Chip packaging box clamping mechanism

Abstract

The embodiment of the utility model provides a chip packaging box clamping mechanism which comprises a base, a clamping mechanism and a clamping mechanism. A plurality of first clamping strips and a plurality of second clamping strips; the first sliding plate is in sliding connection with the sliding rail, and at least part of the inner side of the first sliding plate is attached to the outer sides of the multiple first clamping strips; the second sliding plate is in sliding connection with the sliding rail, and at least part of the inner side of the second sliding plate is attached to the outer sides of the multiple second clamping strips; wherein the first sliding plate and the second sliding plate are detachably and fixedly connected through a connecting piece. The sliding rail is arranged on the base, the first sliding plate and the second sliding plate can slide along the sliding rail, and therefore the distance between the first sliding plate and the second sliding plate can be adjusted, through the dynamic adjustment of the sliding rail and the cooperative clamping design of the multiple clamping strips, the clamping stability and the operation efficiency are remarkably improved while chip packaging boxes of multiple sizes are compatible, and the practicability is high. Products can be effectively prevented from being damaged and polluted in the transportation / vibration process.

Description

Technical Field

[0001] This specification relates to the field of semiconductor carrier technology, specifically to a chip packaging box clamping mechanism. Background Technology

[0002] In the chip manufacturing and packaging process, the chip packaging box serves as a crucial carrier for the chip, and the stability of its transport process directly affects the chip's integrity, safety, and subsequent processing quality. Due to the high precision, high value, and fragility of chips, their packaging boxes require specialized clamping mechanisms for reliable fixation during transport. However, current chip packaging box clamping mechanisms are insufficient to effectively prevent product damage and contamination during transportation and vibration. Summary of the Invention

[0003] In view of this, the embodiments of this specification provide a chip packaging box clamping mechanism. By setting a slide rail on the base, the first slide plate and the second slide plate can slide along the slide rail, thereby realizing the adjustment of the distance between the first slide plate and the second slide plate. Through the dynamic adjustment of the slide rail and the multi-clamping collaborative clamping design, while being compatible with chip packaging boxes of multiple sizes, the clamping stability and operating efficiency are significantly improved, and the product can be effectively prevented from being damaged or contaminated during transportation / vibration.

[0004] This specification provides the following technical solution through its embodiments: a chip packaging box clamping mechanism for clamping and fixing a chip packaging box, the clamping mechanism comprising:

[0005] A base on which a slide rail is mounted;

[0006] Multiple first clips, the inner sides of which are in contact with at least a portion of the outer wall of the first side of the chip packaging box;

[0007] Multiple second clips, the inner sides of which are in contact with at least a portion of the outer wall of the second side of the chip packaging box;

[0008] A first sliding plate is slidably connected to the slide rail, and at least part of the inner side of the first sliding plate is in contact with the outer side of a plurality of first clamping strips;

[0009] The second slide plate is slidably connected to the slide rail, and the inner side of the second slide plate is at least partially in contact with the outer side of the plurality of second clamping strips;

[0010] The first and second skateboards are detachably and fixedly connected by a connector.

[0011] Preferably, the base top is provided with a positioning member, the first sliding plate and the second sliding plate are respectively provided with a first positioning groove and a second positioning groove matched with the positioning member, and the positioning member enables the first sliding plate and the second sliding plate to be in a specified position to clamp and fix the chip packaging box.

[0012] Preferably, the positioning member comprises a positioning column, the first sliding plate is provided with a first positioning groove matched with a first side of the positioning column, and the second sliding plate is provided with a second positioning groove matched with a second side of the positioning column.

[0013] Preferably, the sliding rail comprises a T-shaped sliding rail, the first sliding plate is provided with a first sliding groove matched with the T-shaped sliding rail, and the second sliding plate is provided with a second sliding groove matched with the T-shaped sliding rail.

[0014] Preferably, the base is provided with a mounting groove corresponding to the T-shaped sliding rail, and the T-shaped sliding rail is at least partially mounted in the mounting groove through a threaded column.

