Needle card clamp and wafer detection device

Abstract

The utility model relates to a needle card clamp and a wafer detection device. The needle card clamp comprises a bottom plate, a mounting seat, a movable ring and a sealing ring, the bottom plate is provided with a needle card slot, and the needle card slot is used for arranging a needle card; the mounting seat is arranged on one side of the bottom plate, the mounting seat is provided with a mounting groove, and the mounting groove is arranged around the periphery of the needle clamping groove; the movable ring is movably arranged in the mounting groove in the preset direction, the movable ring is provided with a setting groove, and the preset direction is the arrangement direction of the mounting base and the bottom plate; the sealing ring is arranged in the arrangement groove and partially protrudes out of the side, away from the bottom plate, of the arrangement groove. When the needle card clamp is applied to a wafer detection device, the needle card clamp and a test head have good sealing performance.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, specifically to a pin clamp and wafer inspection device. Background Technology

[0002] In the field of wafer inspection technology, high and low temperature probe stations can cover a test temperature range of -55℃ to 200℃ to test the performance of wafers under test in high and low temperature environments. When testing wafers under test in low temperature environments, there is a gap between the test head of the tester and the probe holder, which may cause frost or dew to form at the gap, easily damaging the probes. Utility Model Content

[0003] In view of this, this application provides a pin clamp and a wafer inspection device, wherein the pin clamp has good sealing performance with the test head when applied to the wafer inspection device.

[0004] This application provides a pin clamp, comprising: a base plate, a mounting base, a movable ring, and a sealing ring. The base plate has a pin clamp groove for mounting pins. The mounting base is disposed on one side of the base plate and has a mounting groove surrounding the outer periphery of the pin clamp groove. The movable ring is movably disposed within the mounting groove along a preset direction and has a setting groove. The preset direction is the arrangement direction of the mounting base and the base plate. The sealing ring is disposed in the setting groove and partially protrudes from the setting groove on the side opposite to the base plate.

[0005] Furthermore, the pin clamp also includes multiple elastic elements, which are spaced apart within the mounting groove. The elastic elements are located between the bottom of the mounting groove and the movable ring, and are respectively connected to the mounting base and the movable ring.

[0006] Furthermore, the pin clamp also includes multiple guide members, each of which is partially inserted through the mounting base and partially inserted through the elastic member. Different guide members are inserted through different elastic members. The multiple guide members are used to guide the elastic members so that the movable ring moves along a preset direction.

[0007] Furthermore, the movable ring has a plurality of through holes spaced apart, the plurality of through holes penetrating two opposite surfaces of the movable ring along a preset direction, each guide member corresponding to one through hole, different guide members corresponding to different through hole settings, and the maximum radial dimension of the guide member being smaller than the minimum radial dimension of the through hole.

[0008] Furthermore, the mounting base has multiple spaced guide grooves, each of which extends along a preset direction and is connected to the mounting groove; the pin clamp also includes multiple connectors, each connector corresponding to one guide groove, and different connectors corresponding to different guide grooves; one end of each connector is connected to the movable ring, and the other end is located in the guide groove.

[0009] Furthermore, the pin clamp also includes a shim, which is disposed between the base plate and the mounting base.

[0010] This application provides a wafer inspection device, which includes: a pin clamp, a pin clamp, and a testing component provided in this application. The pin clamp is disposed in the pin clamp slot. The testing component includes a test head, which includes a connected electrical connection part and a supporting part. The supporting part and the electrical connection part are arranged along a preset direction. The electrical connection part is electrically connected to the pin clamp, and the supporting part supports the sealing ring.

[0011] Furthermore, the wafer inspection device also includes a housing and a flip cover. The flip cover is arranged around the outer periphery of the needle clamp and connected to the base plate. The flip cover is rotatably connected to the housing. The housing and the flip cover form a sample cavity. The base plate includes a first sub-part, a second sub-part, and a third sub-part that are bent and connected together. The flip cover is arranged around the outer periphery of the first sub-part, the first sub-part is arranged around the outer periphery of the second sub-part, and the second sub-part is arranged around the outer periphery of the third sub-part. The first sub-part and the third sub-part are arranged along a preset direction, and the second sub-part and the third sub-part form the needle clamp groove, which communicates with the sample cavity.

[0012] Furthermore, the wafer inspection device also includes a blowing device and multiple pipe assemblies. The blowing device is used to supply gas to the pipe assemblies. The multiple pipe assemblies are connected to the housing and spaced apart in the sample chamber. The multiple pipe assemblies are used to introduce gas into the sample chamber. The dew point temperature of the gas is lower than the test temperature of the wafer inspection device.

[0013] Furthermore, each of the pipe assemblies includes an air inlet, multiple air blowing nozzles, and a guide plate. One end of the air inlet is connected to an air blowing device, and the other end of the air inlet is connected to the multiple air blowing nozzles respectively. The end of the air blowing nozzle opposite to the air inlet is an air blowing port. The guide plate is located on one side of the multiple air blowing ports. The guide plate is connected to the housing and is inclined to the housing to guide the gas blown out from the air blowing nozzle to the center of the sample chamber.

