Ejector pin system and patch packaging equipment

Abstract

The utility model discloses an ejector pin system and patch packaging equipment, and relates to the technical field of semiconductor equipment. The ejector pin system comprises an ejector pin seat shell, a cooling shell, a jacking mechanism, an ejector pin cap and an ejector pin, a negative pressure channel is formed between the ejector pin seat shell and the cooling shell, an ejector pin hole is formed in the ejector pin cap, and the ejector pin hole is communicated with a negative pressure device through the negative pressure channel; the side, attached with the blue film, of the chip is arranged on the ejector pin cap, the ejector pin hole adsorbs the blue film under the action of negative pressure provided by the negative pressure device, the jacking mechanism moves relative to the ejector pin base shell and drives the ejector pin to penetrate through the ejector pin hole to jack up the blue film so that the chip can be separated from the blue film, and a cooling channel is formed between the cooling shell and the jacking mechanism. And the cooling medium is introduced into the cooling channel so as to cool the interior of the ejector pin seat shell. The ejector pin system can solve the problem that the blue film on the back surface of the chip is softened due to overheating of the existing jacking mechanism, so that the chip is difficult to separate from the blue film.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a pin system and a surface mount packaging device. Background Technology

[0002] With the rapid development of the semiconductor industry, surface mount packaging equipment commonly uses a method where ejector pins lift the blue film to separate the chip from the blue film during chip separation. The blue film around the ejector pin is then adsorbed through vacuum holes in the pin cap, thus achieving chip separation. However, in traditional chip-blue film separation operations, the air inside the lifting mechanism is compressed during lifting, which can easily lead to overheating. This overheating softens the blue film on the back of the chip, causing the chip and blue film to become adhesive. This results in a small separation angle for the ejector pins, making separation difficult. Utility Model Content

[0003] The purpose of this application is to provide a pin system and a surface mount packaging device that can solve the problem that overheating of the existing lifting mechanism causes the blue film on the back of the chip to soften, making it difficult to separate the chip from the blue film.

[0004] The embodiments of this application are implemented as follows:

[0005] A first aspect of this application provides a ejector pin system, including an ejector pin housing, a cooling shell sleeved inside the ejector pin housing, a lifting mechanism movably disposed inside the cooling shell, an ejector pin cap fixedly disposed on the top of the ejector pin housing, and an ejector pin fixedly disposed on the top of the lifting mechanism. A negative pressure channel is formed between the ejector pin housing and the cooling shell. The ejector pin cap has an ejector pin hole, which communicates with a negative pressure device through the negative pressure channel. The side of the chip with a blue film attached is disposed on the ejector pin cap. Under the negative pressure provided by the negative pressure device, the ejector pin hole adsorbs the blue film. The lifting mechanism moves relative to the ejector pin housing, causing the ejector pin to pass through the ejector pin hole and lift the blue film, thereby separating the chip from the blue film. A cooling channel is formed between the cooling shell and the lifting mechanism, and a cooling medium is introduced into the cooling channel to cool the interior of the ejector pin housing. This ejector pin system can solve the problem that overheating of existing lifting mechanisms causes the blue film on the back of the chip to soften, making it difficult to separate the chip from the blue film.

[0006] As one possible implementation, the longitudinal cross-sectional shape of the cooling shell is stepped, and the stepped shape includes at least one step structure.

[0007] As one possible implementation, the stepped shape tends to gradually shrink along the lifting direction of the lifting mechanism.

[0008] In one possible implementation, the cooling shell is provided with cooling holes, and the cooling channel is connected to the cooling medium supply device through the cooling holes, so that the cooling medium provided by the cooling medium supply device enters the cooling channel through the cooling holes.

[0009] In one possible implementation, the number of cooling holes is at least one, and when the number of cooling holes is multiple, the multiple cooling holes are evenly distributed along the bottom of the cooling shell.

[0010] In one possible implementation, the cooling medium is a gas.

[0011] As one possible implementation, a vacuum hole is provided at the bottom of the ejector seat housing, and the negative pressure channel is connected to the negative pressure device through the vacuum hole, so that the negative pressure airflow provided by the negative pressure device can enter the negative pressure channel through the vacuum hole.

