ball falls into the ball inlet hole.

[0010] Preferably, the ball inlet and the positioning hole are vertically aligned. When the lower ball inlet at the bottom of the ball supply box passes through the ball inlet on the ball template, the ball falls into the ball inlet and the positioning hole in the groove.

[0011] Preferably, the inclined blocks are arranged opposite each other, and after the welding ball falls into the ball inlet hole and the positioning hole in the groove, the top of the welding ball and the opening at the top of the ball inlet hole are at the same horizontal plane. As the ball supply box continues to move, the excess welding ball is scooped back into the ball supply box by the inclined blocks on both sides of the lower ball inlet.

[0012] (III) Beneficial Effects

[0013] Compared with the prior art, this utility model provides an automatic feeding device for positioning solder balls in high-density chip packaging, which has the following advantages:

[0014] Through design, the automatic solder ball positioning and supply device in this utility model consists of a base plate, a solder ball template, and a ball supply box. When placing solder balls on a chip, the solder ball template is changed according to the required placement position of the solder balls on the chip. After changing the solder ball template, the template is positioned by a screw. Then, the ball supply box is pulled back and forth, and slides along the track of the limit strip. When the lower ball inlet at the bottom of the ball supply box passes the ball inlet hole on the solder ball template, the solder ball falls into the ball inlet hole and the positioning hole in the groove. At this time, the top of the solder ball and the opening at the top of the ball inlet hole are at the same level. As the ball supply box continues to move, excess solder balls are scooped back into the ball supply box by the inclined blocks on both sides of the lower ball inlet. This ball supply structure can automatically fill the solder ball holes on the soldering board through the reciprocating movement of the ball supply box, and avoid the problem of missing solder balls caused by the need to tilt the solder ball template to collect solder balls. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an automatic feeding device for positioning solder balls in high-density chip packaging, provided in an embodiment of this application.

[0016] Figure 2 This is a structural schematic diagram of an automatic feeding device for positioning solder balls in a high-density chip packaging according to an embodiment of this application.

[0017] Figure 3 This is a structural schematic diagram of an automatic feeding device for positioning solder balls in a high-density chip packaging according to an embodiment of this application.

[0018] In the diagram: 1. Base plate; 2. Limiting strip; 201. Screw hole; 3. Groove; 301. Positioning hole; 4. Welding ball template; 401. Ball inlet hole; 5. Screw; 6. Ball supply box; 601. Slide groove; 602. Lower ball inlet; 603. Inclined block; 7. Handle. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] This utility model provides a technical solution: an automatic feeding device for positioning solder balls in high-density chip packaging. Please refer to [link to relevant documentation]. Figure 1 , Figure 2 , Figure 3 The device includes a base plate 1 and a ball supply box 6. The ball supply box 6 is located above the base plate 1. A limit strip 2 is installed on the upper side of the base plate 1. A groove 3 is opened on the upper side of the base plate 1. A positioning hole 301 is opened on the bottom side wall of the groove 3. A welding ball template 4 is set in the groove 3. A ball inlet hole 401 is opened on the welding ball template 4. A screw 5 is rotatably engaged at one end of the welding ball template 4. A lower ball outlet 602 is opened at the bottom of the ball supply box 6. Inclined blocks 603 are set on the front and rear sides of the lower ball outlet 602.

[0021] Please see Figure 1 , Figure 2 , Figure 3The solder ball template 4 is slidably inserted into the base plate 1 via the groove 3. The end of the limiting strip 2 has a screw hole 201, and the screw 5 is threaded into the screw hole 201. When placing solder balls on the chip, the solder ball template 4 is changed according to the required placement position of the solder balls on the chip. After changing the solder ball template 4, it is positioned by the screw 5. The top of the ball supply box 6 is equipped with a handle 7, and the bottom left and right sides of the ball supply box 6 have sliding grooves 601. The sliding grooves 601 are slidably engaged with the limiting strip 2. In use, the ball supply box 6 is pulled, and the ball supply box 6 slides along the track of the limiting strip 2. When the lower ball inlet 602 at the bottom of the ball supply box 6 passes the solder ball template... After the ball enters through the ball inlet 401 on plate 4, the solder ball falls into the ball inlet 401. The ball inlet 401 is vertically aligned with the positioning hole 301. When the lower ball inlet 602 at the bottom of the ball supply box 6 passes through the ball inlet 401 on the ball template 4, the solder ball falls into the ball inlet 401 and the positioning hole 301 in the groove 3. The tilting blocks 603 are relatively arranged, and after the solder ball falls into the ball inlet 401 and the positioning hole 301 in the groove 3, the top of the solder ball is at the same level as the opening at the top of the ball inlet 401. As the ball supply box 6 continues to move, the excess solder ball is scooped back into the ball supply box 6 by the tilting blocks 603 on both sides of the lower ball inlet 602.