[0014] In this application, when the probe holder is applied to a wafer inspection device, the probe holder has a sealing ring for sealing the test head and the probe holder. This prevents gaps between the test head and the probe holder from forming frost or condensation, thus avoiding damage to the probe, extending its lifespan, and improving the accuracy of the wafer inspection device in inspecting the wafer. Specifically, when the test head is connected to the probe holder, the electrical connection of the test head is electrically connected to the probe holder, allowing the probe holder to load an electrical signal and perform inspection of the wafer. The supporting portion abuts against the sealing ring, and under gravity, the test head presses against the sealing ring, causing the movable ring to move in a preset direction toward the base plate. This further strengthens the sealing performance between the sealing ring and the test head, preventing gaps between them from forming frost or condensation, thereby improving the low-temperature inspection performance of the wafer inspection device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a wafer inspection device according to an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a test head according to an embodiment of this application;

[0018] Figure 3 This is a partial exploded view of a wafer inspection device according to an embodiment of this application;

[0019] Figure 4 This is an exploded view of a pin clamp according to an embodiment of this application;

[0020] Figure 5 for Figure 4 Enlarged view of the dashed box A in the middle;

[0021] Figure 6 This is a top view of a pin clip fixture according to an embodiment of this application;

[0022] Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure in the middle BB direction;

[0023] Figure 8 for Figure 7 Enlarged view of the dashed box in the middle (C);

[0024] Figure 9 for Figure 6 Schematic diagram of the cross-sectional structure in the DD direction;

[0025] Figure 10 for Figure 9 Enlarged view of the dashed box in the middle E;

[0026] Figure 11 This is a schematic diagram of the structure of a wafer inspection device according to another embodiment of this application;

[0027] Figure 12 This is a side view of a wafer inspection device according to an embodiment of this application;

[0028] Figure 13 for Figure 12 Schematic diagram of the cross-sectional structure in the FF direction;

[0029] Figure 14 This is a schematic diagram showing the connection between the air blowing device and the pipe assembly according to an embodiment of this application;

[0030] Figure 15 for Figure 13 Enlarged view of the dashed box in the middle G.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100-Pin clamp, 110-Base plate, 111-Pin slot, 112-First sub-part, 113-Second sub-part, 114-Third sub-part, 120-Mounting base, 121-Mounting groove, 122-Guide groove, 130-Moving ring, 131-Setting groove, 132-Through hole, 140-Sealing ring, 150-Elastic element, 160-Guide element, 170-Connector, 180-Elevating element, 20 0-Wafer inspection device, 210-Pin card, 220-Test component, 221-Test head, 2211-Electrical connection part, 2212-Holding part, 222-Testing machine, 230-Housing, 240-Flip cover, 241-Sample chamber, 250-Blowing device, 260-Pipe assembly, 261-Air inlet, 262-Blowing nozzle, 2621-Blowing port, 263-Guide plate, 270-Sample tray. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0035] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] In the field of wafer inspection technology, high and low temperature probe stations can cover a test temperature range of -55℃ to 200℃ to test the performance of wafers under test in high and low temperature environments. When testing wafers under test in low-temperature environments, there is a gap between the test head of the testing machine and the probe holder, which may cause frost or dew to form at the gap, potentially damaging the probes. Furthermore, if the gas in the sample chamber is humid, its dew point is high. When the dew point of the gas in the sample chamber is higher than the test temperature, the gas is prone to frost formation on the chuck and the wafer under test, thus affecting subsequent testing.

[0037] Understandably, in the terminology of this application, "dew point" is also known as dew point temperature, which refers to the temperature at which the gaseous water in the air must reach saturation and condense into liquid water under a fixed atmospheric pressure. At this temperature, the condensed liquid water is called fog if it floats in the air, and dew if it adheres to a solid surface, hence the name dew point.

[0038] Please see Figures 1 to 4 This application provides a pin clip 100, which includes: a base plate 110, a mounting base 120, a movable ring 130, and a sealing ring 140. The base plate 110 has a pin clip groove 111 for mounting pin clips 210. The mounting base 120 is disposed on one side of the base plate 110 and has a mounting groove 121 surrounding the outer periphery of the pin clip groove 111. The movable ring 130 is positioned along a predetermined direction (e.g., ...). Figure 3The movable ring 130 (as shown in the X direction) can be movably disposed in the mounting groove 121. The movable ring 130 has a setting groove 131. The preset direction is the arrangement direction of the mounting base 120 and the base plate 110. The sealing ring 140 is disposed in the setting groove 131 and partially protrudes from the setting groove 131 on the side away from the base plate 110.

