Jig for laser strip trimming of wafer

Abstract

The utility model discloses a jig for trimming a wafer by laser, which relates to the technical field of wafer processing, and comprises a jig body, the top of the jig body is provided with a mounting groove, the top of the jig body is fixedly connected with an annular fixing seat, the annular fixing seat is slidably connected with a sliding rod, and the sliding rod is fixedly connected with the mounting groove. A mounting groove is formed in the jig body, a plurality of sliding rods are arranged in the mounting groove, one end of each sliding rod is fixedly connected with a wafer clamping seat, the wafer clamping seats are arranged in the mounting groove, and a driving mechanism for driving one end of each sliding rod to slide towards the center of the mounting groove is arranged on the jig body. The bottom of the wafer falls on the sliding base plate, the wafer clamping seats are driven by the driving mechanism to slide towards the center of the mounting groove so that the wafer can be fixed to the center of the mounting groove through the wafer clamping seats, wafers of different sizes can be fixed without replacing the jig, the structure is simple, and the adaptability is good.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically a fixture for laser trimming wafers. Background Technology

[0002] Silicon is a gray, brittle, tetravalent nonmetallic chemical element. It makes up 27.8% of the Earth's crust, second only to oxygen in abundance. Silicon is a relatively rich element in nature and can be found in quartz, agate, flint, and common beach rocks. Silicon wafers, also known as silicon wafers, are made from silicon ingots. Through specialized processes, millions of transistors can be etched onto silicon wafers, which are widely used in the manufacture of integrated circuits. Laser trimming refers to the precise correction or repair of wafer dicing ridges using laser technology. This solves problems such as wafer cracking and edge chipping caused by abnormalities in the dicing process, improving chip dicing yield. Its core lies in utilizing the high energy density and non-contact characteristics of lasers to locally process the metal layer or silicon substrate on the dicing ridge surface, avoiding the propagation of microcracks caused by mechanical stress.

[0003] Chinese Patent Publication No. CN105470192A discloses a wafer clamping mechanism, which includes: a turntable; multiple jaws, including at least one movable jaw, which is movably disposed on the turntable and is used to clamp the wafer on the turntable; and an elastic clamping force component, which is configured to provide an elastic clamping force to the movable jaw to clamp the wafer.

[0004] Chinese Patent Publication No. CN118699611A discloses a laser trimming wafer fixture, including a base and a top plate with grooves for placing wafers. The base and the top plate have multiple first fixing holes and multiple second fixing holes around their respective grooves, and these holes are connected by pins. This invention, by providing a detachable base and top plate, allows for easy processing of wafers of different sizes by simply replacing the top plate with one suitable for each size. The detachable connection via pins makes the structure simple and easy to operate.

[0005] However, the inventors of the aforementioned device believe it has certain drawbacks. The device uses different sized top plates or turntables to install and fix wafers of different sizes. The process of installing and removing the top plates or turntables is cumbersome, affecting wafer processing efficiency and exhibiting poor adaptability. Therefore, this utility model provides a fixture for laser trimming wafers. Utility Model Content

[0006] The purpose of this invention is to provide a fixture for laser trimming wafers to solve the problems raised in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a fixture for laser trimming wafers, comprising a fixture body, a mounting groove on the top of the fixture body, an annular fixing seat fixedly connected to the top of the fixture body, a sliding rod slidably connected to the annular fixing seat, a wafer clamping seat fixedly connected to one end of the sliding rod, the wafer clamping seat being disposed inside the mounting groove, and multiple sliding rods, the fixture body being provided with a driving mechanism for driving one end of multiple sliding rods to slide towards the center of the mounting groove, and a sliding pad slidably connected to one side of the wafer clamping seat.

[0008] Preferably, the driving mechanism includes a rotating ring that rotates on the top of the fixture body. The rotating ring has an oblique groove. The other end of the sliding rod is fixedly connected to a sliding block. The sliding block is located inside the oblique groove. By rotating the rotating ring, the sliding block is pressed by the oblique groove, which pushes the other end of the multiple sliding rods to slide towards or away from the center of the mounting groove.

[0009] Preferably, a first spring is sleeved on the sliding rod. The first spring is located between the wafer clamping seat and the annular fixing seat. The wafer clamping seat clamps and fixes the wafer by means of the spring force of the first spring.

[0010] Preferably, one side of the wafer holder is provided with a side sliding groove, and one end of the sliding pad slides inside the side sliding groove. The side sliding groove allows one end of the sliding pad to slide inside the side sliding groove.

