Composite resonance humidity-sensitive chip structure with asymmetric electrodes

Abstract

The utility model relates to a composite resonance humidity-sensitive chip structure with asymmetric electrodes, which belongs to the technical field of quartz resonators and comprises a quartz substrate, vibrating electrodes with different sizes are arranged on the upper surface and the lower surface of the quartz substrate, and the vibrating electrodes are connected with bonding pads on the upper surface and the lower surface of the quartz substrate through connecting electrodes. A platinum resistor with an MEMS structure is prepared on the upper surface of the quartz substrate, the platinum resistor is directly connected with a bonding pad, and the bonding pad is arranged on the edge of the quartz substrate. According to the utility model, the symmetrical electrode structure of the traditional quartz resonator is changed, the sensitivity of the quartz resonator is effectively improved, the refrigeration efficiency and uniformity of an external refrigeration device to the composite resonant humidity-sensitive chip structure can be improved, the surface temperature difference between the platinum resistor and the vibration electrode is reduced, and the surface temperature of the quartz resonator is monitored in real time; and the real-time high-precision measurement of the dew point is realized.

Description

Technical Field

[0001] This invention belongs to the field of quartz resonator technology, specifically a composite resonant humidity-sensitive chip structure with asymmetric electrodes, which can be used for dew point temperature measurement. Background Technology

[0002] Quartz resonators are important devices for humidity measurement, offering advantages such as low cost, high sensitivity, and simple structure. Traditional quartz resonator humidity measurement methods involve coating the resonator surface, but the measurement results are severely affected by the physical properties of the sensitive film. Therefore, a humidity measurement scheme utilizing the physical characteristics of quartz resonators and oscillation circuits is proposed. This scheme employs a composite resonant humidity-sensitive chip for dew point detection. This method eliminates the need for coating the resonator electrode surface with a humidity-sensitive film, offering high accuracy, stable performance, and a simple structure. Traditional composite resonant humidity-sensitive chips use a square substrate and symmetrical electrode structure, which still suffers from the following problems in practical applications: external cooling devices cannot achieve efficient and uniform cooling of the electrode area of ​​the traditional composite resonant humidity-sensitive chip, resulting in poor cooling efficiency during operation and a large temperature difference between the electrode and non-electrode areas of the resonant humidity-sensitive chip. Furthermore, the square substrate of traditional composite humidity-sensitive chips makes them prone to multiple harmonic vibrations, leading to insufficient oscillation stability. Therefore, it is necessary to design a composite humidity-sensitive chip structure with asymmetrical electrodes to address these issues, improve the oscillation stability of the resonant humidity-sensitive chip, and enhance the cooling efficiency of the electrode area. Summary of the Invention

[0003] The technical problem to be solved by this invention is to propose a composite resonant humidity sensor chip with asymmetric electrodes, which improves oscillation stability while improving the cooling efficiency of the electrode area.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: providing a composite resonant humidity-sensitive chip structure with asymmetric electrodes, including a quartz substrate, wherein the upper and lower surfaces of the quartz substrate have a vibrating electrode, a connecting electrode, a pad, and a platinum resistance thermometer, wherein the vibrating electrode is connected to the pad through the connecting electrode, and the platinum resistance thermometer is directly connected to the pad.

[0005] Preferably, the vibration electrodes on the upper and lower surfaces of the quartz substrate have different diameters, with the vibration electrode on the upper surface of the quartz substrate being larger than the vibration electrode on the lower surface of the quartz substrate.

[0006] Preferably, the three pads on the upper surface of the quartz substrate are arranged in a circumferential array.

[0007] Preferably, the platinum resistance thermometer is arc-shaped and distributed on the upper surface of the quartz substrate, with the vibrating electrode close to the upper surface of the quartz substrate directly connected to the pad.

[0008] Preferably, the vibrating electrode, connecting electrode, and pad material are all gold.