[0039] Understandably, the pin holder 100 of this application is applied to a wafer inspection device 200, which includes a pin holder 210 and a test assembly 220. The pin holder 210 is disposed in the pin holder slot 111. The test assembly 220 includes a test head 221, which includes a connected electrical connection portion 2211 and a supporting portion 2212. The supporting portion 2212 and the electrical connection portion 2211 are arranged along a preset direction. The electrical connection portion 2211 is electrically connected to the pin holder 210, and the supporting portion 2212 abuts against the sealing ring 140.

[0040] Understandably, the sealing ring 140, the movable ring 130, the mounting base 120, and the base plate 110 are arranged along a preset direction and at least partially overlap.

[0041] Understandably, the movable ring 130 is movably disposed within the mounting groove 121 along a preset direction. Specifically, the movable ring 130 is disposed within the mounting groove 121 and is movable relative to the mounting base 120 along a preset direction. More specifically, the movable ring 130 can move relative to the mounting base 120 towards the base plate 110 along a preset direction, and the movable ring 130 can also move relative to the mounting base 120 away from the base plate 110 along a preset direction.

[0042] Understandably, when the needle clamp 100 is applied to the wafer inspection device 200 and the wafer inspection device 200 is used to perform low-temperature inspection on the wafer to be inspected, the temperature inside the wafer inspection is low. If there is a gap between the needle clamp 100 and the test head 221, the gas in the air is likely to frost or produce dew in the gap between the needle clamp 100 and the test head 221.

[0043] In this embodiment, when the probe holder 100 is applied to the wafer inspection device 200, the probe holder 100 has a sealing ring 140 for sealing the test head 221 with the probe holder 100. This prevents frost or dew from forming at the gap between the test head 221 and the probe holder 100, thus avoiding damage to the probe, extending the probe's lifespan, and improving the accuracy of the wafer inspection device 200 in inspecting the wafer to be inspected. Specifically, when the test head 221 is connected to the probe holder 100, the electrical connection portion 2211 of the test head 221 is electrically connected to the probe holder 210, so that the probe holder 210 is loaded with an electrical signal and can inspect the wafer to be inspected. The supporting part 2212 abuts against the sealing ring 140, and under the action of gravity, the test head 221 presses against the sealing ring 140, and causes the movable ring 130 to move in a preset direction toward the base plate 110, so as to further enhance the sealing performance between the sealing ring 140 and the test head 221, thereby avoiding the formation of frost or dew due to gaps between the sealing ring 140 and the test head 221, thereby improving the low-temperature detection performance of the wafer inspection device 200.

[0044] Understandably, in the terminology of this application, "low temperature" is used in contrast to "high temperature," and in some embodiments, it may refer to a temperature less than 0°C. In other embodiments, it may refer to a temperature less than 5°C, and this is not limited thereto.

[0045] Optionally, the mounting groove 121 may be, but is not limited to, an annular groove, and the setting groove 131 may be, but is not limited to, an annular groove.

[0046] Optionally, the bottom of the needle slot 111 is a through hole, so that when the needle card 210 is disposed in the needle slot 111, the tip of the needle card 210 can protrude from the side of the needle slot 111 away from the sealing ring 140, so that the tip of the needle card 210 can contact the wafer to be tested and test the wafer to be tested.

[0047] Optionally, in some embodiments, the sealing ring 140 is a silicone component. In other embodiments, the sealing ring 140 is a rubber component.

[0048] Optionally, the movable ring 130 may be, but is not limited to, made of stainless steel. The mounting base 120 may be, but is not limited to, made of stainless steel.

[0049] Please see also Figures 5 to 8In some embodiments, the pin clamp 100 further includes a plurality of elastic elements 150, which are spaced apart in the mounting groove 121. The elastic elements 150 are located between the bottom of the mounting groove 121 and the movable ring 130, and are respectively connected to the mounting base 120 and the movable ring 130.

[0050] Understandably, the elastic element 150 is capable of elastic deformation.

[0051] Understandably, in the terminology of this application, "multiple" refers to two or more, and can be, but is not limited to, two, three, four, five, six, seven, or eight. Preferably, in some embodiments, the number of elastic elements 150 is six.

[0052] In this embodiment, the elastic element 150 is located between the bottom of the mounting groove 121 and the movable ring 130. When the test head 221 abuts against the sealing ring 140, causing the movable ring 130 to move in a preset direction toward the base plate 110, the elastic element 150 is compressed. The reaction force of the elastic element 150 on the movable ring 130 helps to further tighten the sealing ring 140 and the test head 221, thereby further enhancing the sealing performance between the sealing ring 140 and the test head 221, avoiding gaps between the sealing ring 140 and the test head 221 that could cause frost or dew, thus extending the service life of the probe and improving the low-temperature detection performance of the wafer inspection device 200, and improving the accuracy of the wafer inspection device 200 in detecting the wafer to be inspected. Furthermore, when the wafer inspection device 200 stops inspecting the wafer to be inspected and removes the test head 221, the elastic element 150 elastically recovers, making it easier to remove the test head 221, which helps to further improve the performance of the pin clamp 100.