[0012] As one possible implementation, the bottom of the ejector pin housing is provided with an ejector pin storage hole for accommodating ejector pins.

[0013] In one possible implementation, the top of the lifting mechanism is provided with a fixing hole, and the bottom of the ejector pin is provided with a mounting hole. Fasteners are sequentially inserted into the fixing hole and the mounting hole so that the ejector pin is fixedly installed on the lifting mechanism.

[0014] A second aspect of this application provides a surface mount packaging (SMT) apparatus, including a machine base, a vacuum device, a drive device, a cooling medium supply device, and the aforementioned ejector pin system, all mounted on the machine base. The ejector pin system's ejector pin housing is fixedly mounted on the machine base. The negative pressure channel of the ejector pin system is connected to the vacuum device. The lifting mechanism of the ejector pin system is drively connected to the drive device. The cooling channel of the ejector pin system is connected to the cooling medium supply device. This ejector pin system can solve the problem of overheating in existing lifting mechanisms causing softening of the blue film on the back of the chip, making it difficult to separate the chip from the blue film.

[0015] The beneficial effects of the embodiments of this application include:

[0016] The ejector pin system includes an ejector pin housing, a cooling shell fitted inside the ejector pin housing, a lifting mechanism movably disposed inside the cooling shell, an ejector pin cap fixedly disposed on the top of the ejector pin housing, and an ejector pin fixedly disposed on the top of the lifting mechanism. A negative pressure channel is formed between the ejector pin housing and the cooling shell. The ejector pin cap has an ejector pin hole, which is connected to a negative pressure device through the negative pressure channel. The side of the chip with the blue film attached is disposed on the ejector pin cap. Under the negative pressure provided by the negative pressure device, the blue film is adsorbed by the ejector pin hole. The lifting mechanism moves relative to the ejector pin housing, causing the ejector pin to pass through the ejector pin hole and lift the blue film, thereby separating the chip from the blue film. A cooling channel is formed between the cooling shell and the lifting mechanism. A cooling medium is introduced into the cooling channel to cool the interior of the ejector pin housing. The ejector pin system provided in this application effectively reduces the temperature of the lifting mechanism by introducing a cooling medium through the cooling channel, avoiding the problem of the blue film softening due to overheating and ensuring that the chip and the blue film can be separated smoothly. By avoiding separation difficulties caused by blue film softening, and reducing time wasted due to separation operation disruptions, the chip pick-and-place process becomes more efficient. In mass production, this significantly improves overall production efficiency and reduces production costs. Furthermore, a stable chip-blue film separation process helps reduce chip damage and improve product yield. Overheating can affect chip performance; the ejector pin system provided in this application effectively prevents this from happening, ensuring chip quality and performance. Cooling the inside of the ejector pin housing reduces the probability of system failure due to overheating, extending the system's lifespan. Simultaneously, a stable operating temperature helps ensure the normal operation of all system components, improving the overall reliability and stability of the ejector pin system. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of the ejector pin system provided in the embodiments of this application;

[0019] Figure 2 This is a second schematic diagram of the structure of the ejector pin system provided in the embodiments of this application;

[0020] Figure 3 This is the third schematic diagram of the structure of the ejector pin system provided in the embodiments of this application.

