Wafer rounding bonding head device

Abstract

The utility model relates to a wafer rounding bonding head device, comprising two symmetrically arranged reference blocks, each reference block comprises a side plate, a bottom plate and a rear plate, the rear end of the bottom plate is vertically provided with the rear plate, the outer side of the bottom plate is vertically provided with the side plate, the side plate, the bottom plate and the rear plate are vertical to each other, the inner side of the upper part of the side plate is provided with a positioning hole, and the inner side of the upper part of the side plate is provided with a positioning hole. A cylindrical adhesive head is mounted in the positioning hole, a linear groove is formed in the center of the end face of one side of the adhesive head, a connecting hole is formed in the middle of the linear groove, a nail pin is mounted on the outer side of the upper portion of each side plate, and one end of each nail pin penetrates through the reference block to be connected with the connecting hole of the adhesive head. The reference block is composed of the side plate, the bottom plate and the rear plate which are perpendicular to one another, the upper end face of the bottom plate and the front end face of the rear plate serve as the reference face, the position of the square block lump is precisely limited in cooperation with the bonding head, and therefore the square block lump can be conveniently changed into a corresponding wafer.

Description

Technical Field

[0001] This utility model relates to the field of quartz crystal processing technology, and in particular to a wafer resurfacing device. Background Technology

[0002] Quartz crystal oscillators, also known as quartz resonators or simply crystal oscillators, are made using quartz crystal wafers that exhibit piezoelectric effects. With the current development trends of 5G and AI, the demand for high-frequency quartz crystals is booming. Previously, the processing of high-frequency quartz wafers relied on traditional mechanical grinding. However, this method can no longer meet customer requirements for high frequencies, necessitating the use of semiconductor manufacturing processes to process quartz wafers and produce quartz crystal oscillators with higher stability and higher frequencies.

[0003] It was precisely because of the adoption of quartz semiconductor processing that the raw materials for quartz crystals changed from 1 inch to 2 inches, 3 inches, 4 inches, and even 6 inches. As the raw materials became larger, controlling the processing precision of the wafer surface and dimensions became a challenge. Therefore, quartz crystal wafer processing began to develop towards semiconductor photolithography technology, which in turn led to the need for processing 2-inch, 3-inch, and 4-inch circular wafers.

[0004] 2-inch, 3-inch, and 4-inch wafers are produced by wire cutting corresponding rectangular crystal rods into 0.15mm thin square sheets. After the rectangular crystal rods are processed into thin square sheets, the thin square sheets are first glued together with hot melt adhesive to form a square shape. Then, a corresponding rounding device is used to fix the glue head in the corresponding position. The accuracy of this fixing position depends on the precise control of the glue head position. Based on this requirement, an auxiliary device for precise positioning control is designed. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a wafer-to-round bonding head device. The reference block is composed of a side plate, a bottom plate and a rear plate, all of which are perpendicular to each other. The upper end surface of the bottom plate and the front end surface of the rear plate are used as reference surfaces. At the same time, the bonding head is used to accurately define the position of the square block, so that the square block can be easily converted into the corresponding wafer.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: a wafer re-bonding device is provided, including two symmetrically arranged reference blocks. The reference blocks include a side plate, a bottom plate, and a rear plate. The rear plate is vertically installed at the rear end of the bottom plate, and a side plate is vertically installed on the outer side of the bottom plate. The side plate, bottom plate, and rear plate are all perpendicular to each other. A positioning hole is opened on the inner side of the upper part of the side plate, and a bonding head is installed in the positioning hole. The bonding head is cylindrical, and a groove is opened at the center of one end face of the bonding head. A connecting hole is opened in the middle of the groove. A nail is installed on the outer side of the upper part of each side plate. One end of the nail passes through the reference block and is connected to the connecting hole of the bonding head.

[0007] As a supplement to the technical solution described in this utility model, the positioning hole is countersunk and has a through hole in the middle. The nail pin is nail-shaped and includes a cap, a rod, and a nail head connected coaxially in sequence. The cap is fastened to the outside of the side plate, the rod passes through the through hole, and the nail head is threadedly connected to the connecting hole of the adhesive head.

[0008] As a supplement to the technical solution described in this utility model, the groove is provided with two arc-shaped guide grooves symmetrically arranged on the inner walls on both sides of the connecting hole.

[0009] As a supplement to the technical solution described in this utility model, reinforcing strips are provided at the connection between the side plate and the bottom plate, as well as at the connection between the side plate and the bottom plate.

[0010] As a supplement to the technical solution described in this utility model, the reinforcing strip is provided with anti-deformation grooves along its length.

[0011] As a supplement to the technical solution described in this utility model, a positioning groove is provided in the middle of the opposite sides of the two base plates.

[0012] Beneficial effects: This utility model relates to a wafer-to-wafer bonding head device. The reference block is composed of a side plate, a bottom plate, and a rear plate, all of which are perpendicular to each other. The upper end surface of the bottom plate and the front end surface of the rear plate serve as reference surfaces. In conjunction with the bonding head, the position of the square block is precisely defined, which makes it easy to convert the square block into the corresponding wafer to meet the radius and chord edge size requirements of different wafers. The precisely sized wafer provides a guarantee for the subsequent wafer photolithography process. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the reference block described in this utility model;

[0015] Figure 3 This is a schematic diagram of the adhesive head described in this utility model;

[0016] Figure 4 This is a schematic diagram of the adhesive head and nail pin described in this utility model.