[0053] In some embodiments, the pin clamp 100 further includes a plurality of guide members 160, each guide member 160 being partially inserted through the mounting base 120 and partially inserted through the elastic member 150, with different guide members 160 inserted through different elastic members 150, and the plurality of guide members 160 being used to guide the elastic member 150 so that the movable ring 130 moves in a preset direction.

[0054] Understandably, each of the guide members 160 is partially inserted through the elastic member 150, and different guide members 160 are inserted through different elastic members 150. This can be achieved by having the number of guide members 160 equal to the number of elastic members 150, and by providing a one-to-one correspondence between the guide members 160 and the elastic members 150.

[0055] In this embodiment, the elastic element 150 is sleeved on the outer periphery of the guide element 160. When the movable ring 130 is movably disposed in the mounting groove 121 along a preset direction, the guide element 160 can guide the elastic element 150 so that the elastic force direction of the elastic element 150 is parallel or approximately parallel to the preset direction. This avoids the angle between the elastic force direction of the elastic element 150 and the preset direction being too large, which would affect the sealing effect between the sealing ring 140 and the test head 221. As a result, the needle clamp 100 has better performance.

[0056] In some embodiments, the movable ring 130 has a plurality of spaced through holes 132 that penetrate two opposing surfaces of the movable ring 130 along a preset direction. Each guide member 160 is provided with one through hole 132, and different guide members 160 are provided with different through holes 132. The maximum radial dimension of the guide member 160 is smaller than the minimum radial dimension of the through hole 132.

[0057] Understandably, each guide 160 corresponds to one through hole 132, and different guides 160 correspond to different through holes 132. The number of guides 160 is equal to the number of through holes 132, and the guides 160 and through holes 132 correspond one-to-one.

[0058] In this embodiment, the plurality of through holes 132 penetrate two opposing surfaces of the movable ring 130 along a preset direction, and the maximum radial dimension of the guide member 160 is smaller than the minimum radial dimension of the through holes 132. Therefore, when the movable ring 130 moves relative to the mounting base 120 along the preset direction, the guide member 160 can pass through the movable ring 130, so as to guide the elastic member 150 while avoiding interference with the movement of the movable ring 130, thereby making the pin clamp 100 have better performance.

[0059] Understandably, the minimum radial dimension of the elastic element 150 is greater than the maximum radial dimension of the through hole 132, so that when the movable ring 130 moves relative to the mounting base 120 in a preset direction, the opposite ends of the elastic element 150 abut against the bottom of the mounting groove 121 and the bottom of the movable ring 130 respectively, so that the elastic element 150 can provide a reverse force on the movable ring 130, further enhancing the clamping force between the sealing ring 140 and the test head 221.

[0060] Please see also Figure 9 and Figure 10In some embodiments, the mounting base 120 has a plurality of spaced guide grooves 122, each of which extends along a preset direction and is connected to the mounting groove 121; the pin clamp 100 also includes a plurality of connectors 170, each of which corresponds to one guide groove 122, and different connectors 170 correspond to different guide grooves 122; one end of each connector 170 is connected to the movable ring 130, and the other end is located in the guide groove 122.

[0061] Understandably, each of the connectors 170 corresponds to one of the guide grooves 122, and different connectors 170 correspond to different guide grooves 122. For example, the number of connectors 170 is equal to the number of guide grooves 122, and the connectors 170 and guide grooves 122 are configured in a one-to-one correspondence.

[0062] In this embodiment, the connectors 170 and guide grooves 122 are arranged in a one-to-one correspondence. One end of each connector 170 is connected to the movable ring 130, and the other end is located in the guide groove 122. When the movable ring 130 moves relative to the mounting base 120 in a preset direction, the end of the connector 170 located in the guide groove 122 moves along the preset direction of the guide groove 122 to guide the end of the connector 170 connected to the movable ring 130 to move in the preset direction. This avoids the movable ring 130 deviating from the preset direction when moving relative to the mounting base 120. It also helps the sealing ring 140 on the movable ring 130 to press against the test head 221, improving the tightness between the test head 221 and the needle clamp 100. This prevents frost or water mist from forming between the test head 221 and the needle clamp 100 during low-temperature testing. As a result, when the needle clamp 100 is applied to the wafer inspection device 200, the wafer inspection device 200 has better performance.

[0063] In some embodiments, the pin clamp 100 further includes a shim 180 disposed between the base plate 110 and the mounting base 120.

[0064] Understandably, the sealing ring 140, the movable ring 130, the mounting base 120, the shim 180, and the base plate 110 are arranged along the preset direction and at least partially overlap.

[0065] In this embodiment, the needle clip clamp 100 further includes a shim 180, which is disposed between the base plate 110 and the mounting base 120. This ensures that when the test head 221 is connected to the needle clip clamp 100, the distance between the abutment portion 2212 of the test head 221 and the base plate 110 is within a reasonable range. This allows the abutment portion 2212 of the test head 221 to tightly abut against the sealing ring 140, and the elastic member 150 is in a compressed state. This ensures good tightness between the test head 221 and the sealing ring 140, thereby preventing water mist or frost from forming between the test head 221 and the sealing ring 140.