[0021] Icons: 100-Ejector system; 10-Ejector seat housing; 11-Vacuum hole; 12-Ejector storage hole; 20-Cooling shell; 21-Cooling hole; 30-Lifting mechanism; 31-Fastener; 32-Fixing groove; 40-Ejector cap; 41-Ejector hole; 50-Ejector; 60-Negative pressure channel; 70-Cooling channel; 200-Blue film; 300-Chip. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0023] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "horizontal," "vertical," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. The terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] Please refer to the reference. Figures 1 to 3This application provides an ejector pin system 100, including an ejector pin housing 10, a cooling shell 20 sleeved inside the ejector pin housing 10, a lifting mechanism 30 movably disposed inside the cooling shell 20, an ejector pin cap 40 fixedly disposed on the top of the ejector pin housing 10, and an ejector pin 50 fixedly disposed on the top of the lifting mechanism 30. A negative pressure channel 60 is formed between the ejector pin housing 10 and the cooling shell 20. The ejector pin cap 40 is provided with an ejector pin hole 41, which is connected to the negative pressure channel 60 through a negative pressure channel. The device is connected; the side of the chip 300 with the blue film 200 attached is positioned on the ejector cap 40. Under the negative pressure provided by the negative pressure device, the ejector hole 41 adsorbs the blue film 200. The lifting mechanism 30 moves relative to the ejector seat housing 10, causing the ejector pin 50 to pass through the ejector hole 41 and lift the blue film 200, thus separating the chip 300 from the blue film 200. A cooling channel 70 is formed between the cooling shell 20 and the lifting mechanism 30, and a cooling medium is introduced into the cooling channel 70 to cool the interior of the ejector seat housing 10. This ejector system 100 can solve the problem of overheating of the existing lifting mechanism 30 causing the blue film 200 on the back of the chip 300 to soften, making it difficult to separate the chip 300 from the blue film 200.

[0026] It should be noted that, as Figures 1 to 3 As shown, in this embodiment, the ejector system 100 includes an ejector seat housing 10, a cooling shell 20, a lifting mechanism 30, an ejector cap 40, and ejector pins 50. The ejector seat housing 10 serves as the external support structure for the entire ejector system 100, protecting the internal components and forming a negative pressure channel 60 with the cooling shell 20. The cooling shell 20 is fitted inside the ejector seat housing 10, forming the negative pressure channel 60 together with the ejector seat housing 10 and a cooling channel 70 with the lifting mechanism 30, thus providing conditions for the system's cooling function. The lifting mechanism 30... The movable part is located inside the cooling shell 20 and can move relative to the ejector pin housing 10. The main function of the lifting mechanism 30 is to drive the ejector pin 50 to move and lift the blue film 200. The ejector pin cap 40 is fixedly installed on the top of the ejector pin housing 10. The ejector pin cap 40 has an ejector pin hole 41, which is the channel through which the ejector pin 50 passes. At the same time, it plays an adsorption role on the blue film 200 under negative pressure. The ejector pin 50 is fixedly installed on the top of the lifting mechanism 30. When the lifting mechanism 30 moves, the ejector pin 50 will pass through the ejector pin hole 41 on the ejector pin cap 40, thereby lifting the blue film 200.

[0027] The negative pressure channel 60 formed between the ejector pin housing 10 and the cooling housing 20, through communication with a negative pressure device, generates negative pressure in the ejector pin hole 41 on the ejector pin cap 40. When the side of the chip 300 with the blue film 200 attached is placed on the ejector pin cap 40, the ejector pin hole 41 adsorbs the blue film 200 under the action of negative pressure, fixing the blue film 200 to the ejector pin cap 40 and ensuring the stability of the chip 300 in the subsequent separation process. The lifting mechanism 30 moves relative to the ejector pin housing 10, driving the ejector pin 50 to pass through the ejector pin hole 41 and lift the blue film 200. Since the blue film 200 is adsorbed and fixed, the lifting force of the ejector pin 50 will separate the chip 300 from the blue film 200, completing the chip 300 pick-up and drop operation. A cooling channel 70 is formed between the cooling housing 20 and the lifting mechanism 30, and the cooling medium is introduced into the cooling channel 70. During the operation of the ejector system 100, the lifting mechanism 30 generates heat. The cooling medium flows in the cooling channel 70 and carries away the heat through heat exchange, thereby cooling the inside of the ejector seat housing 10 and preventing the lifting mechanism 30 from overheating.

[0028] The existing lifting mechanism 30 easily generates a large amount of heat during operation, causing the blue film 200 on the back of the chip 300 to soften. The softened blue film 200 adheres tightly to the chip 300, making separation difficult and affecting production efficiency and product quality. To solve this problem, this application provides a ejector pin system 100 that introduces a cooling medium through a cooling channel 70, effectively reducing the temperature of the lifting mechanism 30 and preventing the blue film 200 from softening due to overheating. This ensures smooth separation of the chip 300 and the blue film 200. By avoiding the separation difficulties caused by the softening of the blue film 200, and reducing time wasted due to inefficient separation operations, the chip 300 handling process becomes more efficient. In large-scale production, this can significantly improve overall production efficiency and reduce production costs. Furthermore, a stable separation process between the chip 300 and the blue film 200 helps reduce damage to the chip 300 and improve product yield. Overheating can affect the performance of the chip 300, but the cooling function of the ejector pin system 100 provided in this application can effectively prevent this from happening, ensuring the quality and performance of the chip 300. By cooling the inside of the ejector pin housing 10, the probability of system failure due to overheating is reduced, extending the system's service life. At the same time, a stable operating temperature also helps ensure the normal operation of all components of the system, improving the reliability and stability of the entire ejector pin system 100.