[0017] Diagram: 1. Base block, 2. Nail pin, 3. Adhesive head, 4. Positioning groove, 5. Reinforcing strip, 6. Deformation-resistant groove, 7. Positioning hole, 8. Through hole, 9. Side plate, 10. Bottom plate, 11. Rear plate, 12. Straight groove, 13. Connecting hole, 14. Guide groove, 15. Cap, 16. Rod, 17. Nail head. Detailed Implementation

[0018] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0019] The embodiments of this utility model relate to a wafer re-bearing device, such as... Figure 1-4 As shown, the system includes two symmetrically arranged reference blocks 1. Each reference block 1 includes a side plate 9, a bottom plate 10, and a rear plate 11. The rear plate 11 is vertically mounted at the rear end of the bottom plate 10, and the side plate 9 is vertically mounted on the outer side of the bottom plate 10. The side plate 9, the bottom plate 10, and the rear plate 11 are all perpendicular to each other. A positioning hole 7 is opened on the inner side of the upper part of the side plate 9, and an adhesive head 3 is installed in the positioning hole 7. The adhesive head 3 is cylindrical, and a groove 12 is opened at the center of one end face of the adhesive head 3. A connecting hole 13 is opened in the middle of the groove 12. A nail pin 2 is installed on the outer side of the upper part of each side plate 9. One end of the nail pin 2 passes through the reference block 1 and connects to the connecting hole of the adhesive head 3.

[0020] As a structural description of the nail pin 2, the positioning hole 7 is countersunk, and a through hole 8 is provided in the middle of the positioning hole 7. The nail pin 2 is nail-shaped and includes a cap part 15, a rod part 16 and a nail head 17 connected coaxially in sequence. The cap part 15 is fastened to the outside of the side plate 9, the rod part 16 passes through the through hole 8, and the nail head 17 is threadedly screwed into the connecting hole of the adhesive head 3.

[0021] The groove 12 is located on the inner wall of the connecting hole 13, and two arc-shaped guide grooves 14 are symmetrically arranged.

[0022] Reinforcing strips 5 are provided at the connection between the side plate 9 and the bottom plate 10, and at the connection between the side plate 9 and the bottom plate 10. The reinforcing strips 5 reinforce the structure between the two plates to ensure stability and strength. Anti-deformation grooves 6 are provided on the reinforcing strips 5 along the length direction to enhance the anti-deformation ability.

[0023] A positioning slot 4 is provided in the middle of the opposite sides of the two base plates 10. The positioning slot 4 is used to quickly position the reference block 1.

[0024] This utility model has two symmetrically arranged reference blocks 1, divided into a left and a right part. The left part will be used as an example. In use, the operator first inserts the adhesive head 3 and the nail pin 2 into the positioning hole 7 of the left reference block 1. After the adhesive head 3 is fixed, the square block is placed against the left reference block 1, with one side of the square block against the adhesive head 3. The position of the square block is precisely defined by the upper end face of the base plate 10 and the front end face of the rear plate 11. The lower end of the square block contacts the upper end face of the base plate 10, and the rear end of the square block contacts the front end face of the rear plate 11. Then, instant adhesive is used to bond and fix the square block and the adhesive head 3. After that, the square block and the left adhesive head 3 are removed. The above operation is then repeated to fix the right adhesive head 3. This allows two adhesive heads 3 to be symmetrically attached to both sides of the square block for subsequent rounding using a rounding machine. The two pins of the rounding machine are aligned and clamped to the groove 12 of the adhesive head 3. Then, the square block is ground by the motor-driven grinding wheel and grinding machine to obtain the wafer block with the required radius and chord edge size. Finally, the wafer block is fused with hot melt adhesive by heating and the circular sheet is removed.

[0025] Reference block 1 comes in several different sizes to accommodate the processing of wafers of different sizes.

[0026] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0027] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0028] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0029] The above provides a detailed description of a wafer re-gluing device for wafer re-gluing. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A wafer roundness correction chucking device comprising two reference blocks (1) arranged symmetrically, characterized in that: The benchmark block (1) comprises side plates (9), a bottom plate (10) and a back plate (11), the back end of the bottom plate (10) is vertically provided with the back plate (11), the outer side of the bottom plate (10) is vertically provided with the side plate (9), the side plate (9), the bottom plate (10) and the back plate (11) are perpendicular to each other, the inner side of the upper part of the side plate (9) is provided with a positioning hole (7), the positioning hole (7) is provided with a sticky head (3), the sticky head (3) is in a cylindrical shape, the end face of one side of the sticky head (3) is provided with a one-groove (12), the one-groove (12) is provided with a connecting hole (13) in the middle, the outer side of the upper part of each side plate (9) is provided with a nail pin (2), one end of the nail pin (2) penetrates the benchmark block (1) and is connected with the connecting hole of the sticky head (3).

2. The wafer modification chucking head apparatus of claim 1, wherein: The positioning hole (7) is in a counterbore shape, the positioning hole (7) is provided with a via hole (8) in the middle, the nail pin (2) is in a nail shape, the nail pin (2) comprises a hat part (15), a rod part (16) and a nail head (17) which are coaxially connected in sequence, the hat part (15) is buckled on the outer side of the side plate (9), the rod part (16) penetrates the via hole (8), and the nail head (17) is screw-threadedly connected with the connecting hole of the sticky head (3).

3. The wafer modification chucking head apparatus of claim 1, wherein: The one-groove (12) is provided with two arc-shaped guide grooves (14) which are symmetrically arranged on the inner walls on both sides of the connecting hole (13).

4. The wafer modification chucking head apparatus of claim 1, wherein: The connecting part of the side plate (9) and the bottom plate (10) and the connecting part of the side plate (9) and the bottom plate (10) are provided with reinforcing strips (5).

5. The wafer modification chucking head apparatus of claim 4, wherein: The reinforcing strip (5) is provided with an anti-deformation groove (6) along the length direction.

6. The wafer modification chucking head apparatus of claim 1, wherein: The middle parts of the opposite sides of the two bottom plates (10) are provided with positioning notches (4).

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