[0066] Optionally, the shim 180 may be, but is not limited to, a stainless steel component.

[0067] Understandably, different height shims 180 can be selected based on the distance from the abutment portion 2212 of the test head 221 to the base plate 110. That is, different shims 180 can be selected based on the distance between the surface of the abutment portion 2212 near the electrical connection portion 2211 and the surface of the electrical connection portion 2211 away from the abutment portion 2212, so that the abutment portion 2212 of the test head 221 can tightly abut against the sealing ring 140, and the elastic member 150 is in a compressed state.

[0068] Please see also Figures 1 to 4 ,as well as Figure 11 This application provides a wafer inspection device 200, which includes: a pin holder 100, a pin holder 210, and a test assembly 220 provided in this application. The pin holder 210 is disposed in the pin holder slot 111. The test assembly 220 includes a test head 221, which includes a connected electrical connection portion 2211 and a supporting portion 2212. The supporting portion 2212 and the electrical connection portion 2211 are arranged along a preset direction. The electrical connection portion 2211 is electrically connected to the pin holder 210, and the supporting portion 2212 abuts against the sealing ring 140.

[0069] Understandably, the wafer inspection device 200 is used to inspect the wafer to be inspected.

[0070] Understandably, the needle clip 100 is used to set the needle clip 210.

[0071] Understandably, the electrical connection portion 2211 is closer to the pin slot 111 than the abutment portion 2212.

[0072] In this embodiment, the wafer inspection device 200 includes the pin holder 100 provided in this application. When the test head 221 is connected to the pin holder 100, the electrical connection portion 2211 of the test head 221 is electrically connected to the pin holder 210, so that the pin holder 210 is loaded with an electrical signal and the wafer to be inspected is inspected. The supporting portion 2212 abuts against the sealing ring 140, and under the action of gravity, the test head 221 presses against the sealing ring 140, and the movable ring 130 moves in a preset direction toward the base plate 110, so as to further enhance the sealing performance between the sealing ring 140 and the test head 221, thereby avoiding the presence of gaps between the sealing ring 140 and the test head 221 that could cause frost or dew, thereby improving the low-temperature inspection performance of the wafer inspection device 200. When the internal testing temperature of the wafer inspection device 200 is low, the pin clamp 100 and the test head 221 have good sealing performance, which can prevent frost from forming in the gap between the sealing ring 140 and the test head 221 due to the temperature of the air being higher than that of the pin clamp 100. This can prevent damage to the pin clamp 210, extend the service life of the pin clamp 210, and improve the accuracy of testing the wafer under test in a low-temperature environment.

[0073] Optionally, the test assembly 220 further includes a tester 222, which is electrically connected to the test head 221. The tester 222 is used to apply an electrical signal to the test head 221. The test head 221 is electrically connected to the pin card 210 to apply an electrical signal to the pin card 210 and to perform the test on the wafer to be tested.

[0074] Please see also Figure 12 and Figure 13 In some embodiments, the wafer inspection device 200 further includes a housing 230 and a flip plate 240. The flip plate 240 is arranged around the outer periphery of the needle clamp 100 and connected to the base plate 110. The flip plate 240 is rotatably connected to the housing 230. The housing 230 and the flip plate 240 form a sample cavity 241. The base plate 110 includes a first sub-part 112, a second sub-part 113, and a third sub-part 114 that are bent and connected. The flip plate 240 is arranged around the outer periphery of the first sub-part 112. The first sub-part 112 is arranged around the outer periphery of the second sub-part 113. The second sub-part 113 is arranged around the outer periphery of the third sub-part 114. The first sub-part 112 and the third sub-part 114 are arranged along a preset direction, and the second sub-part 113 and the third sub-part 114 form a needle clamp groove 111, which communicates with the sample cavity 241.

[0075] Understandably, the flip cover 240 is rotatably connected to the housing 230. This means that the flip cover 240 can rotate relative to the housing 230 to open or close the sample chamber 241, facilitating the maintenance or replacement of the components inside the sample chamber 241 by the staff.

[0076] Understandably, the first sub-part 112 and the third sub-part 114 are located on opposite sides of the second sub-part 113 along a predetermined direction.

[0077] Understandably, the first sub-part 112 and the third sub-part 114 are arranged in a preset direction, and the second sub-part 113 and the third sub-part 114 form the needle slot 111. The needle slot 111 is a recessed groove, which is recessed on the side of the first sub-part 112 near the sample chamber 241 to accommodate part of the structure of the needle clip 210 and the electrical connection part 2211 of the test head 221.