[0015] Preferably, the T-shaped sliding rail is provided with two, and the two T-shaped sliding rails are symmetrically distributed about the center of the base.

[0016] Preferably, the connecting member comprises a plurality of bolts, the first sliding plate is provided with a first threaded hole through which the bolt passes, and the second sliding plate is provided with a threaded groove corresponding to the bolt.

[0017] Preferably, the plurality of first clamping strips are different in size.

[0018] And / or, the plurality of second clamping strips are different in size.

[0019] Preferably, the first clamping strip is an elastic strip.

[0020] And / or, the second clamping strip is an elastic strip.

[0021] Preferably, the second sliding plate is provided at the top with a placing groove for placing a chip lead.

[0022] Compared with the prior art, the above at least one technical solution adopted by the embodiments of the present specification can achieve at least the following beneficial effects:

[0023] By providing the sliding rail on the base, the first sliding plate and the second sliding plate can slide along the sliding rail, thereby adjusting the distance between the first sliding plate and the second sliding plate. Through the dynamic adjustment of the sliding rail and the cooperative clamping design of the plurality of clamping strips, the compatibility of the chip packaging box of multiple sizes is realized, and the clamping stability and operation efficiency are significantly improved, which can effectively prevent product damage and pollution during transportation / vibration. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art based on the drawings without creative effort shall fall within the scope of the present application.

[0025] Fig. 1 is an explosion structure schematic diagram of a chip packaging box clamping mechanism provided by the present application;

[0026] Fig. 2 is a first perspective structure schematic diagram of a chip packaging box clamping mechanism provided by the present application;

[0027] Fig. 3 is a second perspective structure schematic diagram of a chip packaging box clamping mechanism provided by the present application.

[0028] In the drawings, 1 is a base, 2 is a first clamping strip, 3 is a second clamping strip, 4 is a first sliding plate, 5 is a second sliding plate, 6 is a T-shaped sliding rail, 7 is a connecting piece, 8 is a positioning column, 9 is a first positioning groove, 10 is a second positioning groove, 11 is a mounting groove, 12 is a first sliding groove, 13 is a second sliding groove, 14 is a placing groove, and 15 is a chip packaging box. DETAILED DESCRIPTION

[0029] The embodiments of the present application will be described in detail below with reference to the drawings.

[0030] The embodiments of the present application are described below through specific and detailed examples, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. Obviously, the described embodiments are only some of the embodiments of the present application, not all. The present application can also be implemented or applied through other different specific embodiments, and each detail in the specification can be modified or changed based on different views and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort shall fall within the scope of the present application.

[0031] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0032] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0033] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0034] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0035] like Figs. 1-3 As shown, a chip packaging box clamping mechanism is used to clamp and fix a chip packaging box 15. The clamping mechanism includes:

[0036] Base 1, on which a slide rail is mounted;

[0037] Multiple first clips 2, the inner sides of which are all in contact with at least a portion of the outer wall of the first side of the chip packaging box 15;

[0038] Multiple second clips 3, the inner sides of which are all in contact with at least a portion of the outer wall of the second side of the chip packaging box 15;

[0039] The first slide plate 4 is slidably connected to the slide rail, and the inner side of the first slide plate 4 is at least partially attached to the outer side of the plurality of first clamping strips 2;

[0040] The second slide plate 5 is slidably connected to the slide rail, and the inner side of the second slide plate 5 is at least partially in contact with the outer side of the plurality of second clamping strips 3;

[0041] The first slide plate 4 and the second slide plate 5 are detachably and fixedly connected by a connector 7.

[0042] The slide rail installed on the base 1 provides a horizontal sliding path for the first slide plate 4 and the second slide plate 5. The distance between the two can be adjusted by sliding to adapt to chip packaging boxes 15 of different sizes. Multiple first clamping strips 2 and second clamping strips 3 respectively fit against the first and second outer walls of the chip packaging box 15, forming multi-point contact, dispersing clamping pressure, and avoiding local stress concentration. When the first slide plate 4 and the second slide plate 5 slide along the slide rail, the inner side of the slide plate 4 and the outer side of the first clamping strip 2 and the second clamping strip 3 push the clamping strips to move synchronously, realizing bidirectional clamping or releasing operation. The first slide plate 4 and the second slide plate 5 are fixed by the detachable connector 7, which supports quick assembly and disassembly, and facilitates maintenance or replacement of the first clamping strip 2 and / or the second clamping strip.

