Module ESD protection clamp base and module ESD protection clamp

Abstract

The utility model belongs to the technical field of optical communication, and particularly provides a module ESD (Electro-Static Discharge) protection clamp base which is provided with a clamping groove matched with a product to be bonded; a golden finger contact area, a bonding equipment guide rail contact area and an anodic oxidation area are arranged on the base; the golden finger contact area is located in the clamping groove; and the anodic oxidation region is provided with an anodic oxidation layer. According to the technical scheme, anodizing removal is carried out on the local area of the base, so that conduction between a product and a clamp and conduction between the clamp and equipment are achieved, invisible damage to a chip and an electronic component caused by discharge action of a high-speed product in the gold wire bonding process is reduced, the chip stably and normally works, and therefore the product yield is improved, material cost waste is reduced, and cost is saved.

Description

Technical Field

[0001] This utility model belongs to the field of optical communication technology, specifically relating to a module ESD protection fixture base and a module ESD protection fixture. Background Technology

[0002] Most optical communication devices convert electrical signals to optical signals through optical transceiver modules, enabling the connection of optical fibers as the transmission medium. When manufacturing communication devices, it is necessary to select and provide optical transceivers adapted to the environmental medium (e.g., communication rate, communication distance, and transmission medium). Generally, electronic components in high-speed products are highly sensitive to electrostatic discharge (ESD). In severe cases, this can cause invisible damage to the product itself, leading to intractable failures during the manufacturing process. Therefore, ESD protection measures are required during the manufacturing process. Currently, common ESD prevention methods focus on reducing damage to the equipment, but they do not fundamentally solve the problem of chip failures during manufacturing. Therefore, further research and verification on how to eliminate or reduce chip failures in products is a direction for exploration in related fields. Utility Model Content

[0003] The purpose of this invention is to overcome the problem of product failure caused by static electricity in the manufacturing process of electronic components in the prior art.

[0004] To address this, the present invention provides a modular ESD protection fixture base, wherein the base has a slot that matches the product to be bonded; the base has a gold finger contact area, a bonding equipment guide rail contact area, and an anodized area; the gold finger contact area is located within the slot; and the anodized area has an anodized layer.

[0005] Specifically, the base has multiple slots.

[0006] This utility model also provides a module ESD protection fixture, including a cover plate and the above-mentioned module ESD protection fixture base; the cover plate is detachably installed on the base; the cover plate is hollowed out at the corresponding bonding area of ​​the product to be bonded.

[0007] Specifically, the cover plate is provided with a positioning post; the base is provided with a positioning hole that matches the positioning post; the positioning post is inserted into the positioning hole.

[0008] Specifically, the base is provided with a limiting protrusion; a matching limiting groove is opened on one side of the cover plate.

[0009] Specifically, the base is provided with a cover plate matching groove; the slot is provided at the bottom of the cover plate matching groove.

[0010] Specifically, the base has a thermally conductive substrate at its bottom.

[0011] Specifically, the aforementioned module ESD protection clamp also includes a pressure plate for pressing the cover plate onto the base.

[0012] Specifically, the aforementioned pressure plate includes a pressing part and a clamping part; the pressing part has a bonding window; the clamping part is symmetrically arranged on both sides of the pressing part; the clamping part is used to be clamped by a bonding device.

[0013] Specifically, the clamping part is provided with mounting holes, which are used to cooperate with bonding equipment to install and fix the pressure plate.

[0014] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0015] The modular ESD protection fixture provided by this utility model achieves electrical conductivity between the product and the fixture, and between the fixture and the equipment by deanotting a local area of ​​the base. This reduces the hidden damage to the chip and electronic components caused by discharge during the gold wire bonding process of high-speed products, enabling the chip to work stably and normally, thereby improving product yield, reducing material waste, and saving costs.

[0016] The present invention will be further described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the base structure of the modular ESD protection fixture provided by this utility model.

[0018] Figure 2 This is a bottom view of the base of the modular ESD protection fixture provided by this utility model.

[0019] Figure 3 This is a schematic diagram of the modular ESD protection fixture structure provided by this utility model.

[0020] Figure 4 This is a top view of the modular ESD protection fixture provided by this utility model.

[0021] Figure 5 This is a bottom view of the modular ESD protection fixture provided by this utility model.

[0022] Figure 6 This is a schematic diagram of the cover plate structure of the modular ESD protection clamp provided by this utility model.

[0023] Figure 7 This is a schematic diagram of the base structure of the modular ESD protection clamp provided by this utility model.

[0024] Explanation of reference numerals in the attached diagram: 1. Left baffle; 2. Right baffle; 3. Front baffle; 4. Rear baffle.