[0009] Compared with existing technologies, the advantages of this invention are as follows: This invention relates to a composite resonant humidity-sensitive chip structure with asymmetric electrodes. Replacing the traditional square quartz substrate with a circular quartz substrate effectively suppresses multiple harmonic oscillations of the chip and improves its oscillation stability. Replacing the traditional symmetric electrodes with asymmetric electrodes effectively improves the sensitivity of the quartz resonator. The non-electrode area on the back side, corresponding to the outer edge region of the larger diameter electrode, can closely cooperate with the external cooling structure, reducing the surface temperature difference between the electrode and non-electrode areas of the resonant humidity-sensitive chip. This not only does not affect the vibration characteristics but also improves the cooling efficiency and increases the response speed of the humidity-sensitive device. A platinum resistance thermometer with a microelectromechanical system (MEMS) structure is fabricated on the upper surface of the quartz substrate. The platinum resistance thermometer is arranged around the vibrating electrode on the upper surface of the quartz substrate, reducing the temperature difference between the platinum resistance thermometer and the vibrating electrode. Attached Figure Description

[0010] The present invention will be further described below with reference to the accompanying drawings.

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0012] Figure 2 This is a schematic diagram of the upper surface structure of this utility model.

[0013] Figure 3 This is a schematic diagram of the lower surface structure of this utility model. Detailed Implementation

[0014] The present invention will now be described in detail with reference to specific embodiments: Example

[0015] The embodiments of this utility model relate to a composite resonant humidity-sensitive device with asymmetric electrodes, such as... Figures 1 to 3 As shown, it includes a circular quartz substrate 1. The upper and lower surfaces of the quartz substrate have a vibrating electrode 2, a connecting electrode 5, a pad 3, and a platinum resistance 4. The vibrating electrode 2 is connected to the pad 3 through the connecting electrode 5, and the platinum resistance 4 is directly connected to the pad 3.

[0016] The vibrating electrodes 2 on the upper and lower surfaces of the circular quartz substrate 1 are of different sizes. The diameter of the vibrating electrode 2 on the upper surface of the quartz substrate 1 is 1.2-10 times that of the vibrating electrode 2 on the lower surface of the quartz substrate 1, which can effectively improve the sensitivity of the composite humidity sensor.

[0017] The three pads 3 on the upper surface of the circular quartz substrate 1 are arranged in a circumferential array, with each pair of pads 3 placed at a 120° angle, making the product structure more symmetrical and easier to clamp.

[0018] The platinum resistance 4 is arc-shaped and distributed on the upper surface of the quartz substrate 1, near the vibrating electrode 2 on the upper surface of the quartz substrate 1. The inner diameter of the platinum resistance 4 with the center of the quartz substrate as the center is 4.0-5.0 mm, preferably 4.3 mm. The diameter of the platinum vibrating electrode 2 with the center of the quartz substrate as the center is 2.0-3.0 mm, preferably 2.2 mm. The platinum resistance 4 is directly connected to the pad 3, which can effectively reduce the temperature difference between the platinum resistance 4 and the vibrating electrode 2.

[0019] The vibrating electrode 2, connecting electrode 5, and solder pad 3 are all made of gold, which fully ensures the conductivity and sensitivity of the composite resonant humidity-sensitive device.

[0020] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0021] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0022] The above provides a detailed description of the composite resonant humidity-sensitive chip structure with asymmetric electrodes provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A composite resonant humidity sensitive chip structure of asymmetric electrodes comprising a quartz substrate, characterized in that: The upper and lower surfaces of the quartz base have vibration electrodes, connecting electrodes, pads and platinum resistance, the vibration electrodes are connected with the pads through the connecting electrodes, and the platinum resistance is directly connected with the pads.

2. The composite type resonant humidity sensing chip structure of asymmetric electrode according to claim 1, characterized in that: The vibration electrodes on the upper and lower surfaces of the quartz base are different in size, and the size of the vibration electrode on the upper surface of the quartz base is larger than that of the vibration electrode on the lower surface of the quartz base.

3. The composite type resonant humidity sensing chip structure of asymmetric electrode according to claim 1, wherein: The three pads on the upper surface of the quartz base are distributed in a circumferential array.

4. The composite type resonant humidity sensing chip structure of asymmetric electrode according to claim 1, wherein: The platinum resistance is in an arc shape and is distributed on the upper surface of the quartz base and directly connected with the pads.

5. The composite type resonant humidity sensing chip structure of asymmetric electrode according to claim 1, wherein: The materials of the vibration electrodes, the connecting electrodes and the pads are gold.

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