[0043] like Figs. 1-3 As shown, in some embodiments, a positioning element is provided on the top of the base 1. The first sliding plate 4 and the second sliding plate 5 are respectively provided with a first positioning groove 9 and a second positioning groove 10 that cooperate with the positioning element. The positioning element positions the first sliding plate 4 and the second sliding plate 5 in a designated position to clamp and fix the chip packaging box 15. The positioning element on the top of the base 1 forms a geometric match with the first positioning groove 9 and the second positioning groove 10 on the first sliding plate 4 and the second sliding plate 5, ensuring that the first sliding plate 4 and the second sliding plate 5 are in a designated position (i.e., the distance between the first sliding plate 4 and the second sliding plate 5 is fixed), facilitating high-precision positioning, rapid adjustment, and stable clamping of the chip packaging box 15 of a specified size.

[0044] like Figs. 1-3 As shown, in some embodiments, the positioning element includes a positioning post 8. The first sliding plate 4 has a first positioning groove 9 that mates with a first side of the positioning post 8, and the second sliding plate 5 has a second positioning groove 10 that mates with a second side of the positioning post 8. The positioning post 8 is vertically fixed to the top of the base 1, and its two sides respectively form geometric fits with the first positioning groove 9 and the second positioning groove 10 on the first sliding plate 4 and the second sliding plate 5. The cross-sectional shape of the positioning post 8 (e.g., cylindrical) is geometrically matched with the first positioning groove 9 and the second positioning groove 10 to ensure no offset when the sliding plate moves, achieving high-precision positioning.

[0045] like Figs. 1-3As shown, in some embodiments, the slide rail includes a T-shaped slide rail 6. The bottom of the first slide plate 4 has a first groove 12 that mates with the T-shaped slide rail 6, and the bottom of the second slide plate 5 has a second groove 13 that mates with the T-shaped slide rail 6. The trapezoidal cross-section (wider at the top and narrower at the bottom) of the T-shaped slide rail 6 forms a complementary geometric match with the first groove 12 and the second groove 13 at the bottom of the first slide plate 4 and the second slide plate 5, restricting the vertical displacement freedom of the first slide plate 4 and the second slide plate 5, ensuring that the first slide plate 4 and the second slide plate 5 can only slide along a specific direction, thereby achieving high-precision guidance, stable clamping, and rapid adjustment of the first slide plate 4 and the second slide plate 5.

[0046] like Figs. 1-3 As shown, in some embodiments, the base 1 has a mounting groove 11 corresponding to the T-shaped slide rail 6, and the T-shaped slide rail 6 is at least partially installed in the mounting groove 11 by threaded posts. By opening the mounting groove 11 on the base 1, the bottom of the T-shaped slide rail 6 is embedded in the mounting groove 11, and the T-shaped slide rail 6 is connected to the bottom wall of the mounting groove 11 by threaded posts, thereby fixing the T-shaped slide rail 6.

[0047] like Figs. 1-3 As shown, in some embodiments, two T-shaped slide rails 6 are provided, and the two T-shaped slide rails 6 are symmetrically distributed about the center of the base 1. By providing two sets of T-shaped slide rails 6, the two sets of T-shaped slide rails 6 respectively slide in contact with the bottom of the opposite sides of the first slide plate 4 and the second slide plate 5, ensuring the stability of the first slide plate 4 and the second slide plate 5 when sliding along the T-shaped slide rails 6.