[0025] 1. Base; 101. Cover plate matching groove; 102. Slot; 103. Gold finger contact area; 104. Bonding equipment guide rail contact area; 105. Positioning hole; 106. Limiting protrusion; 2. Cover plate; 201. Positioning post; 202. Limiting groove; 3. Thermally conductive substrate; 4. Pressure plate; 401. Pressing part; 402. Clamping part; 403. Bonding window; 404. Mounting hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0028] Reference Figure 1-2 This utility model provides a modular ESD protection fixture base 1. The base 1 has a slot 102 that matches the product to be bonded. The base 1 has a gold finger contact area 103, a bonding equipment guide rail contact area 104, and an anodized area. The gold finger contact area 103 is located within the slot 102. The anodized area has an anodized layer. During manufacturing, the base 1 can be processed according to the drawings. After grinding the areas except for the anodized area, such as the gold finger contact area 103 and the bonding equipment guide rail contact area 104, the base 1 is covered with tape. The base 1 is then immersed in a solution for anodizing treatment. After this process, the tape and any residual adhesive are removed, resulting in a base 1 with an anodized layer covering the anodized area.

[0029] Furthermore, the base 1 has multiple slots 102, which can clamp multiple products.

[0030] This utility model also provides a modular ESD protection clamp, see reference. Figure 3-5The system includes a cover plate 2 and the aforementioned module ESD protection fixture base 1. The cover plate 2 is detachably mounted on the base 1. The cover plate 2 has a cutout corresponding to the bonding area of ​​the product to be bonded. During the gold wire bonding process, the product to be bonded is placed in the slot 102 of the base 1, with the gold fingers located in the gold finger contact area 103 not covered by the anodized layer. The cover plate 2 is then closed to complete the clamping. A multimeter can be used to measure whether the GNDPad of adjacent products is conductive to ensure the degree of contact between the product and the fixture. After the measurement is qualified, the fixture is assembled with the bonding equipment guide rail for bonding operation. When the bonding equipment is grounded, the energy released during the discharge of the fuse rod is transferred to the product. The chips and components on the product are connected to the PCBA board, and the potential is conducted to the ground wire at the gold finger end. The gold finger makes full contact with the fixture, and the potential is conducted to the fixture. The fixture makes tight contact with the equipment, and the potential is dissipated, thereby eliminating the energy damage generated by the discharge and achieving the ESD protection of the module. This reduces the loss of static electricity that cannot be eliminated in the product manufacturing process and reduces the module testing cost in subsequent processes.

[0031] To improve installation and positioning efficiency, such as Figure 6 As shown, the cover plate 2 is provided with a positioning post 201; the base 1 is provided with a positioning hole 105 that matches the positioning post 201; the positioning post 201 is inserted into the positioning hole 105. Through the cooperation of the positioning post 201 and the positioning hole 105, the cover plate 2 and the base 1 are installed in a precise manner.

[0032] In another embodiment, a limiting protrusion 106 is provided on the base 1; a matching limiting groove 202 is provided on one side of the cover plate 2. The limiting groove 202 and the limiting protrusion 106 limit the cover plate 2 horizontally to prevent the cover plate 2 from slipping.

[0033] Furthermore, the base 1 is provided with a cover plate matching groove 101 that matches the size of the cover plate 2; the slot 102 is provided at the bottom of the cover plate matching groove 101.

[0034] Preferably, the base 1 has a thermally conductive substrate 3 at its bottom, which provides a good heat conduction path to help disperse and eliminate the heat generated during the bonding process, avoid local overheating, and thus reduce the impact of temperature on the bonding quality.

[0035] In a more detailed embodiment, the module ESD protection fixture further includes a pressure plate 4 for pressing the cover plate 2 onto the base 1. The pressure plate 4 secures the product to be bonded within the slot 102, preventing it from shifting and affecting the bonding effect.

[0036] Specifically, such as Figure 7As shown, the pressure plate 4 includes a pressing part 401 and a clamping part 402; the pressing part 401 has a bonding window 403; the clamping part 402 is symmetrically arranged on both sides of the pressing part 401; the clamping part 402 is used to be clamped by the bonding equipment.

[0037] To facilitate installation, a mounting hole 404 is provided in the clamping part 402. On the one hand, the mounting hole 404 is used to fix the device to the bonding equipment, and on the other hand, the mounting hole 404 can be used for positioning.

[0038] Example 1:

[0039] This embodiment also provides a modular ESD protection fixture, including a cover plate 2, a pressure plate 4, and a base 1.