[0011] Preferably, a connecting rod is fixedly connected to one end of the sliding pad, and one end of the connecting rod extends to the top of the wafer holder. A pulling piece is fixedly connected to the top of the connecting rod, so that the sliding pad can be easily pulled to slide upward by the connecting rod and the pulling piece.

[0012] Preferably, a second spring is provided inside the side sliding groove. The second spring is sleeved on the outer surface of the connecting rod. Under the action of the second spring force, the sliding pad quickly slides down and resets when no force is applied.

[0013] Preferably, the longitudinal section of the wafer holder is a right trapezoidal shape, and one side of the upper part of the wafer holder is inclined, and the inclined surface can be used for placing the wafer.

[0014] Preferably, the plurality of sliding rods are distributed in a circumferential array on the outer surface of the annular fixing base, and the number of sliding rods is greater than three.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This application places the wafer inside the mounting slot, so that the bottom of the wafer rests on the sliding pad. The drive mechanism drives multiple wafer holders to slide closer to the center of the mounting slot, thereby fixing the wafer in the center of the mounting slot. Different sizes of wafers can be fixed without changing the fixture. The structure is simple and has good adaptability.

[0017] 2. This application releases the fixing effect on the wafer, and then pulls the pull plate to slide the sliding pad upward under the connection of the connecting rod, which facilitates the quick removal of the wafer and makes the operation simple. Attached Figure Description

[0018] Figure 1 This is a perspective view of the fixture for laser trimming wafers according to this utility model;

[0019] Figure 2 This is a perspective view of the annular fixing base of the fixture for laser trimming wafers according to this utility model.

[0020] Figure 3 This utility model relates to a fixture for laser trimming wafers. Figure 2 Enlarged view at point A;

[0021] Figure 4 This is a three-dimensional view of the wafer clamping base structure of the fixture for laser trimming wafers according to this utility model.

[0022] The following are the labels in the diagram: 1. Fixture body; 2. Mounting groove; 3. Annular fixing seat; 4. Sliding rod; 41. Sliding block; 42. First spring; 5. Wafer clamping seat; 51. Side sliding groove; 6. Rotating ring; 61. Angled groove; 7. Sliding pad; 71. Connecting rod; 72. Second spring; 73. Pulling plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4A fixture for laser trimming wafers includes a fixture body 1. The top of the fixture body 1 has a mounting groove 2. An annular fixing seat 3 is fixedly connected to the top of the fixture body 1. The mounting groove 2 and the annular fixing seat 3 are concentric. A sliding rod 4 is slidably connected to the annular fixing seat 3. One end of the sliding rod 4 is fixedly connected to a wafer clamping seat 5. The wafer clamping seat 5 is located inside the mounting groove 2. By driving the sliding rod 4 to slide closer to the center of the mounting groove 2, the wafer clamping seat 5 clamps and fixes the wafer placed inside the mounting groove 2.

[0025] Please refer to it again. Figure 1 , Figure 2 and Figure 3 There are multiple sliding rods 4, which are arranged in a circular array on the outer surface of the annular fixing base 3. There are more than three sliding rods 4. The wafer is clamped and fixed in multiple directions by multiple wafer clamping bases 5, so that the wafer is installed in the center of the mounting groove 2. The fixture body 1 is provided with a driving mechanism that drives one end of the multiple sliding rods 4 to slide towards the center of the mounting groove 2. The driving mechanism includes a rotating ring 6 rotating on the top of the fixture body 1. The rotating ring 6 has an inclined groove 61. The other end of the sliding rod 4 is fixedly connected to a sliding block 41. The sliding block 41 is located inside the inclined groove 61. The rotating ring 6 is circular. By driving the rotating ring 6 to rotate, the sliding block 41 is squeezed in the inclined groove 61, so that the sliding block 41 slides inside the inclined groove 61, thereby pushing the other end of the sliding rod 4 to slide towards the center of the mounting groove 2. The inclined groove 61 is inclined, and the sliding block 41 is cylindrical.

[0026] Please refer to it again. Figure 1 , Figure 2 and Figure 3 A first spring 42 is sleeved on the sliding rod 4. The first spring 42 is located between the wafer clamping base 5 and the annular fixing base 3. Under the action of the elastic force of the first spring 42, the wafer clamping base 5 stably clamps the wafer. The longitudinal section of the wafer clamping base 5 is in the shape of a right trapezoid, and one side of the upper part of the wafer clamping base 5 is inclined. When placing, the wafer can be placed on the inclined surface of the wafer clamping base 5.