[0078] In this embodiment, the base plate 110 is disposed on the flip plate 240, and the first sub-part 112 of the base plate 110 is connected to the flip plate 240. The first sub-part 112, the second sub-part 113, and the third sub-part 114 are bent and connected, and the second sub-part 113 is disposed around the outer periphery of the third sub-part 114. The second sub-part 113 and the third sub-part 114 are both located on the side of the first sub-part 112 facing the sample chamber 241. The second sub-part 113 and the third sub-part 114 form a needle slot 111 for setting the needle card 210. The needle slot 111 communicates with the sample chamber 241, that is, the bottom of the needle slot 111 is a through hole, so that the tip of the needle card 210 protrudes from the side of the needle slot 111 away from the sealing ring 140, so that the tip of the needle card 210 can contact the wafer to be tested and test the wafer to be tested. Furthermore, along a preset direction, the sealing ring 140, the movable ring 130, the mounting base 120, the elevating member 180, the first sub-part 112, the second sub-part 113, and the third sub-part 114 are arranged in sequence. When the holding part 2212 of the test head 221 abuts against the sealing ring 140, the cavity formed by the sealing ring 140, the movable ring 130, the mounting base 120, the elevating member 180, the first sub-part 112, the second sub-part 113, and the third sub-part 114 is used to accommodate the electrical connection part 2211. When the wafer inspection device 200 is used to test the performance of the wafer under test in a low-temperature environment, the temperature of the sample chamber 241 and the needle holder 210 is low, and the test head 221 and the needle holder clamp 100 have good sealing performance, which can prevent gas in the air from entering the chamber and causing frost or water mist on the surface of the needle holder 210, thereby helping to extend the service life of the needle holder 210 and improve the accuracy of the wafer inspection device 200 in testing the performance of the wafer under test in a low-temperature environment.

[0079] Optionally, the wafer inspection device 200 further includes a sample tray 270, which is movably disposed within the sample cavity 241 and is used to hold the wafer to be inspected. When the test head 221 is connected to the pin clamp 100 and the pin clamp 210 is disposed in the pin clamp 100, the test head 221 is electrically connected to the pin clamp 210, so that the pin clamp 210 is loaded with an electrical signal. By moving the sample tray 270, the test point of the wafer to be inspected is aligned with the pin clamp 210. When the pin clamp 210 contacts the test point of the wafer to be inspected, the test of the wafer to be inspected is realized.

[0080] Understandably, when the dew point temperature of the gas in the sample chamber 241 is lower than the temperature of the sample tray 270, the gas in the sample chamber 241 can be prevented from frosting or generating water mist on the surface of the chuck.

[0081] Please see also Figure 14 and Figure 15 In some embodiments, the wafer inspection device 200 further includes a blowing device 250 and a plurality of pipe assemblies 260. The blowing device 250 is used to supply gas to the pipe assemblies 260. The plurality of pipe assemblies 260 are connected to the housing 230 and spaced apart within the sample chamber 241. The plurality of pipe assemblies 260 are used to introduce gas into the sample chamber 241. The dew point temperature of the gas is lower than the test temperature of the wafer inspection device 200.

[0082] Understandably, the gas can be a "dry gas". In the terminology of this application, "dry gas" refers to a gas with a humidity lower than that of the gas in the sample chamber 241.

[0083] Understandably, in the terminology of this application, "test temperature of wafer inspection device 200" refers to the temperature of the sample cavity 241 when the wafer inspection device 200 is inspecting the wafer to be inspected, and may also refer to the temperature of the sample disk 270.

[0084] In this embodiment, the blowing device 250 connects to the plurality of pipe assemblies 260, providing gas to the plurality of pipe assemblies 260, and the dew point temperature of the gas is lower than the testing temperature of the wafer inspection device 200. When the plurality of pipe assemblies 260 are spaced apart from the housing 230, the plurality of pipe assemblies 260 introduce dry gas with a humidity of less than or equal to 40% into the sample chamber 241, so that the gas pressure inside the sample chamber 241 is greater than the gas pressure outside the sample chamber 241. On the one hand, this can prevent external gas from entering the sample chamber 241 and causing frost or water mist in the gaps of the housing 230, the gaps of the flip plate 240, the gaps of the needle clamp 100, or the gap between the housing 230 and the flip plate 240; on the other hand, it can also replace the gas in the sample chamber 241 by introducing the gas into the sample chamber 240. Dry gas is introduced into the sample chamber 241, which can discharge the original gas with high humidity in the sample chamber 241 through the gap of the housing 230 or the gap of the flip plate 240. This allows the sample chamber 241 to be filled with gas with a low dew point temperature, so that the dew point of the gas in the sample chamber 241 is lower than the temperature of the sample tray 270, that is, lower than the test temperature of the wafer inspection device 200. This prevents the gas in the sample chamber 241 from frosting or generating water mist on the sample tray 270, thereby improving the accuracy of the wafer inspection device 200 in detecting the performance of the wafer under test in a low-temperature environment.

[0085] Optionally, the difference between the test temperature of the wafer inspection device 200 and the dew point temperature of the gas is greater than 5°C. Specifically, the difference between the test temperature of the wafer inspection device 200 and the dew point temperature of the gas can be, but is not limited to, 5.2°C, 6°C, 6.2°C, 6.5°C, 7°C, 7.3°C, 7.8°C, 8°C, 8.2°C, 8.4°C, and 8.5°C.