[0040] The base 1 has a cover plate matching groove 101 that matches the size of the cover plate 2; the bottom of the cover plate matching groove 101 has a slot 102 that matches the product to be bonded; the slot 102 has a gold finger contact area 103; the base 1 has a bonding equipment guide rail contact area 104; the surface of the base 1, except for the gold finger contact area 103 and the bonding equipment guide rail contact area 104, is an anodized area with an anodized layer; the cover plate matching groove 101 has a positioning hole 105 and a limiting protrusion 106; the bottom of the base 1 has a thermally conductive substrate 3.

[0041] The cover plate 2 is hollowed out at the bonding area corresponding to the bonding area of ​​the product to be bonded; a limiting groove 202 matching the limiting protrusion 106 is opened on one side of the cover plate 2; a positioning post 201 matching the positioning hole 105 is provided at the bottom of the cover plate 2.

[0042] The pressure plate 4 includes a pressing part 401 and a clamping part 402; the pressing part 401 has a bonding window 403; the clamping part 402 is symmetrically arranged on both sides of the pressing part 401; the clamping part 402 has a mounting hole 404.

[0043] The module ESD protection fixture provided in this embodiment is prepared using the following steps: The cover plate 2, pressure plate 4, and base 1 are machined according to the design dimensions in the drawings. The gold finger contact area 103 and the bonding equipment guide rail contact area 104 are ground to 0.1 mm and then covered with adhesive tape. The fixture is immersed in a solution for anodizing treatment. After this process, the adhesive tape and any attached residual adhesive are removed. A thermally conductive substrate 3 is installed at the bottom of the base 1.

[0044] Before use, place the product to be bonded in the slot 102 of the base 1, with the gold fingers located in the contact area 103 of the gold fingers not covered by the anodized layer. Use a multimeter to measure whether the GND Pad of adjacent products is conductive, ensuring the degree of contact between the product and the fixture. After the measurement is qualified, assemble the fixture base 1 with the guide rail of the bonding equipment. The clamping part 402 of the pressure plate 4 is clamped by the bonding equipment through the mounting hole 404, pressing the cover plate 2 and the product onto the base 1 for bonding operation. When the bonding equipment itself is grounded, the energy released during the discharge process is transferred to the product. The chips and components on the product are conductive to the PCBA board, and the potential is conducted to the ground wire at the gold finger end. The gold fingers are in complete contact with the fixture, and the potential is conducted to the fixture. The fixture and the equipment are in close contact, and the potential is dissipated, thereby eliminating the energy damage generated by the discharge and achieving the module ESD protection function. This reduces the loss of static electricity that cannot be eliminated in the product manufacturing process and reduces the module testing cost in subsequent processes.

[0045] The above examples are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A modular ESD-protected probe card base, characterized by: The base (1) is provided with a clamping groove (102) matched with the product to be bonded; the base (1) is provided with a gold finger contact area (103), a bonding equipment guide rail contact area (104) and an anodization area; the gold finger contact area (103) is located in the clamping groove (102); the anodization area is provided with an anodization layer.

2. The modular ESD protected probe card platform of claim 1, wherein: The base (1) is provided with a plurality of clamping grooves (102).

3. A modular ESD protection clamp, characterized by: The module ESD protection clamp base (1) comprises a cover plate (2) and the module ESD protection clamp base (1) of claim 1; the cover plate (2) is detachably mounted on the base (1); the cover plate (2) is hollowed out at a position corresponding to the bonding area of the product to be bonded.

4. The modular ESD protection clamp of claim 3, wherein: The cover plate (2) is provided with a positioning column (201), and the base (1) is provided with a positioning hole (105) matched with the positioning column (201); the positioning column (201) is inserted into the positioning hole (105).

5. The module ESD protection clamp as described in claim 3, characterized in that: The base (1) is provided with a limiting protrusion (106), and one side of the cover plate (2) is provided with a limiting groove (202) matched with the limiting protrusion (106).

6. The modular ESD protection clamp of claim 3, wherein: The base (1) is provided with a cover plate matching groove (101), and the clamping groove (102) is formed at the bottom of the cover plate matching groove (101).

7. The modular ESD protection clamp of claim 3, wherein: The bottom of the base (1) is provided with a heat-conducting substrate (3).

8. The modular ESD protection clamp of claim 3, wherein: Further comprising a pressing plate (4) for pressing the cover plate (2) against the base (1).

9. The modular ESD protection clamp of claim 8, wherein: The pressing plate (4) comprises a pressing portion (401) and a clamping portion (402); the pressing portion (401) is provided with a bonding window (403); the clamping portion (402) is symmetrically arranged on both sides of the pressing portion (401); and the clamping portion (402) is used for being clamped by a bonding equipment.

10. The modular ESD protection clamp of claim 9, wherein: The clamping portion (402) is provided with a mounting hole (404), and the mounting hole (404) is used for mounting and fixing the pressing plate (4) in cooperation with the bonding equipment.

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