[0029] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, the longitudinal cross-sectional shape of the cooling shell 20 is stepped, and the stepped shape includes at least one step structure.

[0030] It should be noted that, as Figure 1 and Figure 3 As shown, in this embodiment, the cooling shell 20, viewed in longitudinal cross-section, exhibits a step-like shape. This can be understood as being composed of multiple cylinders or other shaped parts of different diameters stacked in a specific order, with adjacent parts transitioning through steps. For example, the upper part might have a smaller diameter, the lower part a larger diameter, and the sections connected by one or more steps, forming a stepped appearance.

[0031] The stepped shape increases the contact area between the cooling shell 20 and the cooling medium. As the cooling medium flows within the cooling channel 70, it makes full contact with each surface of the stepped structure, more effectively absorbing the heat generated by the lifting mechanism 30, improving cooling efficiency, better maintaining the operating temperature of the lifting mechanism 30, and further preventing softening of the blue film 200 on the back of the chip 300. Furthermore, the stepped structure can guide the flow of the cooling medium. As the cooling medium flows within the cooling channel 70, it forms a specific flow field along the shape of the steps. This flow field distribution helps to distribute the cooling medium more evenly within the cooling channel 70, avoiding localized overheating or uneven cooling, thereby improving the consistency of the overall cooling effect.

[0032] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, the stepped shape has a gradually shrinking tendency along the lifting direction of the lifting mechanism 30.

[0033] It should be noted that, as Figure 1 and Figure 3 As shown, in this embodiment, the stepped shape gradually contracts along the lifting direction of the lifting mechanism 30, meaning that the diameter or size of the cooling shell 20 gradually decreases from bottom to top in the longitudinal direction. The lifting mechanism 30 performs lifting movements inside the cooling shell 20, and the contracting shape of the cooling shell 20 can be designed differently according to the working state and heat dissipation requirements of the lifting mechanism 30 at different positions. For example, at the bottom of the lifting mechanism 30, since it may be connected to a power source or other components that generate a lot of heat, a larger space is needed to arrange the cooling channel 70 and allow the cooling medium to circulate and dissipate heat better; while as the lifting direction goes upward, some components of the lifting mechanism 30 may generate relatively less heat, or the structure may not require a large space. At this time, the diameter of the cooling shell 20 gradually contracts, which satisfies the heat dissipation requirements without wasting space.

[0034] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, the cooling shell 20 is provided with cooling holes 21, and the cooling channel 70 is connected to the cooling medium supply device through the cooling holes 21, so that the cooling medium provided by the cooling medium supply device enters the cooling channel 70 through the cooling holes 21.

[0035] It should be noted that, as Figure 1 and Figure 3 As shown, in this embodiment, the cooling holes 21 provided on the cooling shell 20 are the key channels connecting the cooling channel 70 and the cooling medium supply device. The cooling medium supply device is a device specifically designed to provide cooling media (such as coolant, cooling gas, etc.), and it can generate and deliver cooling media with a certain pressure and flow rate. The cooling channel 70 is the space located between the cooling shell 20 and the lifting mechanism 30. The cooling medium flows in this channel and carries away the heat generated by the lifting mechanism 30 through heat exchange. The cooling holes 21 act as a "bridge," connecting the cooling medium supply device and the cooling channel 70, allowing the cooling medium to smoothly enter the cooling channel 70 from the supply device.