[0027] Please refer to it again. Figure 1 , Figure 2 and Figure 4A sliding pad 7 is slidably connected to one side of the wafer clamping base 5. A side sliding groove 51 is provided on one side of the wafer clamping base 5. One end of the sliding pad 7 slides inside the side sliding groove 51. A connecting rod 71 is fixedly connected to one end of the sliding pad 7. One end of the connecting rod 71 extends to the top of the wafer clamping base 5. A pulling piece 73 is fixedly connected to the top of the connecting rod 71. The wafer is placed on the top of the sliding pad 7. When the wafer clamping base 5 releases the wafer, the wafer is pulled up by pulling the top of the pulling piece 73 under the connection of the connecting rod 71, so that the wafer can be easily removed from the inside of the mounting slot 2. A second spring 72 is provided inside the side sliding groove 51. The second spring 72 is sleeved on the outer surface of the connecting rod 71. Under the action of the elastic force of the second spring 72, the sliding pad 7 slides back quickly when no force is applied.

[0028] Working principle: The wafer is placed inside the mounting slot 2, so that the wafer falls on the sliding pad 7. The rotating ring 6 is driven to rotate. Under the action of the inclined slot 61 pressing the sliding block 41, the sliding block 41 slides inside the inclined slot 61, which pushes multiple sliding rods 4 to slide towards the center of the mounting slot 2. Multiple wafer clamping seats 5 clamp the wafer, so that the wafer is installed inside the mounting slot 2. By rotating the rotating ring 6 in the opposite direction, under the action of the sliding rods 4, the sliding block 41 and the inclined slot 61, the multiple wafer clamping seats 5 are pulled away from each other to release the wafer clamping. Then, by pulling the pulling piece 73 upward, the wafer is pulled up under the connection of the connecting rod 71, so that the wafer can be removed from the inside of the mounting slot 2.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A jig for laser repair of wafer, characterized in that: Including the tool body (1), the top of the tool body (1) is provided with a mounting groove (2), the top of the tool body (1) is fixedly connected with an annular fixing seat (3), the annular fixing seat (3) is slidably connected with a sliding rod (4), one end of the sliding rod (4) is fixedly connected with a wafer clamping seat (5), the wafer clamping seat (5) is arranged in the inside of the mounting groove (2), the number of the sliding rod (4) is multiple, the tool body (1) is provided with a drive mechanism for driving one end of the plurality of sliding rods (4) to slide to the center of the mounting groove (2), one side surface of the wafer clamping seat (5) is slidably connected with a sliding backing plate (7).

2. The jig for laser repair wafer according to claim 1, wherein: The drive mechanism comprises a rotating ring (6) rotating on the top of the tool body (1), the rotating ring (6) is provided with an inclined groove (61), the other end of the sliding rod (4) is fixedly connected with a sliding block (41), and the sliding block (41) is arranged in the inside of the inclined groove (61).

3. The apparatus for laser repair of wafer according to claim 1, wherein: The sliding rod (4) is sleeved with a first spring (42), and the first spring (42) is arranged between the wafer clamping seat (5) and the annular fixing seat (3).

4. The apparatus for laser repair strip wafer as claimed in claim 1, wherein: One side surface of the wafer clamping seat (5) is provided with a side sliding groove (51), and one end of the sliding backing plate (7) is slidably arranged in the inside of the side sliding groove (51).

5. The jig for laser repair wafer according to claim 4, wherein: One end of the sliding backing plate (7) is fixedly connected with a connecting pull rod (71), one end of the connecting pull rod (71) extends to the top of the wafer clamping seat (5), and the top of the connecting pull rod (71) is fixedly connected with a pulling piece (73).

6. The jig for laser repair wafer according to claim 5, wherein: The inside of the side sliding groove (51) is provided with a second spring (72), and the second spring (72) is sleeved on the outer surface of the connecting pull rod (71).

7. The apparatus for laser repair strip wafer as claimed in claim 1, wherein: The longitudinal section of the wafer clamping seat (5) is a right trapezoidal shape, and one side surface of the upper part of the wafer clamping seat (5) is inclined.

8. The apparatus for laser repair strip wafer as claimed in claim 1, wherein: The plurality of sliding rods (4) are distributed in a circumferential array on the outer surface of the annular fixing seat (3), and the number of the sliding rods (4) is greater than three.

Images