[0022] The automatic solder ball positioning and supply device in this utility model consists of a base plate 1, a solder ball template 4, and a ball supply box 6. A limit strip 2 is installed on the upper side of the base plate 1, and grooves 3 are provided at both ends of the base plate 1. Positioning holes 301 are provided on the bottom sidewall of the grooves 3. The solder ball template 4 is slidably inserted into the base plate 1 through the grooves 3. After the solder ball template 4 is inserted and engaged with the grooves 3, the bolt that is rotated and locked in one end of the solder ball template 4 is threadedly connected to the screw hole 201 at the end of the limit strip 2, thereby fixing the solder ball template 4. The solder ball template 4 is provided with ball inlet holes 401 with the same inner diameter as the positioning holes 301, and the distribution of the ball inlet holes 401 corresponds to the chip position where the balls are to be placed. The solder ball template 4 can be replaced according to the chip model.

[0023] The ball supply box 6 is located in the upper middle part of the base plate 1. The bottom side of the ball supply box 6 is attached to the upper side wall of the base plate 1. The bottom end of the ball supply box 6 is provided with sliding grooves 601 on both sides. Through the sliding grooves 601, the ball supply box 6 is slidably engaged with the limiting strip 2 on the base plate 1. The bottom of the ball supply box 6 is provided with a lower ball hole, and the lower ball hole is provided with inclined blocks 603 on both sides. The inclined blocks 603 are fixedly installed with the bottom inner wall of the ball supply box 6. A handle 7 is installed on the top of the ball supply box 6 for moving the ball supply box 6.

[0024] When placing solder balls on the chip, the solder ball template 4 is replaced according to the required placement position of the solder balls on the chip. After replacing the solder ball template 4, the solder ball template 4 is positioned by the screw 5. Then, the ball supply box 6 is pulled, and the ball supply box 6 slides along the track of the limit bar 2. When the lower ball inlet 602 at the bottom of the ball supply box 6 passes the ball inlet hole 401 on the solder ball template 4, the solder ball falls into the ball inlet hole 401 and the positioning hole 301 in the groove 3. At this time, the top of the solder ball is at the same level as the opening at the top of the ball inlet hole 401. As the ball supply box 6 continues to move, the excess solder balls are scooped back into the ball supply box 6 by the inclined blocks 603 on both sides of the lower ball inlet 602, so as to avoid excess solder balls remaining on the solder ball template 4, which would cause the problem of multiple solder balls sticking together during the placement of the balls.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] In this document, unless otherwise expressly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise expressly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-density chip package solder ball positioning and automatic feeding apparatus comprising a base plate (1) and a ball feeder box (6) disposed above the base plate (1), characterized in that: The bottom plate (1) is provided with a limiting strip (2) on the upper side, the upper side of the bottom plate (1) is provided with a groove (3), the bottom side wall of the groove (3) is provided with a positioning hole (301), the groove (3) is provided with a solder ball template (4), the solder ball template (4) is provided with a ball inlet hole (401), one end of the solder ball template (4) is rotatably connected with a screw rod (5), the bottom of the ball supply box (6) is provided with a lower ball outlet (602), the front and rear sides of the lower ball outlet (602) are provided with inclined blocks (603).

2. The apparatus according to claim 1, wherein: the solder ball supply device is a high-density chip package solder ball positioning automatic supply device. The top of the ball supply box (6) is provided with a handle (7), the bottom of the ball supply box (6) is provided with a sliding groove (601) on the left and right sides, and the sliding groove (601) is slidably connected with the limiting strip (2).

3. The apparatus of claim 1, wherein: the apparatus further comprises a ball supply device for supplying the solder balls to the ball placement head. The inclined blocks (603) are oppositely arranged.

4. The high-density chip packaging solder ball positioning automatic feeding device according to claim 1, characterized in that: The solder ball template (4) is slidably connected with the bottom plate (1) through the groove (3).

5. The high-density chip packaging solder ball positioning automatic feeding device according to claim 1, characterized in that: The end of the limiting strip (2) is provided with a screw hole (201), and the screw rod (5) is threadedly connected with the screw hole (201).

6. The high-density chip packaging solder ball positioning automatic feeding device according to claim 1, characterized in that: The ball inlet hole (401) is vertically aligned with the positioning hole (301).

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