[0086] Specifically, gas is introduced into the sample chamber 241 to lower the dew point temperature of the gas in the sample chamber 241, so that the dew point temperature of the gas in the sample chamber 241 is at least 5° lower than the test temperature. In other words, when the test temperature of the wafer inspection device 200 is -50°C, the dew point temperature of the gas in the sample chamber 241 must be at least below -55°C.

[0087] Optionally, the flow rate of gas introduced into the sample chamber 241 by the plurality of pipe assemblies 260 ranges from 400 L / min to 650 L / min. Specifically, the flow rate of gas introduced into the sample chamber 241 by the plurality of pipe assemblies 260 can be, but is not limited to, 400 L / min, 420 L / min, 450 L / min, 480 L / min, 500 L / min, 520 L / min, 545 L / min, 560 L / min, 600 L / min, 620 L / min, 635 L / min, 640 L / min, and 650 L / min.

[0088] Optionally, in some embodiments, the number of pipe assemblies 260 is four sets, and the four sets of pipe assemblies 260 are spaced apart around the housing 230 and are all located within the sample chamber 241.

[0089] Optionally, the pipe assembly 260 is disposed near the bottom of the sample chamber 241 to facilitate the expulsion of the gas originally contained in the sample chamber 241 from the gap between the housing 230 and the flip plate 240.

[0090] Optionally, in some embodiments, the piping assembly 260 includes an air inlet 261 and a plurality of air nozzles 262. One end of the air inlet 261 is connected to the air blowing device 250, and the other end of the air inlet 261 is connected to the plurality of air nozzles 262. The air blowing device 250, the air inlet 261, and the plurality of air nozzles 262 cooperate to blow dry gas into the sample chamber 241, thereby lowering the dew point of the gas in the sample chamber 241 and preventing the gas in the sample chamber 241 from frosting or generating water mist on the chuck, thereby improving the performance of the wafer inspection device 200. It is understood that in this embodiment, the piping assembly 260 does not include a baffle plate 263.

[0091] In some embodiments, each of the pipe assemblies 260 includes an air inlet 261, a plurality of air blowing nozzles 262, and a guide plate 263. One end of the air inlet 261 is connected to the air blowing device 250, and the other end of the air inlet 261 is connected to the plurality of air blowing nozzles 262. The end of the air blowing nozzle 262 opposite to the air inlet 261 is an air blowing port 2621. The guide plate 263 is located on one side of the plurality of air blowing ports 2621. The guide plate 263 is connected to the housing 230 and is inclined to the housing 230 to guide the gas blown out from the air blowing nozzles 262 to the center of the sample chamber 241.

[0092] Understandably, the air blowing device 250, the air inlet 261, and the plurality of air blowing nozzles 262 are connected in sequence.

[0093] In this embodiment, the blowing device 250, the air inlet 261, and the plurality of blowing nozzles 262 are sequentially connected, and the guide plate 263 is located at the blowing port 2621 of the blowing nozzle 262. When the blowing device 250 supplies gas to the pipe assembly 260, the gas is blown out from the blowing port 2621. The guide plate 263 is inclined to the housing 230 to guide the gas blown out from the blowing nozzle 262 to the center of the sample chamber 241, so that the gas in the middle of the sample chamber 241 is full, thereby squeezing out the original gas in the sample chamber 241 and replacing the gas in the sample chamber 241. More specifically, the original gas in the sample chamber 241 can be squeezed out from the gap in the housing 230 or the gap in the flip plate 240. The gas provided by the blowing device 250 is relatively dry, which can effectively reduce the dew point of the gas in the sample chamber 241 and improve the efficiency of reducing the dew point of the gas in the sample chamber 241. This avoids the gas in the sample chamber 241 from frosting or generating water mist on the surface of the sample tray 270, which in turn helps to improve the accuracy of the wafer under test for testing the performance of the wafer under test in a low-temperature environment.

[0094] Optionally, the plurality of pipe assemblies 260 are staggered along the preset direction, and the plurality of air inlets 2621 of the same group of pipe assemblies 260 have the same orientation; the plurality of air inlets 2621 of different pipe assemblies 260 have at least partially different orientations.

[0095] In this embodiment, the multiple air outlets 2621 of the same group of pipe assemblies 260 are oriented in the same direction, so that the same group of pipe assemblies 260 can introduce gas into the sample chamber 241, thereby improving the efficiency of gas replacement in the sample chamber 241. The multiple pipe assemblies 260 are staggered along the preset direction, and the multiple air outlets 2621 of different pipe assemblies 260 are at least partially different in orientation, that is, the multiple air outlets 2621 of the multiple pipe assemblies 260 are at different heights and the air blowing direction is not uniform. This can effectively prevent the formation of cyclones or idling in the sample chamber 241, which would prevent the original high-humidity gas in the sample chamber 241 from being unable to be quickly discharged from the sample chamber 241. This helps to improve the efficiency of reducing the dew point of the gas in the sample chamber 241, and avoids the gas in the sample chamber 241 from frosting or generating water mist on the surface of the sample tray 270. In turn, it helps to improve the accuracy of the wafer under test for testing the performance of the wafer under test in a low-temperature environment.