[0036] When the cooling medium supply device is activated, the cooling medium is pressurized inside the device and then transported through pipes to the cooling holes 21 of the cooling shell 20. Since the cooling holes 21 are connected to the cooling channel 70, the pressurized cooling medium flows into the cooling channel 70 through the cooling holes 21. Inside the cooling channel 70, the cooling medium comes into full contact with the surface of the lifting mechanism 30, absorbing the heat generated by the lifting mechanism 30 and thus cooling it. Afterwards, the cooled medium, having absorbed heat, flows out from the other end of the cooling channel 70, and may return to the cooling medium supply device for further cooling and recycling.

[0037] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, the number of cooling holes 21 is at least one. When the number of cooling holes 21 is multiple, the multiple cooling holes 21 are evenly distributed along the bottom of the cooling shell 20.

[0038] It should be noted that, as Figure 1 and Figure 3 As shown, in this embodiment, the flow rate and velocity of the cooling medium can be adjusted by modifying the size, number, and distribution of the cooling holes 21, thereby achieving precise control of the cooling effect. For example, if it is necessary to enhance the cooling effect, the number of cooling holes 21 or the diameter of the cooling holes 21 can be increased, allowing more cooling medium to quickly enter the cooling channel 70; conversely, if it is necessary to reduce the cooling intensity, the number of cooling holes 21 or the diameter of the cooling holes 21 can be reduced. This adjustability allows the ejector pin system 100 to flexibly adjust the cooling effect according to different working environments and process requirements, improving the system's adaptability and stability.

[0039] When there are multiple cooling holes 21, they are evenly distributed along the bottom of the cooling shell 20. Multiple cooling holes 21 ensure that the cooling medium is evenly distributed within the cooling channel 70. A well-designed distribution of the cooling holes 21 ensures that the cooling medium, after entering the cooling channel 70, can quickly cover all parts of the lifting mechanism 30, avoiding cooling dead zones. This allows the cooling medium to fully contact the lifting mechanism 30, improving heat exchange efficiency and removing heat more quickly, thereby more effectively reducing the temperature of the lifting mechanism 30 and ensuring the smooth separation of the chip 300 from the blue film 200.

[0040] As one possible implementation method, the cooling medium is gas.

[0041] It should be noted that in the ejector system 100, gas is selected as the cooling medium. Typically, the gas is pressurized by a cooling medium supply device and then introduced into the cooling channel 70 between the cooling shell 20 and the lifting mechanism 30 through the cooling holes 21. The gas flows within the cooling channel 70, exchanging heat with the heated surface of the lifting mechanism 30. Because the gas temperature is lower than the temperature of the lifting mechanism 30, heat is transferred from the lifting mechanism 30 to the gas, lowering the temperature of the lifting mechanism 30. The gas that has absorbed heat is then discharged from the outlet of the cooling channel 70, completing one cooling cycle. Common gases used for cooling include air and nitrogen, which have good fluidity and heat transfer properties, effectively carrying away heat.

[0042] Gases have lower density and higher specific heat capacity, enabling them to quickly absorb and carry away heat. Compared to liquid cooling media, gases can absorb more heat per volume, thus more effectively reducing the temperature of the lifting mechanism 30. This prevents the blue film 200 on the back of the chip 300 from softening due to overheating, ensuring smooth separation of the chip 300 from the blue film 200. Using liquids as cooling media carries the risk of leakage, which could damage the ejector pin system 100 and surrounding equipment. Gases as cooling media eliminate this problem, improving system reliability and stability and reducing maintenance costs and downtime caused by liquid leaks.

[0043] The circulation of gas in the cooling system is relatively simple, requiring no complex piping and pump systems. Furthermore, the exhausted gas can be directly discharged into the atmosphere, eliminating the need for specialized recovery and treatment like liquid cooling media, thus reducing the operating costs and complexity of the cooling system. Gas cooling media generally have strong environmental adaptability, maintaining good cooling performance in both high and low temperature environments. Simultaneously, unlike some liquid cooling media, gas cooling media are not affected by freezing or solidification, enabling stable operation over a wider temperature range and expanding the applicability of the ejector pin system 100.

[0044] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, a vacuum hole 11 is provided at the bottom of the ejector seat housing 10, and the negative pressure channel 60 is connected to the negative pressure device through the vacuum hole 11, so that the negative pressure airflow provided by the negative pressure device can be introduced into the negative pressure channel 60 through the vacuum hole 11.