[0048] like Figs. 1-3 As shown, in some embodiments, the connector 7 includes several bolts. The first slide plate 4 has a first threaded hole for the bolts to pass through, and the second slide plate 5 has a threaded groove corresponding to the bolts. The first slide plate 4 and the second slide plate 5 are connected by several bolts, ensuring that the first slide plate 4 and the second slide plate 5 are relatively fixed. The connection and disassembly operations between the first slide plate 4 and the second slide plate 5 are relatively convenient.

[0049] like Fig. 1 As shown, in some embodiments, the multiple first clamping strips 2 have different sizes; the multiple second clamping strips 3 have different sizes. By using multiple first clamping strips 2 and second clamping strips 3 of different sizes, it is easy to fit them against the outer wall of the chip packaging box 15, which has an irregular outer structure, thus ensuring the clamping and fixing effect on the chip packaging box 15.

[0050] In some embodiments, the first clamping strip 2 is an elastic strip; the second clamping strip 3 is an elastic strip. The inner sides of the first clamping strip 2 and the second clamping strip 3 can be designed as stepped or elastic padding (such as silicone or polyurethane) to adapt to slight deformations of the packaging box surface and enhance clamping stability.

[0051] like Figs. 2-3 As shown, in some embodiments, a placement groove 14 is formed on the top of the second slide plate 5 for placing chip leads. By forming the placement groove 14 on the top of the second slide plate 5, the placement groove 14 can be used to place FPC flexible material leads extending outside the chip package 15.

[0052] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0053] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip packaging box clamping mechanism, characterized in that, The application relates to a clamping mechanism for clamping and fixing a chip package box, which comprises the following parts: a base, wherein a sliding rail is arranged on the base; a plurality of first clamping strips, the inner sides of the first clamping strips being in contact with the outer walls of a first side of the chip package box; a plurality of second clamping strips, the inner sides of the second clamping strips being in contact with the outer walls of a second side of the chip package box; a first sliding plate, which is in sliding connection with the sliding rail, and the inner side of the first sliding plate is in contact with the outer sides of the first clamping strips; a second sliding plate, which is in sliding connection with the sliding rail, and the inner side of the second sliding plate is in contact with the outer sides of the second clamping strips; wherein the first sliding plate and the second sliding plate are detachably fixedly connected through a connecting piece.

2. The chip package clamping mechanism according to claim 1, wherein The base is provided with a positioning piece, and the first sliding plate and the second sliding plate are respectively provided with a first positioning groove and a second positioning groove matched with the positioning piece; the positioning piece makes the first sliding plate and the second sliding plate be in a specified position to clamp and fix the chip package box.

3. The chip package clamping mechanism according to claim 2, wherein The positioning piece comprises a positioning column, the first sliding plate is provided with a first positioning groove matched with the first side of the positioning column, and the second sliding plate is provided with a second positioning groove matched with the second side of the positioning column.

4. The chip package clamping mechanism according to claim 1, wherein The sliding rail comprises a T-shaped sliding rail, the first sliding plate is provided with a first sliding groove matched with the T-shaped sliding rail, and the second sliding plate is provided with a second sliding groove matched with the T-shaped sliding rail.

5. The chip package clamping mechanism according to claim 4, wherein The base is provided with an installation groove corresponding to the T-shaped sliding rail, and the T-shaped sliding rail is at least partially installed in the installation groove through a threaded column.

6. The chip package clamping mechanism according to claim 5, wherein The T-shaped sliding rail is provided with two T-shaped sliding rails which are symmetrically distributed about the center of the base.

7. The chip package clamping mechanism according to claim 1, wherein The connecting piece comprises a plurality of bolts, the first sliding plate is provided with a first threaded hole through which the bolt passes, and the second sliding plate is provided with a threaded groove corresponding to the bolt.

8. The chip package clamping mechanism according to claim 1, wherein The sizes of the first clamping strips are different; and / or the sizes of the second clamping strips are different.

9. The chip package clamping mechanism according to claim 1, wherein The first clamping strips are elastic strips; and / or the second clamping strips are elastic strips.

10. The chip package clamping mechanism according to claim 1, wherein The second sliding plate is provided with a placing groove at the top, and the placing groove is used for placing chip leads.

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