[0096] Optionally, in some embodiments, the air nozzle 262 is a silencer nozzle, that is, the air nozzle 262 is provided with a silencer structure to reduce the volume of gas when it enters the air nozzle 262, and can reduce the vibration of the pipe assembly 260 and the housing 230 when the gas flows, which is beneficial to improving the accuracy of the probe in detecting the wafer to be tested and improving the performance of the wafer detection device 200.

[0097] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A needle card gripper characterized by, The needle clamp includes: a bottom plate having a needle clamp slot for disposing a needle clamp; a mounting seat disposed on one side of the bottom plate, the mounting seat having a mounting slot disposed around the outer periphery of the needle clamp slot; a movable ring movably disposed in the mounting slot along a predetermined direction, the movable ring having a setting slot, the predetermined direction being the arrangement direction of the mounting seat and the bottom plate; and a sealing ring disposed in the setting slot and partially protruding from the setting slot away from one side of the bottom plate.

2. The needle chucking fixture of claim 1, wherein, The needle clamp further includes a plurality of elastic members, the plurality of elastic members being spaced apart and disposed in the mounting slot, the elastic members being located between the bottom of the mounting slot and the movable ring, and respectively connected to the mounting seat and the movable ring.

3. The needle chucking fixture of claim 2, wherein, The needle clamp further includes a plurality of guide members, each of the guide members being partially disposed in the mounting seat and partially disposed in the elastic members, different guide members being disposed in different elastic members, the plurality of guide members being used to guide the elastic members to move the movable ring along the predetermined direction.

4. The needle chucking fixture of claim 3, wherein, The movable ring has a plurality of spaced-apart through holes, the plurality of through holes penetrating the movable ring along two opposite surfaces in the predetermined direction, each of the guide members corresponding to one of the through holes, different guide members corresponding to different through holes, the maximum radial dimension of the guide member being smaller than the minimum radial dimension of the through hole.

5. The needle chucking fixture of claim 1, wherein, The mounting seat has a plurality of spaced-apart guide slots, the plurality of guide slots each extending along the predetermined direction and respectively communicating with the mounting slot. The needle clamp further includes a plurality of connecting members, each of the connecting members corresponding to one of the guide slots, different connecting members corresponding to different guide slots; one end of each of the connecting members being connected to the movable ring, and the other end being located in the guide slot.

6. The needle chuck according to any one of claims 1 to 5, characterized in that The needle clamp further includes a spacer, the spacer being disposed between the bottom plate and the mounting seat.

7. A wafer inspection apparatus characterized by comprising: The wafer detection device includes: the needle clamp of any one of claims 1 to 6; a needle clamp disposed in the needle clamp slot; and a test assembly including a test head, the test head including an electrically connected portion and a contact portion connected to each other, the contact portion and the electrically connected portion being arranged along a predetermined direction, the electrically connected portion being electrically connected to the needle clamp, and the contact portion being in contact with the sealing ring.

8. The wafer inspection apparatus according to claim 7, wherein The wafer detection device further includes a housing and a flip cover, the flip cover being disposed around the outer periphery of the needle clamp and connected to the bottom plate, the flip cover being rotatably connected to the housing, and the housing and the flip cover enclosing a sample cavity; the bottom plate including a first sub-portion, a second sub-portion, and a third sub-portion connected to each other in a bent manner, the flip cover being disposed around the outer periphery of the first sub-portion, the first sub-portion being disposed around the outer periphery of the second sub-portion, the second sub-portion being disposed around the outer periphery of the third sub-portion, the first sub-portion and the third sub-portion being arranged along a predetermined direction, and the second sub-portion and the third sub-portion enclosing the needle clamp slot, the needle clamp slot communicating with the sample cavity.

9. The wafer inspection apparatus according to claim 8, wherein The wafer detection device further comprises a blowing device and a plurality of pipe assemblies, the blowing device is used to provide gas to the pipe assemblies; the plurality of pipe assemblies are connected to the shell and are arranged in the sample cavity, and the plurality of pipe assemblies are used to introduce gas into the sample cavity, and the dew point temperature of the gas is lower than the test temperature of the wafer detection device.

10. The wafer inspection apparatus according to claim 9, wherein Each of the pipe assemblies comprises a gas inlet nozzle, a plurality of gas blowing nozzles and a flow guide plate, one end of the gas inlet nozzle is connected to the blowing device, the other end of the gas inlet nozzle is respectively communicated with the plurality of gas blowing nozzles, one end of the gas blowing nozzle away from the gas inlet nozzle is a gas blowing port, the flow guide plate is located on one side of the plurality of gas blowing ports, the flow guide plate is connected to the shell and is arranged obliquely with the shell, and is used to guide the gas blown from the gas blowing nozzle to the center of the sample cavity.

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