[0045] It should be noted that, as Figure 1 and Figure 3 As shown, in this embodiment, the vacuum hole 11 at the bottom of the ejector seat housing 10 serves as the connection channel between the negative pressure channel 60 and the negative pressure device. A negative pressure device is a device capable of generating a pressure environment below atmospheric pressure, such as a vacuum pump. The negative pressure channel 60 is the space located between the ejector seat housing 10 and the cooling shell 20. When the negative pressure device is activated, it creates a negative pressure area within itself, which connects to the vacuum hole 11 at the bottom of the ejector seat housing 10 via a pipe, thus forming a connected system with the negative pressure channel 60.

[0046] After the negative pressure device starts working, its internal pressure decreases, creating a negative pressure. Due to the pressure difference, air flows from the area of ​​higher pressure to the negative pressure device where the pressure is lower. In the ejector pin system 100, outside air (the air pressure at the ejector pin cap 40 is relatively higher for the entire system) first enters the ejector pin hole 41 on the ejector pin cap 40, then flows into the negative pressure channel 60 through the ejector pin hole 41, and then flows from the vacuum hole 11 to the negative pressure device through the negative pressure channel 60. This forms a negative pressure airflow channel from the ejector pin cap 40 to the negative pressure device, enabling negative pressure adsorption to be generated at the ejector pin hole 41.

[0047] By providing a vacuum hole 11 at the bottom of the ejector housing 10 and connecting it to a negative pressure device, a stable and sufficiently strong negative pressure can be ensured at the ejector hole 41 of the ejector cap 40. When the side of the chip 300 with the blue film 200 attached is placed on the ejector cap 40, the negative pressure at the ejector hole 41 can firmly attract the blue film 200, making the blue film 200 tightly adhere to the ejector cap 40. During the process of the lifting mechanism 30 driving the ejector 50 through the ejector hole 41 to lift the blue film 200, the stable adsorption force can prevent the blue film 200 from shifting or shaking, ensuring that the chip 300 and the blue film 200 can be accurately and smoothly separated, improving the success rate and accuracy of the separation operation.

[0048] As one possible implementation method, such as Figure 1 and Figure 3 As shown, in this embodiment, the bottom of the ejector pin housing 10 is provided with an ejector pin storage hole 12, which is used to accommodate the ejector pin 50.

[0049] It should be noted that, as Figure 1 and Figure 3As shown, in this embodiment, the bottom of the ejector pin housing 10 is provided with an ejector pin storage hole 12. The ejector pin storage hole 12 is used to accommodate ejector pins 50. The size and shape of the ejector pin storage hole 12 match the ejector pin 50, and it is usually cylindrical or has a shape adapted to the shape of the ejector pin 50 so that the ejector pin 50 can be accurately inserted into it. When the ejector pin system 100 is not working, the ejector pin 50 can be placed in the storage hole to achieve orderly storage and positioning of the ejector pin 50, avoid collisions and friction between the ejector pin 50 and external objects, thereby preventing damage to the tip of the ejector pin 50 or deformation of the ejector pin 50 body. This helps to maintain the accuracy and performance of the ejector pin 50, extend its service life, reduce the frequency of replacement due to ejector pin 50 damage, and reduce maintenance costs. In addition, ejector pins 50 of different sizes and models can be stored in the ejector pin storage hole 12 to improve the applicability of the system.

[0050] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, the top of the lifting mechanism 30 is provided with a fixing hole, the bottom of the ejector pin 50 is provided with an installation hole, and the fastener 31 is sequentially inserted into the fixing hole and the installation hole so that the ejector pin 50 is fixedly installed on the lifting mechanism 30.

[0051] It should be noted that, as Figure 1 and Figure 2 As shown, in this embodiment, fixing holes are machined on the top of the lifting mechanism 30. The position and number of these fixing holes are determined according to the installation requirements of the ejector pin 50. Similarly, mounting holes are also provided at the bottom of the ejector pin 50, and their position and size correspond to the fixing holes on the lifting mechanism 30. During installation, fasteners 31 (such as bolts, screws, etc.) are first passed through the fixing holes on the top of the lifting mechanism 30, and then inserted into the mounting holes at the bottom of the ejector pin 50. By tightening the fasteners 31, the lifting mechanism 30 and the ejector pin 50 are tightly connected together, thereby fixing the ejector pin 50 on the lifting mechanism 30. This installation method ensures the accurate position of the ejector pin 50 on the lifting mechanism 30 and can withstand the force generated during the lifting process, ensuring a stable and reliable connection between the ejector pin 50 and the lifting mechanism 30.

[0052] The connection method using fasteners 31 passing through the fixing holes and mounting holes provides strong connection force, ensuring a very stable installation of the ejector pin 50 on the lifting mechanism 30. Even under significant pressure and impact during operation of the lifting mechanism 30, the ejector pin 50 is not prone to loosening or falling off, thus guaranteeing the stability and reliability of the ejector pin system 100 and improving the success rate and consistency of the separation process between the chip 300 and the blue film 200.

[0053] This application also provides a surface mount packaging device, including a machine base, a vacuum device, a drive device, a cooling medium supply device, and the aforementioned ejector pin system 100, all mounted on the machine base. The ejector pin seat housing 10 of the ejector pin system 100 is fixedly mounted on the machine base. The negative pressure channel 60 of the ejector pin system 100 is connected to the vacuum device. The lifting mechanism 30 of the ejector pin system 100 is connected to the drive device via a fixing groove 32. The cooling channel 70 of the ejector pin system 100 is connected to the cooling medium supply device. Since the structure and beneficial effects of the ejector pin system 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0054] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0055] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A system of ejector pins, characterized in that, The top pin seat shell and the cooling shell form a negative pressure channel therebetween, and the top pin cap is provided with a top pin hole which communicates with a negative pressure device through the negative pressure channel. The side of the chip attached with the blue film is arranged on the top pin cap, the top pin hole adsorbs the blue film under the action of negative pressure provided by the negative pressure device, the top lifting mechanism moves relative to the top pin seat shell, drives the top pin to pass through the top pin hole to lift the blue film, so that the chip is separated from the blue film, and the cooling shell and the top lifting mechanism form a cooling channel, and a cooling medium is introduced into the cooling channel to cool the inside of the top pin seat shell.

2. The system of claim 1, wherein, The longitudinal section shape of the cooling shell is in a stepped shape, and the stepped shape includes at least one step structure.

3. The system of claim 2, wherein, The stepped shape has a gradually shrinking trend along the lifting direction of the top lifting mechanism.

4. The pim system of claim 1, wherein, The cooling shell is provided with a cooling hole, and the cooling channel communicates with a cooling medium supply device through the cooling hole, so that the cooling medium provided by the cooling medium supply device is introduced into the cooling channel through the cooling hole.

5. The system of claim 4, wherein, The number of the cooling holes is at least one, and when the number of the cooling holes is multiple, the multiple cooling holes are uniformly distributed along the bottom of the cooling shell.

6. The pim system of claim 1, wherein, The cooling medium is a gas.

7. The system of claim 1, wherein, The bottom of the top pin seat shell is provided with a vacuum hole, and the negative pressure channel communicates with the negative pressure device through the vacuum hole, so that the negative pressure flow provided by the negative pressure device can be introduced into the negative pressure channel through the vacuum hole.

8. The pim system of claim 1, wherein, The bottom of the top pin seat shell is provided with a top pin receiving hole for accommodating the top pin.

9. The system of claim 8, wherein, The top of the top lifting mechanism is provided with a fixing hole, and the bottom of the top pin is provided with a mounting hole, and a fastener is sequentially arranged in the fixing hole and the mounting hole, so that the top pin is fixedly installed on the top lifting mechanism.

10. A patch packaging apparatus characterized by comprising: The top pin system includes a machine table, a vacuum device arranged on the machine table, a driving device, a cooling medium supply device, and the top pin system of any one of claims 1-9, the top pin seat shell of the top pin system is fixedly installed on the machine table, the negative pressure channel of the top pin system communicates with the vacuum device, the top lifting mechanism of the top pin system is in transmission connection with the driving device, and the cooling channel of the top pin system communicates with the cooling medium supply device.

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